SANTA CLARA, USA: Core Wafer Systems Inc. (CWS) and SEMATECH, a global consortium of chipmakers, today announced that CWS has joined SEMATECH’s Front End Processes (FEP) program, and will work with SEMATECH to characterize novel transistor processes, emerging technology devices and designs.
The partnership will focus on the development and verification of advanced test reliability libraries.
As a member of SEMATECH’s FEP program, CWS will collaborate with FEP experts in the characterization arena to develop an analysis tool for reliability testing of deep submicron devices.
The tool set, an advanced deep submicron reliability testing solution codenamed WARp, is, according to CWS CEO Roger Goetz, “a quantum leap from current reliability products in terms of both measurement capability and suitability to manufacturers addressing deep submicron reliability.” WARp, which is scheduled for release in May 2010, is based on CWS’ proprietary parallel measurement scheme for physical phenomena in semiconductor structures.
"SEMATECH is pleased to welcome CWS as a partner,” said Raj Jammy, SEMATECH vice president of emerging technology. “CWS’ proven expertise in reliability data collection and analysis will complement our own technical expertise, as we work together to develop technologies and processes that will extend CMOS and pave the path for beyond CMOS technologies."
Dr. Gennadi Bersuker, Fellow of SEMATECH, added: "With each new technology node, it is increasingly important to develop an adequate reliability analysis methodology. CWS’ reliability software capabilities will enable us to create a comprehensive characterization software which addresses our industry’s manufacturing needs."
Monday, December 7, 2009
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