4G World 2010, CHICAGO, USA: DesignArt Networks announced that its new and disruptive DAN3000 4G SoC family employs multiple customized processor cores from Tensilica, Inc.
The result is the first fully integrated 40nm multi-layer, multi-core SoC platform, delivering more than 1 Gbps in mobile broadband data throughput, ready for LTE Advanced applications. With the DAN3000 SoC family, DesignArt Networks integrated all radio access network (RAN) processing layers into one single-SoC architecture, eliminating cost, size and performance roadblocks to multi-gigabit 4G broadband services.
“Tensilica’s customizable DPU cores gave us the ability to create a highly integrated multi-layer SoC architecture, maintaining full software flexibility at unrestricted 4G performance levels, yielding the highest number of MIPS per Watt in the market,” said Assaf Touboul, DesignArt Networks CTO.
“The customization capability of Tensilica’s DPU cores enabled us to design a DSP architecture that is custom-built for advanced 3G and 4G signal processing performance. Without this capability it would not have been possible to develop such a powerful, yet efficient multi-layer system-on-chip architecture.”
“The DAN3000 SoC platform is a breakthrough device that provides equipment vendors with a future-proof software-defined integrated development platform,” said Eric Dewannain, Tensilica’s vice president and general manager of the baseband business unit. “This SoC design exemplifies what designers with deep knowledge of application-specific product requirements can achieve with our customizable data plane processor (DPU) IP cores.”
The DAN3000 SoC platform can replace several FPGA, DSP and Network Processor components, and in some cases, even multiple baseband cards, with a single-chip SoC design. This eliminates multiple vendor-specific development frameworks, providing a single integrated development environment (IDE), while offering state-of-the art multi-core simulation and debugging tools, as well as a single structured C/C++ programming model.
Moreover, as the first fully software-defined multi-layer, multi-core SoC architecture, the DAN3000 SoC family provides a single integrated development framework for all RAN product segments, ranging from traditional BTS, BBU, RRH, and Mobile Backhaul equipment, to next-generation Compact BTS equipment.
Thursday, October 21, 2010
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