FSI International receives multiple ANTARES orders from leading logic device maker

MINNEAPOLIS, USA: FSI International Inc. announced that a leading Asia-based logic device producer has placed additional orders for multiple ANTARES CryoKinetic cleaning systems, further broadening the platform’s installed base.

The logic chip provider currently uses the ANTARES system for various BEOL particle removal processes and with this order, is adding capacity in the 45nm technology generation at its US fab. The systems are expected to ship in the second quarter of fiscal 2011. The dual process chamber ANTARES systems range in price from $1.8 to $2.3 million, depending on configuration.

The ANTARES System is a fully automated, single-wafer, CryoKinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. CryoKinetic processing technology is an all-dry, non-reactive process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films.

The system’s highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL. Many of the leading logic device manufacturers worldwide utilize the ANTARES system for its defect reduction and yield improvement benefits.