EVG unveils EVG520L3 next-gen wafer bonding system

SEMICON EUROPA, DRESDEN, GERMANY: EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, announced the latest addition to its industry-leading EVG500 Series of permanent wafer bonding systems.

The new three-chamber EVG520L3 wafer bonding system builds on the series' proven strengths in temperature control, piston force uniformity and modularity, with the next major implementation of the bond chamber concept—addressing the need for high-vacuum, CMOS-compatible bonding processes while delivering significantly higher throughput, cost of ownership (CoO) and yields.

Ongoing industry exploration of new technologies for MEMS devices and advanced packaging/3D interconnect applications is driving increased demand for flexible, yet reliable, processing equipment.

Wafer stacking and bonding systems must be able to accommodate a variety of materials and material properties, offer faster heating and cooling, and enable parallel processing capabilities to ensure overall quality and uniformity. The EVG520L3 was developed with these requirements in mind, delivering capabilities superior to those of competitive offerings—all the while addressing advanced CoO and yield requirements.

One of the most significant hurdles to higher throughput is long pumping times for achieving high vacuum in the device. To address this, the EVG520L3 features a brand new three-chamber design, which enables processing of up to three substrate stacks simultaneously.

This concept utilizes pre- and post-bond process chambers, which separates the baking and pumping, high-vacuum bonding and post-bond cooling. The new layout speeds up the bond process (by up to 3x for high-vacuum and 5.5x for ultra-high vacuum), and results in significantly improved throughput and yield.

Other enhancements include:
* A heater design that supports 45 degrees C/minute heating and up to 100 degrees C/minute cooling ramps with silent wafer cooling, for improved temperature uniformity in EVG's proven heater design.
* Rapid vacuum build-up to enable high-vacuum applications, such as bolometers.
* Option to support up to 100kN contact force—enabling metallic bonds on the larger substrates used for MEMS and 3D IC applications.
* Unparalleled force accuracy and uniformity for highest yield.