Samsung Mobile Solutions Forum 2011, TAIPEI, TAIWAN: Samsung Electronics Co. Ltd has developed the industry’s first monolithic four gigabit (Gb) LPDDR3 (low power double-data-rate 3) memory using 30 nanometer (nm) class technology for mobile applications such as smartphones and tablet PCs, at the eighth annual Samsung Mobile Solutions Forum held at the Westin Taipei. LPDDR3 DRAM is needed to support faster processors, high resolution displays and 3D graphics in high-end next generation mobile devices
“Samsung is offering the most advanced green mobile memory solution by developing the industry’s first 30nm-class 4Gb-based LPDDR3 packages,” said Wanhoon Hong, executive VP, memory sales & marketing, Device Solutions, Samsung Electronics. “Samsung will keep working closely with mobile device designers to deliver high-performance mobile solutions, while expanding the next-generation mobile memory market.”
The new 4Gb LPDDR3 DRAM can transfer data at up to 1,600 megabits per second (Mbps), which is approximately 1.5 times faster than the industry’s current highest performance LPDDR2, which operates at 1,066Mbps. The new component also consumes 20 percent less electrical power than its predecessor.
In addition, by stacking two 4Gb chips, Samsung is enabling use of a single 1GB LPDDR3 package, with a data transmission rate up to 12.8 gigabytes (GB) per second.
Starting next quarter, Samsung will begin sampling the 4Gb-based LPDDR3 chips to key mobile device providers. The chips are expected to be widely adopted next year in advanced mobile applications including next-generation smartphones and tablet PCs.
To accommodate the growing need for higher density mobile memory solutions to process large amount of data, the maximum amount of mobile DRAM in high-end mobile devices will grow from 1GB (8Gb) up to 2GB (16Gb) by early next year. These densities will be available by stacking four 4Gb LPDDR3 chips.
According to a research report from IHS iSuppli, the market for LPDDR3 DRAM will expand sharply starting in 2013. Samsung will be readying the market by mass producing more components in 2012 therein encouraging faster adoption of premium mobile DRAM solutions throughout the mobile electronics industry.
Thursday, September 29, 2011
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