PCB Piezotronics new MEMS devices built on advanced Plasma-Therm deep silicon etch technology

ST. PETERSBURG, USA: PCB Piezotronics (PCB) has expanded its sensor product line to include several MEMS devices using silicon based technology. Development and production of these sensors has relied on a Plasma-Therm VERSALINE DSE system for several critical deep silicon etching fabrication steps.

These new MEMS based sensor products include a series of shock accelerometers utilized in industrial monitoring applications such as load vibration, pile driving and hole drilling. Additionally, these products are used in aerospace and defense.

Successful etching of a complex silicon-on-insulator (SOI) MEMS device structure enables PCB to produce the industry’s smallest, most accurate and durable shock accelerometer as a result of Plasma-Therm’s low notch etch technology.

Andrea Tombros, Senior MEMS Design Engineer at PCB, said: “We developed our MEMS shock accelerometer series using the etch technology provided by the VERSALINE DSE system. This system has been a crucial element in advancing our sensor technology product collection.

"To meet our high expectations for quality and to stay at the leading edge of our industry, we use best in class systems like the VERSALINE. Working with an equipment supplier with Plasma-Therm’s expertise was a critical part of our product development.”

Dr. David Lishan, Director of Technical Marketing at Plasma-Therm, added: “Our suite of DSE technologies gives designers a broad canvas and allows them to create new advanced devices. We provide DSE technology that gives our customers confidence to test new ideas and a platform that allows them to implement those ideas into reliable production. VERSALINE continues to be a preferred system for both research laboratories and production facilities alike because it extends the palette of capabilities.”