SAN DIEGO, USA: Entropic Communications Inc., a leading provider of silicon and software solutions to enable connected home networking and entertainment, announced support for the new ECONA CNS3XXX energy efficient ARM-Based processor family from Cavium Networks, a leading provider of semiconductor products that enable intelligent processing for networking, communications, storage, wireless, video and security applications.
Building upon the relationship established earlier this year, the two companies are committed to enabling the development and fast delivery of best-in-class home networking solutions ideally suited for the fiber-to-the-home and IPTV service deployments, pairing Entropic's third-generation MoCA 1.1 compliant EN2510 single-chip network controller solution with Cavium's ECONA single-dual-core ARM-based processor family.
"We are pleased to continue to grow our relationship with Entropic as we build our portfolio of home networking solutions," said Syed Ali, president and CEO of Cavium Networks.
"We believe it is important to align ourselves with the industry's leader in MoCA technology and we're excited to work with Entropic to benefit from their unmatched field-proven deployment experience and demonstrated leadership implementing the MoCA 1.1 specification, which is consistent with our goal of bringing high-performance, low-cost solutions to market quickly."
The EN2510 offers best-in-class value for connected products requiring the features, robustness and throughput performance of a MoCA home network. The EN2510 offers convenience and cost savings by combining the coaxial network controller and RF transceiver into a single 15x15mm chip.
Manufactured in an advanced 65nm process, the EN2510 substantially lowers power consumption over previous generations and supports advanced input/output interfaces such as PCI Express along with MII/TMII/GMII and RGMII.
"Pushing performance, features and capabilities of the MoCA home network is key to our silicon strategy," said Patrick Henry, CEO, Entropic Communications. "Our continued collaboration with Cavium propels our mission to deliver best-in-class, low-power home networking products that allow end users to enjoy high-performance, bandwidth-intensive multimedia applications and services, while driving down costs."
The ECONA Energy Efficient ARM-based processor family offers single and dual ARM11 MPCore processors, a rich set of integrated hardware accelerators and a range of I/Os for glueless voice, video and data connectivity. Sophisticated power management techniques enable super low-power operation starting at less than 1 Watt.
Showing posts with label processors. Show all posts
Showing posts with label processors. Show all posts
Wednesday, September 9, 2009
Wednesday, September 2, 2009
AMD announces six-core AMD Opteron EE processor
BANGALORE, INDIA: AMD announced the immediate availability of the new six-core AMD Opteron EE processor at 40W ACP.
Delivering up to 31 percent higher performance-per-watt over standard Quad-Core AMD Opteron processors, the Six-Core AMD Opteron EE processor is tailored to meet the demands of customers who need strong performance, but must trim out every watt possible in a server system and reduce the datacenter’s power draw.
Many customers requiring this very low power processor deploy dense, large-scale IT projects where system power trumps raw performance and every watt of power savings can have significant positive impact on the bottom line.
AMD offers a wide range of energy-efficient processors; customers now have 15 low and very low power server processor choices available.
All of AMD’s low power processors are fully-featured and available with the same AMD Virtualization (AMD-V™) technology and AMD-P features for advanced virtualization and power savings capability as standard power versions.
This 40W ACP processor is currently being integrated in custom solutions programs and will be available from system builders for cloud and Web 2.0 customers where density and low power are key considerations.
“It’s important for our industry to look at how technology is being used and where customers have emerging needs,” said Patrick Patla, vice president and general manager, Server and Workstation Division.
“The AMD Opteron EE processor enables OEMs to deliver energy-sipping servers that don’t compromise on power management, virtualization or performance features. It is specifically designed to help address the challenges that are generating a great deal of discussion these days - building and running very dense data centers for Web services, while doing more with less.”
Delivering up to 31 percent higher performance-per-watt over standard Quad-Core AMD Opteron processors, the Six-Core AMD Opteron EE processor is tailored to meet the demands of customers who need strong performance, but must trim out every watt possible in a server system and reduce the datacenter’s power draw.
Many customers requiring this very low power processor deploy dense, large-scale IT projects where system power trumps raw performance and every watt of power savings can have significant positive impact on the bottom line.
AMD offers a wide range of energy-efficient processors; customers now have 15 low and very low power server processor choices available.
All of AMD’s low power processors are fully-featured and available with the same AMD Virtualization (AMD-V™) technology and AMD-P features for advanced virtualization and power savings capability as standard power versions.
This 40W ACP processor is currently being integrated in custom solutions programs and will be available from system builders for cloud and Web 2.0 customers where density and low power are key considerations.
“It’s important for our industry to look at how technology is being used and where customers have emerging needs,” said Patrick Patla, vice president and general manager, Server and Workstation Division.
“The AMD Opteron EE processor enables OEMs to deliver energy-sipping servers that don’t compromise on power management, virtualization or performance features. It is specifically designed to help address the challenges that are generating a great deal of discussion these days - building and running very dense data centers for Web services, while doing more with less.”
Monday, August 10, 2009
AMD intros two new dual-core, 18W TDP processors
MUMBAI, INDIA: AMD today announced immediate availability of two new dual-core, 18W TDP processors for the highly-scalable ASB1 BGA embedded client platform.
The AMD Turion Neo X2 processor Model L625 and the AMD Athlon Neo X2 processor Model L325 deliver PC-caliber performance in a very low power envelope and with an embedded-friendly ball grid array (BGA) package.
This embedded client solution is ideal for traditional embedded applications such as single board computing and thin client systems, as well as markets for self-service kiosks, point of sale machines and digital signage.
The ball grid array (BGA) package helps alleviate potential reliability issues for systems that are deployed in rugged environments and has a low z-height that is designed to enable thin, compact enclosures.
The addition of these new dual-core processors to the ASB1 BGA platform can help increase the performance of existing single-core designs. When combined with either the AMD 780E or M690E chipset, embedded system designers can take advantage of a complete x86-based solution that can help streamline development, minimize time to market and offers leading-edge graphics capability, which is increasingly important in many embedded markets.
All of AMD’s embedded products are offered with industry-standard five-year component longevity.
Systems based on the new dual-core processors are expected at launch from industry-leading embedded system providers IBASE and IEI, among others.
“We are committed to helping simplify the development cycle for our embedded customers with a platform that readily addresses the shifting needs of their markets,” said Buddy Broeker, director, Embedded Computing Solutions Division, AMD.
“Systems such as digital signage, point of sale, and thin clients require PC-class performance and a rich graphics experience. Our ASB1 BGA platform is a ready-to-go, one-stop solution for these markets and at the same time offers the flexibility of multiple CPU and chipset choices.”
The AMD Turion Neo X2 processor Model L625 and the AMD Athlon Neo X2 processor Model L325 deliver PC-caliber performance in a very low power envelope and with an embedded-friendly ball grid array (BGA) package.
This embedded client solution is ideal for traditional embedded applications such as single board computing and thin client systems, as well as markets for self-service kiosks, point of sale machines and digital signage.
The ball grid array (BGA) package helps alleviate potential reliability issues for systems that are deployed in rugged environments and has a low z-height that is designed to enable thin, compact enclosures.
The addition of these new dual-core processors to the ASB1 BGA platform can help increase the performance of existing single-core designs. When combined with either the AMD 780E or M690E chipset, embedded system designers can take advantage of a complete x86-based solution that can help streamline development, minimize time to market and offers leading-edge graphics capability, which is increasingly important in many embedded markets.
All of AMD’s embedded products are offered with industry-standard five-year component longevity.
Systems based on the new dual-core processors are expected at launch from industry-leading embedded system providers IBASE and IEI, among others.
“We are committed to helping simplify the development cycle for our embedded customers with a platform that readily addresses the shifting needs of their markets,” said Buddy Broeker, director, Embedded Computing Solutions Division, AMD.
“Systems such as digital signage, point of sale, and thin clients require PC-class performance and a rich graphics experience. Our ASB1 BGA platform is a ready-to-go, one-stop solution for these markets and at the same time offers the flexibility of multiple CPU and chipset choices.”
Friday, July 31, 2009
inSilica licenses Beyond Semiconductor's BA22 processor
SANTA CLARA, USA: inSilica Inc. has licensed the BA22 RISC processor solution from Beyond Semiconductor for use in its next generation camera processor.
The value to inSilica of Beyond Semiconductor's IP solution is to reduce power in its camera processor SoC while reducing overall silicon area cost.
The BA22 processor offers extensive power control features, including clock management and a variety of sleep modes. In addition, the BA22 offers the best-in-class code density for similar processors, resulting in lower memory requirements and consequently, a smaller die area.
"We are delighted to sign this mutually beneficial agreement with Beyond Semiconductor. Their proven IP for consumer solutions will allow us to continue to lead the semiconductor industry in developing efficient, low-cost and low-power camera processor platforms for our mobile products," said Ram Rangarajan, Vice President, Imaging. "We enjoy working with Beyond Semiconductor's excellent team."
"inSilica's decision to design our BA22 RISC processor IP solutions into its high volume mobile chip product, demonstrates their confidence in our ability and our IP," said Matjaz Breskvar, CEO at Beyond Semiconductor. "We look forward to continuing our strategic partnership with inSilica and contributing to their long-term success."
The value to inSilica of Beyond Semiconductor's IP solution is to reduce power in its camera processor SoC while reducing overall silicon area cost.
The BA22 processor offers extensive power control features, including clock management and a variety of sleep modes. In addition, the BA22 offers the best-in-class code density for similar processors, resulting in lower memory requirements and consequently, a smaller die area.
"We are delighted to sign this mutually beneficial agreement with Beyond Semiconductor. Their proven IP for consumer solutions will allow us to continue to lead the semiconductor industry in developing efficient, low-cost and low-power camera processor platforms for our mobile products," said Ram Rangarajan, Vice President, Imaging. "We enjoy working with Beyond Semiconductor's excellent team."
"inSilica's decision to design our BA22 RISC processor IP solutions into its high volume mobile chip product, demonstrates their confidence in our ability and our IP," said Matjaz Breskvar, CEO at Beyond Semiconductor. "We look forward to continuing our strategic partnership with inSilica and contributing to their long-term success."
Tuesday, June 30, 2009
TI's four new processors provide unmatched connectivity options
BANGALORE, INDIA: Connected, energy-efficient designs require high levels of peripheral integration, lower heat dissipation and longer battery life.
To address this, Texas Instruments Inc. (TI) today announced four new processors -- the TMS320C6742, TMS320C6746, TMS320C6748 and OMAP-L138, respectively -- with unmatched connectivity options and fixed- and floating-point capabilities that are also the industry’s lowest power floating-point digital signal processors (DSPs).
Ramprasad Ananthaswamy, Director, Power Management Products, Texas Instruments India said: “Packed with a unique combination of application-tuned features and peripherals, these devices reduce overall system cost for a wide spectrum of products including industrial, communications, medical diagnostics and audio.”
For instance, power protection systems benefit from the OMAP-L138 device’s fixed/floating-point DSP, ARM9, Ethernet MAC (EMAC) and LCD controller for up to $14 cost reduction compared to current solutions. For applications that need high-speed data transfer and high-capacity storage, such as test and measurement, public safety radios, music effects and intelligent occupancy sensors, the processors feature a universal parallel port (uPP) and are also the first TI devices with an integrated Serial Advanced Technology Attachment (SATA).
With performance levels up to 300 MHz, these products offer the ability to manage on-chip power through dynamic voltage and frequency scaling (DVFS) and multiple power down modes.
When coupled with TI power management software and complementary analog solutions, developers can optimize their system for performance and power without having to be an energy expert. To ease and reduce development time, the new offerings are pin-for-pin compatible with each other, code compatible with all TMS320C6000 devices and complemented by a low-cost experimenter board and full-featured evaluation module (EVM).
C6742, C6746 and C6748 DSP key features and benefits:
* Lowest-cost and lowest-power C6000 processors and industry’s lowest-power floating-point DSPs with 7mW of standby power at 1.0V/25°C and 420mW total power in use case scenarios.
* Standby power up to nine times lower than existing floating-point DSP solutions on market.
* First TI processor with an integrated SATA for high-capacity data storage.
* A uPP enables high-speed connection to data converters, FPGAs or other C6742/C6746/C6748/OMAP-L138 processors.
* EMAC, multimedia card/secure digital (MMC/SD) and high-speed USB 2.0/1.1 for desktop, network or portable connectivity or storage.
* Video port interface provides the ability to input/output raw video while a LCD controller allows developers to easily connect video graphics array (VGA) resolution displays.
* Multiple operating points facilitated through DVFS, powering off unused peripherals and selectable I/O voltages enable portability and reduce heat dissipation in products.
* Complementary TI TPS65070 power management device implements all sequence and default options as well as supports the devices’ power modes.
* C674x core up to 300MHz provides floating-point operations for high-precision and wide dynamic range as well as fixed-point operations for higher performance.
* Pin-for-pin compatibility (C6742, C6746, C6748 and OMAP-L138) enables customer to expand their entire product portfolio using the same hardware and software platform
128 KB to 448 KB on-chip memory to reduce external memory access and power usage.
OMAP-L138 processor features and benefits:
* Dual-core processor that builds on the C6748 DSP with a 300 MHz ARM9 gives developers the flexibility to add intuitive human machine interfaces, touch screens or networking capability to their applications.
* ARM9 allows developers to implement high-level operating systems, such as Linux
Windows® Embedded CE and Integrity support is expected in 4Q09.
* Low power usage with 440mW total power and 15mW in standby mode in use case scenarios.
Development tools for varying levels of expertise:
* A community-supported $149 experimenter board is available from Logic, the designer and manufacturer. The board features the OMAP-L138 system-on-module (SOM), 64MB mDDR, open source Linux, DSP/BIOS drivers and can be used to develop on any of the four devices.
* An OMAP-L138/C6748 EVM from TI is available for those that need full peripheral access and TI support. The EVM builds on the experimenter board with an extra C6748 SOM, double the memory (128 MB mDDR) and full support for connectivity peripherals.
* An OMAP-L138 (SOM) is a production-ready solution with 128 MB mDDR, power management and Ethernet PHY. It is available for less than $99 @ 10k EAU from Logic.
To address this, Texas Instruments Inc. (TI) today announced four new processors -- the TMS320C6742, TMS320C6746, TMS320C6748 and OMAP-L138, respectively -- with unmatched connectivity options and fixed- and floating-point capabilities that are also the industry’s lowest power floating-point digital signal processors (DSPs).
Ramprasad Ananthaswamy, Director, Power Management Products, Texas Instruments India said: “Packed with a unique combination of application-tuned features and peripherals, these devices reduce overall system cost for a wide spectrum of products including industrial, communications, medical diagnostics and audio.”
For instance, power protection systems benefit from the OMAP-L138 device’s fixed/floating-point DSP, ARM9, Ethernet MAC (EMAC) and LCD controller for up to $14 cost reduction compared to current solutions. For applications that need high-speed data transfer and high-capacity storage, such as test and measurement, public safety radios, music effects and intelligent occupancy sensors, the processors feature a universal parallel port (uPP) and are also the first TI devices with an integrated Serial Advanced Technology Attachment (SATA).
With performance levels up to 300 MHz, these products offer the ability to manage on-chip power through dynamic voltage and frequency scaling (DVFS) and multiple power down modes.
When coupled with TI power management software and complementary analog solutions, developers can optimize their system for performance and power without having to be an energy expert. To ease and reduce development time, the new offerings are pin-for-pin compatible with each other, code compatible with all TMS320C6000 devices and complemented by a low-cost experimenter board and full-featured evaluation module (EVM).
C6742, C6746 and C6748 DSP key features and benefits:
* Lowest-cost and lowest-power C6000 processors and industry’s lowest-power floating-point DSPs with 7mW of standby power at 1.0V/25°C and 420mW total power in use case scenarios.
* Standby power up to nine times lower than existing floating-point DSP solutions on market.
* First TI processor with an integrated SATA for high-capacity data storage.
* A uPP enables high-speed connection to data converters, FPGAs or other C6742/C6746/C6748/OMAP-L138 processors.
* EMAC, multimedia card/secure digital (MMC/SD) and high-speed USB 2.0/1.1 for desktop, network or portable connectivity or storage.
* Video port interface provides the ability to input/output raw video while a LCD controller allows developers to easily connect video graphics array (VGA) resolution displays.
* Multiple operating points facilitated through DVFS, powering off unused peripherals and selectable I/O voltages enable portability and reduce heat dissipation in products.
* Complementary TI TPS65070 power management device implements all sequence and default options as well as supports the devices’ power modes.
* C674x core up to 300MHz provides floating-point operations for high-precision and wide dynamic range as well as fixed-point operations for higher performance.
* Pin-for-pin compatibility (C6742, C6746, C6748 and OMAP-L138) enables customer to expand their entire product portfolio using the same hardware and software platform
128 KB to 448 KB on-chip memory to reduce external memory access and power usage.
OMAP-L138 processor features and benefits:
* Dual-core processor that builds on the C6748 DSP with a 300 MHz ARM9 gives developers the flexibility to add intuitive human machine interfaces, touch screens or networking capability to their applications.
* ARM9 allows developers to implement high-level operating systems, such as Linux
Windows® Embedded CE and Integrity support is expected in 4Q09.
* Low power usage with 440mW total power and 15mW in standby mode in use case scenarios.
Development tools for varying levels of expertise:
* A community-supported $149 experimenter board is available from Logic, the designer and manufacturer. The board features the OMAP-L138 system-on-module (SOM), 64MB mDDR, open source Linux, DSP/BIOS drivers and can be used to develop on any of the four devices.
* An OMAP-L138/C6748 EVM from TI is available for those that need full peripheral access and TI support. The EVM builds on the experimenter board with an extra C6748 SOM, double the memory (128 MB mDDR) and full support for connectivity peripherals.
* An OMAP-L138 (SOM) is a production-ready solution with 128 MB mDDR, power management and Ethernet PHY. It is available for less than $99 @ 10k EAU from Logic.
Monday, April 20, 2009
Intel's margins hurt again by Atom to tune of $1bn
Intel’s misjudgment of the low margins of the Atom in its netbook processor has hurt the company for the second successive quarter, according to the report: “Netbook-Mobile Internet Device Convergence: Strategic Issues and Markets,” recently published by The Information Network (www.theinformationnet.com).
The Information Network had stated on January 7 that Intel misjudged the success of the Netbook and its Atom processor to the tune of about a billion dollars for Q4. Given the low margins announced in its Q1 release, Intel is still bogged down by the Atom.
The Atom used in a Netbook is processed with 45nm feature sizes on 300mm wafers and measures 25sqmm. It is priced at about $29. Intel’s Penryn Core 2 processor is used in Notebooks. It is also processed with 45nm feature sizes on 300mm wafers and measures 107sqmm. It is priced at about $279. There is a price difference of $200 per processor between the Penryn and Atom, but more importantly, a difference of $115,000 per processed 300mm wafer.
“Intel rethought its production schedule in Q1 by allocating capacity for the Atom and for the Penryn, unlike Q4 where the cut back production on the more profitable Penryn,” noted Dr. Robert N. Castellano, president of The Information Network. “We estimate that Intel produced 5 million Atom processors and 50 million Penryns.”
On March 2, Intel and TSMC announced they had reached an agreement to collaborate on technology platform, IP infrastructure, and SoC solutions for the Atom CPU cores. That situation will improve Intel’s margins for Q2 2009.
“While the announcement was slated toward TSMC’s capability to produce Atom cores for Intel’s march into the Mobile Internet Device (MID) market, which is dominated by ARM, it was an opportunity for Intel to wipe production of the Atom off its books. I’d like to think of it as ‘Intel’s Atom Bomb’,” added Dr. Castellano. “It indicates the tech sector is not really that bad off as the numbers suggest, but just a miscalculation on Intel’s part. Indeed, Intel did say that the bottom had been reached in the PC sector.”
The Information Network had stated on January 7 that Intel misjudged the success of the Netbook and its Atom processor to the tune of about a billion dollars for Q4. Given the low margins announced in its Q1 release, Intel is still bogged down by the Atom.
The Atom used in a Netbook is processed with 45nm feature sizes on 300mm wafers and measures 25sqmm. It is priced at about $29. Intel’s Penryn Core 2 processor is used in Notebooks. It is also processed with 45nm feature sizes on 300mm wafers and measures 107sqmm. It is priced at about $279. There is a price difference of $200 per processor between the Penryn and Atom, but more importantly, a difference of $115,000 per processed 300mm wafer.
“Intel rethought its production schedule in Q1 by allocating capacity for the Atom and for the Penryn, unlike Q4 where the cut back production on the more profitable Penryn,” noted Dr. Robert N. Castellano, president of The Information Network. “We estimate that Intel produced 5 million Atom processors and 50 million Penryns.”
On March 2, Intel and TSMC announced they had reached an agreement to collaborate on technology platform, IP infrastructure, and SoC solutions for the Atom CPU cores. That situation will improve Intel’s margins for Q2 2009.
“While the announcement was slated toward TSMC’s capability to produce Atom cores for Intel’s march into the Mobile Internet Device (MID) market, which is dominated by ARM, it was an opportunity for Intel to wipe production of the Atom off its books. I’d like to think of it as ‘Intel’s Atom Bomb’,” added Dr. Castellano. “It indicates the tech sector is not really that bad off as the numbers suggest, but just a miscalculation on Intel’s part. Indeed, Intel did say that the bottom had been reached in the PC sector.”
Intel's margins hurt again by Atom to tune of $1bn
Intel’s misjudgment of the low margins of the Atom in its netbook processor has hurt the company for the second successive quarter, according to the report: “Netbook-Mobile Internet Device Convergence: Strategic Issues and Markets,” recently published by The Information Network.
The Information Network had stated on January 7 that Intel misjudged the success of the Netbook and its Atom processor to the tune of about a billion dollars for Q4. Given the low margins announced in its Q1 release, Intel is still bogged down by the Atom.
The Atom used in a Netbook is processed with 45nm feature sizes on 300mm wafers and measures 25sqmm. It is priced at about $29. Intel’s Penryn Core 2 processor is used in Notebooks. It is also processed with 45nm feature sizes on 300mm wafers and measures 107sqmm. It is priced at about $279. There is a price difference of $200 per processor between the Penryn and Atom, but more importantly, a difference of $115,000 per processed 300mm wafer.
“Intel rethought its production schedule in Q1 by allocating capacity for the Atom and for the Penryn, unlike Q4 where the cut back production on the more profitable Penryn,” noted Dr. Robert N. Castellano, president of The Information Network. “We estimate that Intel produced 5 million Atom processors and 50 million Penryns.”
On March 2, Intel and TSMC announced they had reached an agreement to collaborate on technology platform, IP infrastructure, and SoC solutions for the Atom CPU cores. That situation will improve Intel’s margins for Q2 2009.
“While the announcement was slated toward TSMC’s capability to produce Atom cores for Intel’s march into the Mobile Internet Device (MID) market, which is dominated by ARM, it was an opportunity for Intel to wipe production of the Atom off its books. I’d like to think of it as ‘Intel’s Atom Bomb’,” added Dr. Castellano. “It indicates the tech sector is not really that bad off as the numbers suggest, but just a miscalculation on Intel’s part. Indeed, Intel did say that the bottom had been reached in the PC sector.”
The Information Network had stated on January 7 that Intel misjudged the success of the Netbook and its Atom processor to the tune of about a billion dollars for Q4. Given the low margins announced in its Q1 release, Intel is still bogged down by the Atom.
The Atom used in a Netbook is processed with 45nm feature sizes on 300mm wafers and measures 25sqmm. It is priced at about $29. Intel’s Penryn Core 2 processor is used in Notebooks. It is also processed with 45nm feature sizes on 300mm wafers and measures 107sqmm. It is priced at about $279. There is a price difference of $200 per processor between the Penryn and Atom, but more importantly, a difference of $115,000 per processed 300mm wafer.
“Intel rethought its production schedule in Q1 by allocating capacity for the Atom and for the Penryn, unlike Q4 where the cut back production on the more profitable Penryn,” noted Dr. Robert N. Castellano, president of The Information Network. “We estimate that Intel produced 5 million Atom processors and 50 million Penryns.”
On March 2, Intel and TSMC announced they had reached an agreement to collaborate on technology platform, IP infrastructure, and SoC solutions for the Atom CPU cores. That situation will improve Intel’s margins for Q2 2009.
“While the announcement was slated toward TSMC’s capability to produce Atom cores for Intel’s march into the Mobile Internet Device (MID) market, which is dominated by ARM, it was an opportunity for Intel to wipe production of the Atom off its books. I’d like to think of it as ‘Intel’s Atom Bomb’,” added Dr. Castellano. “It indicates the tech sector is not really that bad off as the numbers suggest, but just a miscalculation on Intel’s part. Indeed, Intel did say that the bottom had been reached in the PC sector.”
Tuesday, April 7, 2009
AMD on cross-license dspute, Xeon 5500 and HP Pavilion DV2
Following my recent posts on the Intel-AMD cross-license dispute, I was fortunate enough to be able to meet up with Ramkumar Subramanian, VP, Marketing & Sales, AMD India, and Vamsi Krishna, Senior Technical Manager, AMD India, and discuss this, and more, in greater detail.
On cross-license dispute
On the cross-license dispute, Subramanian said: GlobalFoundries is a subsidiary of AMD. The agreement is already there with AMD. It is unclear what an artificial dispute will achieve. Intel is a much bigger company than AMD, and if they wish to divert attention from their difficulties, this is nothing much than a distracting strategy."
He added that if one reads what the European Commission's (EC) findings are, these steps are not taken unless they really believe there has been some abuse of monopoly power.
By asking questions on different angles, is Intel trying to gather more information? Remains to be seen!
Subramanian added that the end customers -- enterprises or home users -- they will tell you that the price of computing has reduced signiificantly and the quality of technology available to them has increased substantially. This is a direct result of competition. "We have merely asked for the competition to be fair and open," he contended. Value for money assumes great importance.
It is perhaps, fit that two people do not sit across the table and discuss to form a monopoly. A person who's looking to stretch their dollar would stand to benefit more from competition!
On HP Pavilion DV2
AMD also showcased a new notebook, released recently, the HP Pavilion DV2. This notebook is using the AMD Athlon NEO. Subramanian said: "We are working on platforms. At the platform level, a lot of innovation has happened in this notebook, which will give you a very rich, visual experience."
So, what does it bring to the consumer? According to Subramanian, it is the visual experience, which would be available in the normal notebook segment. Users can play HD content, complex games, etc. Krishna, added: "The moment you tune the notebook for high-end graphics applications, the Office applications become a cakewalk."
On workstation graphics
AMD also touched upon workstation graphics.
Subramanian said that AMD entered this business post the acquisition of ATI. The ATI FirePro cards available today -- whether in the range of application suites, or performance, or price -- seems to be an unbeatable proposition. "We are bringing the value of competition in the workstation space," he added.
Nvidia has been a partner in many ways, but in this space it is a competitor. AMD's FirePro series -- the applications certified on this particular card -- that's important. "We believe we will be able to penetrate this space very well," he remarked.
Why AMD commented on Intel's Xeon 5500?
I took this opportunity to ask AMD why it chose to comment on the Intel Xeon 5500, prior to its launch in India?
Krishna contended that AMD has brought a lot of innovation to the table ahead of the competition. "We have been leaders in this space, and brining innovative products to the marketplace," said.
Subramanian added: "The world should know that we are the leaders in technology. Our position would be much stronger if the market was fair and open."
Krisha noted that most people would think one-dimension -- performance. "It is the overall value you give in the whole package. A simple example -- Istanbul -- it is exactly pin compatible to the existing server platforms. The value -- customers have an extended product lifecycle.
Nehalem is a new processor, with a new platform. The IT managers would probably weigh all of the pros and cons, and arrive at decisions. Competition requirements are going up. Krishna added: "If your server investment is on the AMD server platforms, and they have a requirement of increasing computation requirements, they can swap the processors. Istanbul is a six core processor.
"In the same footprint, without changing the equation, they are multiplying the performance. Istanbul is also on the same power envelope as the existing dual- or quad-core Optron processors."
I surely need to have AMD and Intel on stage, someday, for a proper panel discussion and sort out all issues, if possible.
On cross-license dispute
On the cross-license dispute, Subramanian said: GlobalFoundries is a subsidiary of AMD. The agreement is already there with AMD. It is unclear what an artificial dispute will achieve. Intel is a much bigger company than AMD, and if they wish to divert attention from their difficulties, this is nothing much than a distracting strategy."He added that if one reads what the European Commission's (EC) findings are, these steps are not taken unless they really believe there has been some abuse of monopoly power.
By asking questions on different angles, is Intel trying to gather more information? Remains to be seen!
Subramanian added that the end customers -- enterprises or home users -- they will tell you that the price of computing has reduced signiificantly and the quality of technology available to them has increased substantially. This is a direct result of competition. "We have merely asked for the competition to be fair and open," he contended. Value for money assumes great importance.
It is perhaps, fit that two people do not sit across the table and discuss to form a monopoly. A person who's looking to stretch their dollar would stand to benefit more from competition!
On HP Pavilion DV2
AMD also showcased a new notebook, released recently, the HP Pavilion DV2. This notebook is using the AMD Athlon NEO. Subramanian said: "We are working on platforms. At the platform level, a lot of innovation has happened in this notebook, which will give you a very rich, visual experience."
So, what does it bring to the consumer? According to Subramanian, it is the visual experience, which would be available in the normal notebook segment. Users can play HD content, complex games, etc. Krishna, added: "The moment you tune the notebook for high-end graphics applications, the Office applications become a cakewalk."
On workstation graphics
AMD also touched upon workstation graphics.
Subramanian said that AMD entered this business post the acquisition of ATI. The ATI FirePro cards available today -- whether in the range of application suites, or performance, or price -- seems to be an unbeatable proposition. "We are bringing the value of competition in the workstation space," he added.
Nvidia has been a partner in many ways, but in this space it is a competitor. AMD's FirePro series -- the applications certified on this particular card -- that's important. "We believe we will be able to penetrate this space very well," he remarked.
Why AMD commented on Intel's Xeon 5500?
I took this opportunity to ask AMD why it chose to comment on the Intel Xeon 5500, prior to its launch in India?
Krishna contended that AMD has brought a lot of innovation to the table ahead of the competition. "We have been leaders in this space, and brining innovative products to the marketplace," said.Subramanian added: "The world should know that we are the leaders in technology. Our position would be much stronger if the market was fair and open."
Krisha noted that most people would think one-dimension -- performance. "It is the overall value you give in the whole package. A simple example -- Istanbul -- it is exactly pin compatible to the existing server platforms. The value -- customers have an extended product lifecycle.
Nehalem is a new processor, with a new platform. The IT managers would probably weigh all of the pros and cons, and arrive at decisions. Competition requirements are going up. Krishna added: "If your server investment is on the AMD server platforms, and they have a requirement of increasing computation requirements, they can swap the processors. Istanbul is a six core processor.
"In the same footprint, without changing the equation, they are multiplying the performance. Istanbul is also on the same power envelope as the existing dual- or quad-core Optron processors."
I surely need to have AMD and Intel on stage, someday, for a proper panel discussion and sort out all issues, if possible.
Wednesday, April 1, 2009
AMD and Intel at each other, again! Post launch of Intel's Xeon 5500 processor series
Intel has recently introduced 17 enterprise-class processors, led by the Intel Xeon processor 5500 series. The Xeon processor 5500 series, previously codenamed "Nehalem-EP," offers several breakthrough technologies that radically improve system speed and versatility. Technologies such as Intel Turbo Boost Technology, Intel Hyper-Threading Technology, integrated power gates, and Next-Generation Intel Virtualization Technology (VT) improved through extended page tables, allow the system to adapt to a broad range of workloads.
Now, even before I could analyze all of this, it was interesting to find first, AMD, and then Intel, exchanging pleasant notes on the chip's features itself! And, I am being quite mild in my statement here! :) The picture here is from the Intel Xeon 5500 launch in India.
First, AMD! According to Vamsi Krishna, Sr. Technical Manager, AMD India, "Intel launched its new processor architecture (Nehalem) yesterday, which is quite different from any of its predecessors. However, what’s amazing is that many of the ‘groundbreaking, innovative technologies’ are quite similar to technologies AMD pioneered years ago, 2003 to be precise.
"Memory controller integration into the silicon die is one of the many features included in the new Intel architecture and this is believed to boost the whole system performance significantly. However, this is a standard feature on all of AMD’s server products since 2003. Nehalem is also supported by a high speed internal bus known as Quick Path Interconnect. It will replace current FSB (Front Side Bus) in most of the current design. Again, the concept is quite similar to existing HyperTransport technology available in AMD products and is known as Direct Connect Architecture (DCA).
"Products like Nehalem and technologies like Quick Path Interconnect are simply Intel’s admission that AMD was right all along about an integrated memory controller being the key to superior processor architecture."
Naturally, I had Intel's response too on these remarks. As per an Intel spokesperson: "The platform architecture of the Xeon Processor 5500 series has some similarities with AMD’s platform architecture in the use of an integrated memory controller and high speed serial interconnect, although the QuickPath Interconnect offers greater performance and additional capabilities compared to HyperTransport. The individual design tradeoffs are not as important to customers as overall performance and efficiency. Previous generations of Intel Xeon processors were superior to competitive alternatives due to superior microarchitecture, process technology and cache implementation. The new platform advances help the Xeon Processor 5500 series widen this competitive lead."
Great! Here's a classic case of two folks sledging over nothing!
First, the Intel chip is one of its kind, as of now, and I don't think any other chip maker has a similar product, as of April 1. If they have, please come forth!
Two, AMD, if it had indeed pioneered such technologies, as those used in the Xeon 5500, in 2003, my simple question to them is: why aren't you the no. 1 player in the semiconductor space today?
Three, will this new chip make Intel a runaway winner? Too early to say! We are still in a downturn, although, some positive news have been forthcoming. Will the chip be able to make its mark? That remains to be seen. IT spends need to go up significantly for that to happen, isn't it?
Gartner recently put out a report on global IT spends. It says: "The unprecedented decline of the global economy is impacting the IT industry with worldwide IT spending forecast to total $3.2 trillion in 2009, a 3.8 percent decline from 2008 revenue of nearly $3.4 trillion. IT organisations worldwide are being asked to trim budgets, and consumers are cutting back on discretionary spending," said Richard Gordon, research vice president, and head of global forecasting at Gartner. "The speed and severity of the response by businesses and consumers alike to these economic circumstances will result in an IT market slowdown in 2009 that will be worse than the 2.1 percent decline in IT spending in 2001 when the Internet investment bubble burst."
It is not about the technologies you are using, or the process nodes. It is about market share and being there first. Who's able to do so, timely, wins! Any other discussion won't have any bearing!
Finally, to my friends at Intel and AMD: folks, do not take that cross-license deal issue to such levels. The industry does not need these things. It is a time to ally and move forward, focus on your core businesses and contribute to the overall health and growth of the global semiconductor industry.
Frankly, it takes off the joys of analysis, when people try to influence you to form a judgement they prefer! Well, I have always formed my own judgement, and right now, I feel that both friends of mine are in the wrong. Request, please shake hands!!
Now, even before I could analyze all of this, it was interesting to find first, AMD, and then Intel, exchanging pleasant notes on the chip's features itself! And, I am being quite mild in my statement here! :) The picture here is from the Intel Xeon 5500 launch in India.First, AMD! According to Vamsi Krishna, Sr. Technical Manager, AMD India, "Intel launched its new processor architecture (Nehalem) yesterday, which is quite different from any of its predecessors. However, what’s amazing is that many of the ‘groundbreaking, innovative technologies’ are quite similar to technologies AMD pioneered years ago, 2003 to be precise.
"Memory controller integration into the silicon die is one of the many features included in the new Intel architecture and this is believed to boost the whole system performance significantly. However, this is a standard feature on all of AMD’s server products since 2003. Nehalem is also supported by a high speed internal bus known as Quick Path Interconnect. It will replace current FSB (Front Side Bus) in most of the current design. Again, the concept is quite similar to existing HyperTransport technology available in AMD products and is known as Direct Connect Architecture (DCA).
"Products like Nehalem and technologies like Quick Path Interconnect are simply Intel’s admission that AMD was right all along about an integrated memory controller being the key to superior processor architecture."
Naturally, I had Intel's response too on these remarks. As per an Intel spokesperson: "The platform architecture of the Xeon Processor 5500 series has some similarities with AMD’s platform architecture in the use of an integrated memory controller and high speed serial interconnect, although the QuickPath Interconnect offers greater performance and additional capabilities compared to HyperTransport. The individual design tradeoffs are not as important to customers as overall performance and efficiency. Previous generations of Intel Xeon processors were superior to competitive alternatives due to superior microarchitecture, process technology and cache implementation. The new platform advances help the Xeon Processor 5500 series widen this competitive lead."
Great! Here's a classic case of two folks sledging over nothing!
First, the Intel chip is one of its kind, as of now, and I don't think any other chip maker has a similar product, as of April 1. If they have, please come forth!
Two, AMD, if it had indeed pioneered such technologies, as those used in the Xeon 5500, in 2003, my simple question to them is: why aren't you the no. 1 player in the semiconductor space today?
Three, will this new chip make Intel a runaway winner? Too early to say! We are still in a downturn, although, some positive news have been forthcoming. Will the chip be able to make its mark? That remains to be seen. IT spends need to go up significantly for that to happen, isn't it?
Gartner recently put out a report on global IT spends. It says: "The unprecedented decline of the global economy is impacting the IT industry with worldwide IT spending forecast to total $3.2 trillion in 2009, a 3.8 percent decline from 2008 revenue of nearly $3.4 trillion. IT organisations worldwide are being asked to trim budgets, and consumers are cutting back on discretionary spending," said Richard Gordon, research vice president, and head of global forecasting at Gartner. "The speed and severity of the response by businesses and consumers alike to these economic circumstances will result in an IT market slowdown in 2009 that will be worse than the 2.1 percent decline in IT spending in 2001 when the Internet investment bubble burst."
It is not about the technologies you are using, or the process nodes. It is about market share and being there first. Who's able to do so, timely, wins! Any other discussion won't have any bearing!
Finally, to my friends at Intel and AMD: folks, do not take that cross-license deal issue to such levels. The industry does not need these things. It is a time to ally and move forward, focus on your core businesses and contribute to the overall health and growth of the global semiconductor industry.
Frankly, it takes off the joys of analysis, when people try to influence you to form a judgement they prefer! Well, I have always formed my own judgement, and right now, I feel that both friends of mine are in the wrong. Request, please shake hands!!
Saturday, November 15, 2008
AMD's roadmap 2009 provides lots of answers... now, to deliver!
AMD's roadmap 2009, or guidance, presented during its 2008 Financial Analyst Day on Nov. 13th, provided a lot of answers to several of the questions it had been facing. Also, AMD did something Intel hasn't! It did not revise the Q4 guidance!! During a webcast, AMD CFO, Bob Rivet, said he would offer an update to the company’s earnings outlook in the first week of December. Also, one of AMD's announcements, the Yukon, is definitely not going to take on Intel's Atom, and should be priced higher.
Kicking of proceedings, Dirk Meyer, President and CEO, talked about a complete AMD & Foundry Company realignment, which includes executing key technology transitions. These include: deliver 2nd wave of 45nm products and platforms -- including chipsets; transition to 40nm graphics products; finalize 32nm designs for 2010 production. Also, deliver, market and sell platforms; and continue operational excellence.
Later, during the Q&A session, when asked about the validity of AMD's cross-license for patents with Intel, Meyer said there was no legal issue. AMD's agreement with Intel allows AMD subsidiaries to be licensed. The Foundry Company, 43.5 percent owned by AMD, qualifies as a subsidiary, as defined, as per the agreement with Intel.
Asset Smart strategy
According to Rivet, who spoke last during the Webcast, it has been a tough operating environment. However, AMD launched Asset Smart; achieved operating profitability in Q3-08 and is now making progress toward $1.5B operating income breakeven by early ‘09. It also has a richer MPU product mix and the first 45nm product has been launched. Graphics has returned to operating profitability. AMD has already divested its DTV business and plans to sell handheld.
Asset Smart manufacturing strategy
* Strategic commitment from Mubadala
* The Foundry Company plans multi-billion dollar build-out of leading edge fabs in Dresden and Upstate New York
* Expanded IBM partnership delivering leading-edge bulk and SOI process technology
Stronger financial structure
* ~$1B new cash investment
* ~$1.2B debt assumed by The Foundry Company
* Future fab capital expenditures optional
* Reduced process technology R&D costs
* Improved free cash flow by elimination of required fabrication capital expenditures offset somewhat by wafers purchased for cash (foundry model)
* Leaner and more variable business model, with a lower breakeven point of ~$1.5B
The Foundry Company
Doug Grose, Senior VP, Manufacturing & Supply Chain Management and Incoming CEO, The Foundry Company, highlighted AMD's 2009 manufacturing priorities. These are: transition to best-in-class foundry model; complete conversion to 45nm production; and successful 32nm technology development.
This October 7, AMD and the Advanced Technology Investment Co. announced their intention to create a new global enterprise, The Foundry Company, to address the growing global demand for independent, leading-edge semiconductor manufacturing. This announcement was the lynchpin of AMD’s Asset Smart plan, and a key initiative designed to enable the company to achieve sustainable profitability.
At the 2008 AMD Financial Analyst Day event, AMD provided more details on what its manufacturing operations will look like once the spin-out of The Foundry Company is complete.
* For the Silicon on Insulator (SOI) and bulk manufacturing processes needed to build AMD CPUs and APUs, The Foundry Company plans to offer AMD 65nm, 45nm and 32nm manufacturing capabilities at:
- Fab 36 (Dresden)
- Fab 38 (Dresden)
- Fab 4x (Saratoga County, NY)
* For the bulk manufacturing processes AMD uses to manufacture its chipsets and GPUs, AMD plans to have access to 55nm, 40nm and 32nm manufacturing capabilities at:
- TSMC/UMC (Taiwan)
- Fab 38 (Dresden)
- Fab 4x (Saratoga County, NY)
* The Foundry Company also provided an update on its progress towards moving to a new 32nm manufacturing process for bulk and SOI production. The company confirmed that it will complete 32nm test chips in Dresden by the end of year, and is on schedule to successfully incorporate High-k Metal Gate within this process node. 32nm technology development will ramp in late 2009 in preparation for 1H 2010 volume production.
Platforms for ultraportable notebooks and mini-notebooks
There has been lot of interest in ultraportable notebooks and mini-notebooks, owing to their small form factor and lightweight profile. AMD also announced new platforms aimed at serving these markets.
* AMD introduced two ultraportable notebook platforms -- Congo and Yukon. Congo is based on the dual-core Conesus CPU with the RS780M and SB710 chipset. Yukon is based on a single-core CPU with the RS690E and SB600 chipset. While targeted at the ultra-portable market, these platforms are designed to address a portion of mini-notebook market, especially at the dissatisfied users of limited Internet experience of mini-notebooks. Yukon is planned to be available in 1H09 followed by Congo in 2H09.
* AMD announced the 2010 ultraportable notebook platform code named Nile. It will feature dual-core Geneva CPU utilizing DDR3.
* In 2011, AMD plans to introduce the dual-core Ontario APU for ultraportable and mini-notebook platforms.
Server platforms
* Fiorano, the first AMD platform to combine AMD server processors and chipsets. It is on schedule for mid-2009 introduction based on planned release of the AMD SR5690 chipset. Fiorano will likely support Shanghai and the upcoming six-core Istanbul processor in 2H09.
* AMD's next-generation, DDR3-based server platform, Maranello, remains on track for introduction in 1H10.
Desktop platforms
* Dragon is set to launch in Q1 2009 and feature AMD's upcoming 45nm AMD Phenom II X4 quad-core processors, codenamed Deneb.
* Kodiak is scheduled to enhance AMD Business Class platforms in 2H09.
* Pisces mainstream desktop platform will debut in 2H09.
* Maui is its new home theater platform planned for launch in Q408.
There you have it! Everyone wants the global semiconductor industry to be humming and chirping! It would be great if AMD delivers on its promise and hopefully, becomes profitable all over again as well.
For those keen, PDF files of all of AMD's presentations can be downloaded from its web site.
Kicking of proceedings, Dirk Meyer, President and CEO, talked about a complete AMD & Foundry Company realignment, which includes executing key technology transitions. These include: deliver 2nd wave of 45nm products and platforms -- including chipsets; transition to 40nm graphics products; finalize 32nm designs for 2010 production. Also, deliver, market and sell platforms; and continue operational excellence.Later, during the Q&A session, when asked about the validity of AMD's cross-license for patents with Intel, Meyer said there was no legal issue. AMD's agreement with Intel allows AMD subsidiaries to be licensed. The Foundry Company, 43.5 percent owned by AMD, qualifies as a subsidiary, as defined, as per the agreement with Intel.
Asset Smart strategy
According to Rivet, who spoke last during the Webcast, it has been a tough operating environment. However, AMD launched Asset Smart; achieved operating profitability in Q3-08 and is now making progress toward $1.5B operating income breakeven by early ‘09. It also has a richer MPU product mix and the first 45nm product has been launched. Graphics has returned to operating profitability. AMD has already divested its DTV business and plans to sell handheld.
Asset Smart manufacturing strategy
* Strategic commitment from Mubadala
* The Foundry Company plans multi-billion dollar build-out of leading edge fabs in Dresden and Upstate New York
* Expanded IBM partnership delivering leading-edge bulk and SOI process technology
Stronger financial structure
* ~$1B new cash investment
* ~$1.2B debt assumed by The Foundry Company
* Future fab capital expenditures optional
* Reduced process technology R&D costs
* Improved free cash flow by elimination of required fabrication capital expenditures offset somewhat by wafers purchased for cash (foundry model)
* Leaner and more variable business model, with a lower breakeven point of ~$1.5B
The Foundry Company
Doug Grose, Senior VP, Manufacturing & Supply Chain Management and Incoming CEO, The Foundry Company, highlighted AMD's 2009 manufacturing priorities. These are: transition to best-in-class foundry model; complete conversion to 45nm production; and successful 32nm technology development.
This October 7, AMD and the Advanced Technology Investment Co. announced their intention to create a new global enterprise, The Foundry Company, to address the growing global demand for independent, leading-edge semiconductor manufacturing. This announcement was the lynchpin of AMD’s Asset Smart plan, and a key initiative designed to enable the company to achieve sustainable profitability.
At the 2008 AMD Financial Analyst Day event, AMD provided more details on what its manufacturing operations will look like once the spin-out of The Foundry Company is complete.
* For the Silicon on Insulator (SOI) and bulk manufacturing processes needed to build AMD CPUs and APUs, The Foundry Company plans to offer AMD 65nm, 45nm and 32nm manufacturing capabilities at:
- Fab 36 (Dresden)
- Fab 38 (Dresden)
- Fab 4x (Saratoga County, NY)
* For the bulk manufacturing processes AMD uses to manufacture its chipsets and GPUs, AMD plans to have access to 55nm, 40nm and 32nm manufacturing capabilities at:
- TSMC/UMC (Taiwan)
- Fab 38 (Dresden)
- Fab 4x (Saratoga County, NY)
* The Foundry Company also provided an update on its progress towards moving to a new 32nm manufacturing process for bulk and SOI production. The company confirmed that it will complete 32nm test chips in Dresden by the end of year, and is on schedule to successfully incorporate High-k Metal Gate within this process node. 32nm technology development will ramp in late 2009 in preparation for 1H 2010 volume production.
Platforms for ultraportable notebooks and mini-notebooks
There has been lot of interest in ultraportable notebooks and mini-notebooks, owing to their small form factor and lightweight profile. AMD also announced new platforms aimed at serving these markets.
* AMD introduced two ultraportable notebook platforms -- Congo and Yukon. Congo is based on the dual-core Conesus CPU with the RS780M and SB710 chipset. Yukon is based on a single-core CPU with the RS690E and SB600 chipset. While targeted at the ultra-portable market, these platforms are designed to address a portion of mini-notebook market, especially at the dissatisfied users of limited Internet experience of mini-notebooks. Yukon is planned to be available in 1H09 followed by Congo in 2H09.
* AMD announced the 2010 ultraportable notebook platform code named Nile. It will feature dual-core Geneva CPU utilizing DDR3.
* In 2011, AMD plans to introduce the dual-core Ontario APU for ultraportable and mini-notebook platforms.
Server platforms
* Fiorano, the first AMD platform to combine AMD server processors and chipsets. It is on schedule for mid-2009 introduction based on planned release of the AMD SR5690 chipset. Fiorano will likely support Shanghai and the upcoming six-core Istanbul processor in 2H09.
* AMD's next-generation, DDR3-based server platform, Maranello, remains on track for introduction in 1H10.
Desktop platforms
* Dragon is set to launch in Q1 2009 and feature AMD's upcoming 45nm AMD Phenom II X4 quad-core processors, codenamed Deneb.
* Kodiak is scheduled to enhance AMD Business Class platforms in 2H09.
* Pisces mainstream desktop platform will debut in 2H09.
* Maui is its new home theater platform planned for launch in Q408.
There you have it! Everyone wants the global semiconductor industry to be humming and chirping! It would be great if AMD delivers on its promise and hopefully, becomes profitable all over again as well.
For those keen, PDF files of all of AMD's presentations can be downloaded from its web site.
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