Dell’s Latitude-On gives TI a PC entree -- but doesn’t displace Wintel!

EL SEGUNDO, USA: Dell Inc.’s new Latitude-On concept marks the first use of Texas Instruments Inc.’s ARM-based OMAP applications processor in a notebook PC. But does it really represent a challenge to the PC hegemony now enjoyed by the X86 microprocessor and the Windows operating system?

With Latitude-On intended only to perform a specific and limited function in notebook PCs, iSuppli Corp. does not believe it represents a threat to Wintel’s dominance.

Dell describes Latitude-On as a “system on a system” wherein a regular Dell laptop using an Intel Corp. X86 and Microsoft Windows adds a separate subsystem that is based on Texas Instruments’ OMAP3430 chip.

The OMAP system allows users to boot into a slimmed-down Linux operating environment with access to a web browser. When turning on a notebook using the Latitude-On mode, the PC delivers nearly instantaneous web access, bypassing the lengthy boot-up time required for Windows.

Latitude-On aims to provide access to web-based e-mail, contacts, calendars and other Internet content and services without the lengthy boot cycle associated with traditional laptops. Basic document viewing functionality also is supported for Microsoft Office and Adobe PDF files.

Via one of its technical blogs, Dell announced the availability of Latitude-ON on its new Latitude Z series of business laptops.

In addition to TI OMAP processor, Latitude-On also includes Wi-Fi and mobile broadband connections. The Latitude-On module can also be retro-fitted to specific Latitude models.

“While at first glance Latitude-On appears to represent an encroachment of the ARM microprocessor and Linux operating system into the Wintel-dominated PC world, the reality is quite different,” said Matthew Wilkins, principal analyst, compute platforms, for iSuppli.

“Yes, Dell is making use of a TI OMAP processor-based system in these laptops, but it is only being employed for a very narrow purpose: providing a very lightweight conduit to certain types of information. It does not in any way displace the key functions of the Intel- and Microsoft-based laptop platform.”

ARM microprocessor-based chips presently do not command any significant volume in the PC market.

The main barrier for ARM’s acceptance is that there is no version of Microsoft Windows that has been compiled to run natively on the microprocessor architecture. Microprocessors based on the ARM instruction set use a fundamentally different set of operating procedures than those of the x86 processors from AMD and Intel. Therefore, an ARM-based microprocessor cannot run applications and operating systems designed for X86 chips.

Despite rumors that a port of Windows to the ARM has been or is being investigated, it seems unlikely that there will be an ARM-centric Windows PC in the near- or mid-term.

However, an ARM-centric Linux PC certainly is possible and could be an intriguing option for users looking for alternatives to Wintel in personal computing.

A boost for Texas Instruments?
TI’s OMAP processors typically are used in cell phones and various types of Mobile Internet Devices (MIDs). The processor employed by Dell for Latitude-On, the OMAP3430, is targeted primarily at smart phones.

Texas Instruments’ OMAP line dominates the market currently for standalone applications processors, with a share of 24 percent of global revenue in the second quarter of 2009. In comparison, No.-2 applications processor supplier Samsung Electronics Co. Ltd. accounted for 15.9 percent of the market during the same period.

However, Texas Instruments’ OMAP line has been under increasing competitive pressure from Samsung in the smart-phone market, primarily fueled by Samsung’s partnership with Apple Inc. for the applications processor in the iPhone. If Dell’s Latitude-One gains acceptance in the market, it could represent a significant boost for the OMAP line.

“As the market for handsets continues to mature, semiconductor suppliers traditionally targeting that segment are looking to expand their presence in other applications to help promote growth,” said Francis Sideco, principal analyst, wireless communications, for iSuppli.

Blurring the lines
The Latitude-On system endows notebook PCs with features similar to those of smart phones like the iPhone and members of the BlackBerry line, which also provide access to email and document viewing in an “instant on” manner.

“Dell’s solution certainly represents an attempt by the PC market to fight back against the kind of access that smart phones provide,” Wilkins observed. “Dell clearly has sought and received sufficient customer feedback to implement such a rapid-on and limited-environment system. However, before drawing any conclusion on the success of this approach, iSuppli will wait and see how the system performs with customers. It also will be interesting to see what the reaction will be from Intel and Microsoft.”

TI announces new 720 MHz OMAP3530 processor for multimedia apps

BANGALORE, INDIA: Giving designers more performance to run new application features and additional headroom to add their own IP, Texas Instruments Inc.(TI) announced a speed upgrade for the OMAP3530 applications processor and evaluation module (EVM).

The new OMAP3530 processor features a 720 MHz ARM Cortex-A8 core and a 520 MHz TMS320C64x+ DSP. This enables users to gain faster access to databases, spreadsheets, presentations, e-mail, audio and video attachments, Web browsing and video conferencing applications.

This single-chip solution also supports faster boot times suitable for applications such as portable infotainment, Point-of-Sale (POS) devices, Web tablets and single board computers.

720 MHz OMAP3530 processor key features and benefits:
* 720 MHz ARM Cortex-A8 core provides 1400 Dhrystone million instructions per second (MIPS).
* 520 MHz C64x+ DSP provides more headroom to optimize quality audio and video codecs and custom IP.
* POWERVR SGX subsystem for 3D graphics acceleration to support display and gaming effects.
* Comprehensive power and clock-management scheme that enables high-performance, low-power operation and low-power standby features.
* Pin-for-pin compatible with TI’s OMAP35x devices makes it easy for OEMs to efficiently create a complete product portfolio based on the single platform.

OMAP3530 EVM key features and benefits:
* Based on the 720 MHz OMAP3530 processor and can also be used to evaluate the OMAP3503, OMAP3515 and OMAP3525.
* Ability to run full-featured operating systems, such as Windows® Embedded CE and Linux.
* New S-Video/Component/Composite input, S-Video output.
* Features TI’s TVP5146 analog-to-digital video decoder.
* TI integrated power management ICs, OMAP3530 power requirements and design considerations.

TI opens world's most advanced analog manufacturing facility in the US

RICHARDSON, USA: Texas Instruments Inc. (TI) announced the opening of its manufacturing facility in Richardson, Texas. The company expects to begin moving equipment into the facility in October.

To view the Multimedia News Release, go to: http://www.prnewswire.com/mnr/ti/39147

Known as RFAB, ("R" for Richardson, "FAB" for fabrication), the fab will be the world's only production facility to use 300-millimeter (12-inch) silicon wafers to manufacture analog chips, which are essential components in virtually all electronics.

The facility will give TI a strategic advantage in high-volume production because thousands of analog chips can be etched onto each of these wafers, more than double the number on the more commonly used and smaller 200-millimeter wafers.

"The time is right for this investment," said Rich Templeton, TI's chairman, president and CEO. "Customer demand for analog chips is growing, and there's tremendous desire to save energy and protect the environment. The chips produced here will help our customers make thousands of electronic products that are more energy-efficient. It is significant that these devices will be made here, in North Texas, in one of the industry's most environmentally responsible fabs."

The facility will produce analog integrated circuits based on TI's proprietary process. Customers will use these chips in electronics ranging from smartphones and netbooks, to telecom and computing systems.

At a ribbon-cutting ceremony with local and state officials, Templeton said TI plans to ship the first chips from this facility by the end of 2010. When the first phase of equipment is ramped and producing at full capacity, the facility will be capable of shipping more than $1 billion worth of analog chips per year.

Hiring will begin immediately for 250 jobs in RFAB. "These are high-quality, well-paying engineering, manufacturing and administrative jobs for our North Texas region. The infrastructure that a facility like this requires will create other indirect jobs with suppliers and support services," said Templeton.

"We want to thank our great partners in Richardson, Dallas, Plano and Austin who helped us make this happen," Templeton said, referring to the City of Richardson, Collin County, the Plano Independent School District and the Collin County Community College District.

"Texas Instruments' decision to again invest in Texas is yet another example of how, even during these economic times, the Lone Star State remains the top choice for companies looking to expand," Gov. Rick Perry said. "Our combination of a predictable regulatory climate, low taxation and a world-class workforce that is well prepared to fill the hundreds of new high-technology jobs TI will be bringing to the area."

Recent expansions
The opening of RFAB is the most recent in a series of manufacturing expansions by TI. Earlier this year, TI opened Clark, an assembly and test facility in the Philippines. TI also has been installing new test equipment at several other locations, and is in the process of installing newly acquired 200-mm manufacturing equipment for analog chip production at sites around the world, including Dallas.

Local education benefits
Local education has benefitted from TI's decision to build the fab in Richardson. As part of the original agreement between community and state partners, the nearby University of Texas at Dallas will receive a total of $300 million from the Texas Enterprise Fund, the Texas General Land Office, the UT System, and private donors for improvement of its engineering and research programs.

"Texas Instruments has been a remarkable partner with education at all levels," said Dr. David E. Daniel, president of UT Dallas. "The impact of the RFAB's creation on UT Dallas has been dramatic in terms of recognition and research activity. This project's high profile played a direct role in our most recent efforts to reach for what many call Tier One status--our aspiration to become a nationally recognized research university. We look forward to partnering with Texas Instruments and the rest of our community as we grow toward this stature in service to the Dallas area and the region."

Green model
RFAB has been an important model of green construction. It was the first semiconductor facility to achieve Gold certification with the US Green Building Council's Leadership in Energy and Environmental Design (LEED) program. TI has applied knowledge from the RFAB designs to other facilities all over the world.

TI's single-chip power management units for portable electronics cut board space in half

BANGALORE, INDIA: Texas Instruments Inc. (TI) has introduced the TPS65070 and TPS65073 family of single-chip power management integrated circuits for portable electronics.

The new power management unit (PMU) implements all sequencing and default options to power today’s leading processors, including TI’s OMAP and digital signal processors.

The TPS65070 and TPS65073 devices result in a 50-percent smaller DC/DC implementation versus a discrete design, by integrating three highly efficient, 2.25-MHz, 1.5-A DC/DC step-down converters that support core processor, memory and I/O voltages; two general purpose, 200-mA LDOs; white LED backlighting to support up to 5-inch LED displays; I2C communications interface; 10-bit A/D converter; touch-screen interface and an integrated 1.5-A linear battery charger.

TI’s new PMUs support the following processors with easy-to-design reference designs:

* TPS65070: OMAP-L1x, TMS320C6742, TMS320C6746 and TMS320C6748 devices.
* TPS65073 and TPS650731: OMAP35x processors.

TI achieves industry’s lowest drift with family of high-voltage bipolar DACs

BANGALORE, INDIA: Texas Instruments Inc. TI) has introduced a four-channel, high-voltage, bipolar digital-to-analog converter (DAC).

Developed on TI’s HPA07 analog CMOS process technology, the 16-bit DAC8734 is part of a new family of high-performance, bipolar DACs, including pin-compatible 12- and 14-bit family members featuring up to six times lower drift than competing devices along with the widest operating temperature range and the highest initial accuracy.

The DAC8734 offers automated test equipment (ATE) and medical equipment designers space savings and flexibility in a 6 mm x 6 mm QFN-40 or 7 mm x 7 mm TQFP-48 package. The device is capable of driving ±16 V or 0 to +20 V across four channels, eliminating the external operational amplifier typically required for additional voltage gain. Designers need to add only a single voltage reference, such as the REF5050, for bipolar operation.

Key features and benefits of DAC8734:
* Lowest drift over time and temperature provides high stability
* Widest operating temperature range of -40°C to 105°C helps ensure performance in extreme environments.
* Integral non-linearity of ±1 LSB, maximum (0.006% FSR), is achievable even at 16-bit resolution. To further boost precision, the family is trimmed during manufacturing to a maximum gain error of 4 LSB (at 16 bits). Built-in user calibration further reduces gain error down to ±1 LSB, maximum, with a zero error of up to 1/8 LSB.
The device’s programmable output range of 2x to 4x the reference voltage for bipolar operation at ±2 V to ±16 V maximizes design flexibility.

TI applies digital power management to next-gen Xilinx FPGA designs

BANGALORE, INDIA: Texas Instruments (TI) announced that Xilinx is using TI power management technology to simplify power design in its new Virtex-6 ML605 FPGA evaluation kit.

TI’s Fusion Digital Power controllers give FPGA users advanced power management capability and design flexibility, including the ability to monitor a power system’s behavior in real time.

“As FPGA designs become increasingly sophisticated, there is a growing need for intelligent power management solutions with accurate current monitoring and control,” said Brent Przybus, Director of platform marketing at Xilinx.

“New developments in digital control technology from Texas Instruments give Virtex-6 FPGA customers a high degree of power system optimization, while accelerating design time with the Xilinx Base Platform.”

TI’s UCD9240 integrated power system controller, along with complementary power stage ICs and plug-in modules, intelligently manage today’s high-density, high-performance power systems, such as those used in telecom and datacom infrastructure applications.

The controller supports up to four independent digital control loops and up to eight phases. Two UCD9240 devices manage the power for the Virtex-6 FPGA ML605 evaluation kit. The kit also includes the INA333, the industry’s lowest power zero-drift instrumentation amplifier. Xilinx’s soon to be released Spartan-6 FPGA SP605 kit also includes TI’s digital power products.

Easy-to-use Fusion Digital Power design tool
The evaluation kit features TI’s digital power design tool with an easy-to-use graphical user interface, which helps designers configure key design parameters, optimize control loop design, and meet specific supply voltage sequencing criteria – with no programming required.

The tool contains real-time monitoring, control loop modeling and impedance measuring features that support Virtex-6 FPGA design requirements.

“A major focus for Xilinx’s new generation of products is reducing power consumption without compromising performance,” said Steve Bakota, manager of TI’s digital power business. “Power measurement and control are important features in Xilinx’s new development boards. Customers using our digital power products can take full advantage of advances this technology delivers.”

TI's OMAP technology powers AMX’s automation and control panels

BANGALORE, INDIA: As homes and businesses become more complex, there is a need to simplify building automation and management by eliminating the clutter of multiple control devices. To help with this, Texas Instruments Inc. (TI) announced that its OMAP technology powers AMX’s automation and control panels.

The Modero ViewPoint touch panels (MVP-5000 series), Modero wall/flush mount touch panels (NXD-500i and NXD-430 series) and the Metreau Entry Communicator devices are sleek, single-system automation panels that seamlessly manage electronics, lighting, temperature, video/audio conferences, Internet and more for homes, theatre systems, hotel rooms, meeting and conference rooms, classrooms or restaurants.

TI’s OMAP processor provides advanced processing performance and extended battery life for crisp, life-like video and graphics for these latest products.

The ARM and digital signal processor (DSP) processing architecture offered by the OMAP device enables AMX to deliver advanced graphical user interfaces (GUIs) so consumers can navigate on-screen functions with multiple windows, monitor remote security cameras and control audio and video equipment at the same time.

Additionally, the multi-core design of the OMAP processor simultaneously supports numerous functions, such as video encoding/decoding and playback, 2D/3D graphics and audio. This gives AMX the edge in designing multi-functional touch panels with exceptional system efficiency to instantly run applications without compromising performance.

With several power modes from full-powered to processor shutdown, the Modero ViewPoint touch panels for instance, take advantage of the sophisticated power management framework to yield greater energy savings by turning off unused peripherals based on the user’s activity and modes of operation.

“We are dedicated to developing flexible, compact and innovative solutions that allow consumers to easily automate their entire home or corporate environment from managing audio and video equipment, changing the thermostat, checking who is at the front door to making a phone call with just a single touch of a button,” said Robert Noble, Chief Technology Officer, AMX.

“By working with TI, we are able to address customer’s growing demands for products featuring the latest, cutting-edge technologies that are easy to operate to ultimately simplify their lives.”

Complete system-level solution
AMX leverages a complete system-level solution from TI, ranging from the OMAP applications processor to a full complement of analog ICs, including power management, interface, audio, touch screen control and logic devices.

The combined solutions pave the way for AMX’s signature ultra-light, ergonomic designs to integrate the fastest video processing, intuitive GUIs with photo-realistic graphics and low power consumption levels on a single platform.

Looking for sales in all the right places: Used semiconductor equipment

PHOENIX, USA: Semico Research Corp. study, “Used Semiconductor Manufacturing Equipment: Looking for Sales in All the Right Places,” identifies opportunities in the used semiconductor market.

This week, as the study is being released for publication, it is being reported that Texas Instruments is interested in taking over the 300mm assets from Qimonda’s US-based fab in Virginia. This announcement confirms one of the major opportunities pointed out in the study.

One of Semico’s major findings relates to advanced 300mm fabs which currently offer manufacturing capability from 90nm to 45nm. These fabs will be converted from the production of once leading-edge processors and memory devices to the production of other semiconductors such as analog devices, image sensors, mixed signal parts and other logic devices.

Some of these semiconductors will migrate to production at 90nm or less, using the 300mm tools at their original design capabilities.

The study goes on to identify other opportunities for semiconductor products that use trailing edge, mature and advanced 300mm technologies.

Trailing Edge Fabs (Technology Nodes > 0.80µm): Wafer demand for trailing edge semiconductors will increase more than 20% from 2008 through 2013. Bargain-priced 200mm tools are now on the market. This creates a sales opportunity for used 200mm tools to be used for trailing edge production at nodes well below their original capabilities.

Mature Fabs (Technology Nodes from 0.80µm to 130nm): Wafer demand for products requiring 0.80µm to 130nm capacity will increase more than 16 percent from 2008 through 2013. This creates an opportunity for the sale of used 200mm tools to be put back into production to meet capacity requirements.

Semico’s Study MA108-09 predicts that other semiconductors will migrate to production on 300mm equipment. The purpose will be to increase production capacity while realizing the cost benefits of production on 300mm wafers. This is exactly what TI appears to be doing by purchasing the advanced Qimonda tools. TI is acquiring 300mm wafer capacity for production of analog products.

The Semico study, “Used Semiconductor Manufacturing Equipment: Looking for Sales in All the Right Places,” provides five-year forecasts for worldwide semiconductor shipments by device type, wafer demand and fabs required for production (Trailing Edge, Mature, Advanced and Leading Edge). Finally, the study provides a five-year forecast for semiconductor equipment supply and demand.

TI dramatically reduces system cost in consumer audio with class-D amplifiers

BANGALORE, INDIA: Texas Instruments Inc. today introduced a 15-W stereo, true filter-free, analog-input, class-D audio amplifier.

The device’s advanced electromagnetic interference (EMI) suppression technology eliminates the need for costly inductor-based output filters, reducing bill of materials (BOM) cost by as much as 50 percent.

The TPA3110D2’s SpeakerGuard protection circuitry protects speakers from damage, helping to reduce end equipment customer returns and associated support costs.

The device also features enhanced performance, making the TPA3110D2 an excellent choice for consumer audio applications, including HDTVs, media docking stations, digital radios and sound bars.

The TPA3110D2:
* Filter-free advanced EMI suppression technology reduces bill of materials costs by as much as 50 percent, yet meets EMC performance specifications. Costly inductor-based output filters are replaced with low-cost ferrite bead filters, reducing board space.
* SpeakerGuard technology includes an adjustable power limiter and DC protection circuitry on the audio inputs, preventing speakers from being overdriven or damaged by DC currents due to board component failure or defects on the audio input circuitry.
* Ultra-low THD+N performance of < 0.1 percent THD+N over full power range at 1 kHz and advanced click-and-pop suppression circuitry enables outstanding audio performance and fidelity.
* Flow-through pin-out facilitates hassle-free layout and optimizes thermal performance with high-voltage pins on one side and input and control pins on the other.
* Differential inputs enables excellent common mode noise rejection and high-fidelity audio.

TI unveils three new multi-channel video decoders

BANGALORE, INDIA: Texas Instruments Inc. introduced the new TVP5158, TVP5157 and TVP5156 multi-channel NTSC/PAL video decoders that deliver superior picture quality.

The new devices feature advanced 2D adaptive comb filter core and image enhancement techniques, such as auto contrast and video noise filtering. With the ability to simultaneously decode four channels of video input, the new TVP515x solutions are ideal for video surveillance and video conferencing designs that require multiple-channels of decoding in a cost- and space-efficient manner.

These applications include multi-channel digital video recorders (DVR), digital video servers (DVS), hybrid DVRs, cameras for video conferencing and digital signage products.

Additionally, flexible video outputs on the TVP5158 and seamless interface to TI digital media processors based on DaVinci technology (TMS320DM6467 and TMS320DM365) reduce system cost by up to $10 by eliminating the need for an external FPGA. For product details, please visit: www.ti.com/tvp5158-prprod.

TVP5158, TVP5157 and TVP5156 key features and benefits:
* Four high-quality NTSC/PAL video decoders on each TVP515x chip can concurrently decode four video channels and then stream a single output to the DSP, enabling customers to benefit from a lower cost per channel.
* High-quality five-line adaptive comb filter algorithms for all NTSC/PAL standards.
* Multi-chip operation with two TVP5158 devices allow for simultaneous eight channel half D1 or eight channel CIF output.
* Auto contrast improves image quality under poor lighting conditions and off-loads processing from the associated DSP, giving customers more headroom to implement other algorithms.
Video noise reduction with 2D spatial filtering improves image quality and compression ratio under poor lighting conditions for better storage compression.

TI delivers industry’s smallest 16-bit ADC

BANGALORE, INDIA: Texas Instruments Inc. (TI) introduced a family of 16-bit analog-to-digital converters (ADCs) packaged in a leadless QFN measuring 2.0 x 1.5 x 0.4 mm – 70 percent smaller than the nearest competition.

In addition to significant system space savings, the ADS1115 family provides product options for scalable integration to reduce component count and simplify design.

This family supports battery monitoring, portable instrumentation, industrial process control, smart transmitters, medical instrumentation and other industrial and consumer systems. For more product information, see www.ti.com/ads1115-pr.

"Analog customers require ever higher functionality and performance without sacrificing system size and power in order to take their products to the next level," said Art George, senior vice president of TI’s High-Performance Analog business unit.

"By reducing size by 70 percent and delivering a complete family of integration and resolution options, the ADS1115 will help designers achieve a smaller system footprint, lower power, higher performance and easy design implementation."

Apoorva Awasthy, Business Development Manager, Analog, Texas Instruments India, said: "Designed for precision, power efficiency and ease of implementation, the ADS1115 family performs conversions at programmable data rates up to 860 samples per second (SPS), consuming just 150 µA (typical) of supply current and operating down to 2 V.

"The ADS1115 is the most highly integrated member of the new family, incorporating an oscillator, low-drift reference, programmable gain amplifier, comparator and four-channel input multiplexer into a tiny package. This family also includes 12-bit versions for increased flexibility. We see a lot of potential for this product in India."

Key features and benefits
* Ultra-tiny, leadless QFN (RUG) package (2.0 x 1.5 x 0.4 mm) for unmatched system space savings.
* Complete family with product options for scalable selection of on-chip integration reduces component count and simplifies design.
* 14x faster sampling rate supports demanding measurement requirements.
* Integrated programmable comparator simplifies system monitoring.
* Performance upgrade for embedded ADCs.
* Customers can speed time-to-market with compatible TI devices, including amplifiers (OPA333, INA333), references (REF33xx), temperature sensors (TMP102) digital isolators (ISO721), digital-to-analog converters (DAC7731, DAC856x) and ultra-low-power microcontrollers (MSP430).

Competition for high-growth mobile chip market escalating

SCOTTSDALE, USA: The battle for the fast-growing mobile semiconductor market will intensify in late 2009 with the introduction of new processors from each camp–ARM and x86, reports In-Stat.

Intel will introduce processors that will finally reduce the power consumption of the x86 architecture to acceptable levels for smartphones and other mobile devices.

Shortly after, many in the competing ARM camp, including Freescale, TI, and Samsung, will essentially be scaling up performance with multi-core processors that maintain similar power levels to existing single-core products.

“While both will offer competitive solutions, In-Stat does not anticipate quick changes in the current market mix; the x86 architecture dominates the computing applications, and the ARM architecture dominates cellular devices,” says Jim McGregor, In-Stat analyst.

“Mini-notebooks will be the primary battleground as the market starts seeing some crossover in 2011. However, both architectures are likely to co-exist as devices become more focused in features and usage models.”

Recent research by In-Stat found the following:
* The Total Available Market (TAM) for merchant market mobile processors is projected to grow 22.3 percent through 2013.
* Integration of additional cores, graphics/multimedia, I/O, and baseband functionality will continue, particularly in handheld applications. Among smartphones, for example, 87 percent will feature mobile processors with integrated baseband functionality by 2013.
* The estimated value of the processing, graphics/multimedia, and baseband functions will all increase at double-digit growth rates over the next few years.

Semiconductors and ICs update: Gauging fallout from ITC's Tessera ruling

USA: Presenting Converge's Market Intelligence Report, August 2009.

Overall, the general IC activity has remained relatively flat compared to last month. However, the shortages discussed in last month’s Market Insights report for the Xilinx Virtex 5 product line continue, as do those mentioned from TI, Altera and Freescale.

Activity for ST Micro has increased over the last several weeks, most likely out of concerns regarding the ITC's Tessera ruling. Consumer/telecom demand is still subdued, but demand in the industrial PC and embedded technology sectors are showing some signs of life.

Fallout from the ITC's Tessera ruling has been difficult to gauge, as specific information regarding the judgment has been slow to emerge. Some suppliers have adhered immediately to what they perceive will be the strictest letter of the law, while others have been quick to move inventory to make it available for sale in anticipation of enforcement.

In addition, increased customs enforcement by nations in Asia and Europe have made it much more difficult and time-consuming to move certain products, including FPGAs, from one region to another. Converge is advising our customers to add an additional one to two weeks to lead times on parts originating from these countries.

TI tops ABI Research's MID platforms vendor matrix ranking

NEW YORK, USA: Texas Instruments has been ranked at the top of the latest Vendor Matrix released by ABI Research.

NVIDIA and Freescale Semiconductor claimed the second and third spots in the company’s new evaluation of worldwide Mobile Internet Device (MID) platform vendors.

“Congratulations to TI for taking the MID Platforms vendor title for the second time,” said Jeff Orr, senior analyst.

“The company’s current MID platforms, incorporating ARM processor cores, excelled in several categories, including the implementation of every mobile operating system we examined –- from Windows Mobile to Palm’s webOS.”

Seven PC and mobile operating systems were factored into scoring. NVIDIA and Freescale represent the next generation of multimedia-rich MID platforms, which are expected to debut during the second half of 2009.

The Vendor Matrix is an analytical tool developed by ABI Research to provide a clear understanding of vendors’ positions in specific markets. Vendors are assessed on the important parameters of “innovation” and “implementation” across several criteria unique to each vendor matrix.

For this particular matrix, under "innovation," ABI Research examined these platforms’ connectivity options, their level of voice support, the capabilities of their processors, their displays, and the integration and support services available to licensees and manufacturers of the MID platform.

“TI received perfect scores for its range of voice support, display capabilities and integration support services,” notes Orr. “The company offers development tools, reference designs and consultative services necessary to accelerate MID design programs into manufacturing.”

Under "implementation," ABI Research scrutinized the following criteria: existing customer types (ie. what PC system, mobile handset and consumer electronics vendors are currently buying or licensing the MID platform or architecture); commercially available products, current PC operating system support, and existing mobile operating system support.

TI's FlatLink transmitter offers first glueless connection to low-power embedded processors

DALLAS, USA: Texas Instruments Inc. has introduced the first LVDS serializer that connects directly to 1.8-V powered processors.

Using TI's FlatLink technology, the SN75LVDS83B eliminates the need for a costly level shifter when using 1.8-V and 2.5-V logic interfaces, lowering cost and reducing board space by up to 83 percent.

The SN75LVDS83B supports 8-bit color and serializes RGB data. It then consolidates 24 data lines into one LVDS clock and four LVDS data pairs, which connect to LCD modules. For product details visit: www.ti.com/sn75lvds83b-pr.

The SN75LVDS83B supports applications such as netbooks, mobile Internet devices, digital picture frames and others where an LVDS link from a processor to the LCD module is required.

The SN75LVDS83B supports a very broad pixel frequency range from 10 MHz up to high-definition (HD) screen resolutions of 135 MHz. The device is compatible with numerous processors, including OMAP35x applications processors and digital media processors based on TI's DaVinci technology.

Key features and benefits
* Connects directly to any TTL level from 1.8 V to 3.3 V, eliminating the need for additional components.
* Eliminates the level shifter, lowering cost by more than one dollar and reducing board space by up to 83 percent with the BGA package, and up to 39 percent with the TSSOP package.
* 135-MHz pixel clock supports HD screen resolutions.

The SN75LVDS83B is available now in a 56-pin TSSOP priced at $2.60, and a 56-ball BGA package priced at $2.80. The SN75LVDS83A is available in the 56-pin TSSOP package only.

The SN75LVDS83A has a maximum frequency of 100 MHz, supports only 3.3-V input levels and is priced at $2.10. All prices are for quantities of 1,000 units.

Ittiam's off-the-shelf multi-channel DVR system for video security apps

BANGALORE, INDIA: Ittiam Systems has announced an off-the-shelf multi-channel digital video recorder (DVR) system based on the TMS320DM646x digital media processor from Texas Instruments (TI) for high quality and reliability applications in the video security industry.

Ittiam's DVR system is designed for a broad range of DVR products including PC add-on-cards, rack-mounted recorder cards and stand-alone DVR systems. It is a complete system solution with media compression technology, feature-rich application and an intuitive user interface.

At its core, the system leverages Ittiam's high performance H.264 Main Profile encoder with application specific enhancements, such as bit-optimal VBR rate control, subjective quality improvements exploiting spatial activity-based bit consumption optimizations and field picture encoding modes for interlace camera inputs.

The highly optimized H.264 encoder and decoder leverage the performance of TI's DM646x processor to enable system performance of four channels of simultaneous recording, eight channels of file playback or simultaneous recording up to four channels and playback up to two channels (at 600MHz).

The DVR system combines high-quality media compression with video security specific live recording options, interactive media file playback, dual-streaming capability and an intuitive Web browser based user interface.

Live Recording features overlay date, time and other user configured information in the recorded files and event triggered pre-event recording with configurable trigger options enabling optimized utilization of storage space.

Recorded files can be played on standard players such as QuickTime(TM) and VLC(TM). Playback features include multi-channel video composition, file listing, file selection, trick play and single step modes to enable close review of live recordings.

Dual streaming allows high quality recording and bandwidth optimized streaming from a given camera simultaneously. Hybrid operations enabling simultaneous multi-channel live camera recording and streaming and file playback are supported.

The DVR system is also equipped with notifications of events such as loss of camera signal, network connectivity or low disk space and is equipped with comprehensive handling for these events.

The Web browser user interface enables easy user access to all DVR features. An additional IR based remote control option to control local file playback completes the intuitive user interface.

"With a powerful system-on-chip like the DM646x, it is critical to leverage the device features and functionality to deliver the highest possible performance," said Sattam Dasgupta, vice president, media streaming business, Ittiam Systems. "We have ensured this by designing a system that optimizes the critical path across BSP, codecs, media system and application," he added.

"Building off their technology expertise, Ittiam was able to leverage the functionality of the DM646x digital media processors to create this very feature-rich, off-the-shelf solution," said Jacob Alamat, TI's digital media processors business manager. "By optimizing this solution, Ittiam is helping customers get to market faster."

The DVR system leverages all avenues of optimization at system and component levels including hardware, board support package, media encoders and decoders to provide an optimized and reliable video security DVR solution. It is proven in high end surveillance for government systems and applications including aerial, maritime surveillance and law enforcement car DVRs.

This system is available off-the-shelf from Ittiam enabling a faster time-to-market for customers and is delivered along with datasheet, user guide and comprehensive test reports. Ittiam also offers hardware design expertise, customizations to the DVR software system including custom GUI and board support package to suit custom application requirements.

Q2 results reveal healthy inventory positions for major chip suppliers

EL SEGUNDO, USA: Most major global semiconductor suppliers that have reported second-quarter results are currently holding lean levels of chip inventory, putting them in a strong competitive position as demand begins to recover, according to iSuppli Corp.

Of 15 companies that have reported second-quarter results, 11 indicated that their Days of Inventory (DOI) during the period were at a lower level compared to their average level for the past three years. Eight of the companies reported inventories lower than the average by double-digit percentages.

“The latest results from semiconductor suppliers validate iSuppli’s assertion that inventories have been reduced to appropriate levels, down from previously excessive positions,” said Carlo Ciriello, financial analyst for iSuppli.

“Inventory levels are lean—but appropriate—given current revenue levels. With fab utilization so low, semiconductor suppliers can ramp up production to build inventories to meet increased demand, should it be necessary.”

With inventories having been excessive in recent times, companies with DOI of 10 percent or more less than their trailing three-year average are in optimal competitive positions, having adjusted for the new supply and demand equation brought by the dramatically smaller end markets.

With annual chip demand expected to peak in the third quarter to be followed by a decline sequentially in the fourth quarter, the present quarter represents the best—and possibly last chance—for managers to cut inventories in order to meet new equilibrium levels.

The figure presents second-quarter DOI for 15 semiconductor suppliers that have reported results for the period compared to their respective trailing three-year DOI averages.

iSuppli: Average Days of Inventory Compared to Three-Year Average for Semiconductor Suppliers Reporting Second-Quarter ResultsSource: iSuppli

No second-half snap-back for inventories
The world’s leading chip supplier, Intel Corp., in the second quarter held DOI 19 percent below its three-year average.

Other companies running notably lean inventories included Texas Instruments Inc. at negative 10 percent, Qualcomm Inc. at minus 25 percent, Advanced Micro Devices Inc. (AMD) at minus 25 percent, Micron Technology Inc. at negative 23 percent, NXP at minus 19 percent and Xilinx Inc. at negative 19 percent.

Significantly, companies reporting second-quarter results indicated that there is no major inventory build in the offing.

Intel described its current levels as being “in very good shape,” while Qualcomm has said the inventory contraction “has now stabilized.” AMD said it is “pleased with our current inventory position.”

“Many semiconductor suppliers are anxious about expected demand levels in the fourth quarter, following the conclusion of the peak third-quarter buying season,” Ciriello said. “Because of this concern, they are being cautious about rebuilding inventories beyond what future demand can justify.”

Top 20 semiconductor suppliers sales surge 21 percent in 2Q09!

USA: The 2Q09 results from the top 20 semiconductor producers illustrate why IC Insights has, since the beginning of this downturn, encouraged its clients to think quarterly about 2009! As shown below, the semiconductor industry continues to move through this silicon cycle very quickly on its way to recovery.

4Q08 — The beginning of the downturn/collapse
1Q09 — The bottom of the cycle
2Q09 — Inventory replenishment phase
3Q09 — Seasonal increase in demand
4Q09 and beyond — Market growth will mirror the health of the worldwide economy and electronic system sales

Over the past few years, much has been said regarding the "maturing" of the semiconductor industry and less volatile cycles. However, IC Insights' new Mid-Year Update to The McClean Report shows that the trend toward a less volatile semiconductor market does not apply when looking at the industry on a quarterly basis.

As shown in Fig. 1, the top 20 semiconductor companies, in total, registered a 2Q09/1Q09 sales increase of 21 percent. This was a 37-point swing compared to the 1Q09/4Q08 results when these same top 20 suppliers endured a sales drop of 16 percent!Source: IC Insights

As discussed in detail in IC Insights' Mid-Year Update to The McClean Report, much of the semiconductor sales surge in 2Q09 was due to inventory replenishment after the severe cutbacks of 4Q08 and 1Q09. However, seasonal demand for electronic systems is forecast to drive 3Q09 semiconductor sales up by at least another 8 percent.

IC Insights continues to forecast a 17 percent decline for the full-year 2009 semiconductor market (the same forecast it presented in December of 2008).

Spurred by the bottoming of the worldwide economy from global recession in 1Q09, the semiconductor market is forecast to continue along its recovery path in the second half of this year and gain further momentum in 2010.

Climbers:
TSMC — As forecast by IC Insights, the world's largest IC foundry almost doubled its sales in 2Q09. In fact, all of the four major pure-play foundries (TSMC, UMC, Chartered, and SMIC) registered very strong 2Q09 sales.

TSMC is expecting another 20 percent increase in sales in 3Q09. Moreover, the company raised its 2009 capital spending budget from $1.9 billion to $2.3 billion, which is good news for the struggling semiconductor equipment suppliers. Considering that the company only spent $390 million in the first half of 2009, a huge jump in spending (to $1.9 billion) is scheduled for the second half of this year!

Hynix — One of the world's largest memory suppliers, Hynix displayed a 40 percent sales surge in 2Q09/1Q09 and replaced AMD in the top 10. The company cited rebounding average selling prices (ASPs) for both flash memory and DRAM as a key boost to its sales figures.

IC Insights expects that memory ASPs will continue to rise in the second half of 2009 and beyond as the severe cutbacks in memory capital spending and facility closures further restrict available capacity.

MediaTek — High-flying fabless IC supplier MediaTek joined the top 20 ranking by jumping six positions in 1Q09. As shown, the company moved up another two spots, to number 17, in 2Q09 with a 20 percent jump in sales.

The company continues to attribute much of its success to the "stay-at-home-economy" driving digital TV IC sales as well as continued strength in its core wireless communications business.

Descenders:
AMD — The second-largest MPU supplier in the world has continued to find that it is no fun to be in competition with the giant Intel! As shown, the company fell out of the top 10 in 2Q09 by barely growing (+0.6 percent), while Intel increased its sales by 12 percent. Moreover, AMD's guidance for 3Q09 was uninspiring, saying that it expects its sales to be "up slightly" from 2Q09.

Freescale — Freescale dropped from being ranked 16th in 2008 to 18th in 1Q09 to 20th in 2Q09 and was one of only two top-20 companies (along with Fujitsu) to register a 2Q09/1Q09 sales decline (-2 percent).

The company is in the midst of a major re-organization (eliminating its cellular phone business) and its fortunes are increasingly influenced by the health of the automotive industry.

Fujitsu — Fujitsu dropped from being ranked 17th in 1Q09 to 22nd in 2Q09 (Nvidia replaced Fujitsu in the 2Q09 top 20 ranking) as its 2Q09/1Q09 sales declined by 9 percent. The company stated that its flash memory and automotive device sales suffered the most in 2Q09.

However, Fujitsu believes that its customers' excess device inventories have now been depleted and that consumer demand is picking up.

TI's fully integrated 10-A synchronous buck converter with integrated FETs

BANGALORE, INDIA: Texas Instruments Inc. has introduced a fully integrated, 10-A synchronous buck converter with integrated FETs that combines wide input, light load efficiency and reduced solution size to enable increased power density.

The TPS51315, a 1-MHz DC/DC switcher, features D-CAP Mode control scheme, which allows a fast transient response while reducing the required number of external output capacitors by 32 percent compared to competing devices.

This converter helps designers meet Energy Star/90 Plus guidelines by utilizing auto-skip mode and Eco-mode light load control schemes to achieve high efficiency across the entire load range.

Its wide input and output voltage ranges and programmable switching frequency can enable designers to meet the requirements of power-dense applications in embedded PCs, notebooks and other computing applications, as well as base stations and network attached storage.

Key features and benefits:
* Input voltage of 3 V to 14 V and an output voltage range of 0.75 V to 5.5 V allows for flexible design in 3.3-V, 5-V and 12-V power systems and can power various components, such as DSPs, FPGAs, ASICs, I/O and DDR memory cores.
* Integrated power MOSFETs enable high efficiency of more than 91 percent at full 10-A output current.
* Adaptive on-time D-CAP Mode control scheme allows less than 100 nsec response time in load step transient with fewer components.
* Selectable auto-skip/Eco-mode light load control schemes achieve high efficiency at light loads.
* Complements TI’s full power management portfolio for chipset cores and DDR memory, including PWM controllers, DDR termination linear regulators, DC/DC converters and controllers and power interface devices.

One-two punch knocks wireless semicon market back to 2003

EL SEGUNDO, USA: The combination of the global recession and excess inventory has set back the wireless semiconductor market to levels not seen since 2003, according to iSuppli Corp.

Global revenue for wireless semiconductors, the majority of which are used in mobile handsets, is set to decline to $39.4 billion in 2009, down a stunning 26.7 percent from $53.8 billion in 2008. This is the lowest level of annual revenue for the wireless semiconductor industry since it generated $34.7 billion in 2003.

“While all major application markets for the semiconductor industry will contract this year, the wireless area arguably will post the worst performance,” said Francis Sideco, senior analyst for wireless communications at iSuppli. “Wireless semiconductors were hit in the first half by the one-two punch of soft end-market demand and an inventory correction.”

The figure presents iSuppli’s forecast of global annual wireless semiconductor revenue. This figure consists of revenue from sales of all semiconductors used for wireless applications, including mobile handsets, wireless infrastructure equipment, WLANs and connectivity products.Source: iSuppli, July 2009

While 2009 will be a poor year by any measure, conditions are improving markedly in the second half.

“As the wireless semiconductor market enters the second half of 2009, iSuppli expects a return to normal seasonality and growth, which will continue into 2010 and beyond,” Sideco said. “With that return comes opportunities to not only survive but also to thrive for those companies properly positioned to take advantage of new product trends, driving the next round of growth.”

MIDs deliver max opportunity
One new product trend is the accelerating momentum behind Mobile Internet Devices (MIDs) and mobile consumer electronics. These devices and their requirements have created a veritable arms race in the mobile wireless semiconductor market.

At the heart of this race is the fact that just as MIDs fill the space between notebooks and smart phones, their requirements will also dictate that performance be optimized for processing capability and power consumption.

However, although these two parameters were traded off by chipset and system design in traditional devices, chipset solutions targeting this space can no longer afford to do the same sort of exchange and remain competitive.

Two main microprocessor architectures are being used today and will continue to be employed by MID-class devices: X86 and ARM. X86-based architectures from companies such as Intel and AMD traditionally have been used in compute platforms such as desktops and notebooks.

In contrast, ARM-based architectures such as those solutions from Texas Instruments, Qualcomm, ST-Ericsson and Infineon typically have been used in mobile phones.

Consequently—or at least historically—X86 microprocessors are optimized for processing capabilities while ARM-based devices have been tailored for low power consumption—in line with the requirements of their respective target markets.

ARM vs. X86
“The difference in historically optimized capabilities between the two architectures represents the crux of one of the most competitive races ever to be contested by semiconductor chipset manufacturers,” Sideco said.

“The issue simply is that MID-class devices are unique in that in most cases, they require the processing capabilities of compute platforms and the power consumption performance of mobile devices. This begs the question: Is it easier for a processing-optimized architecture to now solve the power consumption problem or for a power-optimized architecture to solve the processing problem?”

iSuppli believes that companies with a focus on optimizing the balance between these two parameters for specific target devices can achieve an advantage by more quickly addressing the requirements of MID-class devices.

Next-gen rising
Another such trend that iSuppli has identified as a key inflection point is the upcoming wave of upgrades for next-generation technologies and networks, such as HSPA+ and LTE, as well as the corresponding backhaul and upgrades of core networks that are required to fully take advantage of the advances in these radio access technologies.

While these upgrades are not forecasted to really occur until 2010-2011, product cycles require that in order to meet this window, semiconductor suppliers should now be aligning their R&D efforts to best catch this upcoming wave.