BANGALORE, INDIA: Infineon Technologies AG announced that its unique chip-based asymmetric authentication solution has been ported to Intel vPro technology, providing the basis for IT system administrators, OEM Tech Support and Warranty Services to improve the integrity of computer systems.
At the recent Intel Developer Forum 2009, Infineon demonstrated how chip-based authentication can help implement authentication of PC peripherals and improve the integrity of enterprise systems. The Infineon ORIGA (SLE 95050) chip makes it possible to recognize if a peripheral or accessory, such as external storage devices and graphics cards, is original equipment or cloned.
Cloned devices, which may not offer the same level of reliability, quality and warranty as authorized original equipment, cannot be operated on a system configured to work only with authenticated hardware. In environments with Intel vPro technology, IT administrators and other authorized users can use Intel Active Management Technology (AMT) to authenticate system components and perform inventory checks of networked assets.
“Authentication of devices can enhance system security by restricting access if an unauthorized PC peripheral or accessory is attached to a client device,” said Paolo Cocchiglia, Vice President, ASIC and Power IC, Infineon Technologies North America Corp.
“In conjunction with Intel vPro technology, it can also improve reliability and help to reduce maintenance issues by preventing deliberate or accidental use of cloned devices, since an administrator can readily identify any cloned or unauthorized devices attached to a system and address the issue before it causes problems. Together with energy efficiency and communication, security is one of the three focus areas of Infineon.”
“We are committed to creating an ecosystem of suppliers and partners to enhance the native capabilities of Intel vPro technology,” said Larry Wiklund, Director Business Development, Business Client Group, Intel.
“Infineon’s demonstration of hard-wired authentication for system components and peripherals shows how IT administrators can gain access to a new and powerful tool to enhance the integrity of systems and help validate that all hardware in a digital office environment complies with corporate requirements.”
In the demonstration, a USB-stick containing the ORIGA chip acted as a peripheral to be authenticated. In practice, manufacturers of peripherals and accessories, including graphics cards, external storage devices, networking cards, user interface accessories, notebook and netbook batteries, etc., would integrate the chip into their products, working with Infineon to implement a secure authentication supply chain.
The demonstration utilizes the IDE_REDIRECT feature of Intel AMT to illustrate how remote secure manageability from Intel can be coupled with strong and secure authentication technology from Infineon to deliver solutions for a secure digital office.
Infineon’s authentication chip, the ORIGA (SLE 95050), provides asymmetric authentication based on elliptic curve cryptography (ECC). The low-power chip, with single wire bus interface, can be operated in a bus-powered mode and contains a hardware-protected private key that is integrated into the peripheral device.
The host device only contains a software resident public key that is used in the authentication process. ECC is a more advanced encryption/decryption algorithm than today’s asymmetric systems (i.e. RSA) and the public/private key algorithms are recognized as more secure than symmetric, shared key systems like AES and DES.
The ECC asymmetric authentication technology allows different host-to-peripheral authentication which is independent of the location of the peripheral or the communication interface (wireless, local, wired, chip-to-chip, etc.).
Additional applications of ORIGA technology include allowing service providers (i.e. Internet, data service, media provider) to use secure authentication technology to deliver content to the rightful subscriber or owner, and providing consumers with a tool for secure digital home environments.
Showing posts with label Intel. Show all posts
Showing posts with label Intel. Show all posts
Thursday, October 1, 2009
Thursday, September 24, 2009
Intel technology, processing power key to TV revolution
INTEL DEVELOPER FORUM, SAN FRANCISCO, USA: The television, both the device and the experience, has arrived at an inflection point. In keynote addresses today at the Intel Developer Forum, Intel executives Eric Kim and Justin Rattner discussed what happens and what's needed when the full Internet converges with broadcast networks.
The executives laid out the opportunities, both short- and long-term, to make the TV experience more visual, more personal and more interactive.
Kim, senior vice president and general manager of Intel's Digital Home Group, took the wraps off the Intel Atom processor CE4100, the newest system-on-chip (SoC) in a family of consumer electronics (CE) media processors, and announced efforts with several key industry players including Adobe, CBS, Cisco and TransGaming which are helping to make the vision of interactive TV a reality in the short-term.
"At the center of the TV evolution is more processing power, which we deliver with the CE4100 media processor, built on the Intel Atom core and optimized for IPTV digital set-tops, connected media players and digital TVs," said Kim. "With its performance and high-resolution graphics capabilities, CE manufacturers and software developers now have a platform for real innovation."
According to Rattner, Intel's chief technology officer and Senior Fellow, that innovation will accelerate in the next few years.
"By the year 2015, you can expect 15 billion consumer devices capable of delivering TV content with billions of hours of video available," said Rattner. "We'll need much more sophisticated ways to organize content and provide it on demand. Intel Labs researchers are working on evolving technology so people can get the TV content they want, when they want it and wherever they want it."
3D, advanced graphics and more
As consumer devices deliver more and more TV content, developers will need to blend together video, 3-D animation and rich graphics. And in turn, the importance of graphics and audio/video decoding in CE platforms becomes increasingly critical.
Kim disclosed that Intel and Adobe Systems are working together to port Adobe Flash Player 10, a key tool for content developers, to the new family of SoC media processors. This will result in future CE devices that are optimized for playback of graphics and H.264 video to enable for the first time a wide array of Flash Player 10-based applications on the television.
Rattner predicted that high-quality 3-D video will someday soon be consumed in the privacy of your own living room. Onstage, he spoke to a life-size 3-D version of 3ality Digital CTO Howard Postley about the intense computation and bandwidth required for capturing and managing 3-D TV in real time.
Both executives discussed how a new high-speed optical I/O technology from Intel, codenamed "Light Peak," will improve bandwidth and flexibility while greatly reducing complexity and cost for PC users downloading videos and other digital media. Postley said 50 copper-based cables on the set of a 3-D shoot today could be replaced with a single optical cable with Light Peak technology. In addition to its extreme speed, Light Peak technology has the unique ability to simultaneously transport multiple existing I/O protocols.
Personal TV, intelligent networks
With the massive amount of TV content delivered digitally today and in the future, personalization is critical. TV Network CBS developed a TV Widget, or small Internet application, to help viewers find and connect to premium content in a more customized manner. TV Widgets are made possible by the performance of Intel CE media processors and Widget Channel, a software development framework.
Delivering interactive product placements, games and on-demand video on non-traditional TVs, such as digital connected CE devices, will require innovation in how that content is actually distributed from TV service providers.
Joining Kim on stage was Malachy Moynihan, Cisco's vice president of video product strategy, Service Provider Video Technology Group, to discuss how the company is helping service providers evolve their current networks to a medianet, which integrates the best elements of the existing broadcast infrastructure with carrier-grade IP networks to provide such new services as unified video experience.
The executives laid out the opportunities, both short- and long-term, to make the TV experience more visual, more personal and more interactive.
Kim, senior vice president and general manager of Intel's Digital Home Group, took the wraps off the Intel Atom processor CE4100, the newest system-on-chip (SoC) in a family of consumer electronics (CE) media processors, and announced efforts with several key industry players including Adobe, CBS, Cisco and TransGaming which are helping to make the vision of interactive TV a reality in the short-term.
"At the center of the TV evolution is more processing power, which we deliver with the CE4100 media processor, built on the Intel Atom core and optimized for IPTV digital set-tops, connected media players and digital TVs," said Kim. "With its performance and high-resolution graphics capabilities, CE manufacturers and software developers now have a platform for real innovation."
According to Rattner, Intel's chief technology officer and Senior Fellow, that innovation will accelerate in the next few years.
"By the year 2015, you can expect 15 billion consumer devices capable of delivering TV content with billions of hours of video available," said Rattner. "We'll need much more sophisticated ways to organize content and provide it on demand. Intel Labs researchers are working on evolving technology so people can get the TV content they want, when they want it and wherever they want it."
3D, advanced graphics and more
As consumer devices deliver more and more TV content, developers will need to blend together video, 3-D animation and rich graphics. And in turn, the importance of graphics and audio/video decoding in CE platforms becomes increasingly critical.
Kim disclosed that Intel and Adobe Systems are working together to port Adobe Flash Player 10, a key tool for content developers, to the new family of SoC media processors. This will result in future CE devices that are optimized for playback of graphics and H.264 video to enable for the first time a wide array of Flash Player 10-based applications on the television.
Rattner predicted that high-quality 3-D video will someday soon be consumed in the privacy of your own living room. Onstage, he spoke to a life-size 3-D version of 3ality Digital CTO Howard Postley about the intense computation and bandwidth required for capturing and managing 3-D TV in real time.
Both executives discussed how a new high-speed optical I/O technology from Intel, codenamed "Light Peak," will improve bandwidth and flexibility while greatly reducing complexity and cost for PC users downloading videos and other digital media. Postley said 50 copper-based cables on the set of a 3-D shoot today could be replaced with a single optical cable with Light Peak technology. In addition to its extreme speed, Light Peak technology has the unique ability to simultaneously transport multiple existing I/O protocols.
Personal TV, intelligent networks
With the massive amount of TV content delivered digitally today and in the future, personalization is critical. TV Network CBS developed a TV Widget, or small Internet application, to help viewers find and connect to premium content in a more customized manner. TV Widgets are made possible by the performance of Intel CE media processors and Widget Channel, a software development framework.
Delivering interactive product placements, games and on-demand video on non-traditional TVs, such as digital connected CE devices, will require innovation in how that content is actually distributed from TV service providers.
Joining Kim on stage was Malachy Moynihan, Cisco's vice president of video product strategy, Service Provider Video Technology Group, to discuss how the company is helping service providers evolve their current networks to a medianet, which integrates the best elements of the existing broadcast infrastructure with carrier-grade IP networks to provide such new services as unified video experience.
Intel unveils 45nm SoC for Internet TV
INTEL DEVELOPER FORUM, SAN FRANCISCO, USA: Intel Corp. today unveiled the Intel Atom processor CE4100, the newest SoC in a family of media processors designed to bring Internet content and services to digital TVs, DVD players and advanced set-top boxes.
The CE4100 processor, formerly codenamed "Sodaville," is the first 45nm-manufactured consumer electronics (CE) SoC based on Intel architecture. It supports Internet and broadcast applications on one chip, and has the processing power and audio/video components necessary to run rich media applications such as 3-D graphics.
"Traditional broadcast networks are quickly shifting from a linear model to a multi-stream, Internet-optimized model to offer consumers digital entertainment that complements the TV such as social networking, 3-D gaming and streaming video," said Eric Kim, senior vice president and general manager, Intel Digital Home Group. "At the center of the TV evolution is the CE4100 media processor, a new architecture that meets the critical requirements for connected CE devices."
CE industry rallies around Intel CE media processors
Joining Kim on stage during his keynote were executives from Adobe Systems, BBC (British Broadcast Company), CBS, Cisco and TransGaming. These and other companies are working with Intel to advance content, services and infrastructure for connected CE devices.
As TVs become more interactive, Adobe Flash is an important enabling technology to help content developers blend together video, 3-D animation and rich graphics. Intel is working with Adobe to port Adobe Flash Player 10 to the family of Intel CE media processors to optimize the playback of graphics and H.264 video to enable for the first time a wide array of Flash-based content on the television.
"The architecture of Intel media processors provides a powerful and innovative platform to showcase Flash-based applications in a vivid way," said David Wadhwani, general manager and vice president, Platform Business Unit at Adobe.
"Flash Player 10 combined with the performance of the Intel media processor and its support for standards such as OpenGL ES 2.0 offers a compelling environment for Flash-based games, videos and other rich Web content and applications." The companies expect Adobe Flash Player 10 to be available in the first half of 2010 for Intel media processor-based CE devices.
Malachy Moynihan, vice president for video product strategy, Cisco Service Provider Video Technology Group, discussed how delivering premium video to the TV will require intelligent networks and content storage.
"Cisco is helping service providers evolve their networks to a medianet, integrating the best elements of the existing broadcast infrastructure with carrier-grade IP networks to provide new services like unified video experience," said Moynihan.
"The crucial components to enable a unified video experience include the need for an emerging monetization model across the video ecosystem as well as client devices with quality graphics and a high-performance processor to truly enhance the visual appeal for consumers."
On-demand gaming for TV
TransGaming President and CEO Vikas Gupta announced an on-demand gaming service called GameTree.tv to be optimized for connected digital TVs and CE devices powered by Intel media processors.
"At TransGaming, we're in the business of enabling existing games to operate on alternative operating systems," said Gupta. "Since Intel CE processors run on Intel architecture, it's a fast and easy migration from the PC to the CE platform."
The GameTree.tv service will offer a broad library of games such as sports, action and adventure and provide content developers with a software development kit to support the migration of existing games and the development of new games based on the Intel CE platform. It will help revolutionize the delivery and global consumption of video games and provide a turnkey monetization strategy for CE manufacturers and cable/satellite providers (MSOs).
TV widgets, interactive TV applications
Intel CE media processors provide a full-featured software framework called Widget Channel for the development of Internet applications, or TV widgets. Broadcast networks such as CBS are expanding the gallery of TV widgets to help their viewers find and connect to premium content in a more personalized manner.
"Navigation is the No. 1 challenge for today's television viewers," said George Schweitzer, president, CBS Marketing. "Intel's CE technology and our new TV Widget platform are designed to help people find the shows they want and discover new programs that are relevant to their interests. What's more, the TV Widget gives us another platform to connect and interact with our audience while delivering an exciting new television experience."
Intel is working with the industry to expand Widget Channel to provide consumers a range of services such as movies, music, games and personal videos. TV Widgets and services shown at IDF were from Accedo Broadband*, The Associated Press*, BIGSTAR.tv*, CBS*, CinemaNow*, Dailymotion*, Immediatek*, Mediafly, MyVideo*, Netflix*, PlayJam*, RadioTime*, RallyPoint*, ShowTime Networks*, Tagesschau* and WhereverTV.*
Intel Atom processor CE4100
The CE4100 processor can deliver speeds up to 1.2GHz while offering lower power and a small footprint to help decrease system costs. It is backward compatible with the Intel Media Processor CE 3100 and features Intel Precision View Technology, a display processing engine to support high-definition picture quality and Intel Media Play Technology for seamless audio and video.
It also supports hardware decode of up to two 1080p video streams and advanced 3-D graphics and audio standards. To provide OEMs flexibility in their product offerings, new features were added such as hardware decode for MPEG4 video that is ready for DivX Home Theater 3.0 certification, an integrated NAND flash controller, support for both DDR2 and DDR3 memory and 512K L2 cache.
The CE SoC contains a display processor, graphics processor, video display controller, transport processor, a dedicated security processor and general I/O including SATA-300 and USB 2.0.
The CE4100 processor, formerly codenamed "Sodaville," is the first 45nm-manufactured consumer electronics (CE) SoC based on Intel architecture. It supports Internet and broadcast applications on one chip, and has the processing power and audio/video components necessary to run rich media applications such as 3-D graphics.
"Traditional broadcast networks are quickly shifting from a linear model to a multi-stream, Internet-optimized model to offer consumers digital entertainment that complements the TV such as social networking, 3-D gaming and streaming video," said Eric Kim, senior vice president and general manager, Intel Digital Home Group. "At the center of the TV evolution is the CE4100 media processor, a new architecture that meets the critical requirements for connected CE devices."
CE industry rallies around Intel CE media processors
Joining Kim on stage during his keynote were executives from Adobe Systems, BBC (British Broadcast Company), CBS, Cisco and TransGaming. These and other companies are working with Intel to advance content, services and infrastructure for connected CE devices.
As TVs become more interactive, Adobe Flash is an important enabling technology to help content developers blend together video, 3-D animation and rich graphics. Intel is working with Adobe to port Adobe Flash Player 10 to the family of Intel CE media processors to optimize the playback of graphics and H.264 video to enable for the first time a wide array of Flash-based content on the television.
"The architecture of Intel media processors provides a powerful and innovative platform to showcase Flash-based applications in a vivid way," said David Wadhwani, general manager and vice president, Platform Business Unit at Adobe.
"Flash Player 10 combined with the performance of the Intel media processor and its support for standards such as OpenGL ES 2.0 offers a compelling environment for Flash-based games, videos and other rich Web content and applications." The companies expect Adobe Flash Player 10 to be available in the first half of 2010 for Intel media processor-based CE devices.
Malachy Moynihan, vice president for video product strategy, Cisco Service Provider Video Technology Group, discussed how delivering premium video to the TV will require intelligent networks and content storage.
"Cisco is helping service providers evolve their networks to a medianet, integrating the best elements of the existing broadcast infrastructure with carrier-grade IP networks to provide new services like unified video experience," said Moynihan.
"The crucial components to enable a unified video experience include the need for an emerging monetization model across the video ecosystem as well as client devices with quality graphics and a high-performance processor to truly enhance the visual appeal for consumers."
On-demand gaming for TV
TransGaming President and CEO Vikas Gupta announced an on-demand gaming service called GameTree.tv to be optimized for connected digital TVs and CE devices powered by Intel media processors.
"At TransGaming, we're in the business of enabling existing games to operate on alternative operating systems," said Gupta. "Since Intel CE processors run on Intel architecture, it's a fast and easy migration from the PC to the CE platform."
The GameTree.tv service will offer a broad library of games such as sports, action and adventure and provide content developers with a software development kit to support the migration of existing games and the development of new games based on the Intel CE platform. It will help revolutionize the delivery and global consumption of video games and provide a turnkey monetization strategy for CE manufacturers and cable/satellite providers (MSOs).
TV widgets, interactive TV applications
Intel CE media processors provide a full-featured software framework called Widget Channel for the development of Internet applications, or TV widgets. Broadcast networks such as CBS are expanding the gallery of TV widgets to help their viewers find and connect to premium content in a more personalized manner.
"Navigation is the No. 1 challenge for today's television viewers," said George Schweitzer, president, CBS Marketing. "Intel's CE technology and our new TV Widget platform are designed to help people find the shows they want and discover new programs that are relevant to their interests. What's more, the TV Widget gives us another platform to connect and interact with our audience while delivering an exciting new television experience."
Intel is working with the industry to expand Widget Channel to provide consumers a range of services such as movies, music, games and personal videos. TV Widgets and services shown at IDF were from Accedo Broadband*, The Associated Press*, BIGSTAR.tv*, CBS*, CinemaNow*, Dailymotion*, Immediatek*, Mediafly, MyVideo*, Netflix*, PlayJam*, RadioTime*, RallyPoint*, ShowTime Networks*, Tagesschau* and WhereverTV.*
Intel Atom processor CE4100
The CE4100 processor can deliver speeds up to 1.2GHz while offering lower power and a small footprint to help decrease system costs. It is backward compatible with the Intel Media Processor CE 3100 and features Intel Precision View Technology, a display processing engine to support high-definition picture quality and Intel Media Play Technology for seamless audio and video.
It also supports hardware decode of up to two 1080p video streams and advanced 3-D graphics and audio standards. To provide OEMs flexibility in their product offerings, new features were added such as hardware decode for MPEG4 video that is ready for DivX Home Theater 3.0 certification, an integrated NAND flash controller, support for both DDR2 and DDR3 memory and 512K L2 cache.
The CE SoC contains a display processor, graphics processor, video display controller, transport processor, a dedicated security processor and general I/O including SATA-300 and USB 2.0.
Intel unveils fastest laptop chips ever with new Intel Core i7 mobile processor
INTEL DEVELOPER FORUM, SAN FRANCISCO, USA: Intel Corp. introduced its revolutionary Intel Core i7 Mobile Processor and Intel Core i7 Mobile Processor Extreme Edition, bringing Intel’s award-winning and super-fast Nehalem microarchitecture to the mobile market.
These processors in addition to the new Intel PM55 Express Chipset, provide the best laptop experience for intense gaming, digital media, photos, music, business applications and other multi-threaded software that hungers for faster processing speed. The chips also boost overall performance when using several of these applications simultaneously.
"With intelligent features like Intel Turbo Boost Technology, Intel Hyper-Threading Technology and a host of others, Intel has revolutionized the laptop PC processor, delivering performance when you need it, energy efficiency when you don’t," said Dadi Perlmutter, executive vice president and general manager, Intel Architecture Group. "For the first time, mobile users can choose a laptop that delivers Internet-server like speed, right in their laps for the most demanding tasks, from intense gaming to digital video editing and social media applications."
Formerly codenamed "Clarksfield," Intel Core i7 mobile processors offer Intel Turbo Boost Technology, which can accelerate the processor clock speed up to 75 percent to match workloads, as well as better performance on highly threaded applications with the power of Intel Hyper-Threading Technology. The new Intel Core i7 mobile processors also include two-channel DDR3 1333 MHz memory support and full 1 x16 or 2 x8 PCI Express 2.0 graphics.
Whether users are editing a video, composing a song, playing a video game or updating their Facebook status with the latest YouTube video craze, Intel Core i7 mobile processors adapt to provide the right processing power for the task, with more performance and flexibility to match their on-the-go needs.
Laptops with Intel Core i7 mobile processor Extreme Edition support Intel Extreme Memory Profiles (Intel XMP) and Intel Extreme Tuning Utility, the ultimate tuning utility making it possible to overclock3 and fine tune your laptop for incredible performance and battery life optimizations. In addition, the Intel PM55 Express Chipset enables high-end workstation and gaming laptops to support features such as Intel® Matrix Storage Technology, Intel® High-Definition Audio, and increased I/O interfaces.
Pricing and availability
Leading OEMs including Asus, Dell, HP and Toshiba began shipping laptops today based on Intel Core i7 mobile processors, with additional systems from OEMs available in the coming months. 1ku pricing for the Intel Core i7-920XM, Intel Core i7-820QM and Intel® Core i7-720QM mobile processors is $1,054, $546 and $364, respectively.
These processors in addition to the new Intel PM55 Express Chipset, provide the best laptop experience for intense gaming, digital media, photos, music, business applications and other multi-threaded software that hungers for faster processing speed. The chips also boost overall performance when using several of these applications simultaneously.
"With intelligent features like Intel Turbo Boost Technology, Intel Hyper-Threading Technology and a host of others, Intel has revolutionized the laptop PC processor, delivering performance when you need it, energy efficiency when you don’t," said Dadi Perlmutter, executive vice president and general manager, Intel Architecture Group. "For the first time, mobile users can choose a laptop that delivers Internet-server like speed, right in their laps for the most demanding tasks, from intense gaming to digital video editing and social media applications."
Formerly codenamed "Clarksfield," Intel Core i7 mobile processors offer Intel Turbo Boost Technology, which can accelerate the processor clock speed up to 75 percent to match workloads, as well as better performance on highly threaded applications with the power of Intel Hyper-Threading Technology. The new Intel Core i7 mobile processors also include two-channel DDR3 1333 MHz memory support and full 1 x16 or 2 x8 PCI Express 2.0 graphics.
Whether users are editing a video, composing a song, playing a video game or updating their Facebook status with the latest YouTube video craze, Intel Core i7 mobile processors adapt to provide the right processing power for the task, with more performance and flexibility to match their on-the-go needs.
Laptops with Intel Core i7 mobile processor Extreme Edition support Intel Extreme Memory Profiles (Intel XMP) and Intel Extreme Tuning Utility, the ultimate tuning utility making it possible to overclock3 and fine tune your laptop for incredible performance and battery life optimizations. In addition, the Intel PM55 Express Chipset enables high-end workstation and gaming laptops to support features such as Intel® Matrix Storage Technology, Intel® High-Definition Audio, and increased I/O interfaces.
Pricing and availability
Leading OEMs including Asus, Dell, HP and Toshiba began shipping laptops today based on Intel Core i7 mobile processors, with additional systems from OEMs available in the coming months. 1ku pricing for the Intel Core i7-920XM, Intel Core i7-820QM and Intel® Core i7-720QM mobile processors is $1,054, $546 and $364, respectively.
Intel's priority: A total mobile computing experience
INTEL DEVELOPER FORUM, SAN FRANCISCO, USA: At the developer conference, Intel demonstrated how from handhelds and netbooks for light-computing to the balanced performance and style of ultra-thin laptops to full-function laptop computing, the company delivers the right combination of priorities for every mobile experience.
The Intel Developer Forum keynote by David (Dadi) Perlmutter, executive vice president and general manager, Intel Architecture Group, also marked the debut of three new super-fast and intelligent Intel Core i7 processors for laptops.
"Staying connected on an increasingly broad array of mobile devices has become the most exciting and quickly evolving part of technology," said Perlmutter. "Intel is delivering the total mobile experience on each device, offering different levels of performance and power in sleek form factors coupled with compatibility, a superior mobile Internet experience and embedded WiMAX wireless broadband. We're truly taking mobility to the next level of cool."
Based on Intel's award-winning Nehalem microarchitecture, the new Intel Core i7 processors and a new chipset include such features as Intel Turbo Boost Technology and Intel Hyper-Threading2 Technology. The quad-core chips deliver unmatched processing power on-the-go for the most demanding PC users who create digital video, play intense games or run compute-intensive business applications.
Perlmutter also highlighted Intel's next generation of mobile processors, codenamed "Arrandale," which brings the Nehalem microarchitecture to mainstream laptops. These chips will integrate the dual-core CPU and graphics in the package and incorporate the 32nm manufacturing process and second-generation high-k metal gate transistors for increased performance and power efficiency for mainstream mobile PCs. This integration of platform components will continue into the future with a fully monolithic processor on 32nm, codenamed "Sandy Bridge."
Citing a combination of architectural, design and process enhancements, Perlmutter detailed progress with Intel's "Moorestown" platform, scheduled for 2010 and targeting MIDs and smartphones. He discussed some of the innovative techniques that Intel is implementing, such as Distributed Power Gating, for improved performance and major reductions in power and thermal envelope.
These technologies help to achieve up to a 50x improvement in platform idle power reduction compared to Intel's first generation "Menlow" platform. The reductions are enabling Intel to establish new thresholds in ultra low power while making it possible to run the full Internet and media-rich applications in handheld devices.
Perlmutter also touched on Intel's third generation ultra-low power platform, codenamed "Medfield." Expected in 2011, Medfield will be a single-chip 32nm system-on-chip (SoC) design that will enable a much smaller form factor and lower power designs than Moorestown, helping extend Intel squarely into smartphone segments.
Perlmutter demonstrated a new high-speed optical cable technology ready by next year to connect mainstream electronic devices such as laptops, HD displays, cameras, video players, iPods*, docking stations and solid-state drives (SSDs) to each other using optical fiber rather than copper wires, paving the way for a new generation of extreme input and output (I/O) performance.
Developed by Intel and codenamed "Light Peak," this proposed technology will spawn a new generation of extreme computer I/O performance, delivering 10Gb/s of bandwidth, with the potential ability to scale to 100Gb/s over the next decade. At 10Gb/s, a user could transfer a full-length Blu-ray* movie in less than 30 seconds. The company intends to work with the industry to determine the best way to make this new technology a broadly available standard.
In addition, Perlmutter announced Intel® Anti-Theft Technology3 (Intel® AT) version 2.03, an intelligent technology in PC hardware that disables laptop PC and access to encrypted data if it's lost or stolen. Collaborating with key security ISVs, Intel AT will enable enhanced data protection, PC theft deterrence for consumers as well as a broad number of consumer and business laptops from leading PC OEMs in 2010.
James: Developing for Continuum of Intel platforms
In the day's second keynote, Renee James, corporate vice president and general manager of Intel's Software and Services Group, unveiled the Intel Atom Developer Program. This effort encourages independent software vendors and developers to create mobile applications. Intel is partnering with manufacturers, including Acer and ASUS, to create multiple application stores where applications and application building blocks for Intel-based netbooks and handhelds will be sold.
"The Intel Atom Developer Program will drive new innovative applications for consumers and new revenue streams for software developers," said James. "The new program facilitates the creation of applications that consumers can use with confidence knowing they were optimized and validated for Intel Atom processor-based devices."
Microsoft Silverlight and Moblin
Additionally, operating system support for Microsoft* Silverlight will be expanded to include Moblin early next year. Moblin is an open-source operating system project for netbooks, handhelds, smartphones and in-car computers.
Using Silverlight's cross-platform foundation, developers will be able to write applications once and have them run on Windows and Moblin devices, expanding the reach of Silverlight applications to more devices and consumers, and thus demonstrating the continued push into PC, TV and phone.
Demonstrating industry momentum for netbooks and the Moblin operating system, James announced the Dell Inspiron Mini 10v with Ubuntu Moblin Remix Developer Edition pre-installed will be available starting Sept. 24. James also announced that ASUS and Acer have launched – and Samsung planning to launch – Moblin version 2-based netbook devices.
Multiple operating system vendors, including Canonical, CS2C, Linpus, Mandriva, Novell, Phoenix and Turbolinux, announced production-ready Moblin version 2-based operating systems are now available.
The Intel Developer Forum keynote by David (Dadi) Perlmutter, executive vice president and general manager, Intel Architecture Group, also marked the debut of three new super-fast and intelligent Intel Core i7 processors for laptops.
"Staying connected on an increasingly broad array of mobile devices has become the most exciting and quickly evolving part of technology," said Perlmutter. "Intel is delivering the total mobile experience on each device, offering different levels of performance and power in sleek form factors coupled with compatibility, a superior mobile Internet experience and embedded WiMAX wireless broadband. We're truly taking mobility to the next level of cool."
Based on Intel's award-winning Nehalem microarchitecture, the new Intel Core i7 processors and a new chipset include such features as Intel Turbo Boost Technology and Intel Hyper-Threading2 Technology. The quad-core chips deliver unmatched processing power on-the-go for the most demanding PC users who create digital video, play intense games or run compute-intensive business applications.
Perlmutter also highlighted Intel's next generation of mobile processors, codenamed "Arrandale," which brings the Nehalem microarchitecture to mainstream laptops. These chips will integrate the dual-core CPU and graphics in the package and incorporate the 32nm manufacturing process and second-generation high-k metal gate transistors for increased performance and power efficiency for mainstream mobile PCs. This integration of platform components will continue into the future with a fully monolithic processor on 32nm, codenamed "Sandy Bridge."
Citing a combination of architectural, design and process enhancements, Perlmutter detailed progress with Intel's "Moorestown" platform, scheduled for 2010 and targeting MIDs and smartphones. He discussed some of the innovative techniques that Intel is implementing, such as Distributed Power Gating, for improved performance and major reductions in power and thermal envelope.
These technologies help to achieve up to a 50x improvement in platform idle power reduction compared to Intel's first generation "Menlow" platform. The reductions are enabling Intel to establish new thresholds in ultra low power while making it possible to run the full Internet and media-rich applications in handheld devices.
Perlmutter also touched on Intel's third generation ultra-low power platform, codenamed "Medfield." Expected in 2011, Medfield will be a single-chip 32nm system-on-chip (SoC) design that will enable a much smaller form factor and lower power designs than Moorestown, helping extend Intel squarely into smartphone segments.
Perlmutter demonstrated a new high-speed optical cable technology ready by next year to connect mainstream electronic devices such as laptops, HD displays, cameras, video players, iPods*, docking stations and solid-state drives (SSDs) to each other using optical fiber rather than copper wires, paving the way for a new generation of extreme input and output (I/O) performance.
Developed by Intel and codenamed "Light Peak," this proposed technology will spawn a new generation of extreme computer I/O performance, delivering 10Gb/s of bandwidth, with the potential ability to scale to 100Gb/s over the next decade. At 10Gb/s, a user could transfer a full-length Blu-ray* movie in less than 30 seconds. The company intends to work with the industry to determine the best way to make this new technology a broadly available standard.
In addition, Perlmutter announced Intel® Anti-Theft Technology3 (Intel® AT) version 2.03, an intelligent technology in PC hardware that disables laptop PC and access to encrypted data if it's lost or stolen. Collaborating with key security ISVs, Intel AT will enable enhanced data protection, PC theft deterrence for consumers as well as a broad number of consumer and business laptops from leading PC OEMs in 2010.
James: Developing for Continuum of Intel platforms
In the day's second keynote, Renee James, corporate vice president and general manager of Intel's Software and Services Group, unveiled the Intel Atom Developer Program. This effort encourages independent software vendors and developers to create mobile applications. Intel is partnering with manufacturers, including Acer and ASUS, to create multiple application stores where applications and application building blocks for Intel-based netbooks and handhelds will be sold.
"The Intel Atom Developer Program will drive new innovative applications for consumers and new revenue streams for software developers," said James. "The new program facilitates the creation of applications that consumers can use with confidence knowing they were optimized and validated for Intel Atom processor-based devices."
Microsoft Silverlight and Moblin
Additionally, operating system support for Microsoft* Silverlight will be expanded to include Moblin early next year. Moblin is an open-source operating system project for netbooks, handhelds, smartphones and in-car computers.
Using Silverlight's cross-platform foundation, developers will be able to write applications once and have them run on Windows and Moblin devices, expanding the reach of Silverlight applications to more devices and consumers, and thus demonstrating the continued push into PC, TV and phone.
Demonstrating industry momentum for netbooks and the Moblin operating system, James announced the Dell Inspiron Mini 10v with Ubuntu Moblin Remix Developer Edition pre-installed will be available starting Sept. 24. James also announced that ASUS and Acer have launched – and Samsung planning to launch – Moblin version 2-based netbook devices.
Multiple operating system vendors, including Canonical, CS2C, Linpus, Mandriva, Novell, Phoenix and Turbolinux, announced production-ready Moblin version 2-based operating systems are now available.
Cisco, Intel, Microsoft, Government of Kenya and Usaid Launch Joint Project to Enable 21st-Century Education in Kenya Schools
NEW YORK CITY, USA: At the Clinton Global Initiative annual meeting, Cisco, Intel Corp., Microsoft Corp., the government of Kenya and the U.S. Agency for International Development (USAID) announced a joint commitment to improve education in Kenya.
Launched in collaboration with Kenya's Ministry of Education, the Accelerating 21st Century Education (ACE) project aims to improve the quality of primary and secondary education through the effective use of information and communications technology (ICT).
The parties are working together to develop a best-in-class model for deploying ICT in education. Reflecting a combined commitment valued at more than US$9 million, ACE will create "one-to-one e-learning" classrooms in 60 focus schools across Kenya. One-to-one e-learning, a model in which every student has access to a computer, helps foster an environment where young people can develop skills such as problem solving and critical thinking.
ACE will deploy more than 6,000 networked computers for student and teacher use; train approximately 7,000 teachers to effectively integrate technology in the classroom; train technical support staff at each school to maintain the technology; deploy a wireless infrastructure within the schools; provide access to digital educational content; and develop the local ICT industry in Kenya to promote economic development and sustainability.
In addition, Cisco, Intel and Microsoft will work together to establish a School Technology Innovation Center (STIC) in Nairobi — a model that has been promoted in other countries through the Microsoft® Partners in Learning Program. The center will be dedicated to research on innovative emerging technology solutions and serve as a repository and showcase for best-known methods of teaching, learning and educational technology.
"ACE ties in with our mission to increase access to education, improve the quality of education and raise school enrollment rates for children from marginalized areas of East Africa," said USAID Kenya Mission Director Erna Kerst. "We hope this collaboration will encourage more Kenyan children to complete school, improve teacher training practices and enhance professional development for teachers and school administrators with support from USAID."
USAID works closely with the government of Kenya on educational programs aimed at ensuring that more Kenyan children enroll in school, stay in school and receive a high-quality education that equips them with the knowledge and skills they need to succeed in the 21st-century economy. These education programs support more than 400,000 children from the most marginalized communities — including those orphaned by the HIV/AIDS pandemic — as well as systemic changes in teacher training colleges and key educational institutions.
Commitment to action takes holistic approach to ICT in education
The ACE project focuses on 40 secondary schools and 20 primary schools across Kenya. It will deploy 6,000 student personal computers (PCs), 120 teacher laptops, 60 servers and the supporting wireless infrastructure to establish two e-learning classrooms at each school.
The project will also train 2,000 teachers at the schools, as well as 5,000 pre-service teachers at teacher training colleges in Kenya. In addition, ACE will offer education leadership forums to help lead teachers at the participating schools define a strategy for creating 21st-century learning environments. Training will be provided through the Intel Teach Program and the Microsoft Partners in Learning Program, which offer proven ways to integrate technology into the curriculum for enhanced classroom learning.
To promote a sustainable implementation of ICT in education, two instructors and one network administrator at each of the 60 schools will receive networking and IT training through the Cisco Networking Academy. The Networking Academy collaborates with educational institutions, governments and community-based organizations to provide students around the world with foundational ICT skills along with career skills such as problem solving, collaboration and critical thinking for increased access to career and economic opportunities.
"Collaboration among public and private-sector organizations can significantly enhance the quality of education for students around the world and strengthen the communities where they live," said Tae Yoo, senior vice president, Corporate Affairs, Cisco. "By taking a holistic approach to education that includes the effective integration of ICT, the government of Kenya in cooperation with Cisco, Intel, Microsoft and USAID is taking a bold step forward to create a sustainable model of education reform and equip students with the skills they need to be successful in the 21st-century."
ACE aligns closely with the goals of Kenya's Ministry of Education, which recently digitized its national curriculum. The project will provide digital content to help deploy the revamped curriculum, with an initial focus on math and science subjects for primary grades 4-6 and for the first two years of secondary education.
As part of this effort, Intel and the Ministry will collaborate on developing localized content for the Intel skoool Learning and Teaching Technology, an interactive Internet resource for learning math and science. Microsoft is also working with the Ministry to develop a new education portal where teachers can access e-mail and online educational content.
"By mobilizing our combined resources, we can help Kenya's Ministry of Education put the implementation of its National ICT Strategy for Education on the fast track," said Lila Ibrahim, general manager of the Emerging Markets Platform Group at Intel. "We believe that public-private collaborations like the ACE project are the most powerful means to invest in 21st-century learning and at the same time can help to stimulate the local economy."
Extending benefits of ICT in education investments
To encourage the sharing of knowledge related to tested best uses of technology in education, all of the key practices and methods learned from ACE will be captured in a School Technology Innovation Center (STIC) that Cisco, Intel and Microsoft have committed to establish in Nairobi.
Like STICs in other countries, the Kenya center will serve as a hub where education leaders and teachers from the region can access the latest information on technology solutions that are proven to enhance innovative teaching and learning, thus improving the skills needed by students to thrive in the 21st-century. Center visitors will also be able to view research on innovative educational technology solutions, witness technology demos, participate in trainings, and learn from best-practice models and outcomes.
"Providing technology access and IT skills to students is a cornerstone for future innovation, economic growth and individual opportunity in the competitive global marketplace," said Linda Zecher, corporate vice president of Worldwide Public Sector at Microsoft. "By combining the experience and resources of public and private sector partners in a holistic way, the ACE project will help the Ministry of Education further its efforts to transform learning and increase opportunity for all of Kenya's students."
To demonstrate the benefits of technology in the classroom, the STIC will feature 20 Intel-powered classmate PCs, networked via Cisco wireless infrastructure, and the latest software offerings from Microsoft, including the new Windows 7 operating system. The classmate PC is an affordable, full-featured, compact and rugged student laptop designed to promote interactive and collaborative learning among students and teachers. The STIC will also feature other technology products that are well-suited to teaching and learning.
Over the course of three years, the ACE project is expected to directly benefit an estimated 39,000 students and 7,000 teachers through improved educational infrastructure and training. Kenya's Ministry of Education estimates than an additional 300,000 people will benefit indirectly from the STIC and other aspects of knowledge sharing.
Launched in collaboration with Kenya's Ministry of Education, the Accelerating 21st Century Education (ACE) project aims to improve the quality of primary and secondary education through the effective use of information and communications technology (ICT).
The parties are working together to develop a best-in-class model for deploying ICT in education. Reflecting a combined commitment valued at more than US$9 million, ACE will create "one-to-one e-learning" classrooms in 60 focus schools across Kenya. One-to-one e-learning, a model in which every student has access to a computer, helps foster an environment where young people can develop skills such as problem solving and critical thinking.
ACE will deploy more than 6,000 networked computers for student and teacher use; train approximately 7,000 teachers to effectively integrate technology in the classroom; train technical support staff at each school to maintain the technology; deploy a wireless infrastructure within the schools; provide access to digital educational content; and develop the local ICT industry in Kenya to promote economic development and sustainability.
In addition, Cisco, Intel and Microsoft will work together to establish a School Technology Innovation Center (STIC) in Nairobi — a model that has been promoted in other countries through the Microsoft® Partners in Learning Program. The center will be dedicated to research on innovative emerging technology solutions and serve as a repository and showcase for best-known methods of teaching, learning and educational technology.
"ACE ties in with our mission to increase access to education, improve the quality of education and raise school enrollment rates for children from marginalized areas of East Africa," said USAID Kenya Mission Director Erna Kerst. "We hope this collaboration will encourage more Kenyan children to complete school, improve teacher training practices and enhance professional development for teachers and school administrators with support from USAID."
USAID works closely with the government of Kenya on educational programs aimed at ensuring that more Kenyan children enroll in school, stay in school and receive a high-quality education that equips them with the knowledge and skills they need to succeed in the 21st-century economy. These education programs support more than 400,000 children from the most marginalized communities — including those orphaned by the HIV/AIDS pandemic — as well as systemic changes in teacher training colleges and key educational institutions.
Commitment to action takes holistic approach to ICT in education
The ACE project focuses on 40 secondary schools and 20 primary schools across Kenya. It will deploy 6,000 student personal computers (PCs), 120 teacher laptops, 60 servers and the supporting wireless infrastructure to establish two e-learning classrooms at each school.
The project will also train 2,000 teachers at the schools, as well as 5,000 pre-service teachers at teacher training colleges in Kenya. In addition, ACE will offer education leadership forums to help lead teachers at the participating schools define a strategy for creating 21st-century learning environments. Training will be provided through the Intel Teach Program and the Microsoft Partners in Learning Program, which offer proven ways to integrate technology into the curriculum for enhanced classroom learning.
To promote a sustainable implementation of ICT in education, two instructors and one network administrator at each of the 60 schools will receive networking and IT training through the Cisco Networking Academy. The Networking Academy collaborates with educational institutions, governments and community-based organizations to provide students around the world with foundational ICT skills along with career skills such as problem solving, collaboration and critical thinking for increased access to career and economic opportunities.
"Collaboration among public and private-sector organizations can significantly enhance the quality of education for students around the world and strengthen the communities where they live," said Tae Yoo, senior vice president, Corporate Affairs, Cisco. "By taking a holistic approach to education that includes the effective integration of ICT, the government of Kenya in cooperation with Cisco, Intel, Microsoft and USAID is taking a bold step forward to create a sustainable model of education reform and equip students with the skills they need to be successful in the 21st-century."
ACE aligns closely with the goals of Kenya's Ministry of Education, which recently digitized its national curriculum. The project will provide digital content to help deploy the revamped curriculum, with an initial focus on math and science subjects for primary grades 4-6 and for the first two years of secondary education.
As part of this effort, Intel and the Ministry will collaborate on developing localized content for the Intel skoool Learning and Teaching Technology, an interactive Internet resource for learning math and science. Microsoft is also working with the Ministry to develop a new education portal where teachers can access e-mail and online educational content.
"By mobilizing our combined resources, we can help Kenya's Ministry of Education put the implementation of its National ICT Strategy for Education on the fast track," said Lila Ibrahim, general manager of the Emerging Markets Platform Group at Intel. "We believe that public-private collaborations like the ACE project are the most powerful means to invest in 21st-century learning and at the same time can help to stimulate the local economy."
Extending benefits of ICT in education investments
To encourage the sharing of knowledge related to tested best uses of technology in education, all of the key practices and methods learned from ACE will be captured in a School Technology Innovation Center (STIC) that Cisco, Intel and Microsoft have committed to establish in Nairobi.
Like STICs in other countries, the Kenya center will serve as a hub where education leaders and teachers from the region can access the latest information on technology solutions that are proven to enhance innovative teaching and learning, thus improving the skills needed by students to thrive in the 21st-century. Center visitors will also be able to view research on innovative educational technology solutions, witness technology demos, participate in trainings, and learn from best-practice models and outcomes.
"Providing technology access and IT skills to students is a cornerstone for future innovation, economic growth and individual opportunity in the competitive global marketplace," said Linda Zecher, corporate vice president of Worldwide Public Sector at Microsoft. "By combining the experience and resources of public and private sector partners in a holistic way, the ACE project will help the Ministry of Education further its efforts to transform learning and increase opportunity for all of Kenya's students."
To demonstrate the benefits of technology in the classroom, the STIC will feature 20 Intel-powered classmate PCs, networked via Cisco wireless infrastructure, and the latest software offerings from Microsoft, including the new Windows 7 operating system. The classmate PC is an affordable, full-featured, compact and rugged student laptop designed to promote interactive and collaborative learning among students and teachers. The STIC will also feature other technology products that are well-suited to teaching and learning.
Over the course of three years, the ACE project is expected to directly benefit an estimated 39,000 students and 7,000 teachers through improved educational infrastructure and training. Kenya's Ministry of Education estimates than an additional 300,000 people will benefit indirectly from the STIC and other aspects of knowledge sharing.
Wednesday, September 23, 2009
LSI to demo industry's first single-root I/O virtualization solution at IDF 2009
BANGALORE, INDIA: LSI Corp., in collaboration with Intel and Red Hat, today announced the industry's first demonstration of a single-root I/O virtualization (SR-IOV) capable storage controller.
The controller, using Intel Virtualization Technology for Directed I/O (Intel VT-d) and PCI-SIG SR-IOV technology, enables virtual servers in direct-attached storage (DAS) environments to share a storage controller, delivering increased system performance, efficiency and scalability.
The companies will demonstrate the solution in the Intel booth (booth #517) at the Intel Developer Forum (IDF), September 22-24, at the Moscone Center West in San Francisco, Calif.
"The first wave of virtualization has been focused on consolidating physical servers and delivering the economic benefits of increased server utilization," said Luca Bert, director of DAS RAID Architecture and Strategic Planning, LSI. "The next wave will focus on increasing overall system and storage performance, and hardware-based SR-IOV helps achieve that goal."
The technology demonstration will feature an Intel Xeon Processor 5500 Series based server, the Red Hat virtualization solution and an LSI MegaRAID storage controller running a performance benchmark on both conventional and SR-IOV based systems.
The demo will showcase how the MegaRAID controller using Intel VT-d and SR-IOV technology is able to deliver SAN-like capabilities in a low-cost virtualized, direct-attached storage environment. Intel VT-d is part of Intel’s core logic that accelerates I/O virtualization by remapping I/O DMA transfers and device generated interrupts.
“Utilizing Intel VT-d with Intel Xeon processor 5500 series-based platforms and SR-IOV RAID controllers helps to overcome the performance bottlenecks of virtualized solutions by shifting the burden from software implementations of hypervisors to the platform and the storage controller,” said Jim Pappas, Director Industry Initiatives at Intel. “Intel is excited about the overall performance improvements and data center cost savings that Intel VT-d and PCI-SIG SR-IOV solutions can deliver to our customers.”
Based on industry-standard I/O technology specifications developed by PCI-SIG, SR-IOV enables a single physical instance of the storage controller to appear as a number of virtual controllers. This allows multiple operating systems running simultaneously within a single computer to natively share PCI Express devices, resulting in dramatically increased server efficiency, improved system performance and more finely-tuned quality of service (QoS) and data security.
"Optimal virtualization solutions include consolidated storage and rapid, secure provisioning of storage. A hardware SR-IOV capable solution provides the performance, security and flexibility for data center architects to reduce their complexity and costs. This is the type of standards-based innovation that we expect from using Red Hat virtualization technology in collaboration with LSI and Intel,” said Navin Thadani, senior director, Virtualization Business at Red Hat.
The controller, using Intel Virtualization Technology for Directed I/O (Intel VT-d) and PCI-SIG SR-IOV technology, enables virtual servers in direct-attached storage (DAS) environments to share a storage controller, delivering increased system performance, efficiency and scalability.
The companies will demonstrate the solution in the Intel booth (booth #517) at the Intel Developer Forum (IDF), September 22-24, at the Moscone Center West in San Francisco, Calif.
"The first wave of virtualization has been focused on consolidating physical servers and delivering the economic benefits of increased server utilization," said Luca Bert, director of DAS RAID Architecture and Strategic Planning, LSI. "The next wave will focus on increasing overall system and storage performance, and hardware-based SR-IOV helps achieve that goal."
The technology demonstration will feature an Intel Xeon Processor 5500 Series based server, the Red Hat virtualization solution and an LSI MegaRAID storage controller running a performance benchmark on both conventional and SR-IOV based systems.
The demo will showcase how the MegaRAID controller using Intel VT-d and SR-IOV technology is able to deliver SAN-like capabilities in a low-cost virtualized, direct-attached storage environment. Intel VT-d is part of Intel’s core logic that accelerates I/O virtualization by remapping I/O DMA transfers and device generated interrupts.
“Utilizing Intel VT-d with Intel Xeon processor 5500 series-based platforms and SR-IOV RAID controllers helps to overcome the performance bottlenecks of virtualized solutions by shifting the burden from software implementations of hypervisors to the platform and the storage controller,” said Jim Pappas, Director Industry Initiatives at Intel. “Intel is excited about the overall performance improvements and data center cost savings that Intel VT-d and PCI-SIG SR-IOV solutions can deliver to our customers.”
Based on industry-standard I/O technology specifications developed by PCI-SIG, SR-IOV enables a single physical instance of the storage controller to appear as a number of virtual controllers. This allows multiple operating systems running simultaneously within a single computer to natively share PCI Express devices, resulting in dramatically increased server efficiency, improved system performance and more finely-tuned quality of service (QoS) and data security.
"Optimal virtualization solutions include consolidated storage and rapid, secure provisioning of storage. A hardware SR-IOV capable solution provides the performance, security and flexibility for data center architects to reduce their complexity and costs. This is the type of standards-based innovation that we expect from using Red Hat virtualization technology in collaboration with LSI and Intel,” said Navin Thadani, senior director, Virtualization Business at Red Hat.
Manufacturing, chip design expertise driving innovation and integration, historic change to computers
INTEL DEVELOPER FORUM, SAN FRANCISCO, USA: Intel Corp. executives said Moore's Law, driven by Intel's advances in 32 and 22 nanometer (nm)-manufacturing technologies, is leading to a broader and faster pace of "innovation and integration."
Future Intel Atom, Core and Xeon processors and System on Chip (SoC) products will make computers smaller, smarter, more capable and easier to use. For example, among a number of other innovations on tap, Intel will integrate graphics into some of its future chip products for the first time ever.
"Over the past 40 years, the opportunities enabled by Moore's Law have gone beyond just impressive performance increases," said Sean Maloney, executive vice president and general manager of the Intel Architecture Group.
"The rapidly increasing number of transistors and processor instructions we add have made possible the integration of more and more capabilities and features within our processors. This has driven an incredible amount of innovation throughout the industry, with the real winners being the consumers, gamers and businesses which buy these Intel-based computers."
Next generation processors – Westmere and Sandy Bridge
In his Intel Developer Forum keynote, Maloney demonstrated a Westmere-based PC that showed a marked increase in responsiveness on simple, everyday tasks such as Web-surfing with multiple windows open.
Moreover, Westmere is Intel's first 32nm processor, and historic in that it is the first-ever Intel processor to integrate graphics die right into the processor's package. As well as supporting Intel Turbo Boost technology and Intel Hyper-Threading Technology, Westmere adds new Advanced Encryption Standard (AES) instructions for faster encryption and decryption. Westmere in on track with wafers already moving through factory floors for planned fourth-quarter revenue production.
After Westmere, Intel's chip integration will continue with 32nm processors codenamed "Sandy Bridge." Sandy Bridge features Intel's sixth-generation graphics cores on the same die or silicon real estate as the processor core, and will include acceleration for floating point, video, and processor intensive software most often found in media applications. Maloney showed a Sandy Bridge-based system running a range of video and 3-D software to demonstrate the health of a far-future product line at its early stage.
Maloney demonstrated early silicon based on the "Larrabee" architecture, the codename for a family of future graphics-centric co-processors. He also confirmed that key developers have received development systems.
With the first product due next year, Larrabee takes the programmability of Intel Architecture and dramatically extends its parallel processing capabilities. This flexible programmability and the ability to take advantage of available developers, software and design tools give programmers the freedom to realize the benefits of fully programmable rendering and thus easily implement a variety of 3-D graphics pipelines such as rasterization, volumetric rendering or ray tracing.
Combined, PC users will experience stunning visual experiences on Intel-based PCs that incorporate this product. Maloney went on to demonstrate a real-time ray-traced version of the popular game "Quake Wars: Enemy Territory" running on Larrabee and Intel's next-generation enthusiast gaming processor, codenamed "Gulftown," which will carry the Core brand. While Larrabee silicon will initially appear in discrete graphics cards, the Larrabee architecture will eventually be integrated into the processor along with other technologies.
Maloney also provided attendees with a preview of Intel's next-generation intelligent server processor, codenamed Westmere-EP, and Intel's commitment to the high-end of the server market with its Xeon and Itanium processor families. Maloney discussed the unprecedented generational improvement that the forthcoming "Nehalem-EX" server processor will deliver, with performance improvements even greater than what the current Intel Xeon 5500 Series provided versus Intel's previous chip generation.
Maloney described the convergence of compute, networking and storage in the data center, sharing the company's vision of a converged datacenter IO fabric led by Intel 10GbE solutions. Intel also has a number of joint efforts with other industry leaders to deliver optimized platforms, systems, technologies and solutions to address the "hyper-scale" data center environments of the Internet and cloud services trend.
Maloney disclosed a new ultra-low-voltage Intel Xeon 3000 series processor featuring a TDP (Thermal Design Power) of only 30 watts. To complement the broad range of dense and power-optimized platform offerings, Intel also demonstrated publicly for the first time a single-socket "micro server" reference system which will help enable micro server innovation and future specification.
Maloney also described the just-disclosed "Jasper Forest" family of embedded processors as an example of extending the company's popular Nehalem microarchitecture to new markets. Available early next year, Jasper Forest is designed for purpose-built storage, communications, military and aerospace applications, and will offer a new level of integration to save precious board space and power for these dense environments.
Finally, Maloney announced a new PC management tool using Intel vPro technology. Keyboard Video Mouse (KVM) Remote Control enables IT personnel to investigate issues exactly as the user sees them, resulting in faster diagnosis, fewer desk side visits and added cost savings.
Intel technology and manufacturing –- almost 3 billion transistors on a chip
In his keynote address, Bob Baker, senior vice president and general manager, Technology and Manufacturing Group, underscored Intel's relentless pursuit of Moore's Law and its benefits to PC users, and provided more detail on the company's milestone in 22nm process technology. The company is the first to demonstrate working 22nm SRAM and logic test circuits. The 364 million bit SRAM array includes 0.092 square micron SRAM cells and 2.9 billion transistors. These are the smallest SRAM cells in working circuits reported to date.
The 22nm test chip marks the third generation of high-k metal gate technology which was first introduced 2 years ago on the 45nm generation. Intel remains the only company with that energy-efficient and high-performance feature in production, with more than 200 million 45nm CPUs shipped to date.
The manufacturing group has for the first time developed a unique, full-featured technology for SoC designs using Intel's 32nm technology, extending the world-class CPU process into new SoC markets. Designers will be able to choose between extremely high performance with the CPU process or extremely low power consumption, which would be needed for an SoC to extend the battery life of mobile phones and other products.
Future Intel Atom, Core and Xeon processors and System on Chip (SoC) products will make computers smaller, smarter, more capable and easier to use. For example, among a number of other innovations on tap, Intel will integrate graphics into some of its future chip products for the first time ever.
"Over the past 40 years, the opportunities enabled by Moore's Law have gone beyond just impressive performance increases," said Sean Maloney, executive vice president and general manager of the Intel Architecture Group.
"The rapidly increasing number of transistors and processor instructions we add have made possible the integration of more and more capabilities and features within our processors. This has driven an incredible amount of innovation throughout the industry, with the real winners being the consumers, gamers and businesses which buy these Intel-based computers."
Next generation processors – Westmere and Sandy Bridge
In his Intel Developer Forum keynote, Maloney demonstrated a Westmere-based PC that showed a marked increase in responsiveness on simple, everyday tasks such as Web-surfing with multiple windows open.
Moreover, Westmere is Intel's first 32nm processor, and historic in that it is the first-ever Intel processor to integrate graphics die right into the processor's package. As well as supporting Intel Turbo Boost technology and Intel Hyper-Threading Technology, Westmere adds new Advanced Encryption Standard (AES) instructions for faster encryption and decryption. Westmere in on track with wafers already moving through factory floors for planned fourth-quarter revenue production.
After Westmere, Intel's chip integration will continue with 32nm processors codenamed "Sandy Bridge." Sandy Bridge features Intel's sixth-generation graphics cores on the same die or silicon real estate as the processor core, and will include acceleration for floating point, video, and processor intensive software most often found in media applications. Maloney showed a Sandy Bridge-based system running a range of video and 3-D software to demonstrate the health of a far-future product line at its early stage.
Maloney demonstrated early silicon based on the "Larrabee" architecture, the codename for a family of future graphics-centric co-processors. He also confirmed that key developers have received development systems.
With the first product due next year, Larrabee takes the programmability of Intel Architecture and dramatically extends its parallel processing capabilities. This flexible programmability and the ability to take advantage of available developers, software and design tools give programmers the freedom to realize the benefits of fully programmable rendering and thus easily implement a variety of 3-D graphics pipelines such as rasterization, volumetric rendering or ray tracing.
Combined, PC users will experience stunning visual experiences on Intel-based PCs that incorporate this product. Maloney went on to demonstrate a real-time ray-traced version of the popular game "Quake Wars: Enemy Territory" running on Larrabee and Intel's next-generation enthusiast gaming processor, codenamed "Gulftown," which will carry the Core brand. While Larrabee silicon will initially appear in discrete graphics cards, the Larrabee architecture will eventually be integrated into the processor along with other technologies.
Maloney also provided attendees with a preview of Intel's next-generation intelligent server processor, codenamed Westmere-EP, and Intel's commitment to the high-end of the server market with its Xeon and Itanium processor families. Maloney discussed the unprecedented generational improvement that the forthcoming "Nehalem-EX" server processor will deliver, with performance improvements even greater than what the current Intel Xeon 5500 Series provided versus Intel's previous chip generation.
Maloney described the convergence of compute, networking and storage in the data center, sharing the company's vision of a converged datacenter IO fabric led by Intel 10GbE solutions. Intel also has a number of joint efforts with other industry leaders to deliver optimized platforms, systems, technologies and solutions to address the "hyper-scale" data center environments of the Internet and cloud services trend.
Maloney disclosed a new ultra-low-voltage Intel Xeon 3000 series processor featuring a TDP (Thermal Design Power) of only 30 watts. To complement the broad range of dense and power-optimized platform offerings, Intel also demonstrated publicly for the first time a single-socket "micro server" reference system which will help enable micro server innovation and future specification.
Maloney also described the just-disclosed "Jasper Forest" family of embedded processors as an example of extending the company's popular Nehalem microarchitecture to new markets. Available early next year, Jasper Forest is designed for purpose-built storage, communications, military and aerospace applications, and will offer a new level of integration to save precious board space and power for these dense environments.
Finally, Maloney announced a new PC management tool using Intel vPro technology. Keyboard Video Mouse (KVM) Remote Control enables IT personnel to investigate issues exactly as the user sees them, resulting in faster diagnosis, fewer desk side visits and added cost savings.
Intel technology and manufacturing –- almost 3 billion transistors on a chip
In his keynote address, Bob Baker, senior vice president and general manager, Technology and Manufacturing Group, underscored Intel's relentless pursuit of Moore's Law and its benefits to PC users, and provided more detail on the company's milestone in 22nm process technology. The company is the first to demonstrate working 22nm SRAM and logic test circuits. The 364 million bit SRAM array includes 0.092 square micron SRAM cells and 2.9 billion transistors. These are the smallest SRAM cells in working circuits reported to date.
The 22nm test chip marks the third generation of high-k metal gate technology which was first introduced 2 years ago on the 45nm generation. Intel remains the only company with that energy-efficient and high-performance feature in production, with more than 200 million 45nm CPUs shipped to date.
The manufacturing group has for the first time developed a unique, full-featured technology for SoC designs using Intel's 32nm technology, extending the world-class CPU process into new SoC markets. Designers will be able to choose between extremely high performance with the CPU process or extremely low power consumption, which would be needed for an SoC to extend the battery life of mobile phones and other products.
Tuesday, September 22, 2009
Intel Atom Processor Developer Program for mobile devices to spur new wave of apps
INTEL DEVELOPER FORUM, SAN FRANCISCO, USA: To encourage the creation of innovative applications for Intel Atom processor-based products, Intel today launched the Intel Atom Developer Program for independent software vendors (ISVs) and developers.
The program provides a framework for developers to create and sell software applications for netbooks with support for handhelds and smart phones available in the future. Through the program, developers seeking to reduce overhead and streamline the creation of new applications may also license development tools and application modules directly from other independent developers and ISVs.
"We want to fuel the growth of Intel Atom-based products designed for the mobile lifestyle," said Renee James, corporate vice president and general manager, Intel Software and Services Group.
"The netbook has become one of the most popular consumer devices in the market today, but its true potential has been limited by applications that are not optimized for its mobility and smaller screen size. The Intel Atom Developer Program provides a great opportunity for developers to create useful and inventive applications that will unlock a netbook's potential while opening a new sales and distribution channel."
To provide the broadest choice of applications across platforms, the Intel Atom Developer Program will support multiple operating systems and run-time environments. Run-times enable developers to use a single code base to support multiple device platforms and avoid extensive reprogramming, thereby reducing development costs and time-to-market.
Run-times such as Microsoft Silverlight allow developers to access multiple classes of customers and deliver rich applications for Windows and Moblin-based environments using a single toolset, Visual Studio and the .NET Framework.
"Using Silverlight's cross-device, cross-browser, cross-platform technology, developers will be able to write applications once and have them run on Windows and Moblin devices – expanding the reach of Silverlight applications to more consumers, regardless of whether the device they're using is a PC, TV or phone," said Ian Ellison Taylor, general manager, Microsoft Client Platforms and Tools.
"The Adobe Flash Platform enables developers to create and deliver the most compelling applications, content and video to the widest possible audience," said David Wadhwani, general manager and vice president, Adobe Platform Business Unit. "We expect the Intel Atom Developer Program will be a great way for the flash platform community developing on Adobe AIR to monetize their AIR applications and we are working closely with Intel to deliver the necessary technology to enable this opportunity on the Atom platform in the future."
The program offers a streamlined and transparent process that will take the developer from application creation through testing and, finally, to the go-to-market stage. Intel is working with netbook original equipment manufacturers (OEMs) and other partners to create application storefronts through which validated applications will be sold.
"Customer adoption of our Intel Atom-based netbooks is exceeding our expectations," said Jim Wong, president, Acer IT Products Global Operations. "Acer is excited to see Intel's effort in bringing new and innovative applications to netbooks and will use the Intel Atom Developer Program framework to open an application storefront."
"The Intel Atom Developer Program is an integral element of providing a holistic netbook experience for our customers," said S.Y. Shian, vice president and general manager, Asus System Business Group. "Asus sees this new development model as an opportunity to encourage developers and ISVs. Asus plans to offer an application store based on this framework in order to make exciting applications available to our customers."
"Dell is passionate about providing value for developers," said John Thode, vice president, Dell Small Devices. "The Intel Atom Developer Program will open a new world of innovation and business opportunity for developers and we look forward to working with Intel to foster the creation of exciting new Windows and Moblin-based netbook applications."
Developers can learn more about the program, APIs, validation process and application store framework through appdeveloper.intel.com. Applications for ISV and software developer memberships are currently being accepted. Members will be given access to tools and resources that will aid the pre-development process. The Intel Atom Developer Program software development kits will be available to members in late fall.
The program provides a framework for developers to create and sell software applications for netbooks with support for handhelds and smart phones available in the future. Through the program, developers seeking to reduce overhead and streamline the creation of new applications may also license development tools and application modules directly from other independent developers and ISVs.
"We want to fuel the growth of Intel Atom-based products designed for the mobile lifestyle," said Renee James, corporate vice president and general manager, Intel Software and Services Group.
"The netbook has become one of the most popular consumer devices in the market today, but its true potential has been limited by applications that are not optimized for its mobility and smaller screen size. The Intel Atom Developer Program provides a great opportunity for developers to create useful and inventive applications that will unlock a netbook's potential while opening a new sales and distribution channel."
To provide the broadest choice of applications across platforms, the Intel Atom Developer Program will support multiple operating systems and run-time environments. Run-times enable developers to use a single code base to support multiple device platforms and avoid extensive reprogramming, thereby reducing development costs and time-to-market.
Run-times such as Microsoft Silverlight allow developers to access multiple classes of customers and deliver rich applications for Windows and Moblin-based environments using a single toolset, Visual Studio and the .NET Framework.
"Using Silverlight's cross-device, cross-browser, cross-platform technology, developers will be able to write applications once and have them run on Windows and Moblin devices – expanding the reach of Silverlight applications to more consumers, regardless of whether the device they're using is a PC, TV or phone," said Ian Ellison Taylor, general manager, Microsoft Client Platforms and Tools.
"The Adobe Flash Platform enables developers to create and deliver the most compelling applications, content and video to the widest possible audience," said David Wadhwani, general manager and vice president, Adobe Platform Business Unit. "We expect the Intel Atom Developer Program will be a great way for the flash platform community developing on Adobe AIR to monetize their AIR applications and we are working closely with Intel to deliver the necessary technology to enable this opportunity on the Atom platform in the future."
The program offers a streamlined and transparent process that will take the developer from application creation through testing and, finally, to the go-to-market stage. Intel is working with netbook original equipment manufacturers (OEMs) and other partners to create application storefronts through which validated applications will be sold.
"Customer adoption of our Intel Atom-based netbooks is exceeding our expectations," said Jim Wong, president, Acer IT Products Global Operations. "Acer is excited to see Intel's effort in bringing new and innovative applications to netbooks and will use the Intel Atom Developer Program framework to open an application storefront."
"The Intel Atom Developer Program is an integral element of providing a holistic netbook experience for our customers," said S.Y. Shian, vice president and general manager, Asus System Business Group. "Asus sees this new development model as an opportunity to encourage developers and ISVs. Asus plans to offer an application store based on this framework in order to make exciting applications available to our customers."
"Dell is passionate about providing value for developers," said John Thode, vice president, Dell Small Devices. "The Intel Atom Developer Program will open a new world of innovation and business opportunity for developers and we look forward to working with Intel to foster the creation of exciting new Windows and Moblin-based netbook applications."
Developers can learn more about the program, APIs, validation process and application store framework through appdeveloper.intel.com. Applications for ISV and software developer memberships are currently being accepted. Members will be given access to tools and resources that will aid the pre-development process. The Intel Atom Developer Program software development kits will be available to members in late fall.
Moore's Law marches on at Intel!
INTEL DEVELOPER FORUM, SAN FRANCISCO, USA: Intel President and CEO Paul Otellini today displayed a silicon wafer containing the world's first working chips built on 22nm process technology. The 22nm test circuits include both SRAM memory as well as logic circuits to be used in future Intel microprocessors.
"At Intel, Moore's Law is alive and thriving," said Otellini. "We've begun production of the world's first 32nm microprocessor, which is also the first high-performance processor to integrate graphics with the CPU. At the same time, we're already moving ahead with development of our 22nm manufacturing technology and have built working chips that will pave the way for production of still more powerful and more capable processors."
The 22nm wafer displayed by Otellini is made up of individual die containing 364 million bits of SRAM memory and has more than 2.9 billion transistors packed into an area the size of a fingernail. The chips contain the smallest SRAM cell used in working circuits ever reported at .092 square microns. The devices rely on a third-generation high-k metal gate transistor technology for improved performance and lower leakage power.
By continuing to lead in manufacturing technology Intel is able to innovate and integrate new features and functions into its processors. Intel's 32nm process is now certified and Westmere processor wafers are moving through the factory in support of planned fourth quarter revenue production.
Following the move to 32nm Intel will subsequently introduce Sandy Bridge, Intel's next new microarchitecture. Sandy Bridge will feature a sixth generation graphics core on the same die as the processor core and includes AVX instructions for floating point, media, and processor intensive software.
By continuing to drive the pace of innovation Intel is addressing the needs of entirely new market segments including netbooks, handhelds, consumer electronics and embedded applications. "Intel Core and Atom-based processors have generated unprecedented excitement and opportunities in our key growth areas," Otellini said.
"To build on this momentum, we're working on ways to create a seamless Internet experience for people across all their computing devices. Today we're announcing a program to encourage development of software applications that can be written once, but run on Windows and Moblin devices – expanding their reach to more devices and consumers."
The Intel Atom Developer Program provides a framework for independent software vendors (ISVs) and software developers to create and sell applications for netbooks and other Intel Atom processor-based products. To broaden application availability across platforms, the program will support multiple operating systems and run-time environments.
Run-time environments enable developers to use a single code base to support various device platforms without massive reprogramming, reducing cost and time to market. Intel is working with partners, such as netbook OEMs ACER and Asus, to create application storefronts in which validated software applications will be sold.
In the embedded market segment, the Atom processor is driving advanced technology into new areas from hospital patient monitoring to avionics applications to audio systems. The company currently has 460 embedded Atom design wins including Harman International Industries. The provider of a wide range of audio and infotainment products for vehicles, Harman International has announced new in-car devices based on the Atom core that will enable full Internet access, 3-D navigation, brilliant graphics and high-speed wireless connectivity.
"At Intel, Moore's Law is alive and thriving," said Otellini. "We've begun production of the world's first 32nm microprocessor, which is also the first high-performance processor to integrate graphics with the CPU. At the same time, we're already moving ahead with development of our 22nm manufacturing technology and have built working chips that will pave the way for production of still more powerful and more capable processors."
The 22nm wafer displayed by Otellini is made up of individual die containing 364 million bits of SRAM memory and has more than 2.9 billion transistors packed into an area the size of a fingernail. The chips contain the smallest SRAM cell used in working circuits ever reported at .092 square microns. The devices rely on a third-generation high-k metal gate transistor technology for improved performance and lower leakage power.
By continuing to lead in manufacturing technology Intel is able to innovate and integrate new features and functions into its processors. Intel's 32nm process is now certified and Westmere processor wafers are moving through the factory in support of planned fourth quarter revenue production.
Following the move to 32nm Intel will subsequently introduce Sandy Bridge, Intel's next new microarchitecture. Sandy Bridge will feature a sixth generation graphics core on the same die as the processor core and includes AVX instructions for floating point, media, and processor intensive software.
By continuing to drive the pace of innovation Intel is addressing the needs of entirely new market segments including netbooks, handhelds, consumer electronics and embedded applications. "Intel Core and Atom-based processors have generated unprecedented excitement and opportunities in our key growth areas," Otellini said.
"To build on this momentum, we're working on ways to create a seamless Internet experience for people across all their computing devices. Today we're announcing a program to encourage development of software applications that can be written once, but run on Windows and Moblin devices – expanding their reach to more devices and consumers."
The Intel Atom Developer Program provides a framework for independent software vendors (ISVs) and software developers to create and sell applications for netbooks and other Intel Atom processor-based products. To broaden application availability across platforms, the program will support multiple operating systems and run-time environments.
Run-time environments enable developers to use a single code base to support various device platforms without massive reprogramming, reducing cost and time to market. Intel is working with partners, such as netbook OEMs ACER and Asus, to create application storefronts in which validated software applications will be sold.
In the embedded market segment, the Atom processor is driving advanced technology into new areas from hospital patient monitoring to avionics applications to audio systems. The company currently has 460 embedded Atom design wins including Harman International Industries. The provider of a wide range of audio and infotainment products for vehicles, Harman International has announced new in-car devices based on the Atom core that will enable full Internet access, 3-D navigation, brilliant graphics and high-speed wireless connectivity.
Monday, September 21, 2009
EC publishes decision concerning Intel's abuse of dominant position
EUROPE: The European Commission has today published a non-confidential version of its Intel Decision, adopted on 13 May 2009 ( IP/09/745 and MEMO/09/235 ), together with a summary of the key elements of the Decision.
That Decision found that Intel broke EC Treaty antitrust rules (Article 82) by engaging in two types of illegal practice to exclude competitors from the market for computer chips called x86 central processing units (CPUs). These practices harmed consumers throughout the EEA.
By undermining its competitors’ ability to compete on the merits of their products, Intel’s actions undermined competition, reduced consumer choice and hindered innovation. On the basis of a significant amount of contemporaneous evidence and company statements, the Decision demonstrates how Intel broke the law.
Intel abused its dominant position in the x86 CPU market by implementing a series of conditional rebates to computer manufacturers and to a European retailer and by taking other measures aimed at preventing or delaying the launch of computers based on competing products (so-called 'naked restrictions'). The Commission's Decision outlines specific cases of these conditional rebates and naked restrictions, as well as how Intel sought to conceal its practices and how computer manufacturers and Intel itself recognised the growing threat represented by the products of Intel's main competitor, AMD.
Conditional rebates
The conditional rebates were as follows:
Intel rebates to Dell from December 2002 to December 2005 were conditioned on Dell purchasing exclusively Intel CPUs. For example, in an internal Dell presentation of February 2003, Dell noted that should Dell switch any part of its CPU supplies from Intel to its competitor AMD, Intel retaliation "could be severe and prolonged with impact to all LOBs [Lines of Business]." In a February 2004 e-mail on the consequences of the possible purchase by Dell of AMD CPUs, a Dell executive wrote: "Boss, here's an outline of the framework we discussed with Intel. (…) Intel is ready to send [Intel Senior executive] /[Intel executive] /[Intel executive] to meet with [Dell Senior Executive]/[Dell Senior Executive]/[Dell Executive] . (...) Background: [Intel Senior executive] /[Intel Senior executive] are prepared for [all-out war] if Dell joins the AMD exodus. We get ZERO MCP [name of Intel rebate to Dell] for at least one quarter while Intel 'investigates the details' (...) We'll also have to bite and scratch to even hold 50%, including a commitment to NOT ship in Corporate. If we go in Opti [Dell product series for corporate customers] , they cut it to <20 percent and use the added MCP to compete against us."
Intel rebates to HP from November 2002 to May 2005 were conditioned in particular on HP purchasing no less than 95 percent of its CPU needs for business desktops from Intel (the remaining 5 percent that HP could purchase from AMD was then subject to further restrictive conditions set out below). In this regard, in a submission to the Commission, HP stated that "Intel granted the credits subject to the following unwritten requirements: a) that HP should purchase at least 95 percent of its business desktop system from Intel…". By way of example, in an e-mail written in July 2002 during the negotiation of the rebate agreement between HP and Intel, an HP executive wrote: ""PLEASE DO NOT… communicate to the regions, your team members or AMD that we are constrained to 5 percent AMD by pursuing the Intel agreement."
Intel rebates to NEC during the period ranging from October 2002 to November 2005 were conditioned on NEC purchasing no less than 80 percent of its CPU needs for its desktop and notebook segments from Intel. For example, in a May 2002 e-mail (when the arrangement was concluded), an NEC executive specified that "NEC will (...) increase [worldwide] Intel market share from [...] percent to 80 percent. Intel will give NEC [support] and aggressive [...] price."
Intel rebates to Lenovo during year 2007 were conditioned on Lenovo purchasing its CPU needs for its notebook segment exclusively from Intel. For example, in a December 2006 e-mail, a Lenovo executive stated: "Late last week Lenovo cut a lucrative deal with Intel. As a result of this, we will not be introducing AMD based products in 2007 for our Notebook products".
Intel payments to Media Saturn Holding (MSH), Europe's largest PC retailer, were conditioned on MSH selling exclusively Intel-based PCs from October 2002 to December 2007. For example, in a submission to the Commission, MSH stated: "It was clear to MSH in this regard that the sale of AMD-equipped computers would result at least in a reduction of the amount of Intel's contribution payments per Intel CPU under the contribution agreements (and thus in a reduction of the total payments received from Intel, even if the total volume of Intel-CPUs sold by MSH would have remained the same as in previous periods), although MSH never actually tested the issue with Intel."
Naked restrictions
The naked restrictions uncovered by the Commission were as follows:
Between November 2002 and May 2005, Intel payments to HP were conditioned on HP selling AMD-based business desktops only to small and medium enterprises, only via direct distribution channels (rather than distributors), and on HP postponing the launch of its first AMD-based business desktop in Europe by six months. For example, in an internal September 2004 HP e-mail, an HP executive stated: “You can NOT use the commercial AMD line in the channel in any country, it must be done direct. If you do and we get caught (and we will) the Intel moneys (each month) is gone (they would terminate the deal). The risk is too high."
Intel payments to Acer were conditioned on Acer postponing the launch of an AMD-based notebook from September 2003 to January 2004. For example, in a September 2003 email, an Intel executive reported: "good news just came from [Acer Senior Executive] that Acer decides to drop AMD K8 [notebook product] throughout 2003 around the world. We've been talking with them all the way up to [Intel senior executive] 's […] level recently including [Intel executive] , [Intel senior executive] … and [Intel executive]… . They keep pushing back until today, after the call with [Intel executive] this morning, [Acer Senior Executive] just confirmed that they decide to drop AMD K8 throughout 2003 around the world. [Acer Senior Executive] has got this direction from [Acer Senior Executive] as well and will follow through in EMEA [Europe Middle East and Africa region]".
Intel payments to Lenovo were linked to or conditioned on Lenovo postponing the launch of AMD-based notebooks from June 2006 to the end of 2006. For example, in a June 2006 e-mail, a Lenovo executive reported that: "[two Lenovo executives] had a dinner with [an Intel executive] tonight (…). […] When we asked Intel what level of support we will get on NB [notebook] in next quarter, [he] told us (…) the deal is base[d] [sic] on our assumption to not launch AMD NB [notebook] platform. (…) Intel deal will not allow us to launch AMD".
Concealment
The Commission found that Intel generally sought to conceal the conditions in its arrangements with PC manufacturers and MSH. For example:
The rebate arrangement with Dell was not subject to a written agreement but was concluded orally at various meetings. In this regard for example, in a submission to the Commission, Dell stated that " there is no written agreement between Intel and Dell concerning the MCP [rebate] discount, rather, the discount is the subject of constant oral negotiations and agreement".
There was a written agreement with HP but the relevant conditions remained unwritten. In this regard for example, in a submission to the Commission, HP stated that the " unwritten conditions (...) were stated to be part of the HPA1 agreement by [Intel executive] , [Intel executive] and [Intel senior executive] in meetings with HP during the negotiations;
The written agreement with MSH contained a provision that the deal was non-exclusive. However, the evidence demonstrates that at Intel's request, the arrangement was in fact exclusive. In this regard for example, in a submission to the Commission, MSH stated that " It was clear to MSH that despite the non-exclusivity clause the exclusive nature of the relationship remained, for Intel, an essential element of the relationship between Intel and MSH. In fact, [MSH executive] recalls that Intel representatives made it clear to him that the changes in the wording of the agreement had been requested by Intel's legal department, but that in reality the relationship was to continue as before, including the requirement that MSH sell essentially only Intel-based computers."
Other statements from computer manufacturers and MSH outline how the various Intel conditions were an important factor in their decisions not to partially switch to or buy more x86 CPUs from AMD, Intel's main competitor in the x86 CPU market. For instance, in a submission to the Commission, HP stated that it " can confirm that Intel's inducements (in particular the block rebates) were a material factor in determining HP's agreement to the unwritten conditions. As a result (...) HP [Business desktop PC division] stayed at least 95% aligned to Intel."
AMD's growing threat
The evidence in the Decision indicates the growing threat that AMD's products represented to Intel, and that Intel's customers were actively considering switching part of their x86 CPU supplies to AMD.
For example, in an October 2004 e-mail from Dell to Intel, a Dell executive stated that " AMD is a great threat to our business. Intel is increasingly uncompetitive to AMD, which results in Dell being uncompetitive to [Dell competitors]. We have slower, hotter products that cost more across the board in the enterprise with no hope of closing the performance gap for one to two years." In a submission to the Commission, Dell also stated that as regards Opteron, "in Dell's perception this CPU generally performed approximately […] better than the comparable Intel Xeon CPU at the time." As regards AMD's Athlon PC CPU, an internal HP presentation from 2002 stated that it "had a unique architecture", was "more efficient on many tasks" , and had been "CPU of [the] year [for] three consecutive years".
The fact that AMD had improved its products is also recognised by Intel itself. For example, in a 2005 submission to the Commission, Intel stated that "AMD improved its product offerings dramatically with the introduction of its successful Opteron processor". This is also confirmed by contemporaneous documents from Intel. For example, in a 2004 internal Intel e-mail, it is stated that "Opteron is real threat today… Opteron-based single WS [Workstation] benchmarks beat [Intel's] Xeon in all cases."
Procedure
Before the Commission adopted its final Decision, it carried out a comprehensive investigation of the facts. During the proceedings, Intel was able to comment fully on all the Commission's evidence outlined in the Decision. Indeed, the Commission went beyond its legal obligations in safeguarding Intel's rights of defence.
For example, despite the fact that Intel chose not to reply to the Commission's supplementary Statement of Objections (see MEMO/08/517 ) by the extended deadline of 17 October 2008 but instead sought to suspend the Commission's case, the Commission took full account of Intel's belated written submissions relating to the supplementary Statement of Objections.
The full text of the decision, together with a summary, is now available on the Europa website:
http://ec.europa.eu/competition/sectors/ict/intel.html
That Decision found that Intel broke EC Treaty antitrust rules (Article 82) by engaging in two types of illegal practice to exclude competitors from the market for computer chips called x86 central processing units (CPUs). These practices harmed consumers throughout the EEA.
By undermining its competitors’ ability to compete on the merits of their products, Intel’s actions undermined competition, reduced consumer choice and hindered innovation. On the basis of a significant amount of contemporaneous evidence and company statements, the Decision demonstrates how Intel broke the law.
Intel abused its dominant position in the x86 CPU market by implementing a series of conditional rebates to computer manufacturers and to a European retailer and by taking other measures aimed at preventing or delaying the launch of computers based on competing products (so-called 'naked restrictions'). The Commission's Decision outlines specific cases of these conditional rebates and naked restrictions, as well as how Intel sought to conceal its practices and how computer manufacturers and Intel itself recognised the growing threat represented by the products of Intel's main competitor, AMD.
Conditional rebates
The conditional rebates were as follows:
Intel rebates to Dell from December 2002 to December 2005 were conditioned on Dell purchasing exclusively Intel CPUs. For example, in an internal Dell presentation of February 2003, Dell noted that should Dell switch any part of its CPU supplies from Intel to its competitor AMD, Intel retaliation "could be severe and prolonged with impact to all LOBs [Lines of Business]." In a February 2004 e-mail on the consequences of the possible purchase by Dell of AMD CPUs, a Dell executive wrote: "Boss, here's an outline of the framework we discussed with Intel. (…) Intel is ready to send [Intel Senior executive] /[Intel executive] /[Intel executive] to meet with [Dell Senior Executive]/[Dell Senior Executive]/[Dell Executive] . (...) Background: [Intel Senior executive] /[Intel Senior executive] are prepared for [all-out war] if Dell joins the AMD exodus. We get ZERO MCP [name of Intel rebate to Dell] for at least one quarter while Intel 'investigates the details' (...) We'll also have to bite and scratch to even hold 50%, including a commitment to NOT ship in Corporate. If we go in Opti [Dell product series for corporate customers] , they cut it to <20 percent and use the added MCP to compete against us."
Intel rebates to HP from November 2002 to May 2005 were conditioned in particular on HP purchasing no less than 95 percent of its CPU needs for business desktops from Intel (the remaining 5 percent that HP could purchase from AMD was then subject to further restrictive conditions set out below). In this regard, in a submission to the Commission, HP stated that "Intel granted the credits subject to the following unwritten requirements: a) that HP should purchase at least 95 percent of its business desktop system from Intel…". By way of example, in an e-mail written in July 2002 during the negotiation of the rebate agreement between HP and Intel, an HP executive wrote: ""PLEASE DO NOT… communicate to the regions, your team members or AMD that we are constrained to 5 percent AMD by pursuing the Intel agreement."
Intel rebates to NEC during the period ranging from October 2002 to November 2005 were conditioned on NEC purchasing no less than 80 percent of its CPU needs for its desktop and notebook segments from Intel. For example, in a May 2002 e-mail (when the arrangement was concluded), an NEC executive specified that "NEC will (...) increase [worldwide] Intel market share from [...] percent to 80 percent. Intel will give NEC [support] and aggressive [...] price."
Intel rebates to Lenovo during year 2007 were conditioned on Lenovo purchasing its CPU needs for its notebook segment exclusively from Intel. For example, in a December 2006 e-mail, a Lenovo executive stated: "Late last week Lenovo cut a lucrative deal with Intel. As a result of this, we will not be introducing AMD based products in 2007 for our Notebook products".
Intel payments to Media Saturn Holding (MSH), Europe's largest PC retailer, were conditioned on MSH selling exclusively Intel-based PCs from October 2002 to December 2007. For example, in a submission to the Commission, MSH stated: "It was clear to MSH in this regard that the sale of AMD-equipped computers would result at least in a reduction of the amount of Intel's contribution payments per Intel CPU under the contribution agreements (and thus in a reduction of the total payments received from Intel, even if the total volume of Intel-CPUs sold by MSH would have remained the same as in previous periods), although MSH never actually tested the issue with Intel."
Naked restrictions
The naked restrictions uncovered by the Commission were as follows:
Between November 2002 and May 2005, Intel payments to HP were conditioned on HP selling AMD-based business desktops only to small and medium enterprises, only via direct distribution channels (rather than distributors), and on HP postponing the launch of its first AMD-based business desktop in Europe by six months. For example, in an internal September 2004 HP e-mail, an HP executive stated: “You can NOT use the commercial AMD line in the channel in any country, it must be done direct. If you do and we get caught (and we will) the Intel moneys (each month) is gone (they would terminate the deal). The risk is too high."
Intel payments to Acer were conditioned on Acer postponing the launch of an AMD-based notebook from September 2003 to January 2004. For example, in a September 2003 email, an Intel executive reported: "good news just came from [Acer Senior Executive] that Acer decides to drop AMD K8 [notebook product] throughout 2003 around the world. We've been talking with them all the way up to [Intel senior executive] 's […] level recently including [Intel executive] , [Intel senior executive] … and [Intel executive]… . They keep pushing back until today, after the call with [Intel executive] this morning, [Acer Senior Executive] just confirmed that they decide to drop AMD K8 throughout 2003 around the world. [Acer Senior Executive] has got this direction from [Acer Senior Executive] as well and will follow through in EMEA [Europe Middle East and Africa region]".
Intel payments to Lenovo were linked to or conditioned on Lenovo postponing the launch of AMD-based notebooks from June 2006 to the end of 2006. For example, in a June 2006 e-mail, a Lenovo executive reported that: "[two Lenovo executives] had a dinner with [an Intel executive] tonight (…). […] When we asked Intel what level of support we will get on NB [notebook] in next quarter, [he] told us (…) the deal is base[d] [sic] on our assumption to not launch AMD NB [notebook] platform. (…) Intel deal will not allow us to launch AMD".
Concealment
The Commission found that Intel generally sought to conceal the conditions in its arrangements with PC manufacturers and MSH. For example:
The rebate arrangement with Dell was not subject to a written agreement but was concluded orally at various meetings. In this regard for example, in a submission to the Commission, Dell stated that " there is no written agreement between Intel and Dell concerning the MCP [rebate] discount, rather, the discount is the subject of constant oral negotiations and agreement".
There was a written agreement with HP but the relevant conditions remained unwritten. In this regard for example, in a submission to the Commission, HP stated that the " unwritten conditions (...) were stated to be part of the HPA1 agreement by [Intel executive] , [Intel executive] and [Intel senior executive] in meetings with HP during the negotiations;
The written agreement with MSH contained a provision that the deal was non-exclusive. However, the evidence demonstrates that at Intel's request, the arrangement was in fact exclusive. In this regard for example, in a submission to the Commission, MSH stated that " It was clear to MSH that despite the non-exclusivity clause the exclusive nature of the relationship remained, for Intel, an essential element of the relationship between Intel and MSH. In fact, [MSH executive] recalls that Intel representatives made it clear to him that the changes in the wording of the agreement had been requested by Intel's legal department, but that in reality the relationship was to continue as before, including the requirement that MSH sell essentially only Intel-based computers."
Other statements from computer manufacturers and MSH outline how the various Intel conditions were an important factor in their decisions not to partially switch to or buy more x86 CPUs from AMD, Intel's main competitor in the x86 CPU market. For instance, in a submission to the Commission, HP stated that it " can confirm that Intel's inducements (in particular the block rebates) were a material factor in determining HP's agreement to the unwritten conditions. As a result (...) HP [Business desktop PC division] stayed at least 95% aligned to Intel."
AMD's growing threat
The evidence in the Decision indicates the growing threat that AMD's products represented to Intel, and that Intel's customers were actively considering switching part of their x86 CPU supplies to AMD.
For example, in an October 2004 e-mail from Dell to Intel, a Dell executive stated that " AMD is a great threat to our business. Intel is increasingly uncompetitive to AMD, which results in Dell being uncompetitive to [Dell competitors]. We have slower, hotter products that cost more across the board in the enterprise with no hope of closing the performance gap for one to two years." In a submission to the Commission, Dell also stated that as regards Opteron, "in Dell's perception this CPU generally performed approximately […] better than the comparable Intel Xeon CPU at the time." As regards AMD's Athlon PC CPU, an internal HP presentation from 2002 stated that it "had a unique architecture", was "more efficient on many tasks" , and had been "CPU of [the] year [for] three consecutive years".
The fact that AMD had improved its products is also recognised by Intel itself. For example, in a 2005 submission to the Commission, Intel stated that "AMD improved its product offerings dramatically with the introduction of its successful Opteron processor". This is also confirmed by contemporaneous documents from Intel. For example, in a 2004 internal Intel e-mail, it is stated that "Opteron is real threat today… Opteron-based single WS [Workstation] benchmarks beat [Intel's] Xeon in all cases."
Procedure
Before the Commission adopted its final Decision, it carried out a comprehensive investigation of the facts. During the proceedings, Intel was able to comment fully on all the Commission's evidence outlined in the Decision. Indeed, the Commission went beyond its legal obligations in safeguarding Intel's rights of defence.
For example, despite the fact that Intel chose not to reply to the Commission's supplementary Statement of Objections (see MEMO/08/517 ) by the extended deadline of 17 October 2008 but instead sought to suspend the Commission's case, the Commission took full account of Intel's belated written submissions relating to the supplementary Statement of Objections.
The full text of the decision, together with a summary, is now available on the Europa website:
http://ec.europa.eu/competition/sectors/ict/intel.html
Wednesday, September 16, 2009
Intel's MPU domination reaches four-year high in Q2
EL SEGUNDO, USA: Capitalizing on a mild recovery in PC demand, Intel Corp. in the second quarter managed to expand its lead in the global microprocessor market to levels not seen in nearly four years, according to iSuppli Corp.
Intel in the second quarter of 2009 accounted for 80.6 percent of global microprocessor revenue, up 1.4 points from 79.1 percent during the same period in 2008, and a 1.5 point rise from the first quarter of 2009. This gave the company the largest share of global microprocessor revenue since it claimed 82.4 percent of revenue in the third quarter of 2005.
“Intel benefitted as the global PC market took a first small step toward recovery in the second quarter, with global shipments rising by 1 percent from the first quarter,” said Matthew Wilkins, principal analyst of compute platforms research for iSuppli.
“However, with PC shipments still down compared to a year earlier, Intel actually suffered a decline in microprocessor revenue compared to a year earlier, as did chief rival Advanced Micro Devices Inc. (AMD).”
Intel in the second quarter enjoyed strong demand for its new-generation products across all segments, including desktops, notebooks and servers. However, in the overall PC market, only the notebook segment produced growth compared to the second quarter of 2008, at 13 percent. Both the desktop PC and entry-level server segments declined on a year-over basis.
In contrast, AMD lost 0.4 percentage points of market share compared to a year earlier, and declined by 1.4 points of share on a sequential basis from the first quarter of 2009.
“AMD didn’t benefit from the small sequential rise in PC sales because its average microprocessor pricing was lower than that from the first quarter of 2009,” Wilkins said.
Intel in the second quarter of 2009 accounted for 80.6 percent of global microprocessor revenue, up 1.4 points from 79.1 percent during the same period in 2008, and a 1.5 point rise from the first quarter of 2009. This gave the company the largest share of global microprocessor revenue since it claimed 82.4 percent of revenue in the third quarter of 2005.
“Intel benefitted as the global PC market took a first small step toward recovery in the second quarter, with global shipments rising by 1 percent from the first quarter,” said Matthew Wilkins, principal analyst of compute platforms research for iSuppli.
“However, with PC shipments still down compared to a year earlier, Intel actually suffered a decline in microprocessor revenue compared to a year earlier, as did chief rival Advanced Micro Devices Inc. (AMD).”
Intel in the second quarter enjoyed strong demand for its new-generation products across all segments, including desktops, notebooks and servers. However, in the overall PC market, only the notebook segment produced growth compared to the second quarter of 2008, at 13 percent. Both the desktop PC and entry-level server segments declined on a year-over basis.
In contrast, AMD lost 0.4 percentage points of market share compared to a year earlier, and declined by 1.4 points of share on a sequential basis from the first quarter of 2009.
“AMD didn’t benefit from the small sequential rise in PC sales because its average microprocessor pricing was lower than that from the first quarter of 2009,” Wilkins said.
Tuesday, September 15, 2009
Organizational changes at Intel!
SANTA CLARA, USA: Intel announced a number of important organizational changes today and expansion of some key executive responsibilities.
The changes align the business around the core competencies of Intel Architecture and world class manufacturing, placing operating responsibility for them in three senior executives. In making the changes, Paul Otellini, Intel's chief executive, will devote a higher quotient of his time to corporate strategy and driving the company's growth initiatives.
First, Intel is consolidating all of its major product divisions into the newly formed Intel Architecture Group (IAG), which will be co-managed by Sean Maloney and Dadi Perlmutter, both executive vice presidents.
Maloney will be responsible for business and operations while Perlmutter will lead product development and architecture. Reporting to them will be all of Intel's components businesses based on the Intel architecture, as well as all the development and marketing teams needed to bring these products to market.
Second, Intel's global manufacturing organization, the Technology and Manufacturing Group (TMG), will now report to Andy Bryant, Intel's chief administrative officer and also an executive vice president.
The move formalizes the role of influence Bryant already plays with TMG and further increases Otellini's time on business strategy. The TMG organization under Bob Baker, Bill Holt and Brian Krzanich will report to Bryant but otherwise remain unchanged. Baker will continue to oversee Intel's NAND flash memory business.
In addition to micro-architecture planning, microprocessor and chipset development, SOC (system on a chip solutions) and wireless teams managed by Steve Pawlowski, Sunil Shenoy, Rony Friedman, Rob Crooke and Raviv Melamed respectively, there will be six business groups operating under the new IAG umbrella.
The first is the PC Client Group that will consolidate Intel's existing mobile and desktop product operations. As markets shift to a higher mix of mobile products, this new group will take advantage of common building blocks that have existed for years and enable Intel to better scale cross-platform efforts like security and manageability. The PC Client Group will be led by Mooly Eden.
The second is the Data Center Group, focused on servers, cloud computing, networking and high-performance computing. This group will be led by Kirk Skaugen.
The third is the Visual Computing Group, focused on advanced visualization products, and led by Jim Johnson.
The fourth is the Ultra Mobility Group, which will continue to be led by Anand Chandrasekher and will focus on extending the Intel architecture into mobile handheld devices.
The fifth is the Embedded and Communications Group, which Doug Davis will continue to lead.
The sixth is the Digital Home Group, still under Eric Kim, that is driving Intel chips into a variety of entertainment systems and consumer electronic applications.
In addition, with Maloney's move to IAG, Tom Kilroy will assume responsibility for Intel's Sales and Marketing Group (SMG). Kilroy was previously co-manager of processors for enterprise-class applications, the unit previously known as the Digital Enterprise Group (DEG). Kilroy will report to CEO Otellini.
Separately, Intel also announced today that Pat Gelsinger and Bruce Sewell have decided to leave the company to pursue other opportunities. Gelsinger co-managed DEG and Sewell served as Intel's general counsel. Suzan Miller, currently deputy general counsel, will take the role of interim general counsel.
"We thank Pat and Bruce for many years of service to Intel and wish them well in their future endeavors," said Otellini.
The changes align the business around the core competencies of Intel Architecture and world class manufacturing, placing operating responsibility for them in three senior executives. In making the changes, Paul Otellini, Intel's chief executive, will devote a higher quotient of his time to corporate strategy and driving the company's growth initiatives.
First, Intel is consolidating all of its major product divisions into the newly formed Intel Architecture Group (IAG), which will be co-managed by Sean Maloney and Dadi Perlmutter, both executive vice presidents.
Maloney will be responsible for business and operations while Perlmutter will lead product development and architecture. Reporting to them will be all of Intel's components businesses based on the Intel architecture, as well as all the development and marketing teams needed to bring these products to market.
Second, Intel's global manufacturing organization, the Technology and Manufacturing Group (TMG), will now report to Andy Bryant, Intel's chief administrative officer and also an executive vice president.
The move formalizes the role of influence Bryant already plays with TMG and further increases Otellini's time on business strategy. The TMG organization under Bob Baker, Bill Holt and Brian Krzanich will report to Bryant but otherwise remain unchanged. Baker will continue to oversee Intel's NAND flash memory business.
In addition to micro-architecture planning, microprocessor and chipset development, SOC (system on a chip solutions) and wireless teams managed by Steve Pawlowski, Sunil Shenoy, Rony Friedman, Rob Crooke and Raviv Melamed respectively, there will be six business groups operating under the new IAG umbrella.
The first is the PC Client Group that will consolidate Intel's existing mobile and desktop product operations. As markets shift to a higher mix of mobile products, this new group will take advantage of common building blocks that have existed for years and enable Intel to better scale cross-platform efforts like security and manageability. The PC Client Group will be led by Mooly Eden.
The second is the Data Center Group, focused on servers, cloud computing, networking and high-performance computing. This group will be led by Kirk Skaugen.
The third is the Visual Computing Group, focused on advanced visualization products, and led by Jim Johnson.
The fourth is the Ultra Mobility Group, which will continue to be led by Anand Chandrasekher and will focus on extending the Intel architecture into mobile handheld devices.
The fifth is the Embedded and Communications Group, which Doug Davis will continue to lead.
The sixth is the Digital Home Group, still under Eric Kim, that is driving Intel chips into a variety of entertainment systems and consumer electronic applications.
In addition, with Maloney's move to IAG, Tom Kilroy will assume responsibility for Intel's Sales and Marketing Group (SMG). Kilroy was previously co-manager of processors for enterprise-class applications, the unit previously known as the Digital Enterprise Group (DEG). Kilroy will report to CEO Otellini.
Separately, Intel also announced today that Pat Gelsinger and Bruce Sewell have decided to leave the company to pursue other opportunities. Gelsinger co-managed DEG and Sewell served as Intel's general counsel. Suzan Miller, currently deputy general counsel, will take the role of interim general counsel.
"We thank Pat and Bruce for many years of service to Intel and wish them well in their future endeavors," said Otellini.
Wednesday, September 9, 2009
Inphi receives Intel validation for low-power LV-GS02 DDR3 memory interface component
Intel Developer Forum 2009, WESTLAKE VILLAGE, USA: Inphi Corp. a high-speed analog semiconductor company, has received Intel validation at 1.5V for its low-power LV-GS02 DDR3 register on Intel’s current Xeon Core i7 and next-generation platforms. The Inphi LV-GS02 enables enterprise computing platforms to achieve higher memory capacity and bandwidth while using significantly less energy.
At the upcoming Intel Developer Forum (IDF) 2009, being held September 22 to 24 at the Moscone Center West in San Francisco, Inphi will demonstrate the technology behind the low-power LV-GS02 DDR3 register. Inphi will be in Booth #321 at IDF 2009.
The LV-GS02 registering clock driver is part of Inphi’s ExacTik® family of server memory interface components. Continuing Inphi’s leadership in developing products to reduce power consumption in the cloud computing infrastructure, its LV-GS02 is designed to help the world’s data centers meet their challenges of reducing energy consumption – while also optimizing the memory capacity and bandwidth of enterprise computing platforms. The Inphi LV-GS02 helps designers meet the increasingly stringent thermal/power envelopes in server and data-center designs.
The Inphi LV-GS02 also supports 1.35V, making it a single, scalable solution offering low-power, dual voltage and supporting DDR3-800 through DDR3-1600. The register exceeds all JEDEC standards at both 1.35V and 1.5V.
“The Inphi LV-GS02 component’s combination of dual-voltage support, high speed and lower power consumption is important for enabling next-generation data centers, cloud computing and other high-performance computing applications,” said Young K. Sohn, president and CEO of Inphi. “By offering a single solution for both standard and low-voltage applications, the Inphi LV-GS02 gives our customers and end users a single SKU with the flexibility and scalability to support current as well as future platform memory requirements, while significantly reducing the costs associated with validation and qualification.”
The innovative design of the Inphi LV-GS02 DDR3 register can yield up to 70 percent core power reduction, as well as operation with minimal idle power consumption. Its overall power consumption is 5 percent to 10 percent below that of other available parts. In high-end systems with 12 to 18 memory modules per server, the Inphi LV-GS02 efficiencies can translate to significant power savings.
At the upcoming Intel Developer Forum (IDF) 2009, being held September 22 to 24 at the Moscone Center West in San Francisco, Inphi will demonstrate the technology behind the low-power LV-GS02 DDR3 register. Inphi will be in Booth #321 at IDF 2009.
The LV-GS02 registering clock driver is part of Inphi’s ExacTik® family of server memory interface components. Continuing Inphi’s leadership in developing products to reduce power consumption in the cloud computing infrastructure, its LV-GS02 is designed to help the world’s data centers meet their challenges of reducing energy consumption – while also optimizing the memory capacity and bandwidth of enterprise computing platforms. The Inphi LV-GS02 helps designers meet the increasingly stringent thermal/power envelopes in server and data-center designs.
The Inphi LV-GS02 also supports 1.35V, making it a single, scalable solution offering low-power, dual voltage and supporting DDR3-800 through DDR3-1600. The register exceeds all JEDEC standards at both 1.35V and 1.5V.
“The Inphi LV-GS02 component’s combination of dual-voltage support, high speed and lower power consumption is important for enabling next-generation data centers, cloud computing and other high-performance computing applications,” said Young K. Sohn, president and CEO of Inphi. “By offering a single solution for both standard and low-voltage applications, the Inphi LV-GS02 gives our customers and end users a single SKU with the flexibility and scalability to support current as well as future platform memory requirements, while significantly reducing the costs associated with validation and qualification.”
The innovative design of the Inphi LV-GS02 DDR3 register can yield up to 70 percent core power reduction, as well as operation with minimal idle power consumption. Its overall power consumption is 5 percent to 10 percent below that of other available parts. In high-end systems with 12 to 18 memory modules per server, the Inphi LV-GS02 efficiencies can translate to significant power savings.
Tuesday, September 8, 2009
Intel intros Core i7, Xeon 3400 and first Core i5 processors
SANTA CLARA, USA: Intel Corp. has introduced several high-performance desktop and server processors today, bringing the next level of integration and intelligence to computers.
The new Intel Core i5 processor family, two new Intel Core i7 processors and the Intel Xeon processor 3400 series bring Intel's latest Nehalem microarchitecture to mainstream desktop and entry server markets.
Intel Core processors for consumers
Formerly codenamed "Lynnfield," these new chips are based on Intel's award-winning Nehalem microarchitecture and are designed for consumers who need top-notch performance for digital media, productivity, gaming and other demanding applications. These processors, along with the new Intel P55 express chipset, are available today.
All processors are lead- and halogen-free1 and feature Intel exclusive Turbo Boost Technology. The top-of-the-line Core i7 processors also support Intel Hyper-Threading Technology. Combined, these features give computer users absolute "intelligent" performance when necessary and optimum power-efficiency when the computer is lightly loaded.
Computers just got smaller
The new chipset brings the most revolutionary design changes since the invention of the PCI bus in the early 1990s and sets the stage for Intel's forthcoming 2010 compute platform.
The Intel P55 Express Chipset will be the baseline building block component for motherboards worldwide, delivering great new levels of performance and scalability for everyone from the retail buyer to the technically savvy do-it-yourselfer.
The new Core i7 and i5 processors are the first Intel processors to integrate both a 16-lane PCI Express 2 graphics port and two-channel memory controller, enabling all input/output and manageability functions to be handled by the single-chip Intel P55 Express Chipset.
Previous Intel chipsets required two separate chips. A new Direct Media Interface (DMI) connects between the processor and chipset. The chipset supports 8 PCI Express 2.0 x1 Ports (2.5GT/s) for flexible device support. Dual graphics cards are supported in a "2x8" configuration. The chipset also supports 6 SATA 3 Gb/s Ports with Intel Matrix Storage Technology providing RAID levels 0/1/5/10.
Up to 14 USB 2.0 [orts can be supported with the chipset's integrated USB 2.0 Rate Matching Hub, along with Intel High Definition Audio for premium digital sound. The new processors are the first to be supported by the new Land Grid Array (LGA) 1156 package and socket technology.
Better entry servers
Small businesses requiring 24/7 operation and educators now have more reasons than ever to buy a purpose-built server with Intel's new Xeon processors and Intel 3400 and 3420 chipsets. These new products improve small business productivity by running email, file, print and dynamic Web serving tasks more efficiently.
They also improve education by enabling dependable classroom collaboration and making school administrative services more productive. Servers based on Xeon 3400 processors provide more dependability over desktop systems through differentiated features such as Error Correcting Code memory and RAID 0/1/5/10 for server operating systems.
They are designed to help small businesses grow by enabling up to 64 percent more sale transactions and up to 56 percent faster business response time. This improvement is enabled with Intel's Nehalem microarchitecture and a 4x improvement in memory capacity (32 GB). Intel Turbo Boost Technology and Intel® Hyper-Threading Technology enable these servers to automatically adapt their performance to unique business needs.
The processors launched today also include the Intel Xeon L3426, a low-power variant that delivers up to 188 percent improvement in energy efficiency per dollar than the previous-generation Intel® Xeon X3380, and enables innovative server form factors for space and thermally constrained environments.
The new Intel Core i5 processor family, two new Intel Core i7 processors and the Intel Xeon processor 3400 series bring Intel's latest Nehalem microarchitecture to mainstream desktop and entry server markets.
Intel Core processors for consumers
Formerly codenamed "Lynnfield," these new chips are based on Intel's award-winning Nehalem microarchitecture and are designed for consumers who need top-notch performance for digital media, productivity, gaming and other demanding applications. These processors, along with the new Intel P55 express chipset, are available today.
All processors are lead- and halogen-free1 and feature Intel exclusive Turbo Boost Technology. The top-of-the-line Core i7 processors also support Intel Hyper-Threading Technology. Combined, these features give computer users absolute "intelligent" performance when necessary and optimum power-efficiency when the computer is lightly loaded.
Computers just got smaller
The new chipset brings the most revolutionary design changes since the invention of the PCI bus in the early 1990s and sets the stage for Intel's forthcoming 2010 compute platform.
The Intel P55 Express Chipset will be the baseline building block component for motherboards worldwide, delivering great new levels of performance and scalability for everyone from the retail buyer to the technically savvy do-it-yourselfer.
The new Core i7 and i5 processors are the first Intel processors to integrate both a 16-lane PCI Express 2 graphics port and two-channel memory controller, enabling all input/output and manageability functions to be handled by the single-chip Intel P55 Express Chipset.
Previous Intel chipsets required two separate chips. A new Direct Media Interface (DMI) connects between the processor and chipset. The chipset supports 8 PCI Express 2.0 x1 Ports (2.5GT/s) for flexible device support. Dual graphics cards are supported in a "2x8" configuration. The chipset also supports 6 SATA 3 Gb/s Ports with Intel Matrix Storage Technology providing RAID levels 0/1/5/10.
Up to 14 USB 2.0 [orts can be supported with the chipset's integrated USB 2.0 Rate Matching Hub, along with Intel High Definition Audio for premium digital sound. The new processors are the first to be supported by the new Land Grid Array (LGA) 1156 package and socket technology.
Better entry servers
Small businesses requiring 24/7 operation and educators now have more reasons than ever to buy a purpose-built server with Intel's new Xeon processors and Intel 3400 and 3420 chipsets. These new products improve small business productivity by running email, file, print and dynamic Web serving tasks more efficiently.
They also improve education by enabling dependable classroom collaboration and making school administrative services more productive. Servers based on Xeon 3400 processors provide more dependability over desktop systems through differentiated features such as Error Correcting Code memory and RAID 0/1/5/10 for server operating systems.
They are designed to help small businesses grow by enabling up to 64 percent more sale transactions and up to 56 percent faster business response time. This improvement is enabled with Intel's Nehalem microarchitecture and a 4x improvement in memory capacity (32 GB). Intel Turbo Boost Technology and Intel® Hyper-Threading Technology enable these servers to automatically adapt their performance to unique business needs.
The processors launched today also include the Intel Xeon L3426, a low-power variant that delivers up to 188 percent improvement in energy efficiency per dollar than the previous-generation Intel® Xeon X3380, and enables innovative server form factors for space and thermally constrained environments.
Saturday, September 5, 2009
SEMI World Fab Forecast: Predicts 64 percent growth in fab spending
SAN JOSE, USA: SEMI’s World Fab Forecast predicts 64 percent growth in fab spending for 2010 to reach $24 billion.
A large portion (about $14 billion) is expected to come from six companies that have announced ambitious investment plans.
The major investments will come from six companies -- TSMC, GlobalFoundries, Toshiba, Samsung, Intel and Inotera. These companies will contribute more than half of the total fab capex spending expected in 2010. The increase of 64 percent appears high, but this percentage increase is against historic lows in 2009.
Christian Dieseldorff, senior analyst at SEMI, noted “Worldwide installed capacity is expected to decline by 2-3 percent in 2009 mainly due to the closure of 31 fabs. This overall capacity is expected to have a slow growth rate of only 4-5 percent in 2010, to about 21.5 million wafers per month (in 200 mm equivalents), and most spending in 2010 is expected to go towards upgrading fabs rather than expansion of installed capacity.”
The World Fab Forecast tracks planned projects resulting in any change of installed capacity.
SEMI World Fab Forecast report provides high-level summaries and graphs, in-depth analyses of capital expenditure, capacity, technology and products, down to the detail of each fab, and forecasts for the next 18 months by quarter. These tools are invaluable for understanding how 2009 and 2010 will look, and learning more about capex for construction projects, fab equipping, technology level, and products.
A large portion (about $14 billion) is expected to come from six companies that have announced ambitious investment plans.
The major investments will come from six companies -- TSMC, GlobalFoundries, Toshiba, Samsung, Intel and Inotera. These companies will contribute more than half of the total fab capex spending expected in 2010. The increase of 64 percent appears high, but this percentage increase is against historic lows in 2009.
Christian Dieseldorff, senior analyst at SEMI, noted “Worldwide installed capacity is expected to decline by 2-3 percent in 2009 mainly due to the closure of 31 fabs. This overall capacity is expected to have a slow growth rate of only 4-5 percent in 2010, to about 21.5 million wafers per month (in 200 mm equivalents), and most spending in 2010 is expected to go towards upgrading fabs rather than expansion of installed capacity.”
The World Fab Forecast tracks planned projects resulting in any change of installed capacity.
SEMI World Fab Forecast report provides high-level summaries and graphs, in-depth analyses of capital expenditure, capacity, technology and products, down to the detail of each fab, and forecasts for the next 18 months by quarter. These tools are invaluable for understanding how 2009 and 2010 will look, and learning more about capex for construction projects, fab equipping, technology level, and products.
Monday, August 31, 2009
Intel selects WANdisco to support development between US and China
SANTA CLARA & SAN RAMON, USA: Intel and WANdisco, a leading provider of infrastructure software for replication, scalability and high availability, announced that Intel’s Consumer Electronics Group has selected WANdisco’s Subversion MultiSite to support over 1,000 developers located at sites in Shanghai, Oregon and Arizona.
Intel joins an ever growing list of globally distributed organizations that rely on WANdisco’s unique technology to overcome the problems of wide area network performance, reliability and availability.
Before implementing Subversion MultiSite, all three teams used one central Subversion server. But slow and unreliable networks between the US and China caused unacceptable delays throughout the entire development lifecycle. Developers and QA staff were forced to work long hours while they waited for the latest changes from other sites, in an effort to stay on schedule. New product releases were frequently delayed.
“With Subversion MultiSite, we’re 24 by 7 now,” said Jeremy Capps, IT Manager at Intel. “We went from over two hours of downtime each day to zero. Slow networks are no longer a problem for remote users and our build process is three to four times faster.”
Before selecting WANdisco, Intel conducted a thorough search for a solution that could solve the problem of network reliability and speed between China and the US. Part of this effort included a review of alternative Source Code Management Solutions and open source alternatives such as Svnsync.
“We searched for open source tools that might fill our need and tested them. We found that our build time was three to four times slower with these products, which were not even close to usable for our application. We had time-outs, false reports and so on. WANdisco is the only product available that fills this need,” continued Jeremy Capps.
After Intel implemented Subversion MultiSite, network performance and reliability were no longer issues. Now, the latest changes are always available everywhere and everything happens at local area network speed. Problems are caught and fixed when they occur, reducing QA and rework.
In addition, downtime for maintenance went from over two hours each day to zero because of Subversion MultiSite’s built-in hot backup, failover and automated recovery features. As a result, development cycle time and cost have been reduced by over 30 percent.
Capps continued, “Since implementing WANdisco we’ve seen some overjoyed developers in our remote locations.”
“We are extremely pleased that Intel has realized the savings in time and cost that WANdisco’s unique technology brings to the development lifecycle in a globally distributed organization,” said David Richards, President and CEO of WANdisco. “Intel’s experience is consistent with what we hear from our customers across the board.”
Intel joins an ever growing list of globally distributed organizations that rely on WANdisco’s unique technology to overcome the problems of wide area network performance, reliability and availability.
Before implementing Subversion MultiSite, all three teams used one central Subversion server. But slow and unreliable networks between the US and China caused unacceptable delays throughout the entire development lifecycle. Developers and QA staff were forced to work long hours while they waited for the latest changes from other sites, in an effort to stay on schedule. New product releases were frequently delayed.
“With Subversion MultiSite, we’re 24 by 7 now,” said Jeremy Capps, IT Manager at Intel. “We went from over two hours of downtime each day to zero. Slow networks are no longer a problem for remote users and our build process is three to four times faster.”
Before selecting WANdisco, Intel conducted a thorough search for a solution that could solve the problem of network reliability and speed between China and the US. Part of this effort included a review of alternative Source Code Management Solutions and open source alternatives such as Svnsync.
“We searched for open source tools that might fill our need and tested them. We found that our build time was three to four times slower with these products, which were not even close to usable for our application. We had time-outs, false reports and so on. WANdisco is the only product available that fills this need,” continued Jeremy Capps.
After Intel implemented Subversion MultiSite, network performance and reliability were no longer issues. Now, the latest changes are always available everywhere and everything happens at local area network speed. Problems are caught and fixed when they occur, reducing QA and rework.
In addition, downtime for maintenance went from over two hours each day to zero because of Subversion MultiSite’s built-in hot backup, failover and automated recovery features. As a result, development cycle time and cost have been reduced by over 30 percent.
Capps continued, “Since implementing WANdisco we’ve seen some overjoyed developers in our remote locations.”
“We are extremely pleased that Intel has realized the savings in time and cost that WANdisco’s unique technology brings to the development lifecycle in a globally distributed organization,” said David Richards, President and CEO of WANdisco. “Intel’s experience is consistent with what we hear from our customers across the board.”
Saturday, August 29, 2009
Intel raises Q3 revenue and gross margin expectations
SANTA CLARA, USA: As a result of stronger than expected demand for microprocessors and chipsets, Intel Corporation now expects revenue for the third quarter to be $9.0 billion, plus or minus $200 million, as compared to the previous range of $8.5 billion, plus or minus $400 million.
The gross margin percentage for the third quarter is expected to be in the upper half of the previous range of 53 percent, plus or minus two percentage points. All other expectations are unchanged.
Intel’s third-quarter Business Outlook was originally published in the company’s second-quarter 2009 earnings release, available at intc.com. The company is scheduled to report its third-quarter financial results on Oct. 13.
Status of business outlook
Through Aug. 31, Intel’s corporate representatives may reiterate the Business Outlook during private meetings with investors, investment analysts, the media and others.
From the close of business on Aug. 31 until publication of the company’s third-quarter earnings release, Intel will observe a “Quiet Period” during which the Business Outlook disclosed in the company’s press releases and filings with the SEC should be considered to be historical, speaking as of prior to the Quiet Period only and not subject to an update by the company.
Risk factors
The above statements and any others in this document that refer to plans and expectations for the third quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties.
Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the corporation’s expectations.
Ongoing uncertainty in global economic conditions poses a risk to the overall economy as consumers and businesses may defer purchases in response to tighter credit and negative financial news, which could negatively affect product demand and other related matters.
Consequently, demand could be different from Intel's expectations due to factors including changes in business and economic conditions, including conditions in the credit market that could affect consumer confidence; customer acceptance of Intel’s and competitors’ products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers.
Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast.
Additionally, Intel is in the process of transitioning to its next generation of products on 32nm process technology, and there could be execution issues associated with these changes, including product defects and errata along with lower than anticipated manufacturing yields.
Revenue and the gross margin percentage are affected by the timing of new Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and Intel’s ability to respond quickly to technological developments and to incorporate new features into its products.
The gross margin percentage could vary significantly from expectations based on changes in revenue levels; capacity utilization; start-up costs, including costs associated with the new 32nm process technology; variations in inventory valuation, including variations related to the timing of qualifying products for sale; excess or obsolete inventory; product mix and pricing; manufacturing yields; changes in unit costs; impairments of long-lived assets, including manufacturing, assembly/test and intangible assets; and the timing and execution of the manufacturing ramp and associated costs.
Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits.
The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets.
The current financial stress affecting the banking system and financial markets and the going concern threats to investment banks and other financial institutions have resulted in a tightening in the credit markets, a reduced level of liquidity in many financial markets, and heightened volatility in fixed income, credit and equity markets.
There could be a number of follow-on effects from the credit crisis on Intel’s business, including insolvency of key suppliers resulting in product delays; inability of customers to obtain credit to finance purchases of our products and/or customer insolvencies; counterparty failures negatively impacting our treasury operations; increased expense or inability to obtain short-term financing of Intel’s operations from the issuance of commercial paper; and increased impairments from the inability of investee companies to obtain financing.
Gains or losses from equity securities and interest and other could also vary from expectations depending on gains or losses realized on the sale or exchange of securities; gains or losses from equity method investments; impairment charges related to debt securities as well as equity and other investments; interest rates; cash balances; and changes in fair value of derivative instruments.
The current volatility in the financial markets and overall economic uncertainty increases the risk that the actual amounts realized in the future on our debt and equity investments will differ significantly from the fair values currently assigned to them.
The majority of our non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management’s plans with respect to our investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains/losses on equity investments and interest and other.
Intel's results could be impacted by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates.
Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports.
The gross margin percentage for the third quarter is expected to be in the upper half of the previous range of 53 percent, plus or minus two percentage points. All other expectations are unchanged.
Intel’s third-quarter Business Outlook was originally published in the company’s second-quarter 2009 earnings release, available at intc.com. The company is scheduled to report its third-quarter financial results on Oct. 13.
Status of business outlook
Through Aug. 31, Intel’s corporate representatives may reiterate the Business Outlook during private meetings with investors, investment analysts, the media and others.
From the close of business on Aug. 31 until publication of the company’s third-quarter earnings release, Intel will observe a “Quiet Period” during which the Business Outlook disclosed in the company’s press releases and filings with the SEC should be considered to be historical, speaking as of prior to the Quiet Period only and not subject to an update by the company.
Risk factors
The above statements and any others in this document that refer to plans and expectations for the third quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties.
Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the corporation’s expectations.
Ongoing uncertainty in global economic conditions poses a risk to the overall economy as consumers and businesses may defer purchases in response to tighter credit and negative financial news, which could negatively affect product demand and other related matters.
Consequently, demand could be different from Intel's expectations due to factors including changes in business and economic conditions, including conditions in the credit market that could affect consumer confidence; customer acceptance of Intel’s and competitors’ products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers.
Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast.
Additionally, Intel is in the process of transitioning to its next generation of products on 32nm process technology, and there could be execution issues associated with these changes, including product defects and errata along with lower than anticipated manufacturing yields.
Revenue and the gross margin percentage are affected by the timing of new Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and Intel’s ability to respond quickly to technological developments and to incorporate new features into its products.
The gross margin percentage could vary significantly from expectations based on changes in revenue levels; capacity utilization; start-up costs, including costs associated with the new 32nm process technology; variations in inventory valuation, including variations related to the timing of qualifying products for sale; excess or obsolete inventory; product mix and pricing; manufacturing yields; changes in unit costs; impairments of long-lived assets, including manufacturing, assembly/test and intangible assets; and the timing and execution of the manufacturing ramp and associated costs.
Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits.
The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets.
The current financial stress affecting the banking system and financial markets and the going concern threats to investment banks and other financial institutions have resulted in a tightening in the credit markets, a reduced level of liquidity in many financial markets, and heightened volatility in fixed income, credit and equity markets.
There could be a number of follow-on effects from the credit crisis on Intel’s business, including insolvency of key suppliers resulting in product delays; inability of customers to obtain credit to finance purchases of our products and/or customer insolvencies; counterparty failures negatively impacting our treasury operations; increased expense or inability to obtain short-term financing of Intel’s operations from the issuance of commercial paper; and increased impairments from the inability of investee companies to obtain financing.
Gains or losses from equity securities and interest and other could also vary from expectations depending on gains or losses realized on the sale or exchange of securities; gains or losses from equity method investments; impairment charges related to debt securities as well as equity and other investments; interest rates; cash balances; and changes in fair value of derivative instruments.
The current volatility in the financial markets and overall economic uncertainty increases the risk that the actual amounts realized in the future on our debt and equity investments will differ significantly from the fair values currently assigned to them.
The majority of our non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management’s plans with respect to our investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains/losses on equity investments and interest and other.
Intel's results could be impacted by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates.
Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports.
Thursday, August 20, 2009
Competition for high-growth mobile chip market escalating
SCOTTSDALE, USA: The battle for the fast-growing mobile semiconductor market will intensify in late 2009 with the introduction of new processors from each camp–ARM and x86, reports In-Stat.
Intel will introduce processors that will finally reduce the power consumption of the x86 architecture to acceptable levels for smartphones and other mobile devices.
Shortly after, many in the competing ARM camp, including Freescale, TI, and Samsung, will essentially be scaling up performance with multi-core processors that maintain similar power levels to existing single-core products.
“While both will offer competitive solutions, In-Stat does not anticipate quick changes in the current market mix; the x86 architecture dominates the computing applications, and the ARM architecture dominates cellular devices,” says Jim McGregor, In-Stat analyst.
“Mini-notebooks will be the primary battleground as the market starts seeing some crossover in 2011. However, both architectures are likely to co-exist as devices become more focused in features and usage models.”
Recent research by In-Stat found the following:
* The Total Available Market (TAM) for merchant market mobile processors is projected to grow 22.3 percent through 2013.
* Integration of additional cores, graphics/multimedia, I/O, and baseband functionality will continue, particularly in handheld applications. Among smartphones, for example, 87 percent will feature mobile processors with integrated baseband functionality by 2013.
* The estimated value of the processing, graphics/multimedia, and baseband functions will all increase at double-digit growth rates over the next few years.
Intel will introduce processors that will finally reduce the power consumption of the x86 architecture to acceptable levels for smartphones and other mobile devices.
Shortly after, many in the competing ARM camp, including Freescale, TI, and Samsung, will essentially be scaling up performance with multi-core processors that maintain similar power levels to existing single-core products.
“While both will offer competitive solutions, In-Stat does not anticipate quick changes in the current market mix; the x86 architecture dominates the computing applications, and the ARM architecture dominates cellular devices,” says Jim McGregor, In-Stat analyst.
“Mini-notebooks will be the primary battleground as the market starts seeing some crossover in 2011. However, both architectures are likely to co-exist as devices become more focused in features and usage models.”
Recent research by In-Stat found the following:
* The Total Available Market (TAM) for merchant market mobile processors is projected to grow 22.3 percent through 2013.
* Integration of additional cores, graphics/multimedia, I/O, and baseband functionality will continue, particularly in handheld applications. Among smartphones, for example, 87 percent will feature mobile processors with integrated baseband functionality by 2013.
* The estimated value of the processing, graphics/multimedia, and baseband functions will all increase at double-digit growth rates over the next few years.
Tuesday, August 11, 2009
Intel, Micron achieve most efficient NAND product using 3-bit-per-cell technology
SANTA CLARA & BOISE, USA: Intel Corp. and Micron Technology Inc. announced the development of a new 3-bit-per-cell (3bpc) multi-level cell (MLC) NAND technology, leveraging their award-winning 34-nanometer (nm) NAND process. The chips are typically used in consumer storage devices such as flash cards and USB drives, where high density and cost-efficiency are paramount.
Designed and manufactured by IM Flash Technologies (IMFT), their NAND flash joint venture, the new 3bpc NAND technology produces the industry’s smallest and most cost-effective 32-gigabit (Gb) chip that is currently available on the market. The 32Gb 3bpc NAND chip is 126mm².
Micron is currently sampling and will be in mass production in the fourth quarter 2009. With the companies continuing to focus on the next process shrink, 3bpc NAND technology is an important piece of their product strategy and is an effective approach in serving key market segments.
“We see 3bpc NAND technology as an important piece of our roadmap,” said Brian Shirley, vice president of Micron’s memory group. “We also continue to move forward on further shrinks in NAND that will provide our customers with a world-leading portfolio of products for many years to come. Today’s announcement further highlights that Micron and Intel have made great strides in 34-nanometer NAND, and we look forward to introducing our 2xnm technology later this year.”
“The move to 3bpc is yet another proof point to the remarkable progress Intel and Micron have made in 34-nm NAND development,” said Randy Wilhelm, Intel vice president and general manager, Intel NAND Solutions Group. “This milestone sets the stage for continued silicon leadership on 2xnm process that will help decrease costs and increase the capabilities of our NAND solutions for our customers.”
Designed and manufactured by IM Flash Technologies (IMFT), their NAND flash joint venture, the new 3bpc NAND technology produces the industry’s smallest and most cost-effective 32-gigabit (Gb) chip that is currently available on the market. The 32Gb 3bpc NAND chip is 126mm².
Micron is currently sampling and will be in mass production in the fourth quarter 2009. With the companies continuing to focus on the next process shrink, 3bpc NAND technology is an important piece of their product strategy and is an effective approach in serving key market segments.
“We see 3bpc NAND technology as an important piece of our roadmap,” said Brian Shirley, vice president of Micron’s memory group. “We also continue to move forward on further shrinks in NAND that will provide our customers with a world-leading portfolio of products for many years to come. Today’s announcement further highlights that Micron and Intel have made great strides in 34-nanometer NAND, and we look forward to introducing our 2xnm technology later this year.”
“The move to 3bpc is yet another proof point to the remarkable progress Intel and Micron have made in 34-nm NAND development,” said Randy Wilhelm, Intel vice president and general manager, Intel NAND Solutions Group. “This milestone sets the stage for continued silicon leadership on 2xnm process that will help decrease costs and increase the capabilities of our NAND solutions for our customers.”
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