TI intros 200-mA linear regulators with auto low-power mode

BANGALORE, INDIA: Texas Instruments Inc. (TI) has introduced a family of 200-mA, low dropout regulators (LDOs), which offer an auto low-power mode that combines ultra-low quiescent current of less than 8 uA with fast transient response while maintaining low noise and a high power supply rejection ratio (PSRR).

With 70 percent lower quiescent current than existing solutions, the LDOs increase battery runtime without sacrificing performance in noise-sensitive applications, such as smartphones, MP3 players, RF modules, remote controls, ZigBee network systems and handheld consumer devices.

Typical high-performance LDOs require the load quiescent current to be 25 uA or less. Auto low-power mode allows the TPS727xx to achieve less than 8 uA without an additional mode pin and automatically switches to and from low power depending on load current.

In addition, the use of auto low-power mode eliminates the need to modify software drivers to control the mode pin, which speeds and simplifies the design process. It also reduces cost by eliminating the need for a general purpose input/output (GPIO) pin and overhead firmware.

Key features and benefits
* Low-power operation with innovative auto low-power mode, ultra-low quiescent current of 8 uA, fast transient response ±50mV for 200mA, low noise 32uVRMS and high PSRR 70dB at 1kHz helps increase battery runtime without sacrificing noise.
* Enables use of small 1.0 uF ceramic capacitors, which allows for a smaller overall solution.
* Provides low dropout of 130 mV, plus stable and accurate output voltage range of 0.9-5 V, which increases system reliability.
* Factory EEPROM programming of the output voltage provides the flexibility to quickly sample and release custom VOUT versions.

Dell’s Latitude-On gives TI a PC entree -- but doesn’t displace Wintel!

EL SEGUNDO, USA: Dell Inc.’s new Latitude-On concept marks the first use of Texas Instruments Inc.’s ARM-based OMAP applications processor in a notebook PC. But does it really represent a challenge to the PC hegemony now enjoyed by the X86 microprocessor and the Windows operating system?

With Latitude-On intended only to perform a specific and limited function in notebook PCs, iSuppli Corp. does not believe it represents a threat to Wintel’s dominance.

Dell describes Latitude-On as a “system on a system” wherein a regular Dell laptop using an Intel Corp. X86 and Microsoft Windows adds a separate subsystem that is based on Texas Instruments’ OMAP3430 chip.

The OMAP system allows users to boot into a slimmed-down Linux operating environment with access to a web browser. When turning on a notebook using the Latitude-On mode, the PC delivers nearly instantaneous web access, bypassing the lengthy boot-up time required for Windows.

Latitude-On aims to provide access to web-based e-mail, contacts, calendars and other Internet content and services without the lengthy boot cycle associated with traditional laptops. Basic document viewing functionality also is supported for Microsoft Office and Adobe PDF files.

Via one of its technical blogs, Dell announced the availability of Latitude-ON on its new Latitude Z series of business laptops.

In addition to TI OMAP processor, Latitude-On also includes Wi-Fi and mobile broadband connections. The Latitude-On module can also be retro-fitted to specific Latitude models.

“While at first glance Latitude-On appears to represent an encroachment of the ARM microprocessor and Linux operating system into the Wintel-dominated PC world, the reality is quite different,” said Matthew Wilkins, principal analyst, compute platforms, for iSuppli.

“Yes, Dell is making use of a TI OMAP processor-based system in these laptops, but it is only being employed for a very narrow purpose: providing a very lightweight conduit to certain types of information. It does not in any way displace the key functions of the Intel- and Microsoft-based laptop platform.”

ARM microprocessor-based chips presently do not command any significant volume in the PC market.

The main barrier for ARM’s acceptance is that there is no version of Microsoft Windows that has been compiled to run natively on the microprocessor architecture. Microprocessors based on the ARM instruction set use a fundamentally different set of operating procedures than those of the x86 processors from AMD and Intel. Therefore, an ARM-based microprocessor cannot run applications and operating systems designed for X86 chips.

Despite rumors that a port of Windows to the ARM has been or is being investigated, it seems unlikely that there will be an ARM-centric Windows PC in the near- or mid-term.

However, an ARM-centric Linux PC certainly is possible and could be an intriguing option for users looking for alternatives to Wintel in personal computing.

A boost for Texas Instruments?
TI’s OMAP processors typically are used in cell phones and various types of Mobile Internet Devices (MIDs). The processor employed by Dell for Latitude-On, the OMAP3430, is targeted primarily at smart phones.

Texas Instruments’ OMAP line dominates the market currently for standalone applications processors, with a share of 24 percent of global revenue in the second quarter of 2009. In comparison, No.-2 applications processor supplier Samsung Electronics Co. Ltd. accounted for 15.9 percent of the market during the same period.

However, Texas Instruments’ OMAP line has been under increasing competitive pressure from Samsung in the smart-phone market, primarily fueled by Samsung’s partnership with Apple Inc. for the applications processor in the iPhone. If Dell’s Latitude-One gains acceptance in the market, it could represent a significant boost for the OMAP line.

“As the market for handsets continues to mature, semiconductor suppliers traditionally targeting that segment are looking to expand their presence in other applications to help promote growth,” said Francis Sideco, principal analyst, wireless communications, for iSuppli.

Blurring the lines
The Latitude-On system endows notebook PCs with features similar to those of smart phones like the iPhone and members of the BlackBerry line, which also provide access to email and document viewing in an “instant on” manner.

“Dell’s solution certainly represents an attempt by the PC market to fight back against the kind of access that smart phones provide,” Wilkins observed. “Dell clearly has sought and received sufficient customer feedback to implement such a rapid-on and limited-environment system. However, before drawing any conclusion on the success of this approach, iSuppli will wait and see how the system performs with customers. It also will be interesting to see what the reaction will be from Intel and Microsoft.”

TI announces new 720 MHz OMAP3530 processor for multimedia apps

BANGALORE, INDIA: Giving designers more performance to run new application features and additional headroom to add their own IP, Texas Instruments Inc.(TI) announced a speed upgrade for the OMAP3530 applications processor and evaluation module (EVM).

The new OMAP3530 processor features a 720 MHz ARM Cortex-A8 core and a 520 MHz TMS320C64x+ DSP. This enables users to gain faster access to databases, spreadsheets, presentations, e-mail, audio and video attachments, Web browsing and video conferencing applications.

This single-chip solution also supports faster boot times suitable for applications such as portable infotainment, Point-of-Sale (POS) devices, Web tablets and single board computers.

720 MHz OMAP3530 processor key features and benefits:
* 720 MHz ARM Cortex-A8 core provides 1400 Dhrystone million instructions per second (MIPS).
* 520 MHz C64x+ DSP provides more headroom to optimize quality audio and video codecs and custom IP.
* POWERVR SGX subsystem for 3D graphics acceleration to support display and gaming effects.
* Comprehensive power and clock-management scheme that enables high-performance, low-power operation and low-power standby features.
* Pin-for-pin compatible with TI’s OMAP35x devices makes it easy for OEMs to efficiently create a complete product portfolio based on the single platform.

OMAP3530 EVM key features and benefits:
* Based on the 720 MHz OMAP3530 processor and can also be used to evaluate the OMAP3503, OMAP3515 and OMAP3525.
* Ability to run full-featured operating systems, such as Windows® Embedded CE and Linux.
* New S-Video/Component/Composite input, S-Video output.
* Features TI’s TVP5146 analog-to-digital video decoder.
* TI integrated power management ICs, OMAP3530 power requirements and design considerations.

TI opens world's most advanced analog manufacturing facility in the US

RICHARDSON, USA: Texas Instruments Inc. (TI) announced the opening of its manufacturing facility in Richardson, Texas. The company expects to begin moving equipment into the facility in October.

To view the Multimedia News Release, go to: http://www.prnewswire.com/mnr/ti/39147

Known as RFAB, ("R" for Richardson, "FAB" for fabrication), the fab will be the world's only production facility to use 300-millimeter (12-inch) silicon wafers to manufacture analog chips, which are essential components in virtually all electronics.

The facility will give TI a strategic advantage in high-volume production because thousands of analog chips can be etched onto each of these wafers, more than double the number on the more commonly used and smaller 200-millimeter wafers.

"The time is right for this investment," said Rich Templeton, TI's chairman, president and CEO. "Customer demand for analog chips is growing, and there's tremendous desire to save energy and protect the environment. The chips produced here will help our customers make thousands of electronic products that are more energy-efficient. It is significant that these devices will be made here, in North Texas, in one of the industry's most environmentally responsible fabs."

The facility will produce analog integrated circuits based on TI's proprietary process. Customers will use these chips in electronics ranging from smartphones and netbooks, to telecom and computing systems.

At a ribbon-cutting ceremony with local and state officials, Templeton said TI plans to ship the first chips from this facility by the end of 2010. When the first phase of equipment is ramped and producing at full capacity, the facility will be capable of shipping more than $1 billion worth of analog chips per year.

Hiring will begin immediately for 250 jobs in RFAB. "These are high-quality, well-paying engineering, manufacturing and administrative jobs for our North Texas region. The infrastructure that a facility like this requires will create other indirect jobs with suppliers and support services," said Templeton.

"We want to thank our great partners in Richardson, Dallas, Plano and Austin who helped us make this happen," Templeton said, referring to the City of Richardson, Collin County, the Plano Independent School District and the Collin County Community College District.

"Texas Instruments' decision to again invest in Texas is yet another example of how, even during these economic times, the Lone Star State remains the top choice for companies looking to expand," Gov. Rick Perry said. "Our combination of a predictable regulatory climate, low taxation and a world-class workforce that is well prepared to fill the hundreds of new high-technology jobs TI will be bringing to the area."

Recent expansions
The opening of RFAB is the most recent in a series of manufacturing expansions by TI. Earlier this year, TI opened Clark, an assembly and test facility in the Philippines. TI also has been installing new test equipment at several other locations, and is in the process of installing newly acquired 200-mm manufacturing equipment for analog chip production at sites around the world, including Dallas.

Local education benefits
Local education has benefitted from TI's decision to build the fab in Richardson. As part of the original agreement between community and state partners, the nearby University of Texas at Dallas will receive a total of $300 million from the Texas Enterprise Fund, the Texas General Land Office, the UT System, and private donors for improvement of its engineering and research programs.

"Texas Instruments has been a remarkable partner with education at all levels," said Dr. David E. Daniel, president of UT Dallas. "The impact of the RFAB's creation on UT Dallas has been dramatic in terms of recognition and research activity. This project's high profile played a direct role in our most recent efforts to reach for what many call Tier One status--our aspiration to become a nationally recognized research university. We look forward to partnering with Texas Instruments and the rest of our community as we grow toward this stature in service to the Dallas area and the region."

Green model
RFAB has been an important model of green construction. It was the first semiconductor facility to achieve Gold certification with the US Green Building Council's Leadership in Energy and Environmental Design (LEED) program. TI has applied knowledge from the RFAB designs to other facilities all over the world.

TI's single-chip power management units for portable electronics cut board space in half

BANGALORE, INDIA: Texas Instruments Inc. (TI) has introduced the TPS65070 and TPS65073 family of single-chip power management integrated circuits for portable electronics.

The new power management unit (PMU) implements all sequencing and default options to power today’s leading processors, including TI’s OMAP and digital signal processors.

The TPS65070 and TPS65073 devices result in a 50-percent smaller DC/DC implementation versus a discrete design, by integrating three highly efficient, 2.25-MHz, 1.5-A DC/DC step-down converters that support core processor, memory and I/O voltages; two general purpose, 200-mA LDOs; white LED backlighting to support up to 5-inch LED displays; I2C communications interface; 10-bit A/D converter; touch-screen interface and an integrated 1.5-A linear battery charger.

TI’s new PMUs support the following processors with easy-to-design reference designs:

* TPS65070: OMAP-L1x, TMS320C6742, TMS320C6746 and TMS320C6748 devices.
* TPS65073 and TPS650731: OMAP35x processors.

TI achieves industry’s lowest drift with family of high-voltage bipolar DACs

BANGALORE, INDIA: Texas Instruments Inc. TI) has introduced a four-channel, high-voltage, bipolar digital-to-analog converter (DAC).

Developed on TI’s HPA07 analog CMOS process technology, the 16-bit DAC8734 is part of a new family of high-performance, bipolar DACs, including pin-compatible 12- and 14-bit family members featuring up to six times lower drift than competing devices along with the widest operating temperature range and the highest initial accuracy.

The DAC8734 offers automated test equipment (ATE) and medical equipment designers space savings and flexibility in a 6 mm x 6 mm QFN-40 or 7 mm x 7 mm TQFP-48 package. The device is capable of driving ±16 V or 0 to +20 V across four channels, eliminating the external operational amplifier typically required for additional voltage gain. Designers need to add only a single voltage reference, such as the REF5050, for bipolar operation.

Key features and benefits of DAC8734:
* Lowest drift over time and temperature provides high stability
* Widest operating temperature range of -40°C to 105°C helps ensure performance in extreme environments.
* Integral non-linearity of ±1 LSB, maximum (0.006% FSR), is achievable even at 16-bit resolution. To further boost precision, the family is trimmed during manufacturing to a maximum gain error of 4 LSB (at 16 bits). Built-in user calibration further reduces gain error down to ±1 LSB, maximum, with a zero error of up to 1/8 LSB.
The device’s programmable output range of 2x to 4x the reference voltage for bipolar operation at ±2 V to ±16 V maximizes design flexibility.

TI applies digital power management to next-gen Xilinx FPGA designs

BANGALORE, INDIA: Texas Instruments (TI) announced that Xilinx is using TI power management technology to simplify power design in its new Virtex-6 ML605 FPGA evaluation kit.

TI’s Fusion Digital Power controllers give FPGA users advanced power management capability and design flexibility, including the ability to monitor a power system’s behavior in real time.

“As FPGA designs become increasingly sophisticated, there is a growing need for intelligent power management solutions with accurate current monitoring and control,” said Brent Przybus, Director of platform marketing at Xilinx.

“New developments in digital control technology from Texas Instruments give Virtex-6 FPGA customers a high degree of power system optimization, while accelerating design time with the Xilinx Base Platform.”

TI’s UCD9240 integrated power system controller, along with complementary power stage ICs and plug-in modules, intelligently manage today’s high-density, high-performance power systems, such as those used in telecom and datacom infrastructure applications.

The controller supports up to four independent digital control loops and up to eight phases. Two UCD9240 devices manage the power for the Virtex-6 FPGA ML605 evaluation kit. The kit also includes the INA333, the industry’s lowest power zero-drift instrumentation amplifier. Xilinx’s soon to be released Spartan-6 FPGA SP605 kit also includes TI’s digital power products.

Easy-to-use Fusion Digital Power design tool
The evaluation kit features TI’s digital power design tool with an easy-to-use graphical user interface, which helps designers configure key design parameters, optimize control loop design, and meet specific supply voltage sequencing criteria – with no programming required.

The tool contains real-time monitoring, control loop modeling and impedance measuring features that support Virtex-6 FPGA design requirements.

“A major focus for Xilinx’s new generation of products is reducing power consumption without compromising performance,” said Steve Bakota, manager of TI’s digital power business. “Power measurement and control are important features in Xilinx’s new development boards. Customers using our digital power products can take full advantage of advances this technology delivers.”

TI's OMAP technology powers AMX’s automation and control panels

BANGALORE, INDIA: As homes and businesses become more complex, there is a need to simplify building automation and management by eliminating the clutter of multiple control devices. To help with this, Texas Instruments Inc. (TI) announced that its OMAP technology powers AMX’s automation and control panels.

The Modero ViewPoint touch panels (MVP-5000 series), Modero wall/flush mount touch panels (NXD-500i and NXD-430 series) and the Metreau Entry Communicator devices are sleek, single-system automation panels that seamlessly manage electronics, lighting, temperature, video/audio conferences, Internet and more for homes, theatre systems, hotel rooms, meeting and conference rooms, classrooms or restaurants.

TI’s OMAP processor provides advanced processing performance and extended battery life for crisp, life-like video and graphics for these latest products.

The ARM and digital signal processor (DSP) processing architecture offered by the OMAP device enables AMX to deliver advanced graphical user interfaces (GUIs) so consumers can navigate on-screen functions with multiple windows, monitor remote security cameras and control audio and video equipment at the same time.

Additionally, the multi-core design of the OMAP processor simultaneously supports numerous functions, such as video encoding/decoding and playback, 2D/3D graphics and audio. This gives AMX the edge in designing multi-functional touch panels with exceptional system efficiency to instantly run applications without compromising performance.

With several power modes from full-powered to processor shutdown, the Modero ViewPoint touch panels for instance, take advantage of the sophisticated power management framework to yield greater energy savings by turning off unused peripherals based on the user’s activity and modes of operation.

“We are dedicated to developing flexible, compact and innovative solutions that allow consumers to easily automate their entire home or corporate environment from managing audio and video equipment, changing the thermostat, checking who is at the front door to making a phone call with just a single touch of a button,” said Robert Noble, Chief Technology Officer, AMX.

“By working with TI, we are able to address customer’s growing demands for products featuring the latest, cutting-edge technologies that are easy to operate to ultimately simplify their lives.”

Complete system-level solution
AMX leverages a complete system-level solution from TI, ranging from the OMAP applications processor to a full complement of analog ICs, including power management, interface, audio, touch screen control and logic devices.

The combined solutions pave the way for AMX’s signature ultra-light, ergonomic designs to integrate the fastest video processing, intuitive GUIs with photo-realistic graphics and low power consumption levels on a single platform.

TI dramatically reduces system cost in consumer audio with class-D amplifiers

BANGALORE, INDIA: Texas Instruments Inc. today introduced a 15-W stereo, true filter-free, analog-input, class-D audio amplifier.

The device’s advanced electromagnetic interference (EMI) suppression technology eliminates the need for costly inductor-based output filters, reducing bill of materials (BOM) cost by as much as 50 percent.

The TPA3110D2’s SpeakerGuard protection circuitry protects speakers from damage, helping to reduce end equipment customer returns and associated support costs.

The device also features enhanced performance, making the TPA3110D2 an excellent choice for consumer audio applications, including HDTVs, media docking stations, digital radios and sound bars.

The TPA3110D2:
* Filter-free advanced EMI suppression technology reduces bill of materials costs by as much as 50 percent, yet meets EMC performance specifications. Costly inductor-based output filters are replaced with low-cost ferrite bead filters, reducing board space.
* SpeakerGuard technology includes an adjustable power limiter and DC protection circuitry on the audio inputs, preventing speakers from being overdriven or damaged by DC currents due to board component failure or defects on the audio input circuitry.
* Ultra-low THD+N performance of < 0.1 percent THD+N over full power range at 1 kHz and advanced click-and-pop suppression circuitry enables outstanding audio performance and fidelity.
* Flow-through pin-out facilitates hassle-free layout and optimizes thermal performance with high-voltage pins on one side and input and control pins on the other.
* Differential inputs enables excellent common mode noise rejection and high-fidelity audio.

Texas Instruments bids $172.5mn for Qimonda's tools

Now, isn't that an interesting piece of news? It is splashed all over the Internet! I came across it on Semiconductor International, Reuters as well as The Dallas Morning News.

David Lammers writes in Semiconductor International: "With a goal of opening the industry's first 300mm analog fab, Texas Instruments Inc. (TI, Dallas) has placed a bid of $172.5M for the 300mm semiconductor production tools at the closed Qimonda DRAM fab in Virginia."

In that same story, TI spokewoman Gail Chandler said: "The equipment would be used for analog manufacturing using 300mm wafers. It would likely result in the world's first 300mm analog fab." That's really going to be some achievement for TI!

I wonder, what would have been the story for the Indian semiconductor industry had an Indian investor showed some spirit by buying out Qimonda ever since it filed for bankruptcy protection during the winter! Or, some Indian company buying out the fab equipment to equip its own fab in India. Did anyone think of such a possibility?

TI unveils three new multi-channel video decoders

BANGALORE, INDIA: Texas Instruments Inc. introduced the new TVP5158, TVP5157 and TVP5156 multi-channel NTSC/PAL video decoders that deliver superior picture quality.

The new devices feature advanced 2D adaptive comb filter core and image enhancement techniques, such as auto contrast and video noise filtering. With the ability to simultaneously decode four channels of video input, the new TVP515x solutions are ideal for video surveillance and video conferencing designs that require multiple-channels of decoding in a cost- and space-efficient manner.

These applications include multi-channel digital video recorders (DVR), digital video servers (DVS), hybrid DVRs, cameras for video conferencing and digital signage products.

Additionally, flexible video outputs on the TVP5158 and seamless interface to TI digital media processors based on DaVinci technology (TMS320DM6467 and TMS320DM365) reduce system cost by up to $10 by eliminating the need for an external FPGA. For product details, please visit: www.ti.com/tvp5158-prprod.

TVP5158, TVP5157 and TVP5156 key features and benefits:
* Four high-quality NTSC/PAL video decoders on each TVP515x chip can concurrently decode four video channels and then stream a single output to the DSP, enabling customers to benefit from a lower cost per channel.
* High-quality five-line adaptive comb filter algorithms for all NTSC/PAL standards.
* Multi-chip operation with two TVP5158 devices allow for simultaneous eight channel half D1 or eight channel CIF output.
* Auto contrast improves image quality under poor lighting conditions and off-loads processing from the associated DSP, giving customers more headroom to implement other algorithms.
Video noise reduction with 2D spatial filtering improves image quality and compression ratio under poor lighting conditions for better storage compression.

TI delivers industry’s smallest 16-bit ADC

BANGALORE, INDIA: Texas Instruments Inc. (TI) introduced a family of 16-bit analog-to-digital converters (ADCs) packaged in a leadless QFN measuring 2.0 x 1.5 x 0.4 mm – 70 percent smaller than the nearest competition.

In addition to significant system space savings, the ADS1115 family provides product options for scalable integration to reduce component count and simplify design.

This family supports battery monitoring, portable instrumentation, industrial process control, smart transmitters, medical instrumentation and other industrial and consumer systems. For more product information, see www.ti.com/ads1115-pr.

"Analog customers require ever higher functionality and performance without sacrificing system size and power in order to take their products to the next level," said Art George, senior vice president of TI’s High-Performance Analog business unit.

"By reducing size by 70 percent and delivering a complete family of integration and resolution options, the ADS1115 will help designers achieve a smaller system footprint, lower power, higher performance and easy design implementation."

Apoorva Awasthy, Business Development Manager, Analog, Texas Instruments India, said: "Designed for precision, power efficiency and ease of implementation, the ADS1115 family performs conversions at programmable data rates up to 860 samples per second (SPS), consuming just 150 µA (typical) of supply current and operating down to 2 V.

"The ADS1115 is the most highly integrated member of the new family, incorporating an oscillator, low-drift reference, programmable gain amplifier, comparator and four-channel input multiplexer into a tiny package. This family also includes 12-bit versions for increased flexibility. We see a lot of potential for this product in India."

Key features and benefits
* Ultra-tiny, leadless QFN (RUG) package (2.0 x 1.5 x 0.4 mm) for unmatched system space savings.
* Complete family with product options for scalable selection of on-chip integration reduces component count and simplifies design.
* 14x faster sampling rate supports demanding measurement requirements.
* Integrated programmable comparator simplifies system monitoring.
* Performance upgrade for embedded ADCs.
* Customers can speed time-to-market with compatible TI devices, including amplifiers (OPA333, INA333), references (REF33xx), temperature sensors (TMP102) digital isolators (ISO721), digital-to-analog converters (DAC7731, DAC856x) and ultra-low-power microcontrollers (MSP430).

TI tops ABI Research's MID platforms vendor matrix ranking

NEW YORK, USA: Texas Instruments has been ranked at the top of the latest Vendor Matrix released by ABI Research.

NVIDIA and Freescale Semiconductor claimed the second and third spots in the company’s new evaluation of worldwide Mobile Internet Device (MID) platform vendors.

“Congratulations to TI for taking the MID Platforms vendor title for the second time,” said Jeff Orr, senior analyst.

“The company’s current MID platforms, incorporating ARM processor cores, excelled in several categories, including the implementation of every mobile operating system we examined –- from Windows Mobile to Palm’s webOS.”

Seven PC and mobile operating systems were factored into scoring. NVIDIA and Freescale represent the next generation of multimedia-rich MID platforms, which are expected to debut during the second half of 2009.

The Vendor Matrix is an analytical tool developed by ABI Research to provide a clear understanding of vendors’ positions in specific markets. Vendors are assessed on the important parameters of “innovation” and “implementation” across several criteria unique to each vendor matrix.

For this particular matrix, under "innovation," ABI Research examined these platforms’ connectivity options, their level of voice support, the capabilities of their processors, their displays, and the integration and support services available to licensees and manufacturers of the MID platform.

“TI received perfect scores for its range of voice support, display capabilities and integration support services,” notes Orr. “The company offers development tools, reference designs and consultative services necessary to accelerate MID design programs into manufacturing.”

Under "implementation," ABI Research scrutinized the following criteria: existing customer types (ie. what PC system, mobile handset and consumer electronics vendors are currently buying or licensing the MID platform or architecture); commercially available products, current PC operating system support, and existing mobile operating system support.

TI's FlatLink transmitter offers first glueless connection to low-power embedded processors

DALLAS, USA: Texas Instruments Inc. has introduced the first LVDS serializer that connects directly to 1.8-V powered processors.

Using TI's FlatLink technology, the SN75LVDS83B eliminates the need for a costly level shifter when using 1.8-V and 2.5-V logic interfaces, lowering cost and reducing board space by up to 83 percent.

The SN75LVDS83B supports 8-bit color and serializes RGB data. It then consolidates 24 data lines into one LVDS clock and four LVDS data pairs, which connect to LCD modules. For product details visit: www.ti.com/sn75lvds83b-pr.

The SN75LVDS83B supports applications such as netbooks, mobile Internet devices, digital picture frames and others where an LVDS link from a processor to the LCD module is required.

The SN75LVDS83B supports a very broad pixel frequency range from 10 MHz up to high-definition (HD) screen resolutions of 135 MHz. The device is compatible with numerous processors, including OMAP35x applications processors and digital media processors based on TI's DaVinci technology.

Key features and benefits
* Connects directly to any TTL level from 1.8 V to 3.3 V, eliminating the need for additional components.
* Eliminates the level shifter, lowering cost by more than one dollar and reducing board space by up to 83 percent with the BGA package, and up to 39 percent with the TSSOP package.
* 135-MHz pixel clock supports HD screen resolutions.

The SN75LVDS83B is available now in a 56-pin TSSOP priced at $2.60, and a 56-ball BGA package priced at $2.80. The SN75LVDS83A is available in the 56-pin TSSOP package only.

The SN75LVDS83A has a maximum frequency of 100 MHz, supports only 3.3-V input levels and is priced at $2.10. All prices are for quantities of 1,000 units.

TI's fully integrated 10-A synchronous buck converter with integrated FETs

BANGALORE, INDIA: Texas Instruments Inc. has introduced a fully integrated, 10-A synchronous buck converter with integrated FETs that combines wide input, light load efficiency and reduced solution size to enable increased power density.

The TPS51315, a 1-MHz DC/DC switcher, features D-CAP Mode control scheme, which allows a fast transient response while reducing the required number of external output capacitors by 32 percent compared to competing devices.

This converter helps designers meet Energy Star/90 Plus guidelines by utilizing auto-skip mode and Eco-mode light load control schemes to achieve high efficiency across the entire load range.

Its wide input and output voltage ranges and programmable switching frequency can enable designers to meet the requirements of power-dense applications in embedded PCs, notebooks and other computing applications, as well as base stations and network attached storage.

Key features and benefits:
* Input voltage of 3 V to 14 V and an output voltage range of 0.75 V to 5.5 V allows for flexible design in 3.3-V, 5-V and 12-V power systems and can power various components, such as DSPs, FPGAs, ASICs, I/O and DDR memory cores.
* Integrated power MOSFETs enable high efficiency of more than 91 percent at full 10-A output current.
* Adaptive on-time D-CAP Mode control scheme allows less than 100 nsec response time in load step transient with fewer components.
* Selectable auto-skip/Eco-mode light load control schemes achieve high efficiency at light loads.
* Complements TI’s full power management portfolio for chipset cores and DDR memory, including PWM controllers, DDR termination linear regulators, DC/DC converters and controllers and power interface devices.

TI simplifies system design and layout with isolated CAN transceiver

BANGALORE, INDIA: Texas Instruments Inc. (TI) today introduced the first isolated controller-area network (CAN) transceiver.

The ISO1050 combines TI’s innovative CAN and isolation technologies to reduce required components by at least half, and simplifies board design in industrial automation, motor control and medical equipment.

Loop time is reduced by 34 percent, giving designers flexibility to use longer network cables than can be used with other common isolated CAN solutions.

“Customers are being challenged to design more complex industrial systems in smaller spaces,” said Art George, senior vice president of TI’s High-Performance Analog business unit. “The ISO1050 single-chip isolated CAN solution eases system design and allows engineers to reduce component count and speed time-to-market.”

Apoorva Awasthy, Business Development Manager, Analog, Texas Instruments India said: “The ISO1050 reduces system-level power consumption by 38 percent compared to isolated optocoupler solutions. In high-voltage applications where minimum clearance is required, the 6.1mm wide-body package reduces board space by 30 percent. Additionally, the ultra-low electromagnetic emissions (EME) support sensitive analog applications, such as industrial sensors.”

Features and benefits
* The capacitive technology in TI isolators provides galvanic isolation of up to 4000 V and life expectancy of more than 25 years.
* Meets requirements for the ISO 11898 standard.
* Meets DeviceNet and CAN timing requirements.
* Wide temperature range from –55C to 105C accommodates the requirements of a variety of industrial applications.
* Customers can speed time-to-market with compatible TI devices including power isolation (DCR010505), and the Piccolo , Delfino and Stellaris MCU series.

Three new medical development kits from TI

BANGALORE, INDIA: Medical electronics manufacturers are looking to speed up new equipment designs to meet healthcare providers’ increasing need for the most advanced devices that offer sophisticated features in a battery-powered, portable design.

To accelerate and simplify development of these portable medical devices, Texas Instruments Inc. (TI) today announced the industry’s first medical development tool set with a complete signal chain and software offering for multiple medical diagnostic and patient monitoring applications.

The three medical development kits (MDKs) -- based on TI’s TMS320VC5505 digital signal processor (DSP) –- can be built by purchasing an analog front-end (AFE) module and a TMS320VC5505 DSP evaluation module (EVM), giving manufacturers a jump start on designing leading-edge electrocardiograms (ECG), digital stethoscopes and pulse oximeter products.

Each kit includes both hardware and software design tools including schematics, sample application code, medical-specific algorithms and collateral that eases the design process and decreases development time for customers by up to eight months.

The MDKs are also extremely flexible with the ability to mix-and-match AFEs with multiple processor platforms for maximum software reuse and return on investment. Additionally, the low power technology offered by the C5505, which is supported by TI’s full analog offering, enables diagnostics functionality for portable medical devices, making them smarter and more energy efficient.

As a result of TI’s advanced DSP and analog technology, coupled with software specific for medical applications, the MDKs enable doctors and patients to quickly benefit from an end product with longer battery life, better portability and more sophisticated user functionality, such as real-time waveform display and menu options on an LCD screen and audio recording and playback.

The MDKs are for feasibility evaluation by experts in laboratory/development environments only, and not for medical/diagnostic use on patients.

TI's four new processors provide unmatched connectivity options

BANGALORE, INDIA: Connected, energy-efficient designs require high levels of peripheral integration, lower heat dissipation and longer battery life.


To address this, Texas Instruments Inc. (TI) today announced four new processors -- the TMS320C6742, TMS320C6746, TMS320C6748 and OMAP-L138, respectively -- with unmatched connectivity options and fixed- and floating-point capabilities that are also the industry’s lowest power floating-point digital signal processors (DSPs).

Ramprasad Ananthaswamy, Director, Power Management Products, Texas Instruments India said: “Packed with a unique combination of application-tuned features and peripherals, these devices reduce overall system cost for a wide spectrum of products including industrial, communications, medical diagnostics and audio.”

For instance, power protection systems benefit from the OMAP-L138 device’s fixed/floating-point DSP, ARM9, Ethernet MAC (EMAC) and LCD controller for up to $14 cost reduction compared to current solutions. For applications that need high-speed data transfer and high-capacity storage, such as test and measurement, public safety radios, music effects and intelligent occupancy sensors, the processors feature a universal parallel port (uPP) and are also the first TI devices with an integrated Serial Advanced Technology Attachment (SATA).

With performance levels up to 300 MHz, these products offer the ability to manage on-chip power through dynamic voltage and frequency scaling (DVFS) and multiple power down modes.

When coupled with TI power management software and complementary analog solutions, developers can optimize their system for performance and power without having to be an energy expert. To ease and reduce development time, the new offerings are pin-for-pin compatible with each other, code compatible with all TMS320C6000 devices and complemented by a low-cost experimenter board and full-featured evaluation module (EVM).

C6742, C6746 and C6748 DSP key features and benefits:
* Lowest-cost and lowest-power C6000 processors and industry’s lowest-power floating-point DSPs with 7mW of standby power at 1.0V/25°C and 420mW total power in use case scenarios.
* Standby power up to nine times lower than existing floating-point DSP solutions on market.
* First TI processor with an integrated SATA for high-capacity data storage.
* A uPP enables high-speed connection to data converters, FPGAs or other C6742/C6746/C6748/OMAP-L138 processors.
* EMAC, multimedia card/secure digital (MMC/SD) and high-speed USB 2.0/1.1 for desktop, network or portable connectivity or storage.
* Video port interface provides the ability to input/output raw video while a LCD controller allows developers to easily connect video graphics array (VGA) resolution displays.
* Multiple operating points facilitated through DVFS, powering off unused peripherals and selectable I/O voltages enable portability and reduce heat dissipation in products.
* Complementary TI TPS65070 power management device implements all sequence and default options as well as supports the devices’ power modes.
* C674x core up to 300MHz provides floating-point operations for high-precision and wide dynamic range as well as fixed-point operations for higher performance.
* Pin-for-pin compatibility (C6742, C6746, C6748 and OMAP-L138) enables customer to expand their entire product portfolio using the same hardware and software platform
128 KB to 448 KB on-chip memory to reduce external memory access and power usage.

OMAP-L138 processor features and benefits:
* Dual-core processor that builds on the C6748 DSP with a 300 MHz ARM9 gives developers the flexibility to add intuitive human machine interfaces, touch screens or networking capability to their applications.
* ARM9 allows developers to implement high-level operating systems, such as Linux
Windows® Embedded CE and Integrity support is expected in 4Q09.
* Low power usage with 440mW total power and 15mW in standby mode in use case scenarios.

Development tools for varying levels of expertise:
* A community-supported $149 experimenter board is available from Logic, the designer and manufacturer. The board features the OMAP-L138 system-on-module (SOM), 64MB mDDR, open source Linux, DSP/BIOS drivers and can be used to develop on any of the four devices.
* An OMAP-L138/C6748 EVM from TI is available for those that need full peripheral access and TI support. The EVM builds on the experimenter board with an extra C6748 SOM, double the memory (128 MB mDDR) and full support for connectivity peripherals.
* An OMAP-L138 (SOM) is a production-ready solution with 128 MB mDDR, power management and Ethernet PHY. It is available for less than $99 @ 10k EAU from Logic.

TI intros low-cost Piccolo MCU motor control kits with PFC

BANGALORE, INDIA: Power factor correction (PFC) is becoming a key requirement for motor control applications, as regulation standards aimed to prevent spikes in the power grid are increasingly implemented.

Texas Instruments Inc. (TI) has announced two new Piccolo Motor Control Kits that enable PFC and sensorless field-oriented control of up to two motors with a single low-cost microcontroller (MCU).

Leveraging TI’s Piccolo MCUs and high-performance analog, the kits include everything needed to immediately begin development of cost-sensitive motor control applications such as pumps, HVAC, refrigerators and other appliances/white goods.

Allowing developers to efficiently meet their design needs, these controlCARD-based kits include a Piccolo controlCARD, Code Composer Studio IDE, software libraries and a hardware designer’s package. The Motor Control and PFC Developer’s Kit includes a single permanent magnet motor while the Dual Motor Control and PFC Developer’s Kit includes two.

Key features of Piccolo MCU Motor Control and PFC Developer’s Kits
* Single 60MHz TMS320F28035 MCU features 128KB flash and control-oriented peripherals such as 12-bit, 16 channel on chip ADC and high resolution PWM outputs.
* Sensorless field-oriented software tuned for kits’ motors allows developers to easily begin design right out of the box.
* Software is broken into incremental builds for easy, step by step learning and development of motor control plus PFC on Piccolo MCUs.
* Dual full bridge PWM motor drivers include programmable cycle-by-cycle current limit and two stage thermal protection capabilities.
* Isolated onboard USB JTAG emulation saves on cost by eliminating the need for an external JTAG emulator.
* Detailed documentation of field-oriented motor control theory and PFC principles, including instructions for executing both with one Piccolo MCU.

TI offers new femtocell DSP family

BANGALORE, INDIA: Texas Instruments Inc. today announced a new family of DSPs (digital signal processors) enabling residential and enterprise femtocell manufacturers and service providers to reduce development time and deliver new products to market quickly.

TI’s family of multicore femtocell solutions includes a full portfolio of complementary analog solutions, support for Linux, and software solutions from TI third parties, Continuous Computing and mimoOn.

These DSPs provide a complete digital solution for HSPA applications, enabling low cost, fully programmable solutions and thus allowing OEMs (original equipment manufacturer) to offer reliable and adaptable femtocell products to market.

Using the software reference design available from Continuous Computing and mimoOn, which provides customers with software for Layer 1, 2 and 3 wireless protocol processing, OEMs can quickly develop femtocell products to provide increased wireless connectivity for streaming video files, interactive gaming, music sharing and other bandwidth-intense multimedia tasks.

TI’s femtocell product family includes the TMS320TCI6485 with two high-performance 850MHz C64x+ DSP cores delivering 1.7 GHz of overall performance for residential femtocell applications, and the TMS320TCI6489 which includes three 850MHz C64x DSPs delivering 2.55 GHz of performance for enterprise or “super femto” applications.

Scaling to meet the varied global requirements of the residential and enterprise market segments, TI’s TCI6485 supports up to eight users while the TCI6489 supports up to 32 users.

The entire product family is compatible with all major 2G/3G and 4G systems including GSM, CDMA, WCDMA, TD-SCDMA, WiMAX and LTE, and furthermore, is code compatible with other TI DSPs for the wireless infrastructure market, where any previous investments in macro or pico base stations can be reused.

TI’s longstanding incumbency in the wireless infrastructure space combined with its robust DSP solutions developed specifically for the femtocell market allow OEMs to develop products for this emerging market with confidence.

Features and benefits of TCI6489 and TCI6485 femtocell DSPs:
* The new TCI6489 three-core DSP and TCI6485 dual-core DSP allows femtocell OEMs to use a single device for Layer 1, 2 & 3 processing, reducing the overall BOM (bill of materials) by eliminating the requirement for a separate microprocessor.

* Optimized for enterprise femtocell applications, the TCI6489 includes three 850 MHz cores, four lanes of Antenna Interface (CPRI/OBSAI) to connect to the analog front end, 3MB of L2 memory and dedicated accelerators for chip rate and forward error correction processing.

* Targeted for the residential femtocell market, the TCI6485 has two 850MHz C64x+ DSP cores that support both higher layer processing and lower layer processing. It also contains two lanes of Antenna Interface (CPRI/OBSAI) for analog RF connectivity, 2MB of L2 memory and dedicated accelerators.

* TI’s single chip solutions allow manufacturers to take advantage of a customized set of memory, peripheral, accelerator, core and performance features that make it the ideal processor for femtocell applications.

With TI’s complete WCDMA software solution for femtocell base stations supported by third parties, OEMs receive a fully operational and tested femtocell software solution, running on TI evaluation hardware, which speeds time-to-market and allows for increased development flexibility. Early versions of the software femtocell reference design will be available in 4Q09.

* TI also provides the complete analog signal chain for femtocell applications, including data converters, RF products, power management, clocks and amplifiers, which allow manufactures to develop a complete hardware femtocell solution from a single silicon supplier.