Lattice announces production of MachXO3L devices in WLCSP and caBGA packages

HILLSBORO, USA: Lattice Semiconductor Corp. announced volume production of its industry-leading MachXO3LTM family in four tiny packages as small as 2.5 mm x 2.5 mm.

Lattice also launched two new low-cost breakout boards that enable designers to evaluate the MachXO3L device’s hard IP, versatile I/O and other capabilities. These releases solidify the MachXO3L family’s lead in enabling engineers to quickly solve complex design problems in applications as diverse as industrial infrastructure and smart connected devices.

“Lattice is clearly ahead of its competition with a rich 25-year legacy of instant-on products,” said Keith Bladen, corporate VP, Marketing. “Our non-volatile FPGA portfolio leads the industry with advanced 40 nm technology, power as low as 19 μW and the industry’s widest density range with 256 to 40K LUT devices in production today. The demand for MachXO3L devices is strong and growing with nearly 200 unique customers across a wide range of markets including industrial, communications and consumer.”