PORTLAND, USA: Electro Scientific Industries, a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, announced that Hynix Semiconductor Inc. has placed a high volume order for its 9850TPIR+ laser link processing system.
ESI’s 9850TPIR+ (tailored-pulse infra-red plus) has experienced rapid adoption since its introduction in July of this year. Hynix plans to utilize the 9850TPIR+ to ramp its advanced DRAM and embedded memory manufacturing.
“The increased productivity gained with ESI’s 9850TPIR+ will help us meet our low cost of ownership goals for our DRAM and embedded memory applications.”
“We are impressed with the flexibility of the 9850TPIR+. ESI’s tailored-pulse laser fuse architecture roadmap is well aligned with our aggressive needs to design and process memory products with innovative designs,” said Seong Dong Lee, director of the test engineering team of Hynix Semiconductor.
“The increased productivity gained with ESI’s 9850TPIR+ will help us meet our low cost of ownership goals for our DRAM and embedded memory applications.”
ESI’s 9850TPIR+ laser link processing system
ESI’s Model 9850TPIR+ laser link processing system is specifically designed for high volume production environments for variety of DRAM and embedded memory devices. The system features ESI’s proprietary tailored-pulse laser technology that includes high resolution temporal pulse profiling and high repetition rates to support the newest, most challenging fuse designs. The 9850TPIR+ delivers fast fuse blowing, while exceeding the accuracy and precision requirements for 40nm class DRAM manufacturing.
“We’re extremely pleased to be supporting Hynix as they implement the latest technologies to meet their growing 40nm class DRAM processing requirements,” said Louis Vintro, vice president and general manager of ESI’s Semiconductor Products Division.
“The high performance, fiber-based tailored-pulse laser architecture in our 9850TPIR+ system delivers market-leading throughput and productivity. We look forward to implementing these systems at Hynix and working together to bring continuous innovation to the DRAM marketplace.”
Tuesday, October 19, 2010
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