SUNNYVALE, USA & DUBLIN, IRELAND: eSilicon Corp., the largest independent semiconductor Value Chain Producer (VCP), and S3 Group, a leader in SoC design services and mixed-signal semiconductor intellectual property (IP), have announced an agreement whereby eSilicon will provide chip manufacturing and productization services, and S3 Group will provide design services to semiconductor organizations worldwide. The arrangement provides customers with a one stop shop complete specification-to-chip offering.
S3 Group has been providing advanced design services and complex IP to semiconductor customers worldwide including some of the largest fabless semiconductor, IDM and OEM companies.
An increasing number of its customers are now seeking Product Cost Reduction services, which offer a turnkey solution including manufacturing and productization services. eSilicon, with its track record as the leading independent VCP, can fulfill the customer’s demand by delivering packaged, tested chips at a lower total cost of ownership (TCO) than the customers can achieve otherwise. The collaboration of both parties means that customers can now get an integrated solution in one place.
“S3 Group has an excellent reputation for RF, analog and digital design services and related RF, analog and mixed-signal IP development,” said Kalar Rajendiran, Senior Director of Marketing at eSilicon. “Through its accelerated design services and IP, combined with our first-time-right silicon track record and proven production capabilities, customers can achieve a shorter time to revenue and grow their market share.”
James Blair, Director of IC Services at S3 Group, said: “Our semiconductor customers not only require comprehensive solutions including design, manufacturing and productization services but they also want the convenience of being able to address their needs through one partner or organization. eSilicon provides a highly sophisticated production infrastructure, engineering excellence and a solid base of supply chain partners. S3 Group complements this with proven design services and complex IP and over 20 years expertise in the industry. Together, we can provide customers with a proven, integrated specification-to-chip offering.”
Friday, June 11, 2010
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