SAN JOSE, USA: IDT (Integrated Device Technology Inc.), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, announced its new family of embedded clocks.
The new devices are ideal for embedded applications or any computing system that is hidden from view and runs a real-time operating system. Such systems include high-end printers, home routers, automotive infotainment systems, outdoor communications equipment, industrial temperature-rated motherboards and ruggedized notebooks.
The IDT embedded clocks have a guaranteed life cycle of at least five years and up to seven years — much longer than traditional PC clocks — providing IDT customers with an added level of reliability.
The new family features embedded clocks that support various standard chip sets used in today’s embedded applications. The IDT embedded clocks provide a single-chip solution for systems using today’s standard chip sets, helping save board space and giving embedded system designers greater flexibility.
The new IDT devices also provide highly accurate outputs supporting Serial ATA and PCI Express. All of the new embedded clocks are SMBus programmable and feature spread spectrum to reduce electromagnetic interference (EMI), providing increased reliability and improved signal integrity.
The embedded clocks are available in various packages, ranging from 48 to 72 pins and including SSOP, TSSOP and MLF package types. Many of the devices are also offered in industrial temperature range versions. The devices are currently available and are priced at $2.95 in 1,000 unit quantities.
Showing posts with label mixed signal semiconductor solutions. Show all posts
Showing posts with label mixed signal semiconductor solutions. Show all posts
Tuesday, August 25, 2009
Thursday, August 6, 2009
IDT, TSMC enter product fabrication agreement
SAN JOSE, USA & HSINCHU, TAIWAN: IDT (Integrated Device Technology Inc.), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience and Taiwan Semiconductor Manufacturing Co. (TSMC) have entered into an agreement to transfer product fabrication processes and related activities currently running in the IDT Hillsboro, Oregon facility to TSMC foundries.
The transfer, which has already received approval by both companies and the IDT Board of Directors, is expected to take up to two years to complete and will cover the lifecycle of all products involved.
“Over the past year or so, IDT has been shifting gears towards developing application specific solutions for the communications, computing and consumer markets. Obtaining an agreement with TSMC enables us to take full advantage of their cutting edge manufacturing processes and geometries and is the logical next step in our transformation,” said Mike Hunter, vice president of worldwide manufacturing for IDT.
“This agreement, which will combine IDT system expertise and architecture and the TSMC technology platform, expands our overall global manufacturing capability. It also officially starts the countdown for IDT to move from a Fab-lite to a Fab-less model.”
“The Fab-less model enables IDT to focus our resources and investments on innovative new product development where we can leverage our core strengths in definition and design differentiation, while outsourcing manufacturing to the industry leader,” said Ted Tewksbury, President and CEO of IDT.
“This initiative is a key enabler of our mixed signal strategy as IDT’s products transition to more advanced process technologies supporting higher levels of speed, complexity and integration.”
“TSMC remains committed to providing a full suite of foundry services to customers, enabling them to deliver market-leading solutions not only in advanced technologies but also in mature technologies,” said Dr. C.C. Wei, senior vice president, Mainstream Technology Business, TSMC. “This announcement reflects our commitment to providing IDT with robust process technologies as they transition to a Fab-less business model.”
IDT product processes and geometries transferred under this agreement include existing IDT products currently manufactured at the Fab 4 facility in Hillsboro, Oregon at .13 micron process technology and above. These processes and products will be transferred to TSMC over the ensuing two years.
The agreement does not include transfer or sale of the process equipment or the IDT facility located in Hillsboro, Oregon. IDT intends to exit the Hillsboro, Oregon wafer fabrication facility at the end of the transfer period and has engaged a third party to market the facility to potential buyers that can continue fabrication operations.
“IDT has long been a valued customer with TSMC,” said Rick Cassidy, president, TSMC North America. “We will work with them step-by-step to ensure a seamless transition and appreciate their confidence in TSMC by making this strategic decision.”
The transfer, which has already received approval by both companies and the IDT Board of Directors, is expected to take up to two years to complete and will cover the lifecycle of all products involved.
“Over the past year or so, IDT has been shifting gears towards developing application specific solutions for the communications, computing and consumer markets. Obtaining an agreement with TSMC enables us to take full advantage of their cutting edge manufacturing processes and geometries and is the logical next step in our transformation,” said Mike Hunter, vice president of worldwide manufacturing for IDT.
“This agreement, which will combine IDT system expertise and architecture and the TSMC technology platform, expands our overall global manufacturing capability. It also officially starts the countdown for IDT to move from a Fab-lite to a Fab-less model.”
“The Fab-less model enables IDT to focus our resources and investments on innovative new product development where we can leverage our core strengths in definition and design differentiation, while outsourcing manufacturing to the industry leader,” said Ted Tewksbury, President and CEO of IDT.
“This initiative is a key enabler of our mixed signal strategy as IDT’s products transition to more advanced process technologies supporting higher levels of speed, complexity and integration.”
“TSMC remains committed to providing a full suite of foundry services to customers, enabling them to deliver market-leading solutions not only in advanced technologies but also in mature technologies,” said Dr. C.C. Wei, senior vice president, Mainstream Technology Business, TSMC. “This announcement reflects our commitment to providing IDT with robust process technologies as they transition to a Fab-less business model.”
IDT product processes and geometries transferred under this agreement include existing IDT products currently manufactured at the Fab 4 facility in Hillsboro, Oregon at .13 micron process technology and above. These processes and products will be transferred to TSMC over the ensuing two years.
The agreement does not include transfer or sale of the process equipment or the IDT facility located in Hillsboro, Oregon. IDT intends to exit the Hillsboro, Oregon wafer fabrication facility at the end of the transfer period and has engaged a third party to market the facility to potential buyers that can continue fabrication operations.
“IDT has long been a valued customer with TSMC,” said Rick Cassidy, president, TSMC North America. “We will work with them step-by-step to ensure a seamless transition and appreciate their confidence in TSMC by making this strategic decision.”
Monday, June 29, 2009
IDT completes acquisition of Tundra Semiconductor
SAN JOSE, USA: IDT (Integrated Device Technology Inc.), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, today announced the closing of its acquisition of all of the shares of Tundra Semiconductor Corp. for aggregate cash consideration of approximately CDN $120.8 million.
The Tundra acquisition is expected to strengthen the IDT product portfolio of serial switching and bridging using PCI Express, Rapid IO and VME interconnect standards. Additionally, the Tundra technology, combined with the IDT mixed signal product portfolio and channel capabilities, is intended to further reinforce the IDT leadership in interconnect solutions for the communication, computing and embedded segments.
“Tundra is a great company, bringing a wealth of technologies and capabilities to IDT that are complementary to our existing product portfolios for RapidIO and PCI Express. We believe that this strategic combination will provide customers with a broader product offering as well as improved service, support and a future roadmap for serial connectivity,” said Dr. Ted Tewksbury, president and CEO of IDT.
“In addition, we currently project that this acquisition will be financially accretive to IDT’s non-GAAP EPS in the second full fiscal quarter of IDT combined operations.”
The Tundra acquisition is expected to strengthen the IDT product portfolio of serial switching and bridging using PCI Express, Rapid IO and VME interconnect standards. Additionally, the Tundra technology, combined with the IDT mixed signal product portfolio and channel capabilities, is intended to further reinforce the IDT leadership in interconnect solutions for the communication, computing and embedded segments.
“Tundra is a great company, bringing a wealth of technologies and capabilities to IDT that are complementary to our existing product portfolios for RapidIO and PCI Express. We believe that this strategic combination will provide customers with a broader product offering as well as improved service, support and a future roadmap for serial connectivity,” said Dr. Ted Tewksbury, president and CEO of IDT.
“In addition, we currently project that this acquisition will be financially accretive to IDT’s non-GAAP EPS in the second full fiscal quarter of IDT combined operations.”
Friday, June 12, 2009
IDT acquires touch sensor technology from Leadis
SAN JOSE, USA: IDT (Integrated Device Technology Inc.), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, announced it has purchased the touch sensor technology assets from Leadis Technology.
In addition, IDT will also acquire the Leadis Technology intellectual property and employee teams necessary to execute on the existing roadmap for continued touch sensor leadership and success. The transaction closed yesterday, June 10, 2009.
"IDT is excited about the acquisition of the touch technology from Leadis Technology. This strategic capability complements our existing audio, video, timing and power smart technologies to enable us to address a broader range of multimedia applications with highly integrated processing, interfacing and connectivity solutions," said Dr. Ted Tewksbury, president and CEO at IDT.
"This transaction will enable us to provide OEMs and ODMs with lower power, higher functionality Application-Specific Standard Products (ASSPs) that will enable them to provide consumers with a richer, more complete digital media experience."
In addition, IDT will also acquire the Leadis Technology intellectual property and employee teams necessary to execute on the existing roadmap for continued touch sensor leadership and success. The transaction closed yesterday, June 10, 2009.
"IDT is excited about the acquisition of the touch technology from Leadis Technology. This strategic capability complements our existing audio, video, timing and power smart technologies to enable us to address a broader range of multimedia applications with highly integrated processing, interfacing and connectivity solutions," said Dr. Ted Tewksbury, president and CEO at IDT.
"This transaction will enable us to provide OEMs and ODMs with lower power, higher functionality Application-Specific Standard Products (ASSPs) that will enable them to provide consumers with a richer, more complete digital media experience."
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