SAN JOSE, USA: IDT (Integrated Device Technology Inc.), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience announced a favorable ruling issued by the International Trade Commission (ITC) in a patent action brought by LSI Corp. against several semiconductor companies, including IDT. In the ruling, the ITC found that the patent claims asserted by LSI were invalid.
LSI had alleged that IDT and the other defendants in the action violated section 337 of the Tariff Act which prohibits the importation and sale of infringing products. Based on the finding of invalidity, the Court held that no violation of section 337 has occurred with respect to the asserted claims.
The full ITC Commission has until November 21 to determine whether to review the initial determination of the judge or allow it to become final.
Showing posts with label IDT. Show all posts
Showing posts with label IDT. Show all posts
Friday, September 25, 2009
Wednesday, August 26, 2009
IDT, Immersion ally on touch feedback to accelerate adoption in digital devices
SAN JOSE, USA: IDT (Integrated Device Technology Inc.), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, and Immersion Corp., the leading developer and licensor of touch feedback technology, will collaborate to drive the adoption of haptics in digital devices.
The companies will work together to provide solutions offering OEMs rapid implementation of high-quality haptic feedback in touch-enabled products.
Haptics, or touch feedback technology, provides a physical “touch” confirmation to the user when input is received into a system via a touchscreen, slider, touchpad or other digital interface.
Through the collaboration, Immersion’s TouchSense high-fidelity haptic technology will allow IDT to address a broader range of multimedia applications with its IDT PureTouch™ silicon solutions, ultimately accelerating touch technology in consumer electronic devices.
“Touch sensor and haptics technologies are key components to the evolution of digital media and consumer electronic devices,” said Ram Iyer, vice president and general manager for the IDT Computing and Multimedia Division. “Our touch sensor technology and collaboration with Immersion will allow us to address a broader range of applications while offering our customers the competitive advantages that haptics technology provides.”
True multi-modal user experiences encompass sight, sound and touch – all physical sensations in consumer electronic devices that IDT is improving through its video, audio and touch semiconductor solutions that ultimately allow OEM customers to provide consumers with richer, more complete digital media experiences.
“IDT shares our vision of dramatically improved user experiences, especially in touch solutions,” said Craig Vachon, senior vice president and general manager, Touch Line of Business at Immersion.
“Enabling haptics at the semiconductor level is a catalyst for further innovation and for accelerated adoption. With Immersion’s TouchSense technology in the IDT PureTouch solutions, the power of human touch – our most fundamental sense – becomes more widely available for manufacturers to bring to life in their products.”
Deployed in over 70 million devices from several of the world’s leading manufacturers, haptics technology fully involves the sense of touch to make the user experience with digital devices more efficient, intuitive, fun and more accurate. Applications include integration in products such as consumer electronics, mobile phones and handheld devices for commercial and industrial applications.
The IDT PureTouch LDS6010, 6018, 6040, and 6048 capacitive controllers integrate the TouchSense haptics technology, sophisticated software capable of delivering the crisp response required to achieve advanced tactile effects.
The driver supports ERM (eccentric rotating mass) and LRA (linear resonant actuator) vibration motors, with a smart watchdog timer implemented to save power by activating shutdown mode if no PWM (pulse width modulation) activity is detected. A programmable on-board voltage regulator enables direct connection of the haptics supply to the system battery while still ensuring a consistent haptics experience across the battery discharge curve.
The companies will work together to provide solutions offering OEMs rapid implementation of high-quality haptic feedback in touch-enabled products.
Haptics, or touch feedback technology, provides a physical “touch” confirmation to the user when input is received into a system via a touchscreen, slider, touchpad or other digital interface.
Through the collaboration, Immersion’s TouchSense high-fidelity haptic technology will allow IDT to address a broader range of multimedia applications with its IDT PureTouch™ silicon solutions, ultimately accelerating touch technology in consumer electronic devices.
“Touch sensor and haptics technologies are key components to the evolution of digital media and consumer electronic devices,” said Ram Iyer, vice president and general manager for the IDT Computing and Multimedia Division. “Our touch sensor technology and collaboration with Immersion will allow us to address a broader range of applications while offering our customers the competitive advantages that haptics technology provides.”
True multi-modal user experiences encompass sight, sound and touch – all physical sensations in consumer electronic devices that IDT is improving through its video, audio and touch semiconductor solutions that ultimately allow OEM customers to provide consumers with richer, more complete digital media experiences.
“IDT shares our vision of dramatically improved user experiences, especially in touch solutions,” said Craig Vachon, senior vice president and general manager, Touch Line of Business at Immersion.
“Enabling haptics at the semiconductor level is a catalyst for further innovation and for accelerated adoption. With Immersion’s TouchSense technology in the IDT PureTouch solutions, the power of human touch – our most fundamental sense – becomes more widely available for manufacturers to bring to life in their products.”
Deployed in over 70 million devices from several of the world’s leading manufacturers, haptics technology fully involves the sense of touch to make the user experience with digital devices more efficient, intuitive, fun and more accurate. Applications include integration in products such as consumer electronics, mobile phones and handheld devices for commercial and industrial applications.
The IDT PureTouch LDS6010, 6018, 6040, and 6048 capacitive controllers integrate the TouchSense haptics technology, sophisticated software capable of delivering the crisp response required to achieve advanced tactile effects.
The driver supports ERM (eccentric rotating mass) and LRA (linear resonant actuator) vibration motors, with a smart watchdog timer implemented to save power by activating shutdown mode if no PWM (pulse width modulation) activity is detected. A programmable on-board voltage regulator enables direct connection of the haptics supply to the system battery while still ensuring a consistent haptics experience across the battery discharge curve.
Tuesday, August 25, 2009
IDT intros new family of embedded clocks
SAN JOSE, USA: IDT (Integrated Device Technology Inc.), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, announced its new family of embedded clocks.
The new devices are ideal for embedded applications or any computing system that is hidden from view and runs a real-time operating system. Such systems include high-end printers, home routers, automotive infotainment systems, outdoor communications equipment, industrial temperature-rated motherboards and ruggedized notebooks.
The IDT embedded clocks have a guaranteed life cycle of at least five years and up to seven years — much longer than traditional PC clocks — providing IDT customers with an added level of reliability.
The new family features embedded clocks that support various standard chip sets used in today’s embedded applications. The IDT embedded clocks provide a single-chip solution for systems using today’s standard chip sets, helping save board space and giving embedded system designers greater flexibility.
The new IDT devices also provide highly accurate outputs supporting Serial ATA and PCI Express. All of the new embedded clocks are SMBus programmable and feature spread spectrum to reduce electromagnetic interference (EMI), providing increased reliability and improved signal integrity.
The embedded clocks are available in various packages, ranging from 48 to 72 pins and including SSOP, TSSOP and MLF package types. Many of the devices are also offered in industrial temperature range versions. The devices are currently available and are priced at $2.95 in 1,000 unit quantities.
The new devices are ideal for embedded applications or any computing system that is hidden from view and runs a real-time operating system. Such systems include high-end printers, home routers, automotive infotainment systems, outdoor communications equipment, industrial temperature-rated motherboards and ruggedized notebooks.
The IDT embedded clocks have a guaranteed life cycle of at least five years and up to seven years — much longer than traditional PC clocks — providing IDT customers with an added level of reliability.
The new family features embedded clocks that support various standard chip sets used in today’s embedded applications. The IDT embedded clocks provide a single-chip solution for systems using today’s standard chip sets, helping save board space and giving embedded system designers greater flexibility.
The new IDT devices also provide highly accurate outputs supporting Serial ATA and PCI Express. All of the new embedded clocks are SMBus programmable and feature spread spectrum to reduce electromagnetic interference (EMI), providing increased reliability and improved signal integrity.
The embedded clocks are available in various packages, ranging from 48 to 72 pins and including SSOP, TSSOP and MLF package types. Many of the devices are also offered in industrial temperature range versions. The devices are currently available and are priced at $2.95 in 1,000 unit quantities.
Thursday, August 13, 2009
IDT appoints ATREG as advisor for 200mm US fab sale
SEATTLE, USA: ATREG, a division of Colliers International, announced its formal appointment as advisor to IDT (Integrated Device Technology Inc.) in the sale of IDT's operational 200mm semiconductor manufacturing facility in Hillsboro, Oregon. The offering includes SMIF process tools and a potential wafer supply agreement.
The flexible Hillsboro campus, located in close proximity to the Portland-Hillsboro Airport, includes a 50,000 square foot class 1 cleanroom that manufactures standard logic, PLL, Network ICs, SRAM and Multiport semiconductor products. The 25-acre, 245,000 square foot facility can be expanded to accommodate future growth, potentially doubling production capacity.
"ATREG will focus on finding an operational purchaser for the IDT facility and its assets," stated Doug Barrett, senior vice president and director of ATREG. "A supply agreement with IDT, in-house failure analysis and test labs are components included in the offering and together with the size and location create a unique opportunity for a purchaser."
"The well-trained, highly motivated workforce provides potential acquirers with a significant head start to quickly and easily bring new products and processes on-line," said Mike Hunter, vice president of worldwide manufacturing for IDT. "The fab currently utilizes 0.35 through 0.13 micron process technologies that are efficient, stable and portable to new products."
The flexible Hillsboro campus, located in close proximity to the Portland-Hillsboro Airport, includes a 50,000 square foot class 1 cleanroom that manufactures standard logic, PLL, Network ICs, SRAM and Multiport semiconductor products. The 25-acre, 245,000 square foot facility can be expanded to accommodate future growth, potentially doubling production capacity.
"ATREG will focus on finding an operational purchaser for the IDT facility and its assets," stated Doug Barrett, senior vice president and director of ATREG. "A supply agreement with IDT, in-house failure analysis and test labs are components included in the offering and together with the size and location create a unique opportunity for a purchaser."
"The well-trained, highly motivated workforce provides potential acquirers with a significant head start to quickly and easily bring new products and processes on-line," said Mike Hunter, vice president of worldwide manufacturing for IDT. "The fab currently utilizes 0.35 through 0.13 micron process technologies that are efficient, stable and portable to new products."
Thursday, August 6, 2009
IDT, TSMC enter product fabrication agreement
SAN JOSE, USA & HSINCHU, TAIWAN: IDT (Integrated Device Technology Inc.), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience and Taiwan Semiconductor Manufacturing Co. (TSMC) have entered into an agreement to transfer product fabrication processes and related activities currently running in the IDT Hillsboro, Oregon facility to TSMC foundries.
The transfer, which has already received approval by both companies and the IDT Board of Directors, is expected to take up to two years to complete and will cover the lifecycle of all products involved.
“Over the past year or so, IDT has been shifting gears towards developing application specific solutions for the communications, computing and consumer markets. Obtaining an agreement with TSMC enables us to take full advantage of their cutting edge manufacturing processes and geometries and is the logical next step in our transformation,” said Mike Hunter, vice president of worldwide manufacturing for IDT.
“This agreement, which will combine IDT system expertise and architecture and the TSMC technology platform, expands our overall global manufacturing capability. It also officially starts the countdown for IDT to move from a Fab-lite to a Fab-less model.”
“The Fab-less model enables IDT to focus our resources and investments on innovative new product development where we can leverage our core strengths in definition and design differentiation, while outsourcing manufacturing to the industry leader,” said Ted Tewksbury, President and CEO of IDT.
“This initiative is a key enabler of our mixed signal strategy as IDT’s products transition to more advanced process technologies supporting higher levels of speed, complexity and integration.”
“TSMC remains committed to providing a full suite of foundry services to customers, enabling them to deliver market-leading solutions not only in advanced technologies but also in mature technologies,” said Dr. C.C. Wei, senior vice president, Mainstream Technology Business, TSMC. “This announcement reflects our commitment to providing IDT with robust process technologies as they transition to a Fab-less business model.”
IDT product processes and geometries transferred under this agreement include existing IDT products currently manufactured at the Fab 4 facility in Hillsboro, Oregon at .13 micron process technology and above. These processes and products will be transferred to TSMC over the ensuing two years.
The agreement does not include transfer or sale of the process equipment or the IDT facility located in Hillsboro, Oregon. IDT intends to exit the Hillsboro, Oregon wafer fabrication facility at the end of the transfer period and has engaged a third party to market the facility to potential buyers that can continue fabrication operations.
“IDT has long been a valued customer with TSMC,” said Rick Cassidy, president, TSMC North America. “We will work with them step-by-step to ensure a seamless transition and appreciate their confidence in TSMC by making this strategic decision.”
The transfer, which has already received approval by both companies and the IDT Board of Directors, is expected to take up to two years to complete and will cover the lifecycle of all products involved.
“Over the past year or so, IDT has been shifting gears towards developing application specific solutions for the communications, computing and consumer markets. Obtaining an agreement with TSMC enables us to take full advantage of their cutting edge manufacturing processes and geometries and is the logical next step in our transformation,” said Mike Hunter, vice president of worldwide manufacturing for IDT.
“This agreement, which will combine IDT system expertise and architecture and the TSMC technology platform, expands our overall global manufacturing capability. It also officially starts the countdown for IDT to move from a Fab-lite to a Fab-less model.”
“The Fab-less model enables IDT to focus our resources and investments on innovative new product development where we can leverage our core strengths in definition and design differentiation, while outsourcing manufacturing to the industry leader,” said Ted Tewksbury, President and CEO of IDT.
“This initiative is a key enabler of our mixed signal strategy as IDT’s products transition to more advanced process technologies supporting higher levels of speed, complexity and integration.”
“TSMC remains committed to providing a full suite of foundry services to customers, enabling them to deliver market-leading solutions not only in advanced technologies but also in mature technologies,” said Dr. C.C. Wei, senior vice president, Mainstream Technology Business, TSMC. “This announcement reflects our commitment to providing IDT with robust process technologies as they transition to a Fab-less business model.”
IDT product processes and geometries transferred under this agreement include existing IDT products currently manufactured at the Fab 4 facility in Hillsboro, Oregon at .13 micron process technology and above. These processes and products will be transferred to TSMC over the ensuing two years.
The agreement does not include transfer or sale of the process equipment or the IDT facility located in Hillsboro, Oregon. IDT intends to exit the Hillsboro, Oregon wafer fabrication facility at the end of the transfer period and has engaged a third party to market the facility to potential buyers that can continue fabrication operations.
“IDT has long been a valued customer with TSMC,” said Rick Cassidy, president, TSMC North America. “We will work with them step-by-step to ensure a seamless transition and appreciate their confidence in TSMC by making this strategic decision.”
Monday, July 6, 2009
IDT PCI Express Gen2 switches with integrated temperature sensor
SAN JOSE, USA: IDT (Integrated Device Technology Inc.), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, announced new additions to its family of PCI Express (PCIe) Gen2 switching solutions.
These provide high performance, line rate throughput and integrate IDT Power Smart technology to solve system-level thermal management challenges in enterprise applications leveraging high-performance networking and storage controllers including 10 gigabit Ethernet and 8 gigabit Fibre Channel devices.
Based on IDT proprietary and industry-leading, low-power design techniques, the new devices are the first PCIe interconnect solutions to integrate a temperature sensor. The addition of a temperature sensor provides IDT customers with the critical system-level thermal data necessary to enable optimized power management, load balancing and mitigation of potential thermal-related faults and outages.
The three new devices -— a 10-lane, 4-port switch, 12-lane, 3-port switch and 16-lane, 4-port switch —- provide high-performance PCIe Gen2 connectivity, and integrate power saving and thermal management features.
Employing key power management extensions to the PCI Special Interest Group (PCI-SIG) PCI Express Base 2.0, the new switches decrease or eliminate thermal management devices and airflow requirements reducing overall system cost and improving time to market through reduced thermal engineering cycles.
Further, the integration of temperature sensing functionality enables the devices to provide localized thermal feedback for global system management. Applications of the temperature sensor allow for monitoring of the thermal conditions of the switch to provide feedback on the relative health or loading of the connected system elements enabling intervention to shift traffic patterns for better system resource utilization and to avert any potential thermally induced failures.
Additionally, the inclusion of temperature sensor technology offers IDT customers key system development and debug functionality.
“With system I/O speeds and density of systems continuing to rise as the enterprise aggressively migrates to 10GE and 8G Fibre Channel and beyond, thermal management considerations have risen significantly in priority,” said Mario Montana, vice president and general manager of the IDT Enterprise Computing Division.
“We worked closely with our customers who manufacture and procure NICs and HBAs to understand their needs and are pleased to deliver a unique solution that fuses organically developed analog technology for temperature sensing to our industry-leading family of PCIe connectivity solutions.”
The new devices are currently sampling and have a dedicated evaluation and development kit for device testing and analysis, and system emulation. Each kit consists of a hardware evaluation board with representative upstream and downstream connectivity, and an IDT-developed, GUI-based software environment that enables the designer to tune system and device configurations to meet system requirements.
These provide high performance, line rate throughput and integrate IDT Power Smart technology to solve system-level thermal management challenges in enterprise applications leveraging high-performance networking and storage controllers including 10 gigabit Ethernet and 8 gigabit Fibre Channel devices.
Based on IDT proprietary and industry-leading, low-power design techniques, the new devices are the first PCIe interconnect solutions to integrate a temperature sensor. The addition of a temperature sensor provides IDT customers with the critical system-level thermal data necessary to enable optimized power management, load balancing and mitigation of potential thermal-related faults and outages.
The three new devices -— a 10-lane, 4-port switch, 12-lane, 3-port switch and 16-lane, 4-port switch —- provide high-performance PCIe Gen2 connectivity, and integrate power saving and thermal management features.
Employing key power management extensions to the PCI Special Interest Group (PCI-SIG) PCI Express Base 2.0, the new switches decrease or eliminate thermal management devices and airflow requirements reducing overall system cost and improving time to market through reduced thermal engineering cycles.
Further, the integration of temperature sensing functionality enables the devices to provide localized thermal feedback for global system management. Applications of the temperature sensor allow for monitoring of the thermal conditions of the switch to provide feedback on the relative health or loading of the connected system elements enabling intervention to shift traffic patterns for better system resource utilization and to avert any potential thermally induced failures.
Additionally, the inclusion of temperature sensor technology offers IDT customers key system development and debug functionality.
“With system I/O speeds and density of systems continuing to rise as the enterprise aggressively migrates to 10GE and 8G Fibre Channel and beyond, thermal management considerations have risen significantly in priority,” said Mario Montana, vice president and general manager of the IDT Enterprise Computing Division.
“We worked closely with our customers who manufacture and procure NICs and HBAs to understand their needs and are pleased to deliver a unique solution that fuses organically developed analog technology for temperature sensing to our industry-leading family of PCIe connectivity solutions.”
The new devices are currently sampling and have a dedicated evaluation and development kit for device testing and analysis, and system emulation. Each kit consists of a hardware evaluation board with representative upstream and downstream connectivity, and an IDT-developed, GUI-based software environment that enables the designer to tune system and device configurations to meet system requirements.
Monday, June 29, 2009
IDT completes acquisition of Tundra Semiconductor
SAN JOSE, USA: IDT (Integrated Device Technology Inc.), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, today announced the closing of its acquisition of all of the shares of Tundra Semiconductor Corp. for aggregate cash consideration of approximately CDN $120.8 million.
The Tundra acquisition is expected to strengthen the IDT product portfolio of serial switching and bridging using PCI Express, Rapid IO and VME interconnect standards. Additionally, the Tundra technology, combined with the IDT mixed signal product portfolio and channel capabilities, is intended to further reinforce the IDT leadership in interconnect solutions for the communication, computing and embedded segments.
“Tundra is a great company, bringing a wealth of technologies and capabilities to IDT that are complementary to our existing product portfolios for RapidIO and PCI Express. We believe that this strategic combination will provide customers with a broader product offering as well as improved service, support and a future roadmap for serial connectivity,” said Dr. Ted Tewksbury, president and CEO of IDT.
“In addition, we currently project that this acquisition will be financially accretive to IDT’s non-GAAP EPS in the second full fiscal quarter of IDT combined operations.”
The Tundra acquisition is expected to strengthen the IDT product portfolio of serial switching and bridging using PCI Express, Rapid IO and VME interconnect standards. Additionally, the Tundra technology, combined with the IDT mixed signal product portfolio and channel capabilities, is intended to further reinforce the IDT leadership in interconnect solutions for the communication, computing and embedded segments.
“Tundra is a great company, bringing a wealth of technologies and capabilities to IDT that are complementary to our existing product portfolios for RapidIO and PCI Express. We believe that this strategic combination will provide customers with a broader product offering as well as improved service, support and a future roadmap for serial connectivity,” said Dr. Ted Tewksbury, president and CEO of IDT.
“In addition, we currently project that this acquisition will be financially accretive to IDT’s non-GAAP EPS in the second full fiscal quarter of IDT combined operations.”
Friday, June 12, 2009
IDT acquires touch sensor technology from Leadis
SAN JOSE, USA: IDT (Integrated Device Technology Inc.), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, announced it has purchased the touch sensor technology assets from Leadis Technology.
In addition, IDT will also acquire the Leadis Technology intellectual property and employee teams necessary to execute on the existing roadmap for continued touch sensor leadership and success. The transaction closed yesterday, June 10, 2009.
"IDT is excited about the acquisition of the touch technology from Leadis Technology. This strategic capability complements our existing audio, video, timing and power smart technologies to enable us to address a broader range of multimedia applications with highly integrated processing, interfacing and connectivity solutions," said Dr. Ted Tewksbury, president and CEO at IDT.
"This transaction will enable us to provide OEMs and ODMs with lower power, higher functionality Application-Specific Standard Products (ASSPs) that will enable them to provide consumers with a richer, more complete digital media experience."
In addition, IDT will also acquire the Leadis Technology intellectual property and employee teams necessary to execute on the existing roadmap for continued touch sensor leadership and success. The transaction closed yesterday, June 10, 2009.
"IDT is excited about the acquisition of the touch technology from Leadis Technology. This strategic capability complements our existing audio, video, timing and power smart technologies to enable us to address a broader range of multimedia applications with highly integrated processing, interfacing and connectivity solutions," said Dr. Ted Tewksbury, president and CEO at IDT.
"This transaction will enable us to provide OEMs and ODMs with lower power, higher functionality Application-Specific Standard Products (ASSPs) that will enable them to provide consumers with a richer, more complete digital media experience."
Sunday, May 3, 2009
IDT, Tundra Semiconductor sign definitive acquisition agreement
SAN JOSE, USA & and OTTAWA, CANADA: IDT (Integrated Device Technology Inc.), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, and Tundra (Tundra Semiconductor Corp.), a leader in system interconnect, announced the two companies have entered into a definitive acquisition agreement, pursuant to which IDT will acquire Tundra for CDN$6.25 per share, for an aggregate purchase price of approximately CDN$120.8 million.
"IDT is excited about the proposed acquisition of Tundra. We look forward to better serving our customers by utilizing the Tundra core strengths in serial switching and bridging using PCI Express, Rapid IO and VME, with the existing IDT mixed signal product portfolio," said Dr. Ted Tewksbury, president and CEO at IDT. "We believe the result of this transaction will provide our customers with a broader product offering as well as improved service, support and future roadmap of serial connectivity innovations. This transaction reflects our commitment to extending our technology leadership in the communications end market, which is particularly critical in the current challenging economic environment."
"Tundra is excited to bring this opportunity to shareholders and customers," said Daniel Hoste, President and Chief Executive Officer of Tundra. "We believe that the combined technology innovation capability of the two companies will allow our customers better service, products, and support with their increasingly complex communications solutions."
"IDT is excited about the proposed acquisition of Tundra. We look forward to better serving our customers by utilizing the Tundra core strengths in serial switching and bridging using PCI Express, Rapid IO and VME, with the existing IDT mixed signal product portfolio," said Dr. Ted Tewksbury, president and CEO at IDT. "We believe the result of this transaction will provide our customers with a broader product offering as well as improved service, support and future roadmap of serial connectivity innovations. This transaction reflects our commitment to extending our technology leadership in the communications end market, which is particularly critical in the current challenging economic environment."
"Tundra is excited to bring this opportunity to shareholders and customers," said Daniel Hoste, President and Chief Executive Officer of Tundra. "We believe that the combined technology innovation capability of the two companies will allow our customers better service, products, and support with their increasingly complex communications solutions."
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