X-FAB releases industry’s first CMOS foundry process for high-temperature analog/mixed-signal apps

ERFURT, GERMANY: X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in “More than Moore” technologies, announced XA035, a comprehensive, analog/mixed-signal complementary metal-oxide-semiconductor (CMOS) high-temperature foundry process for ICs requiring operating temperatures up to 175 degrees Celsius.

The modular 0.35 micrometer process is the first to enable high-temperature-capable system-on-chip (SoC) solutions, combining high-voltage (HV) and embedded non-volatile memory (NVM) elements. Design support includes the XA035 Lifetime Calculator, a unique new tool that calculates expected IC lifetime for a given mission profile to help determine lifetime/temperature trade-offs.

The new XA035 high-temperature process surpasses the stringent AEC-Q100 qualification tests for automotive IC quality and reliability. Compared to the more costly discrete solutions, it allows the manufacturing of cost-effective IC solutions for operation in hostile environments. The XA035 process is ideally suited for high-precision analog circuits, sensor front-ends, and brushless DC motor controls for automotive, industrial, aerospace and military markets.

According to Thomas Hartung, X-FAB’s vice president of sales and marketing: “We expect the XA035 process with its unprecedented range of support and accurate temperature effect modeling will open new markets for high-temperature engine management applications in the automotive space and for energy-conversion products. Customers seeking a cost-effective solution for high-temperature applications – like valve control for factory automation, brushless DC motor controls, sensor interfaces, or drilling or jet engine control – now have it with XA035."

Comprehensive solution, flexible design support
XA035 technology includes a large portfolio of primitive devices such as high-voltage transistors and pre-qualified non-volatile memories, among others, enabling analog/mixed-signal SoC design.

The 0.35-micrometer single poly, triple metal N-well CMOS basic process features operating temperatures up to 175°C, with an absolute maximum of 185°C. It covers voltage ranges from 3.3 to 45V. It also comes with small-area EEPROM blocks including a charge pump, meeting automotive quality requirements. The design rules and transistor performance for all XA035 modules are compatible with X-FAB’s corporate state-of-the-art 0.35-micrometer CMOS processes.

X-FAB offers XA035 design kits covering all major EDA platforms. It also features a variety of dense standard cell libraries optimized for area, speed, low power or low noise; and I/O libraries, including ESD support. All libraries take the temperature effects into account.

In addition, XA035 supports parasitic diode modeling. This new feature enables pre-layout parasitic diode leakage simulation and lets designers simulate leakages at high temperatures early in the design flow.

The new XA035 technology for high-temperature applications is available now.

X-FAB releases first 0.18 micrometer foundry solution for integrated hall sensors

ERFURT, GERMANY: X-FAB Silicon Foundries, a leading analog/mixed-signal foundry and expert in “More than Moore” technologies, announced the industry’s first foundry process for the production of integrated Hall sensor ICs in 0.18 micrometer technology.

Its 0.18 micrometer low-power CMOS process, known as XH018, allows the combination of Hall sensor elements with high-voltage devices and non-volatile memory (NVM) options. This capability augments the industry-leading analog/mixed-signal capabilities inherent in the XH018 process, enabling cost-effective and energy-efficient System-on-Chip (SoC) solutions.

X-FAB’s customers gain the many advantages that Hall effect sensors have over traditional mechanical and reed discrete devices. Silicon-based contactless implementation of Hall sensors improves reliability and durability by virtually eliminating mechanical wear. These sensors enable high-precision measurement and analysis of magnetic fields.

X-FAB’s 0.18 micrometer foundry technology for Hall sensors enables the sensing element to be integrated on the same chip as its control logic and interface circuitry. Due to its small geometry resulting in high integration density, high magnetic sensitivity can be achieved with minimal parasitic effects. On a test chip with a sensor size of 50 by 50 square micrometers, X-FAB has proven a magnetic sensitivity of up to 360 V/(A*T) with high linearity.

Hall sensor technology has been replacing conventional sensing techniques in many applications. X-FAB’s Hall sensor foundry offering is ideal for a variety of applications including magnetic field measurements, position control, speed detection, contactless switches as well as position and angle sensors.

System costs for such applications can be substantially lowered with X-FAB’s integrated approach due to lower part count, simpler assembly, and higher reliability.

X-FAB’s XH018 technology for integrated Hall sensor solutions is available today. It comes with comprehensive design support including characterization data and layout examples.