Semiconductor packaging materials market to reach $25.7 billion by 2015

SAN JOSE, USA: The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $22.8 billion in 2011 and grow to $25.7 billion by 2015, according to a new study by SEMI and TechSearch International.

Laminate substrates remain the largest segment of the market, worth an estimated $9.7 billion globally in 2011, and on a unit basis are projected to grow at a CAGR of 8 percent over the next five years.

The report, titled “Global Semiconductor Packaging Materials Outlook: 2011/2012 Edition,” covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics and thermal interface materials.

Several areas are experiencing stronger growth as new material ramp up in production in packaging, including underfill materials, wafer-level dielectrics, copper bonding, leadframe CSP, and others.Source: SEMI, USA.