FREMONT, USA: Mattson Technology Inc., a leading supplier of advanced process equipment used to manufacture semiconductors, announced the shipment and installation of the Helios XP rapid thermal processing (RTP) system to a leading Asian foundry.
The follow-on evaluation system expands Mattson's RTP installed base at this foundry customer's research and development (R&D) facility, where the Helios XP has been established as the tool of record and is currently being qualified for next-generation process development.
"The Helios XP is delivering on Mattson's initiative to expand our RTP position into the foundry segment," said Andreas Toennis, senior VP and GM of Mattson Technology's Thermal Products Group.
"The system is the development tool of record at this customer's R&D facility, and the follow-on selection by this leading foundry reinforces its ability to meet the stringent requirements of advanced RTP applications with excellent RTP performance at the lowest cost-of-ownership."
Toennis continued: "The Helios XP's thermal uniformity control across the broadest temperature range gives our customers a wider process flexibility in the same system lowering their cost-of-ownership, while the system's unique HotShield technology suppresses pattern loading and temperature effects, enabling improved device yield on advanced IC nodes.
"We look forward to continuing to partner with this leading foundry customer on the development of advanced RTP applications and solutions for next-generation devices."
Wednesday, August 25, 2010
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