HAUPPAUGE, USA: SMSC, a leading semiconductor company providing Smart Mixed-Signal Connectivity solutions, announced that its acquisition of Tallika Corp. closed on September 8, 2009.
Tallika’s team of approximately 50 highly skilled engineers are located in design centers in Chennai, India and Phoenix, Arizona. This team brings to SMSC a broad set of capabilities, including SoC design and software development. Under terms of the acquisition, SMSC paid approximately $3.4 million.
Tallika is expected to play a significant role in accelerating SMSC’s product roadmaps, including USB 3.0, and brings a breadth of expertise in a mix of engineering disciplines including hardware, software, systems, digital design and verification/validation.
Showing posts with label SMSC. Show all posts
Showing posts with label SMSC. Show all posts
Wednesday, September 16, 2009
Friday, August 28, 2009
SMSC launches first TrueAuto Ethernet transceiver
HAUPPAUGE, USA: SMSC, a leading semiconductor company that provides Smart Mixed-Signal Connectivity solutions, launched the LAN88710 MII/RMII 10/100 Ethernet Transceiver, its second TrueAuto Ethernet solution.
This device is designed specifically to meet the high reliability standards required by automotive applications such as on-board diagnostics or fast software download interfaces for central gateway and telematics modules, navigation systems, radio head units and connectivity devices.
The LAN88710 transceiver offers increased access speed for diagnostics and software downloads over traditionally slower speed interfaces typically used to connect to the vehicle today. When used within today's complex vehicle electrical systems, which are packed full with user content, the LAN88710 transceiver can help diagnose issues faster and lower software maintenance time so repairs are completed more quickly and cost less.
The TrueAuto LAN88710 transceiver has been specifically designed, validated, qualified, characterized and manufactured for the high reliability requirements of the car. The device provides a simple, digital interface via the MII standard (IEEE 802.3u) to a typical MAC layer integrated within an embedded microcontroller.
Built into an embedded device within the car, the chip can function as a network branch to the outside world, connecting the car to a personal computer, diagnostic tool or to a complex Ethernet network in the repair shop.
The size of embedded program and data memories in today’s modern cars is growing rapidly. For example, the newly released BMW 7 Series has more than one Gbyte of memory while the previous model had just short of 100 Mbytes of memory.
While repair shops usually diagnose and fix problems, they also have the ability to update the software and data embedded in various control devices inside the car. Access into the car to obtain this valuable information is through the On Board Diagnostics (OBD) connector.
This standardized connector today not only provides a slow communication interface but updating software through this interface can takes hours, which significantly increases both repair times and cost.
As a result, many car companies are working on an upgrade of the OBD connector to provide the car with a high-performance data interface for diagnostics and software downloads -- Ethernet. The initiative is expected to lead to a new ISO/SAE standard that mandates this interface as part of the OBD connector.
Ethernet is a widely used networking technology in the repair shop IT infrastructure. Its broad proliferation, high-bandwidth and optimized communication for bursts or packets of information also make it an excellent connectivity solution to the automobile.
It can connect the external Ethernet-based infrastructure of the repair shop to a vehicle in a repair bay to then move large amounts of diagnostic information and software data seamlessly between the two.
“Transferring data between the diagnostics bay and the car is time consuming and often spotty when using today’s traditional diagnostics interface,” said Dr. Christian Thiel, Vice President and General Manager of SMSC’s Automotive Information Systems group. “SMSC’s automotive Ethernet transceiver delivers high data speed at the reliability grade that our automotive customers expect.”
This device is designed specifically to meet the high reliability standards required by automotive applications such as on-board diagnostics or fast software download interfaces for central gateway and telematics modules, navigation systems, radio head units and connectivity devices.
The LAN88710 transceiver offers increased access speed for diagnostics and software downloads over traditionally slower speed interfaces typically used to connect to the vehicle today. When used within today's complex vehicle electrical systems, which are packed full with user content, the LAN88710 transceiver can help diagnose issues faster and lower software maintenance time so repairs are completed more quickly and cost less.
The TrueAuto LAN88710 transceiver has been specifically designed, validated, qualified, characterized and manufactured for the high reliability requirements of the car. The device provides a simple, digital interface via the MII standard (IEEE 802.3u) to a typical MAC layer integrated within an embedded microcontroller.
Built into an embedded device within the car, the chip can function as a network branch to the outside world, connecting the car to a personal computer, diagnostic tool or to a complex Ethernet network in the repair shop.
The size of embedded program and data memories in today’s modern cars is growing rapidly. For example, the newly released BMW 7 Series has more than one Gbyte of memory while the previous model had just short of 100 Mbytes of memory.
While repair shops usually diagnose and fix problems, they also have the ability to update the software and data embedded in various control devices inside the car. Access into the car to obtain this valuable information is through the On Board Diagnostics (OBD) connector.
This standardized connector today not only provides a slow communication interface but updating software through this interface can takes hours, which significantly increases both repair times and cost.
As a result, many car companies are working on an upgrade of the OBD connector to provide the car with a high-performance data interface for diagnostics and software downloads -- Ethernet. The initiative is expected to lead to a new ISO/SAE standard that mandates this interface as part of the OBD connector.
Ethernet is a widely used networking technology in the repair shop IT infrastructure. Its broad proliferation, high-bandwidth and optimized communication for bursts or packets of information also make it an excellent connectivity solution to the automobile.
It can connect the external Ethernet-based infrastructure of the repair shop to a vehicle in a repair bay to then move large amounts of diagnostic information and software data seamlessly between the two.
“Transferring data between the diagnostics bay and the car is time consuming and often spotty when using today’s traditional diagnostics interface,” said Dr. Christian Thiel, Vice President and General Manager of SMSC’s Automotive Information Systems group. “SMSC’s automotive Ethernet transceiver delivers high data speed at the reliability grade that our automotive customers expect.”
Friday, August 21, 2009
SMSC to showcase automotive MOST, USB and Ethernet products
HAUPPAUGE, USA: SMSC, a leading semiconductor company that provides Smart Mixed-Signal Connectivity solutions, announced that it will present the latest developments in its automotive product line at the 14th International VDI Congress "Electronic Systems for Vehicles" in Baden-Baden, Germany on October 7 and 8, 2009.
In addition to highlighting SMSC’s Media Oriented Systems Transport (MOST) technology, the company will also demonstrate it latest TrueAuto USB and Ethernet solutions supporting consumer connectivity and advanced on-board diagnostics. SMSC will also present its suite of advanced MOST tools, including the latest version of its Optolyzer network analysis solution.
“The VDI Congress is one of the highlights of the European Automotive Industry symposia,” said Harald Schöpp, Vice President Marketing for SMSC’s Automotive product line. “We are proud to present our latest technology for automotive networking, including MOST, USB and Ethernet. With our latest companion ICs for the MOST network, SMSC provides both cost-effective and powerful silicon solutions facilitating the design of MOST devices. Easy signal routing and enhanced power management are important building blocks for a successful system design.”
Schöpp continued, “With the first car makers committing to the MOST150 network in certain 2011+ vehicles, we are focused on providing IC solutions and tool sets to enable successful infotainment implementations at the OEM and supplier level.”
SMSC’s booth will be located on the first floor, #76.
In addition to highlighting SMSC’s Media Oriented Systems Transport (MOST) technology, the company will also demonstrate it latest TrueAuto USB and Ethernet solutions supporting consumer connectivity and advanced on-board diagnostics. SMSC will also present its suite of advanced MOST tools, including the latest version of its Optolyzer network analysis solution.
“The VDI Congress is one of the highlights of the European Automotive Industry symposia,” said Harald Schöpp, Vice President Marketing for SMSC’s Automotive product line. “We are proud to present our latest technology for automotive networking, including MOST, USB and Ethernet. With our latest companion ICs for the MOST network, SMSC provides both cost-effective and powerful silicon solutions facilitating the design of MOST devices. Easy signal routing and enhanced power management are important building blocks for a successful system design.”
Schöpp continued, “With the first car makers committing to the MOST150 network in certain 2011+ vehicles, we are focused on providing IC solutions and tool sets to enable successful infotainment implementations at the OEM and supplier level.”
SMSC’s booth will be located on the first floor, #76.
Thursday, August 13, 2009
SMSC fan speed controller family scales thermal management
HAUPPAUGE, USA: SMSC announced its EMC230x fan speed controller family that consists of four new devices -– the EMC2301, EMC2302, EMC2303 and EMC2305.
The thermal management needs of larger systems are becoming more complicated and the effects of overlapping thermal zones are preventing fan controllers with integrated thermal management from functioning effectively.
To address this, SMSC has developed a new fan speed controller family delivering advanced thermal management in systems requiring as few as one fan or as many as five fans.
In large systems, such as servers, telecommunications systems and networked devices, thermal management is best managed by a central processor that is issuing individual drive signals to remote fans.
Whereas most fans in today’s market only provide +/-20 percent fan speed accuracy for a given drive signal, the EMC230x family is designed to receive drive signals from the central host and hold fan speeds to within one percent accuracy.
The EMC230x family of devices does this by actively monitoring the fan’s tachometer feedback and then adjusting the speed, as needed, to hit a given target. By accurately controlling fan speed, better acoustic and thermal performance can be maintained, yielding a more reliable and predictable design.
“Recognizing that thermal management for different system sizes often requires a variable solution, SMSC is bringing to market a new set of scalable fan controllers so these platforms can be optimized for both performance and cost,” said Mark Beadle, Vice President and General Manager of SMSC’s Analog Product Line.
When using multiple EMC230x devices within a system, fan speeds can be synchronized for optimal performance of a clock output. If the designer chooses not to synchronize clocks, this option can be utilized as a more accurate clock input to yield 0.5 percent fan speed accuracy.
On smaller systems, a designer may simply need to extend the architecture by one fan driver to obtain optimal performance. For these instances, use of the EMC2301 controller is ideal, since the fan drive instructions can be issued over the I2C bus to the EMC2301 to drive an additional fan.
For improved system reliability, all devices in the fan speed controller family can issue important system alerts. These include events such as stalled or aging fans, which help prevent system shut down and overheating. With this information, servicing and troubleshooting fan failures is faster and easier.
In addition, to minimize annoying fan noise associated with sudden changes, all devices come with configurable start-up and ramp rate controls. This feature alleviates some of the compute load associated with driving the fan directly.
In summary, all the flexibility offered by the EMC230x family scales to large multi-fan systems or can simply extend the number of fans in next generation systems.
The thermal management needs of larger systems are becoming more complicated and the effects of overlapping thermal zones are preventing fan controllers with integrated thermal management from functioning effectively.
To address this, SMSC has developed a new fan speed controller family delivering advanced thermal management in systems requiring as few as one fan or as many as five fans.
In large systems, such as servers, telecommunications systems and networked devices, thermal management is best managed by a central processor that is issuing individual drive signals to remote fans.
Whereas most fans in today’s market only provide +/-20 percent fan speed accuracy for a given drive signal, the EMC230x family is designed to receive drive signals from the central host and hold fan speeds to within one percent accuracy.
The EMC230x family of devices does this by actively monitoring the fan’s tachometer feedback and then adjusting the speed, as needed, to hit a given target. By accurately controlling fan speed, better acoustic and thermal performance can be maintained, yielding a more reliable and predictable design.
“Recognizing that thermal management for different system sizes often requires a variable solution, SMSC is bringing to market a new set of scalable fan controllers so these platforms can be optimized for both performance and cost,” said Mark Beadle, Vice President and General Manager of SMSC’s Analog Product Line.
When using multiple EMC230x devices within a system, fan speeds can be synchronized for optimal performance of a clock output. If the designer chooses not to synchronize clocks, this option can be utilized as a more accurate clock input to yield 0.5 percent fan speed accuracy.
On smaller systems, a designer may simply need to extend the architecture by one fan driver to obtain optimal performance. For these instances, use of the EMC2301 controller is ideal, since the fan drive instructions can be issued over the I2C bus to the EMC2301 to drive an additional fan.
For improved system reliability, all devices in the fan speed controller family can issue important system alerts. These include events such as stalled or aging fans, which help prevent system shut down and overheating. With this information, servicing and troubleshooting fan failures is faster and easier.
In addition, to minimize annoying fan noise associated with sudden changes, all devices come with configurable start-up and ramp rate controls. This feature alleviates some of the compute load associated with driving the fan directly.
In summary, all the flexibility offered by the EMC230x family scales to large multi-fan systems or can simply extend the number of fans in next generation systems.
Friday, August 7, 2009
SMSC, Symwave to capitalize on growth of USB 3.0
HAUPPAUGE & LAGUNA NIGUEL, USA: SMSC, a leading semiconductor provider of Smart Mixed-Signal Connectivity solutions, and Symwave Inc., a leading silicon supplier of system solutions for SuperSpeed USB devices, announced a strategic relationship with the objective to accelerate delivery of superior end-to-end USB 3.0 solutions into high volume mobile, consumer and computing segments.
Under the agreement, SMSC has made an initial cash investment of $4 million in Symwave, and SMSC’s President and CEO, Christine King, will join Symwave’s Board of Directors. As part of the relationship, SMSC has committed to an additional $1.3 million investment if required by Symwave and has obtained the right to acquire Symwave under certain conditions.
Symwave is a private semiconductor supplier headquartered in Laguna Niguel, CA, with design centers in San Diego, CA and Shenzhen, China and approximately 100 employees worldwide.
Symwave develops software-intensive high-performance analog/mixed-signal SoC solutions for rapidly emerging USB 3.0 based consumer devices including external storage, cellular phones, media players, camcorders, and digital cameras.
“Symwave has assembled a talented team and they have developed a product roadmap which is complementary to SMSC's own plans for SuperSpeed USB," said Christine King, President and CEO of SMSC.
"In addition, our relationship will give us an option to access a new segment of the USB 3.0 market, which could broaden our applications opportunity beyond PCs, personal media players and smartphones into storage."
The USB 3.0 standard, released in November 2008 is the latest technology evolution of the ubiquitous Universal Serial Bus, first introduced in 1996.
Supporting a 5 gigabit per second signaling rate, USB 3.0 delivers ten times the rate of USB 2.0, and is backward-compatible with all existing and legacy USB 2.0 ports and devices. Additionally, USB 3.0 delivers nearly double the bus powering and charging capability, improves device power management and includes significant host or PC performance improvements.
“SMSC is a recognized leader in some of the most pervasive USB applications today, with proven quality, innovation and high volume production,“ said Yossi Cohen, President and CEO of Symwave. “Collaborating with SMSC will enable Symwave to better execute on our business plan and add tremendous momentum to achieving our goals while simultaneously expanding our USB 3.0 market presence.”
Under the agreement, SMSC has made an initial cash investment of $4 million in Symwave, and SMSC’s President and CEO, Christine King, will join Symwave’s Board of Directors. As part of the relationship, SMSC has committed to an additional $1.3 million investment if required by Symwave and has obtained the right to acquire Symwave under certain conditions.
Symwave is a private semiconductor supplier headquartered in Laguna Niguel, CA, with design centers in San Diego, CA and Shenzhen, China and approximately 100 employees worldwide.
Symwave develops software-intensive high-performance analog/mixed-signal SoC solutions for rapidly emerging USB 3.0 based consumer devices including external storage, cellular phones, media players, camcorders, and digital cameras.
“Symwave has assembled a talented team and they have developed a product roadmap which is complementary to SMSC's own plans for SuperSpeed USB," said Christine King, President and CEO of SMSC.
"In addition, our relationship will give us an option to access a new segment of the USB 3.0 market, which could broaden our applications opportunity beyond PCs, personal media players and smartphones into storage."
The USB 3.0 standard, released in November 2008 is the latest technology evolution of the ubiquitous Universal Serial Bus, first introduced in 1996.
Supporting a 5 gigabit per second signaling rate, USB 3.0 delivers ten times the rate of USB 2.0, and is backward-compatible with all existing and legacy USB 2.0 ports and devices. Additionally, USB 3.0 delivers nearly double the bus powering and charging capability, improves device power management and includes significant host or PC performance improvements.
“SMSC is a recognized leader in some of the most pervasive USB applications today, with proven quality, innovation and high volume production,“ said Yossi Cohen, President and CEO of Symwave. “Collaborating with SMSC will enable Symwave to better execute on our business plan and add tremendous momentum to achieving our goals while simultaneously expanding our USB 3.0 market presence.”
Thursday, August 6, 2009
SMSC reduces power consumption of automotive infotainment
HAUPPAUGE, USA: SMSC, a leading semiconductor company that provides Smart Mixed-signal Connectivity solutions, announced the MPM85000, a low-cost, single-chip solution for power management of Media Oriented Systems Transport (MOST) devices.
Seeing the need to eliminate several discrete electronic components, SMSC’s MPM85000 combines all necessary peripheral functions to implement a MOST network interface such as diagnostics, status monitoring and power supply.
The MPM85000 offers a small footprint 4x4mm², 24-pin QFN package and can be used for all MOST speed grades and physical interfaces whether an Electrical Physical Layer (ePHY) or Optical Physical Layer (oPHY). The internal 3.3V regulator supplies power to the fiber-optical receiver (FOR) for the plastic-fiber-based oPHY interfaces.
While in sleep-mode, the MPM85000’s current can be reduced to 30uA, which fulfills today’s requirement to lower overall power consumption within a car. Additionally, the monitoring logic detects switch-to-power and wake-up events, and observes temperature and up to three configurable voltage levels. All operational states are reported to the MOST Intelligent Network Interface Controller (INIC) and to an external host controller (EHC).
SMSC’s MPM85000 includes an integrated diagnostic LIN transceiver that supports ring-break diagnosis, wake-up and diagnostics communication according to the Electrical Control Line specification (ECL).
The internal power-on-reset generator allows a save power up for the INIC, the EHC and, if used in MOST25 and MOST150 networks, also for the fiber optic transmitter (FOT). Implemented in MOST50 devices, the MPM85000 supports network activity detection on the ePHY interface for wake-up via the MOST network.
The MPM85000 focuses on the MOST-specific power management and does not include specific application power supply functionality. This makes it generically useable across all kinds of devices, independent from their specific power supply requirements regarding voltage and power.
Therefore, the IC can be used in all types of devices from small node setups such as amplifiers to complex head units.
“The MPM85000 offers a highly integrated power management solution for the infotainment network within the car,” said Stefan Lux, Product Manager for SMSC’s Automotive Information Systems product line. “Through a single-chip solution, designers of infotainment systems benefit from board space savings, shorter development times and lower cost regardless of the MOST device configuration. The end result provides designers’ an efficient, yet more robust system compared to a solution built solely on discrete components.”
Samples of the MPM85000 are available today.
Seeing the need to eliminate several discrete electronic components, SMSC’s MPM85000 combines all necessary peripheral functions to implement a MOST network interface such as diagnostics, status monitoring and power supply.
The MPM85000 offers a small footprint 4x4mm², 24-pin QFN package and can be used for all MOST speed grades and physical interfaces whether an Electrical Physical Layer (ePHY) or Optical Physical Layer (oPHY). The internal 3.3V regulator supplies power to the fiber-optical receiver (FOR) for the plastic-fiber-based oPHY interfaces.
While in sleep-mode, the MPM85000’s current can be reduced to 30uA, which fulfills today’s requirement to lower overall power consumption within a car. Additionally, the monitoring logic detects switch-to-power and wake-up events, and observes temperature and up to three configurable voltage levels. All operational states are reported to the MOST Intelligent Network Interface Controller (INIC) and to an external host controller (EHC).
SMSC’s MPM85000 includes an integrated diagnostic LIN transceiver that supports ring-break diagnosis, wake-up and diagnostics communication according to the Electrical Control Line specification (ECL).
The internal power-on-reset generator allows a save power up for the INIC, the EHC and, if used in MOST25 and MOST150 networks, also for the fiber optic transmitter (FOT). Implemented in MOST50 devices, the MPM85000 supports network activity detection on the ePHY interface for wake-up via the MOST network.
The MPM85000 focuses on the MOST-specific power management and does not include specific application power supply functionality. This makes it generically useable across all kinds of devices, independent from their specific power supply requirements regarding voltage and power.
Therefore, the IC can be used in all types of devices from small node setups such as amplifiers to complex head units.
“The MPM85000 offers a highly integrated power management solution for the infotainment network within the car,” said Stefan Lux, Product Manager for SMSC’s Automotive Information Systems product line. “Through a single-chip solution, designers of infotainment systems benefit from board space savings, shorter development times and lower cost regardless of the MOST device configuration. The end result provides designers’ an efficient, yet more robust system compared to a solution built solely on discrete components.”
Samples of the MPM85000 are available today.
Friday, July 10, 2009
SMSC to acquire Tallika design services team
HAUPPAUGE, USA: SMSC announced that it has signed an agreement to acquire Tallika Corp. (Tallika), a team of approximately 50 highly skilled engineers located in design centers in Chennai, India and Phoenix, Arizona.
This team will bring to SMSC a broad set of capabilities, including SoC and software development. The Tallika and SMSC teams have previously worked together on various projects including transceiver development, chip design and pre-silicon verification.
SMSC has agreed to pay approximately $3.4 million to purchase Tallika. The acquisition is expected to be non-dilutive and to close in August 2009.
“Tallika will play a significant role in accelerating our product roadmaps and brings a breadth of expertise in a mix of engineering disciplines including hardware, software, systems, digital design and verification/validation,” said Christine King, President & CEO of SMSC. “Adding this talented group of engineers to our strong design expertise in the US should expand our opportunities for market share growth, particularly with USB 3.0 and other connectivity solutions.”
“We are excited about the opportunity to join the talented engineers at SMSC and look ahead to many growth opportunities,” said Hemi Bhatnagar, President & CEO of Tallika Corp. “Coupling our portfolio of connectivity IP and design expertise with SMSC’s broad array of applications knowledge in the consumer, PC and automotive industries is a natural fit. Together, we expect to drive greater expansion of SMSC’s product roadmaps.”
This team will bring to SMSC a broad set of capabilities, including SoC and software development. The Tallika and SMSC teams have previously worked together on various projects including transceiver development, chip design and pre-silicon verification.
SMSC has agreed to pay approximately $3.4 million to purchase Tallika. The acquisition is expected to be non-dilutive and to close in August 2009.
“Tallika will play a significant role in accelerating our product roadmaps and brings a breadth of expertise in a mix of engineering disciplines including hardware, software, systems, digital design and verification/validation,” said Christine King, President & CEO of SMSC. “Adding this talented group of engineers to our strong design expertise in the US should expand our opportunities for market share growth, particularly with USB 3.0 and other connectivity solutions.”
“We are excited about the opportunity to join the talented engineers at SMSC and look ahead to many growth opportunities,” said Hemi Bhatnagar, President & CEO of Tallika Corp. “Coupling our portfolio of connectivity IP and design expertise with SMSC’s broad array of applications knowledge in the consumer, PC and automotive industries is a natural fit. Together, we expect to drive greater expansion of SMSC’s product roadmaps.”
Tuesday, June 30, 2009
SMSC intros I/O port expander and DTCP co-processor for MOST networks
HAUPPAUGE, USA: SMSC, a leading semiconductor company that provides smart mixed-signal Connectivity solutions, announced the OS85650 I/O companion chip for MOST intelligent network interface controllers (INICs).
With its multiple interfaces, powerful routing engine and the DTCP co-processor, the OS85650 can be used for various audio and video applications such as Head Units, Rear Seat Entertainment, Amplifiers, TV-Tuners and Video Displays.
The OS85650 works together with SMSC INICs for all MOST speed grades (MOST25, MOST50 and MOST150) and can replace many of today’s expensive FPGA solutions.
“With its expanded communication ports, this companion chip allows the INIC family to stay cost optimized in providing minimal application interfaces at a low pin count,” said Stefan Lux, Product Marketing Manager for SMSC’s Automotive group. “Together with the INIC, the OS85650 offers a complete solution for network applications, including data exchange on MOST networks.”
The primary function of the OS85650 is to route data streams simultaneously between industry standard application I/O interfaces, including MediaLB (3-Pin and 6-Pin), HBI, TSI, SPI and I²S. It is the first MediaLB 6-Pin device that supports all features of the MOST150 multimedia network.
Together with the 16 bit parallel Host Bus Interface (HBI), it enables a high-speed connection between the INIC150 and multiple External Host Controllers (EHCs) with over 300Mbit/s. It is also possible to use the OS85650 as a bridge between MediaLB 6-Pin and MediaLB 3-Pin devices.
The high-performance routing engine operates at an internal speed up to 1.5 GBit/s. It is able to route on top of the standard MOST network communication, Ethernet IP packets, multiple MPEG-TS and several high quality 7.1 audio streams.
The Digital Transmission Content Protection (DTCP) co-processor autonomously encrypts and decrypts up to eight multiple synchronous and isochronous data channels routed through the device. It includes full AKE functionality and supports both M6 and AES-128 cipher engines according to DTCP for MOST and DTCP-IP. This content protection is required for high quality audio and video content, like DVD, Blu-ray Disc and HD-Broadcasting Services.
With its multiple interfaces, powerful routing engine and the DTCP co-processor, the OS85650 can be used for various audio and video applications such as Head Units, Rear Seat Entertainment, Amplifiers, TV-Tuners and Video Displays.
The OS85650 works together with SMSC INICs for all MOST speed grades (MOST25, MOST50 and MOST150) and can replace many of today’s expensive FPGA solutions.
“With its expanded communication ports, this companion chip allows the INIC family to stay cost optimized in providing minimal application interfaces at a low pin count,” said Stefan Lux, Product Marketing Manager for SMSC’s Automotive group. “Together with the INIC, the OS85650 offers a complete solution for network applications, including data exchange on MOST networks.”
The primary function of the OS85650 is to route data streams simultaneously between industry standard application I/O interfaces, including MediaLB (3-Pin and 6-Pin), HBI, TSI, SPI and I²S. It is the first MediaLB 6-Pin device that supports all features of the MOST150 multimedia network.
Together with the 16 bit parallel Host Bus Interface (HBI), it enables a high-speed connection between the INIC150 and multiple External Host Controllers (EHCs) with over 300Mbit/s. It is also possible to use the OS85650 as a bridge between MediaLB 6-Pin and MediaLB 3-Pin devices.
The high-performance routing engine operates at an internal speed up to 1.5 GBit/s. It is able to route on top of the standard MOST network communication, Ethernet IP packets, multiple MPEG-TS and several high quality 7.1 audio streams.
The Digital Transmission Content Protection (DTCP) co-processor autonomously encrypts and decrypts up to eight multiple synchronous and isochronous data channels routed through the device. It includes full AKE functionality and supports both M6 and AES-128 cipher engines according to DTCP for MOST and DTCP-IP. This content protection is required for high quality audio and video content, like DVD, Blu-ray Disc and HD-Broadcasting Services.
Monday, June 8, 2009
SMSC launches first TrueAuto Ethernet controller
HAUPPAUGE, USA: SMSC, a leading semiconductor company that provides Smart Mixed-Signal Connectivity solutions, today launched the LAN89218, its first TrueAuto high-performance single-chip 10/100 Ethernet controller.
This device is designed specifically to meet the high reliability standards required by automotive applications such as on-board diagnostics or fast software download interfaces for central gateway and telematics modules, navigation systems, radio head units and connectivity devices.
The LAN89218 offers increased access speed for diagnostics and software downloads over traditionally slower speed interfaces typically used to interface to the vehicle today. Using the LAN89218 high-performance Ethernet interface within today's complex vehicle electrical systems packed full with user functional content can help diagnose issues faster, lower software maintenance time and ultimately bring greater satisfaction to the consumer through shorter repair times and lower cost.
The size of embedded program and data memories used in modern cars is growing rapidly. For example, the newly released BMW 7 Series has more than one GByte of memory while the previous model had just short of 100 Mbytes of memory. While repair shops usually diagnose and fix problems, they also update the software and data embedded in the various control devices inside the car.
The official access into the car for this is the On Board Diagnostics (OBD) connector. Today this standardized connector only provides a slow communication interface. Updating the software of a modern car via this interface takes hours, which significantly increases both repair times and costs.
As a result, many car companies are working on an upgrade of the OBD connector to provide the car with a high-performance data interface for diagnostics and software downloads. The candidate of choice is Ethernet. This initiative is expected to lead to a new ISO/SAE standard that mandates Ethernet as part of the OBD interface for all cars.
Ethernet is the most widely used networking technology in the corporate and repair shop IT infrastructure. Ethernet’s wide proliferation, high-bandwidth and optimized communication for bursts or packets of information make it an excellent connectivity solution for the automobile.
It can connect the external Ethernet-based infrastructure of the repair shop to a vehicle in a repair bay and move large amounts of diagnostic information and software data seamlessly between the two.
As a leading provider of embedded Ethernet products for a wide variety of consumer and industrial applications, SMSC now provides, with the LAN89218, its first TrueAuto Ethernet controller that has specifically been designed, validated, qualified, characterized and manufactured for the high reliability requirements of the car.
SMSC has been a trusted supplier for the automotive market for more than a decade. Its expertise in the design of CarNet, Media Oriented Systems Transport (MOST), Ethernet and USB connectivity allows SMSC to deliver efficient solutions for connections inside and outside of the car.
“The LAN89218 is best suited for making the car accessible to diagnostic systems because it offers a fast mechanism to transfer software into the vehicle,” said Dr. Christian Thiel, Vice President and General Manager of SMSC’s Automotive Information Systems group. “Enabling an Ethernet-based diagnostic and software maintenance entry to the vehicle can significantly reduce the time required to diagnose and fix problems while a car is being serviced.”
The LAN89218 provides a simple, parallel host bus interface to the typical automotive embedded microcontrollers used inside a car. Built into a device embedded in the car, the chip can function as a network branch to the outside world connecting the car to a personal computer, diagnostic tool or a complex Ethernet network in the repair shop.
Features of LAN89218:
* Power Management.
* Wake-on-LAN support allows network to wake-up electronics devices from sleep state.
* Multiple low-power modes.
* Built-in flow control support.
* Prevents receive memory from overflowing.
* Uses either 802.3 “PAUSE” packets or “back-pressure” (half-duplex links).
* HP Auto-MDIX support.
* Automatically ensures viable connections between LAN devices.
* Simple 16/32 bit SRAM-like interface.
* Minimizes CPU overhead.
* Driver support for multiple processors & operating systems.
Samples of the LAN89218 are available today.
This device is designed specifically to meet the high reliability standards required by automotive applications such as on-board diagnostics or fast software download interfaces for central gateway and telematics modules, navigation systems, radio head units and connectivity devices.
The LAN89218 offers increased access speed for diagnostics and software downloads over traditionally slower speed interfaces typically used to interface to the vehicle today. Using the LAN89218 high-performance Ethernet interface within today's complex vehicle electrical systems packed full with user functional content can help diagnose issues faster, lower software maintenance time and ultimately bring greater satisfaction to the consumer through shorter repair times and lower cost.
The size of embedded program and data memories used in modern cars is growing rapidly. For example, the newly released BMW 7 Series has more than one GByte of memory while the previous model had just short of 100 Mbytes of memory. While repair shops usually diagnose and fix problems, they also update the software and data embedded in the various control devices inside the car.
The official access into the car for this is the On Board Diagnostics (OBD) connector. Today this standardized connector only provides a slow communication interface. Updating the software of a modern car via this interface takes hours, which significantly increases both repair times and costs.
As a result, many car companies are working on an upgrade of the OBD connector to provide the car with a high-performance data interface for diagnostics and software downloads. The candidate of choice is Ethernet. This initiative is expected to lead to a new ISO/SAE standard that mandates Ethernet as part of the OBD interface for all cars.
Ethernet is the most widely used networking technology in the corporate and repair shop IT infrastructure. Ethernet’s wide proliferation, high-bandwidth and optimized communication for bursts or packets of information make it an excellent connectivity solution for the automobile.
It can connect the external Ethernet-based infrastructure of the repair shop to a vehicle in a repair bay and move large amounts of diagnostic information and software data seamlessly between the two.
As a leading provider of embedded Ethernet products for a wide variety of consumer and industrial applications, SMSC now provides, with the LAN89218, its first TrueAuto Ethernet controller that has specifically been designed, validated, qualified, characterized and manufactured for the high reliability requirements of the car.
SMSC has been a trusted supplier for the automotive market for more than a decade. Its expertise in the design of CarNet, Media Oriented Systems Transport (MOST), Ethernet and USB connectivity allows SMSC to deliver efficient solutions for connections inside and outside of the car.
“The LAN89218 is best suited for making the car accessible to diagnostic systems because it offers a fast mechanism to transfer software into the vehicle,” said Dr. Christian Thiel, Vice President and General Manager of SMSC’s Automotive Information Systems group. “Enabling an Ethernet-based diagnostic and software maintenance entry to the vehicle can significantly reduce the time required to diagnose and fix problems while a car is being serviced.”
The LAN89218 provides a simple, parallel host bus interface to the typical automotive embedded microcontrollers used inside a car. Built into a device embedded in the car, the chip can function as a network branch to the outside world connecting the car to a personal computer, diagnostic tool or a complex Ethernet network in the repair shop.
Features of LAN89218:
* Power Management.
* Wake-on-LAN support allows network to wake-up electronics devices from sleep state.
* Multiple low-power modes.
* Built-in flow control support.
* Prevents receive memory from overflowing.
* Uses either 802.3 “PAUSE” packets or “back-pressure” (half-duplex links).
* HP Auto-MDIX support.
* Automatically ensures viable connections between LAN devices.
* Simple 16/32 bit SRAM-like interface.
* Minimizes CPU overhead.
* Driver support for multiple processors & operating systems.
Samples of the LAN89218 are available today.
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