FLANDERS, USA: Rudolph Technologies Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, has acquired Adventa Control Technologies Inc.
Adventa provides a wide range of Advanced Process Control (APC) technologies to semiconductor manufacturers specifically for tool automation, run-to-run control, and fault detection and classification.
“We are excited about taking advantage of this opportunity to significantly expand our process control software portfolio with the complementary products from Adventa,” said Paul F. McLaughlin, chairman and chief executive officer of Rudolph. “Much like Rudolph, Adventa has an established and respected presence in the industry, with an estimated 18,000+ systems in use today.”
“By leveraging Rudolph’s worldwide sales and support organization, we will be able to introduce Adventa solutions to markets that had previously been left untapped, thus delivering a paradigmatic growth opportunity for these products, and making Rudolph a more significant supplier to our customers,” McLaughlin concluded.
“Adventa’s experience in providing competitive advanced process control solutions while maintaining profitability was a key reason for pursuing this acquisition,” said Mike Plisinski, vice president and general manager of Rudolph’s Data Analysis and Review Business Unit.
“The duration of the current down cycle in our industry has resulted in manufacturers needing to reduce the use of internal resources but at the same time improve factory profitability through the implementation of enhanced process control and automated analysis solutions. Adventa has been delivering unique solutions to device manufacturers for over 11 years. Their employees average over 15 years of experience in the development and deployment of enterprise level process control solutions.
“When combined with our expertise in process analysis software, we are well-positioned to meet the growing demand from customers for a single, financially stable, supplier of both process control and analysis technologies, which can easily integrate into their existing IT infrastructure.”
Terms of the cash transaction were not disclosed, however, Rudolph projects that revenues from the Adventa acquisition will be accretive in the first year and should more than double the revenues of the Data Analysis and Review Business Unit. According to Gartner Dataquest, this would make Rudolph the No. 2 supplier of process control software solutions for device manufacturers.
“As the semiconductor industry continues to evolve and the technologies become more complex, process control software will continue to play a critical role in the fab,” Plisinski continued. “We believe our customers see a distinct advantage in working with a profitable, global partner such as Rudolph who has clearly demonstrated the commitment and resources for next-generation process solutions. “
Rudolph is unique in providing a total process control solution to both front-end fabs, back-end packaging facilities as well as the rapidly maturing photovoltaic market.
The company’s process control software systems evaluate the overall performance of the entire manufacturing process, resulting in the opportunity for lower operating costs as well as faster and better automated decision making through a tighter integration of process control technologies and process analysis solutions.
Showing posts with label Rudolph Technologies. Show all posts
Showing posts with label Rudolph Technologies. Show all posts
Tuesday, August 4, 2009
Tuesday, June 16, 2009
Rudolph sells Explorer Inspection Cluster to memory maker
FLANDERS, USA: Rudolph Technologies Inc., a leader in process characterization solutions for the semiconductor manufacturing industry, announced the sale of its Explorer Inspection Cluster to a major memory manufacturer in Taiwan.
The Explorer is a new multi-surface inspection system designed to deliver fast, accurate and reliable macro defect inspection at a low cost of ownership.
“The order for this new product is an encouraging example of technology buys that we are beginning to see in the industry,” said Ardy Johnson, vice president of marketing at Rudolph. “While it is too early to forecast a measurable market recovery, we are excited to report orders like this one that are from market segments that have previously been at a standstill.”
The Taiwan DRAM manufacturer has ordered the Explorer ‘total solution package’ that includes the AXi940 front side inspection module, B30 backside inspection module, E30 edge inspection module, the Discover software package for inline defect analysis and data management, and TrueADC software for inline automatic defect classification.
Rudolph’s total solution not only can improve yields by performing high-speed automated inspection on the frontside of the wafer, but also is able to quickly identify edge and/or backside defects, such as cracks, chip-outs, delamination, residuals, particles and flaking.
Scott Balak, Rudolph’s all-surface inspection product manager adds: “Edge bevel inspection, in particular, is becoming more important as we move through 45nm and beyond, and especially as immersion lithography has been introduced into advanced manufacturing processes. Defects originating in non-exposure areas, including streets, partial devices and the edge of the wafer, all have the potential to create problems within the immersion environment. Edge-related processes, such as edge bead removal, need to be monitored closely to control performance and defectivity.”
The Explorer Inspection Cluster is a modular approach to wafer inspection consisting of one or more inspection modules for front, back and edge inspection. Sophisticated queue management and the option of up to four load ports helps to ensure maximum throughput and efficiency.
The improved sensitivity of the edge and backside modules permits the detection of defects down to one micron on patterned wafers. Discover is an inline defect analysis and data management system designed to seamlessly handle advanced macro frontside, edge and backside inspection results. When the E30 and B30 modules are paired with the frontside module, correlation of defect data from all surfaces provides faster more efficient response to defectivity issues.
The Explorer is a new multi-surface inspection system designed to deliver fast, accurate and reliable macro defect inspection at a low cost of ownership.
“The order for this new product is an encouraging example of technology buys that we are beginning to see in the industry,” said Ardy Johnson, vice president of marketing at Rudolph. “While it is too early to forecast a measurable market recovery, we are excited to report orders like this one that are from market segments that have previously been at a standstill.”
The Taiwan DRAM manufacturer has ordered the Explorer ‘total solution package’ that includes the AXi940 front side inspection module, B30 backside inspection module, E30 edge inspection module, the Discover software package for inline defect analysis and data management, and TrueADC software for inline automatic defect classification.
Rudolph’s total solution not only can improve yields by performing high-speed automated inspection on the frontside of the wafer, but also is able to quickly identify edge and/or backside defects, such as cracks, chip-outs, delamination, residuals, particles and flaking.
Scott Balak, Rudolph’s all-surface inspection product manager adds: “Edge bevel inspection, in particular, is becoming more important as we move through 45nm and beyond, and especially as immersion lithography has been introduced into advanced manufacturing processes. Defects originating in non-exposure areas, including streets, partial devices and the edge of the wafer, all have the potential to create problems within the immersion environment. Edge-related processes, such as edge bead removal, need to be monitored closely to control performance and defectivity.”
The Explorer Inspection Cluster is a modular approach to wafer inspection consisting of one or more inspection modules for front, back and edge inspection. Sophisticated queue management and the option of up to four load ports helps to ensure maximum throughput and efficiency.
The improved sensitivity of the edge and backside modules permits the detection of defects down to one micron on patterned wafers. Discover is an inline defect analysis and data management system designed to seamlessly handle advanced macro frontside, edge and backside inspection results. When the E30 and B30 modules are paired with the frontside module, correlation of defect data from all surfaces provides faster more efficient response to defectivity issues.
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