UK: CML Microcircuits is pleased to announce the further expansion of its engineering department.
CML Microcircuits (UK) Ltd has established a new specialist RF and mixed-signal semiconductor design team in Sheffield, England, that will operate as an extension of its existing Essex based design team.
The move will allow CML to accelerate the design and release of new products into the market.
RF has been a recent focus for CML. This new design team builds on existing foundations and will enable CML to address new opportunities in higher frequency wide band systems. CML also expects to utilise this addition of new design engineers to further its planned and existing research activities.
Mike Gurry, MD, said: "I am delighted to announce the expansion of our engineering resource. Adding this talented group of engineers to our design team will enhance our capability to meet our stated objective to define, develop and deliver high-quality, innovative semiconductor solutions to our customers."
The new teams skill base will complement and enhance CMLs capability with regard to both design experience and addressable markets.
Tuesday, April 23, 2013
Qualcomm dominates ABI Research’s LTE baseband vendor competitive assessment
USA: The market for chipsets containing LTE baseband processors has ramped up quickly, and is fraught with competition. 15 companies offer over 35 chipsets with LTE, from singlemode LTE chipsets to multimode chipsets integrated with application processors and wireless connectivity.
ABI Research’s latest Competitive Assessment ranked Qualcomm first in LTE baseband product features and other attributes, followed by ST-Ericsson and Sequans.
Qualcomm is extremely strong across the board and has the highest market share for baseband solution in handsets, resulting in a position far out in front of its competitors. ST-Ericsson has strong products on the market with competitive features. Sequans has a wide range of products, a focus on single-mode LTE that the bigger vendors do not yet address, and highly unique product offerings to address future LTE-enabled products.
The winner for Innovation was Qualcomm, with Broadcom and ST-Ericsson tied for second. Only Qualcomm has a fully integrated platform across application processor, baseband, and wireless connectivity. ST-Ericsson and Renesas Mobile have integrated solutions across application processor and baseband. All have products supporting LTE in both FDD and TDD modes, up-to-date 3GPP Release support, and differentiated products.
The winner for Implementation was Qualcomm, with Sequans in second, and Altair and GCT tied for third. Sequans, Altair, and GCT offer LTE-only solutions that enable them to compete against the established vendors who do not offer LTE-only solutions yet.
“It is curious that ST-Ericsson would be broken up just as it finally came out with highly competitive product features and was possibly the closest to competing against Qualcomm’s Snapdragon in the future across application processor, baseband processor, and wireless connectivity. In one year we expect these results to look very different given solutions coming to market, and this shift will be vital to gain traction in the exploding market for LTE devices,” commented research director Philip Solis.
ABI Research’s latest Competitive Assessment ranked Qualcomm first in LTE baseband product features and other attributes, followed by ST-Ericsson and Sequans.
Qualcomm is extremely strong across the board and has the highest market share for baseband solution in handsets, resulting in a position far out in front of its competitors. ST-Ericsson has strong products on the market with competitive features. Sequans has a wide range of products, a focus on single-mode LTE that the bigger vendors do not yet address, and highly unique product offerings to address future LTE-enabled products.
The winner for Innovation was Qualcomm, with Broadcom and ST-Ericsson tied for second. Only Qualcomm has a fully integrated platform across application processor, baseband, and wireless connectivity. ST-Ericsson and Renesas Mobile have integrated solutions across application processor and baseband. All have products supporting LTE in both FDD and TDD modes, up-to-date 3GPP Release support, and differentiated products.
The winner for Implementation was Qualcomm, with Sequans in second, and Altair and GCT tied for third. Sequans, Altair, and GCT offer LTE-only solutions that enable them to compete against the established vendors who do not offer LTE-only solutions yet.
“It is curious that ST-Ericsson would be broken up just as it finally came out with highly competitive product features and was possibly the closest to competing against Qualcomm’s Snapdragon in the future across application processor, baseband processor, and wireless connectivity. In one year we expect these results to look very different given solutions coming to market, and this shift will be vital to gain traction in the exploding market for LTE devices,” commented research director Philip Solis.
MoSys announces Macnica Americas support of GigaChip interface for high-performance chip-to-chip communications
USA: MoSys announced that Macnica Americas, a leader in semiconductor distribution and design services with expertise in design services, applications support, chip-to-chip communications protocols, and logistics, will support the GigaChip interface in its distribution and technology innovation business.
The GigaChip interface (GCI) is a scalable, high-performance, serial protocol for chip-to-chip communications that is differentiated in efficiency and reliability, resulting in system level benefits of reduced power, cost and complexity. Current implementations built with compatible CEI-11G or XFI SerDes electrical transport standards deliver up to 144 Gigabits per second (Gbps) of full duplex data throughput using 16 SerDes lanes when running at a 10G rate. A key differentiator for the GCI protocol is high transport efficiency, even for small payloads.
Alternative serial interfaces are typically less than 50 percent efficient when transferring 8 bit and 16 bit data, which means that they deliver less than half the performance at a given bandwidth. The combination of 90 percent transport efficiency, from small to large payloads, with power efficient short reach physical interconnect makes GCI ideal for co-processor, memory, or multi-chip communication.
The interface also includes CRC error detection and automatic error recovery provisions to meet the high reliability requirements of enterprise, service provider, and mission-critical communications and compute applications. GCI is an open, royalty-free interface specification designed for use with MoSys’ Bandwidth Engine family of ICs and is suitable for any chip-to-chip interconnect.
The GigaChip interface (GCI) is a scalable, high-performance, serial protocol for chip-to-chip communications that is differentiated in efficiency and reliability, resulting in system level benefits of reduced power, cost and complexity. Current implementations built with compatible CEI-11G or XFI SerDes electrical transport standards deliver up to 144 Gigabits per second (Gbps) of full duplex data throughput using 16 SerDes lanes when running at a 10G rate. A key differentiator for the GCI protocol is high transport efficiency, even for small payloads.
Alternative serial interfaces are typically less than 50 percent efficient when transferring 8 bit and 16 bit data, which means that they deliver less than half the performance at a given bandwidth. The combination of 90 percent transport efficiency, from small to large payloads, with power efficient short reach physical interconnect makes GCI ideal for co-processor, memory, or multi-chip communication.
The interface also includes CRC error detection and automatic error recovery provisions to meet the high reliability requirements of enterprise, service provider, and mission-critical communications and compute applications. GCI is an open, royalty-free interface specification designed for use with MoSys’ Bandwidth Engine family of ICs and is suitable for any chip-to-chip interconnect.
Kozio releases VTOS support for Intel's fourth generation processors
USA: Kozio Inc. announced the release of a Verification and Test OS (VTOS) for Intel's 4th generation processors, Haswell and Haswell Mobile ULT.
Haswell designs can now experience the benefits of VTOS in engineering, production and field deployment. VTOS combines over 300 functional tests, scripting, in-system programming and command line access to provide a unique and powerful solution for embedded hardware design verification and test.
VTOS can be utilized in engineering, production and the field providing a consistent and repeatable test strategy and coverage for each lifecycle phase. Engineering can accelerate the time to OS boot for new prototypes while production can address the declining structural test coverage being realized by ICT and Boundary Scan.
On the production test floor, Haswell designs can now benefit from an embedded test phase which complements ICT and Boundary Scan while improving the predictability of a successful OS boot. In the field, unnecessary and costly board returns can be avoided with a VTOS power-on self-test that can be shipped with your product.
VTOS provides a test and debug solution that supports DDR memory, processor functions (interrupt handling, timer services, etc.), UARTs, I2C devices, SPI devices, USB devices, PCI Express devices and more. Board Scan, a VTOS test capability, executes a scan detecting defective devices in a matter of seconds.
Haswell designs can now experience the benefits of VTOS in engineering, production and field deployment. VTOS combines over 300 functional tests, scripting, in-system programming and command line access to provide a unique and powerful solution for embedded hardware design verification and test.
VTOS can be utilized in engineering, production and the field providing a consistent and repeatable test strategy and coverage for each lifecycle phase. Engineering can accelerate the time to OS boot for new prototypes while production can address the declining structural test coverage being realized by ICT and Boundary Scan.
On the production test floor, Haswell designs can now benefit from an embedded test phase which complements ICT and Boundary Scan while improving the predictability of a successful OS boot. In the field, unnecessary and costly board returns can be avoided with a VTOS power-on self-test that can be shipped with your product.
VTOS provides a test and debug solution that supports DDR memory, processor functions (interrupt handling, timer services, etc.), UARTs, I2C devices, SPI devices, USB devices, PCI Express devices and more. Board Scan, a VTOS test capability, executes a scan detecting defective devices in a matter of seconds.
Camtek receives follow on order for Xact system
ISRAEL: Camtek Ltd announced that it has received an order and completed the installation of an Xact200 system - Camtek's next generation revolutionary TEM Sample Preparation System.
This is a follow on order from a previous purchase of the tool over a year ago.
Shrinking feature dimensions and advances in material complexity require a scale of analysis only possible through Transmission Electron Microscope (TEM) processes. Xact200 performs cutting-edge TEM sample preparation in line with Semiconductor and Nanotechnology roadmap requirements, for next generation physical Failure Analysis and characterization.
Roy Porat, Camtek's CEO, commented: "Camtek penetrated the Sample Preparation market with the acquisition of SELA in 2010. This order represents a milestone after over a year in which we invested a lot of efforts in improving and maturing the product. I am pleased with the progress we have made with Xact200, and look forward to seeing additional installations in the coming months."
This is a follow on order from a previous purchase of the tool over a year ago.
Shrinking feature dimensions and advances in material complexity require a scale of analysis only possible through Transmission Electron Microscope (TEM) processes. Xact200 performs cutting-edge TEM sample preparation in line with Semiconductor and Nanotechnology roadmap requirements, for next generation physical Failure Analysis and characterization.
Roy Porat, Camtek's CEO, commented: "Camtek penetrated the Sample Preparation market with the acquisition of SELA in 2010. This order represents a milestone after over a year in which we invested a lot of efforts in improving and maturing the product. I am pleased with the progress we have made with Xact200, and look forward to seeing additional installations in the coming months."
Alpha and Omega Semiconductor expands family of EZBuck regulators featuring COT control architecture
USA: Alpha and Omega Semiconductor Ltd (AOS) has released the AOZ1237, the latest addition to a family of high-efficiency, easy-to-use synchronous EZBuck regulators featuring a proprietary Constant On-Time (COT) control architecture that enables smaller solutions and simplifies designs.
The AOZ1237 provides the perfect solution for next generation computing chipsets that are pushing the limits of DC/DC converter size; such as those in the latest notebook PCs, Ultrabooks, graphics cards, servers, data storage systems, and high-end smart TVs.
Power supplies which traditionally used DC/DC controller ICs with external MOSFETs are now requiring more integrated solutions to fit within the smaller printed circuit board (PCB) area. AOS's low on-resistance MOSFET technology combined with advanced packaging technology enables high performance DC/DC regulators in small package sizes.
The AOZ1237 provides 8A of continuous output current in a 4x4mm QFN package, while operating over a wide input voltage range of 2.7V to 24V. This new device can provide higher performance with minimal power consumption, making it an ideal solution for system designers who want to reduce the PCB area and total system size without hindering performance. The proprietary COT architecture provides ultra-fast load transient response performance and allows stable and low voltage ripple operation with small size ceramic capacitors.
Competing solutions require several external components when using all ceramic capacitors and need to generate a larger output ripple voltage to stabilize the circuit. Additionally, the input feed forward feature of AOZ1237 provides a constant switching frequency over the entire input voltage range, which further alleviates noise concerns for designers.
The AOZ1237 provides the perfect solution for next generation computing chipsets that are pushing the limits of DC/DC converter size; such as those in the latest notebook PCs, Ultrabooks, graphics cards, servers, data storage systems, and high-end smart TVs.
Power supplies which traditionally used DC/DC controller ICs with external MOSFETs are now requiring more integrated solutions to fit within the smaller printed circuit board (PCB) area. AOS's low on-resistance MOSFET technology combined with advanced packaging technology enables high performance DC/DC regulators in small package sizes.
The AOZ1237 provides 8A of continuous output current in a 4x4mm QFN package, while operating over a wide input voltage range of 2.7V to 24V. This new device can provide higher performance with minimal power consumption, making it an ideal solution for system designers who want to reduce the PCB area and total system size without hindering performance. The proprietary COT architecture provides ultra-fast load transient response performance and allows stable and low voltage ripple operation with small size ceramic capacitors.
Competing solutions require several external components when using all ceramic capacitors and need to generate a larger output ripple voltage to stabilize the circuit. Additionally, the input feed forward feature of AOZ1237 provides a constant switching frequency over the entire input voltage range, which further alleviates noise concerns for designers.
M2M Forum explores MEMS' connection to future of medical devices
USA: MEMS Industry Group (MIG), a global industry organization with more than 140 member-companies and partners, will welcome micro-electromechanical systems (MEMS), medical industry and academic experts to Cambridge, Mass. for Member-to-Member (M2M) Forum® 2013, a conference on the MEMS connection to advancements in healthcare, medical and biomedical applications.
“Tiny, intelligent MEMS sensors—more popularly known for enhancing the user experience with smartphones, tablets and video game controllers—are improving medical technology in dramatic ways. From wearable and implantable drug-delivery systems to remote patient monitoring for diabetes and heart disease, medical researchers and technologists are collaborating on new applications that will improve patients’ health and quality of life in myriad ways,” said Karen Lightman, executive director, MEMS Industry Group.
“This year we are bringing M2M Forum, our annual members’ technical conference, to Cambridge, the very heart of innovation in biomedical/medical research and technology. M2M Forum gives attendees a rare glimpse into the opportunities and challenges affecting the entire MEMS supply chain as they integrate MEMS into biomedical/medical devices.”
Complete development tools platform further simplifies MCU design process
DESIGN WEST, USA: Atmel Corp. has further simplified the MCU design process with the launch of its integrated development tools platform, a complete hardware and software platform specifically designed to support Atmel MCUs and its recently shipping ARM Cortex-M4-based SAM4L family.
As software design continues to become more complex in today's embedded hardware designs, and is increasingly used to differentiate end-customer products, complete solutions that provide designers with all the necessary tools and embedded software becomes more critical.
Even more, as design cycles continue to be shortened, complete tool platforms that are fully integrated and seamless to use becomes more vital—and MCU vendors must think beyond the chip. With Atmel's tools platform, design engineers can quickly evaluate Atmel MCUs and bring their products quickly to market.
Specifically tailored to allow developers to take advantage of Atmel's MCU features, including the recently shipping SAM4L ARM Cortex-M4-based family, the new platform consists of hardware and development tools, embedded software and an embedded 'app' store:
* Atmel Xplained Pro
* Atmel Studio 6
* Atmel Software Framework
* Atmel Gallery.
With Atmel's Xplained Pro evaluation kit, designers have an easy-to-use, flexible and low-cost out-of-the-box board that includes an Atmel MCU, embedded debugger, and connectors for extension boards.
When designers plug the Xplained board into their system, they can pull-up Atmel Studio 6 and Atmel Software Framework with over 2,000 ready-to-run project examples. Atmel Gallery, which is fully integrated into Studio 6, allows embedded designers to pull up a comprehensive development App Store to download third party extensions and plug-ins for their projects.
As software design continues to become more complex in today's embedded hardware designs, and is increasingly used to differentiate end-customer products, complete solutions that provide designers with all the necessary tools and embedded software becomes more critical.
Even more, as design cycles continue to be shortened, complete tool platforms that are fully integrated and seamless to use becomes more vital—and MCU vendors must think beyond the chip. With Atmel's tools platform, design engineers can quickly evaluate Atmel MCUs and bring their products quickly to market.
Specifically tailored to allow developers to take advantage of Atmel's MCU features, including the recently shipping SAM4L ARM Cortex-M4-based family, the new platform consists of hardware and development tools, embedded software and an embedded 'app' store:
* Atmel Xplained Pro
* Atmel Studio 6
* Atmel Software Framework
* Atmel Gallery.
With Atmel's Xplained Pro evaluation kit, designers have an easy-to-use, flexible and low-cost out-of-the-box board that includes an Atmel MCU, embedded debugger, and connectors for extension boards.
When designers plug the Xplained board into their system, they can pull-up Atmel Studio 6 and Atmel Software Framework with over 2,000 ready-to-run project examples. Atmel Gallery, which is fully integrated into Studio 6, allows embedded designers to pull up a comprehensive development App Store to download third party extensions and plug-ins for their projects.
RDA Microelectronics announces Bluetooth design win with Sunplus for automotive DVD systems
CHINA: RDA Microelectronics Inc. announced that Sunplus Technology Co. Ltd has selected the RDA5876A integrated Bluetooth solution to include on its reference design for its latest products for in-car DVD systems.
Based in Taiwan, Sunplus is a leading provider of multimedia IC solutions for DVD players, portable DVD players, car DVD/CD players and HD set-top-boxes. The SPHE8202G-B and SPHE8202VGQ-B in-car DVD products integrate DSP for echo cancellation and noise reduction with Bluetooth function, which were released to customers at the Hong Kong Electronics Fair, Asia's largest electronics fair, held from April 13-16, 2013.
The RDA5876 family of ICs integrates industry-leading Bluetooth and FM radio tuner functions into one chip. The chip's Bluetooth and FM functions can work simultaneously and independently with low power
consumption levels. The CMOS IC comes in a compact 4x4mm 32-pin QFN package to minimize required board space and customer cost. The RDA5876 is designed to easily integrate into customer products and enable rapid time to market.
Based in Taiwan, Sunplus is a leading provider of multimedia IC solutions for DVD players, portable DVD players, car DVD/CD players and HD set-top-boxes. The SPHE8202G-B and SPHE8202VGQ-B in-car DVD products integrate DSP for echo cancellation and noise reduction with Bluetooth function, which were released to customers at the Hong Kong Electronics Fair, Asia's largest electronics fair, held from April 13-16, 2013.
The RDA5876 family of ICs integrates industry-leading Bluetooth and FM radio tuner functions into one chip. The chip's Bluetooth and FM functions can work simultaneously and independently with low power
consumption levels. The CMOS IC comes in a compact 4x4mm 32-pin QFN package to minimize required board space and customer cost. The RDA5876 is designed to easily integrate into customer products and enable rapid time to market.
LineStream's SpinTAC software powers TI's InstaSPIN-MOTION technology
USA: LineStream Technologies, an innovator of software-based motor control solutions, has collaborated with Texas Instruments Inc.(TI) to launch InstaSPIN-MOTION, the performance pinnacle of TI's InstaSPIN family.
Powered by LineStream's SpinTAC software, InstaSPIN-MOTION streamlines the design process and improves system performance of motor-controlled products ranging from washing machines to medical robots.
"Software is increasingly becoming a differentiator for our products, especially in the vast and growing motor control segment," said Scott Roller, VP of Microcontrollers for Texas Instruments. "Partnering with LineStream Technologies has allowed us to remain at the vanguard of this trend and to deliver to the market the industry's most advanced motor control suite."
InstaSPIN-MOTION will help OEMs accelerate time-to-market, cut design costs, and improve the performance of their products. The comprehensive software solution is embedded on TI's 32-bit C2000 Piccolo microcontrollers (MCUs) and features optimized motion profiling, single-parameter tuning, and a disturbance-rejecting controller.
"With InstaSPIN-MOTION, TI is eliminating the time-intensive design processes and performance limitations that have hindered motor system engineers for decades," said David Neundorfer, CEO of LineStream. "Our embedded technology enables step change improvements for the motor control industry."
InstaSPIN-MOTION solves several longstanding inefficiencies in motor control design and implementation. The SpinTAC-powered solution enables engineers to define complex motion sequences in minutes and tune their systems with minimal effort—a process that normally takes 10 to 12 weeks.
Built upon a platform of sensorless field oriented control (FOC), InstaSPIN-MOTION reduces system costs and improves operation by eliminating the need for a mechanical motor rotor sensor. Once deployed, InstaSPIN-MOTION delivers and sustains optimal motor performance, regardless of speed fluctuations or disturbances.
Powered by LineStream's SpinTAC software, InstaSPIN-MOTION streamlines the design process and improves system performance of motor-controlled products ranging from washing machines to medical robots.
"Software is increasingly becoming a differentiator for our products, especially in the vast and growing motor control segment," said Scott Roller, VP of Microcontrollers for Texas Instruments. "Partnering with LineStream Technologies has allowed us to remain at the vanguard of this trend and to deliver to the market the industry's most advanced motor control suite."
InstaSPIN-MOTION will help OEMs accelerate time-to-market, cut design costs, and improve the performance of their products. The comprehensive software solution is embedded on TI's 32-bit C2000 Piccolo microcontrollers (MCUs) and features optimized motion profiling, single-parameter tuning, and a disturbance-rejecting controller.
"With InstaSPIN-MOTION, TI is eliminating the time-intensive design processes and performance limitations that have hindered motor system engineers for decades," said David Neundorfer, CEO of LineStream. "Our embedded technology enables step change improvements for the motor control industry."
InstaSPIN-MOTION solves several longstanding inefficiencies in motor control design and implementation. The SpinTAC-powered solution enables engineers to define complex motion sequences in minutes and tune their systems with minimal effort—a process that normally takes 10 to 12 weeks.
Built upon a platform of sensorless field oriented control (FOC), InstaSPIN-MOTION reduces system costs and improves operation by eliminating the need for a mechanical motor rotor sensor. Once deployed, InstaSPIN-MOTION delivers and sustains optimal motor performance, regardless of speed fluctuations or disturbances.
Microchip brings integrated op amps to low-cost 8-bit PIC MCUs
USA: Microchip Technology Inc. has announced two new 8-bit PIC microcontrollers—the PIC16F527 and PIC16F570, which combine the ease of use of a PIC MCU with low-cost analog peripherals to create a well-integrated, cost-effective family suitable for a wide range of applications.
With an on-chip dual Op Amp module, 8-bit ADC and two comparators, these MCUs are ideal for systems that require signal conditioning and amplification to interpret analog inputs.
The PIC16F527 and PIC16F570 employ a small and highly efficient 8-bit architecture, and add several features to support ease of use and system robustness. The all-new hardware interrupt capability gives designers the freedom to implement more complex functions without adding software overhead, while an integrated Brown-Out Reset (BOR) can detect faults in system power and safely reset the MCU to avoid memory corruption.
The two MCUs also feature self-read/write program Flash memory, which allows for high-use data EEPROM functionality. These key features, along with the integration of commonly used analog peripherals, make the PIC16F527 and PIC16F570 well suited for a number of low-cost sensor products, such as smoke detectors, carbon-monoxide detectors, photo sensors and automotive sensor-interface modules.
“At less than $0.39 in high volume, these two new MCUs represent tremendous value in the 8-bit marketplace,” said Steve Drehobl, VP of Microchip’s MCU8 Division.
With an on-chip dual Op Amp module, 8-bit ADC and two comparators, these MCUs are ideal for systems that require signal conditioning and amplification to interpret analog inputs.
The PIC16F527 and PIC16F570 employ a small and highly efficient 8-bit architecture, and add several features to support ease of use and system robustness. The all-new hardware interrupt capability gives designers the freedom to implement more complex functions without adding software overhead, while an integrated Brown-Out Reset (BOR) can detect faults in system power and safely reset the MCU to avoid memory corruption.
The two MCUs also feature self-read/write program Flash memory, which allows for high-use data EEPROM functionality. These key features, along with the integration of commonly used analog peripherals, make the PIC16F527 and PIC16F570 well suited for a number of low-cost sensor products, such as smoke detectors, carbon-monoxide detectors, photo sensors and automotive sensor-interface modules.
“At less than $0.39 in high volume, these two new MCUs represent tremendous value in the 8-bit marketplace,” said Steve Drehobl, VP of Microchip’s MCU8 Division.
Altera announces availability of Cyclone V SoC development kit
HONG KONG: Altera Corp. announced the availability of its Cyclone V SoC Development Kit, a development platform that enables hardware and software developers to accelerate their embedded systems design development.
Developed in collaboration with ARM, this kit features the recently announced ARM Development Studio 5 (DS-5) Altera Edition Toolkit software, the industry’s only FPGA-adaptive debugging software that enables designers to view the processor and FPGA portions of the device simultaneously.
The Cyclone V SoC Development Kit features the Cyclone V SX SoC with an 800 MHz dual-core ARM Cortex-A9 processor, 110K logic elements (LEs) of logic density, 3.125 Gbps transceivers, PCI Express (PCIe) rootport and endpoint support, and DDR3 memory for both the FPGA and hard processor system via hardened memory controllers.
The Altera SoC Embedded Design Suite (EDS) features the ARM DS-5 Altera Edition Toolkit that removes the debugging barrier between the integrated dual-core processor subsystem and FPGA fabric in Altera SoCs. By combining the most advanced multicore debugger for the ARM architecture with the ability to adapt to the logic contained in the FPGA, the new toolkit provides embedded software developers an unprecedented level of full-chip visibility and control through the standard DS-5 user interface.
An integrated USB-Blaster probe supports both FPGA and processor download and debug through the use of a single probe. An on-board MICTOR connector supports connection to other popular debug probes, such as the Lauterbach TRACE32 and ARM DSTREAM probes.
The kit includes a broad set of memories, peripherals, and interfaces, as well as a high-speed mezzanine connector (HSMC). The HSMC allows daughtercards to be added, extending system capabilities for a wide range of applications, including motor control, automotive driver assistance, and video surveillance. Two on-board Ethernet PHYs are provided that support all the top industrial networking protocols, including EtherCAT, PROFINET and EtherNet/IP.
The Altera Cyclone V SoC Development Kit is available for ordering now at $1,595 with production shipments in May 2013. Hardware development is supported in Quartus II Subscription and Web Editions, starting with the soon-to-be released Quartus II software version 13.0.
The SoC EDS v13.0 provides a complete set of software development tools and is available in two editions: Subscription Edition and the free Web Edition.
The Cyclone V SoC Development Kit features the Cyclone V SX SoC with an 800 MHz dual-core ARM Cortex-A9 processor, 110K logic elements (LEs) of logic density, 3.125 Gbps transceivers, PCI Express (PCIe) rootport and endpoint support, and DDR3 memory for both the FPGA and hard processor system via hardened memory controllers.
The Altera SoC Embedded Design Suite (EDS) features the ARM DS-5 Altera Edition Toolkit that removes the debugging barrier between the integrated dual-core processor subsystem and FPGA fabric in Altera SoCs. By combining the most advanced multicore debugger for the ARM architecture with the ability to adapt to the logic contained in the FPGA, the new toolkit provides embedded software developers an unprecedented level of full-chip visibility and control through the standard DS-5 user interface.
An integrated USB-Blaster probe supports both FPGA and processor download and debug through the use of a single probe. An on-board MICTOR connector supports connection to other popular debug probes, such as the Lauterbach TRACE32 and ARM DSTREAM probes.
The kit includes a broad set of memories, peripherals, and interfaces, as well as a high-speed mezzanine connector (HSMC). The HSMC allows daughtercards to be added, extending system capabilities for a wide range of applications, including motor control, automotive driver assistance, and video surveillance. Two on-board Ethernet PHYs are provided that support all the top industrial networking protocols, including EtherCAT, PROFINET and EtherNet/IP.
The Altera Cyclone V SoC Development Kit is available for ordering now at $1,595 with production shipments in May 2013. Hardware development is supported in Quartus II Subscription and Web Editions, starting with the soon-to-be released Quartus II software version 13.0.
The SoC EDS v13.0 provides a complete set of software development tools and is available in two editions: Subscription Edition and the free Web Edition.
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