USA: Texas Instruments Inc. (TI) announced that its SafeTI functional safety hardware development process is now certified as suitable for development of ISO 26262 and IEC 61508 compliant components.
TI achieved this process certification from TUV SUD, an internationally recognized and accredited independent assessor of compliance to quality, safety, and security standards. The certificate demonstrates TI's commitment to have a process suitable for developing hardware components that are compliant to ISO 26262 and IEC 61508.
Announced last year, SafeTI functional safety design packages help TI's customers manage both systematic and random failures, so they can design their functional safety systems.
SafeTI design packages help customers comply with international functional safety standards such as ISO 26262 and IEC 61508 for applications in transportation, industrial, medical, railway and other areas where functional safety is important.
Thursday, March 21, 2013
Broadcom announces breakthrough cable HD STB solutions
CHINA: Broadcom Corp. has announced the industry's first low cost, high definition (HD) digital cable set-top box SoCs with integrated Full-Band Capture and IP video server technology.
Broadcom's BCM7583 and BCM7584 devices provide entry-level HD and HD-DVR platforms for cable MSOs with features that facilitate internet video streaming capabilities to multiple video devices simultaneously.
By integrating a complete single chip solution with a high-performance CPU, 3D graphics and Full-Band Capture technologies, the BCM7583 and BCM7584 enable operators throughout the world to provide cost effective and advanced video experiences to subscribers.
Broadcom's new STB SoCs also provide state-of-the-art Conditional Access (CA) and Digital Rights Management (DRM) security, enabling the conversion of content from CA to an IP-DRM streaming content to protect the rights of content providers.
"Broadcom's innovative new CATV SoC technology digitizes the entire cable spectrum, delivering multi-screen user experiences in a cost-optimized HD cable mini-server platform," said Dan Marotta , Broadcom's executive VP and GM, Broadband Communications Group.
"Global operators can now effectively compete against IP and OTT service providers with a high-performance yet lower cost platform that combines the very latest industry technologies in an entry-level solution."
Broadcom will be demonstrating the BCM7583 and BCM7584 cable set-top box solution at CCBN in booth #3201.
Broadcom's BCM7583 and BCM7584 devices provide entry-level HD and HD-DVR platforms for cable MSOs with features that facilitate internet video streaming capabilities to multiple video devices simultaneously.
By integrating a complete single chip solution with a high-performance CPU, 3D graphics and Full-Band Capture technologies, the BCM7583 and BCM7584 enable operators throughout the world to provide cost effective and advanced video experiences to subscribers.
Broadcom's new STB SoCs also provide state-of-the-art Conditional Access (CA) and Digital Rights Management (DRM) security, enabling the conversion of content from CA to an IP-DRM streaming content to protect the rights of content providers.
"Broadcom's innovative new CATV SoC technology digitizes the entire cable spectrum, delivering multi-screen user experiences in a cost-optimized HD cable mini-server platform," said Dan Marotta , Broadcom's executive VP and GM, Broadband Communications Group.
"Global operators can now effectively compete against IP and OTT service providers with a high-performance yet lower cost platform that combines the very latest industry technologies in an entry-level solution."
Broadcom will be demonstrating the BCM7583 and BCM7584 cable set-top box solution at CCBN in booth #3201.
SRC, UCLA and ERC utilize atomic layer etch analysis to accelerate development of green chemistries
USA: Researchers sponsored by Semiconductor Research Corp. (SRC), the world's leading university-research consortium for semiconductors and related technologies, announced development of a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used perfluorocarbon (PFC) gases.
The novel approach under way at the University of California, Los Angeles (UCLA) will identify and evaluate green plasma chemistries for processing emerging memory/logic devices and through-silicon-via (TSV)-enabled technologies for the semiconductor industry.
In order to continue the advancement of transistor and memory cell performance, the research will focus on several promising new materials that have been introduced for future generations of integrated circuits (ICs). To exploit this opportunity, the industry requires new and effective etch processes with which to pattern the next-generation fabrics.
The aim of the UCLA research effort within the SRC-funded Engineering Research Center for Environmentally Benign Semiconductor Manufacturing (ERC) is to identify environmentally friendly chemistry for patterning materials in IC fabrication and verify their performance to be equal to, or greater than, current state-of-art plasma chemistries.
The unique performance characteristics required for advanced devices and technologies dictates the use of certain materials and corresponding aggressive etch chemistries. Next-generation processes will benefit from chemicals that are more benign, less hazardous and more efficiently utilized.
The advanced modeling approach developed by UCLA will predict emissions from plasma processes and assess the effectiveness of non-PFC etch chemistries compared to those using PFC gases. While historically PFC gases have been an enabling component of semiconductor manufacturing, the industry continues to aggressively pursue and implement PFC replacement and abatement strategies. The UCLA research will greatly assist and accelerate this industry effort.
The novel approach under way at the University of California, Los Angeles (UCLA) will identify and evaluate green plasma chemistries for processing emerging memory/logic devices and through-silicon-via (TSV)-enabled technologies for the semiconductor industry.
In order to continue the advancement of transistor and memory cell performance, the research will focus on several promising new materials that have been introduced for future generations of integrated circuits (ICs). To exploit this opportunity, the industry requires new and effective etch processes with which to pattern the next-generation fabrics.
The aim of the UCLA research effort within the SRC-funded Engineering Research Center for Environmentally Benign Semiconductor Manufacturing (ERC) is to identify environmentally friendly chemistry for patterning materials in IC fabrication and verify their performance to be equal to, or greater than, current state-of-art plasma chemistries.
The unique performance characteristics required for advanced devices and technologies dictates the use of certain materials and corresponding aggressive etch chemistries. Next-generation processes will benefit from chemicals that are more benign, less hazardous and more efficiently utilized.
The advanced modeling approach developed by UCLA will predict emissions from plasma processes and assess the effectiveness of non-PFC etch chemistries compared to those using PFC gases. While historically PFC gases have been an enabling component of semiconductor manufacturing, the industry continues to aggressively pursue and implement PFC replacement and abatement strategies. The UCLA research will greatly assist and accelerate this industry effort.
TowerJazz and Avago expand strategic collaboration
OFC/NFOEC 2013, USA: TowerJazz and Avago Technologies, a leading supplier of analog interface components for wireless, wireline, and industrial applications, have announced an expanded strategic collaboration focusing on Avago’s next generation products using TowerJazz’s industry leading SiGe BiCMOS technology platform.
Continued collaboration shall enable Avago Fiber Optic Products Division (FOPD) to achieve the stringent technical specifications and meet cost and performance requirements for optical networking markets while helping TowerJazz to define and develop its next-generation process technologies.
The technology collaboration between TowerJazz and Avago FOPD has resulted in Avago’s recent successful launch of the Gen4SR product, a 10Gbps small form factor pluggable optical transceiver (SFP) for short reach applications.
By collaborating with TowerJazz, Avago has unlimited access to TowerJazz’s optimized SiGe BiCMOS technology based on both the SBC18H2 process with transistor speeds of 200GHz and H3 process with transistor speeds of 280GHz together with mixed-signal CMOS.
Continued collaboration shall enable Avago Fiber Optic Products Division (FOPD) to achieve the stringent technical specifications and meet cost and performance requirements for optical networking markets while helping TowerJazz to define and develop its next-generation process technologies.
The technology collaboration between TowerJazz and Avago FOPD has resulted in Avago’s recent successful launch of the Gen4SR product, a 10Gbps small form factor pluggable optical transceiver (SFP) for short reach applications.
By collaborating with TowerJazz, Avago has unlimited access to TowerJazz’s optimized SiGe BiCMOS technology based on both the SBC18H2 process with transistor speeds of 200GHz and H3 process with transistor speeds of 280GHz together with mixed-signal CMOS.
MIPS multi-threaded CPUs from Imagination push performance to new levels for Altair's LTE chipsets
USA: Imagination Technologies announced that two new baseband processors from Altair Semiconductor, a leading developer of high performance, single-mode LTE chipsets, are powered by MIPS CPU cores from Imagination.
Altair's new FourGee-3800 and FourGee-3802 processors are built on the architecture of Altair's MIPS-Based Verizon-Certified FourGee-3100/6200 chipset, with enhanced features and increased performance, supporting the newest LTE standards.
Multi-threading technology within the chips enables better overall throughput, quality of service (QoS), and power/performance efficiency.
The new chipsets each include multiple multi-threaded MIPS cores controlling various functions, including the high-performance 700MHz network processor subsystem.
With ultra-low active and idle power consumption, the latest LTE features and functionality and a broad set of host and peripheral interfaces, the new Altair chipsets are designed to support a range of applications including smartphones, tablets, mobile hotspots, routers and M2M. Multi-threading technology can be a particular advantage in balancing cost, performance and power for these devices, boosting performance where multiple latency-sensitive tasks must be handled simultaneously.
Altair's new FourGee-3800 and FourGee-3802 processors are built on the architecture of Altair's MIPS-Based Verizon-Certified FourGee-3100/6200 chipset, with enhanced features and increased performance, supporting the newest LTE standards.
Multi-threading technology within the chips enables better overall throughput, quality of service (QoS), and power/performance efficiency.
The new chipsets each include multiple multi-threaded MIPS cores controlling various functions, including the high-performance 700MHz network processor subsystem.
With ultra-low active and idle power consumption, the latest LTE features and functionality and a broad set of host and peripheral interfaces, the new Altair chipsets are designed to support a range of applications including smartphones, tablets, mobile hotspots, routers and M2M. Multi-threading technology can be a particular advantage in balancing cost, performance and power for these devices, boosting performance where multiple latency-sensitive tasks must be handled simultaneously.
Microchip's Graphics Display Designer X supports PIC MCU-based GUI creation on Windows, Linux or Mac computers
USA: Microchip Technology Inc. announced the release of Graphics Display Designer X (GDD X), Microchip's enhanced visual design tool that provides a quick and easy way of creating Graphical User Interface (GUI) screens for applications using Microchip's 16-or 32-bit PIC MCUs.
With GDD X, developers have the freedom to work in the environment of their choice, including Windows, Linux or Mac OS operating systems.
Graphical user interfaces are found in a wide range of products today from coffeemakers to automotive dashboards. While the requirement is becoming commonplace, there is a lack of cost-effective tools available to the developer. Placing dialog boxes, guidance text, buttons, sliders, dials and other elements of your GUI while determining colours and calculating x/y coordinates can be very time consuming.
GDD X enables the development of GUIs in a "What You See Is What You Get" (WYSIWYG) environment, and saves valuable design time by automatically generating the C code needed for the user interface. With GDD X, a highly effective GUI can be created to improve the customer experience for applications in the automotive, (e.g., numeric, gauge or infotainment displays), industrial (e.g., operator touch-screen interfaces), home-appliance (e.g., coffeemakers, refrigerators, cook tops, microwave ovens); consumer-electronics (e.g., home automation, alarms and learning toys) and medical markets (e.g., bedside monitoring or medical lab analysis equipment).
GDD X enables development using Microchip's Graphics Library, and can be used as a stand-alone tool or as a plug-in to Microchip's free MPLAB® X Integrated Development Environment (IDE). It allows the creation of a project with configurable display resolution, and imports all the required driver/board support files into MPLAB X. Generated code can be compiled and tested on hardware.
Key improvements to the original GDD include: thumbnail view of screens and snap-to-grid feature, cut/copy/paste, auto object align, and event handling, as well as palette support for 1-, 4-, and 8-bits-per-pixel (bpp) color modes.
"With GDD X, Microchip is bringing together key components of the graphical user interface on 16-and 32-bit hardware platforms in an easy-to-use-graphics development tool," said Sumit Mitra, VP of Microchip's MCU32 Division. "Developers can drag and drop GUI elements into place, and GDD X creates the C code for their project. This saves a significant amount of development time."
With GDD X, developers have the freedom to work in the environment of their choice, including Windows, Linux or Mac OS operating systems.
Graphical user interfaces are found in a wide range of products today from coffeemakers to automotive dashboards. While the requirement is becoming commonplace, there is a lack of cost-effective tools available to the developer. Placing dialog boxes, guidance text, buttons, sliders, dials and other elements of your GUI while determining colours and calculating x/y coordinates can be very time consuming.
GDD X enables the development of GUIs in a "What You See Is What You Get" (WYSIWYG) environment, and saves valuable design time by automatically generating the C code needed for the user interface. With GDD X, a highly effective GUI can be created to improve the customer experience for applications in the automotive, (e.g., numeric, gauge or infotainment displays), industrial (e.g., operator touch-screen interfaces), home-appliance (e.g., coffeemakers, refrigerators, cook tops, microwave ovens); consumer-electronics (e.g., home automation, alarms and learning toys) and medical markets (e.g., bedside monitoring or medical lab analysis equipment).
GDD X enables development using Microchip's Graphics Library, and can be used as a stand-alone tool or as a plug-in to Microchip's free MPLAB® X Integrated Development Environment (IDE). It allows the creation of a project with configurable display resolution, and imports all the required driver/board support files into MPLAB X. Generated code can be compiled and tested on hardware.
Key improvements to the original GDD include: thumbnail view of screens and snap-to-grid feature, cut/copy/paste, auto object align, and event handling, as well as palette support for 1-, 4-, and 8-bits-per-pixel (bpp) color modes.
"With GDD X, Microchip is bringing together key components of the graphical user interface on 16-and 32-bit hardware platforms in an easy-to-use-graphics development tool," said Sumit Mitra, VP of Microchip's MCU32 Division. "Developers can drag and drop GUI elements into place, and GDD X creates the C code for their project. This saves a significant amount of development time."
ST and SoftAtHome demo secure, high-quality platform for multi-screen digital services
SWITZERLAND & FRANCE: STMicroelectronics and SoftAtHome, a provider of home operating platforms enabling operators to deliver convergent services for the digital home, have successfully demonstrated a client/server solution that will allow service providers to reach extra screens with optimal user experience in subscribers' homes via a single, managed connection.
Taking advantage of ST's set-top box IC portfolio, which covers a broad range of performance and features for applications from gateway/server devices to low-cost zapper boxes, the solution allows an entry-level client such as a mini-box or HDMI dongle connected to a secondary television or PC to receive operator services via the main home gateway.
Built upon ST's competitively priced STiH205, the client device supports higher video quality than other types of devices such as mobiles, and provides a secure platform for conditional-access services.
The STiH416 system-on-chip powering the server/gateway is the world's highest performing set-top box IC, which supports high-speed decoding and transcoding to deliver outstanding user experiences to any home client. The SoftAtHome software platform enables operator services to present a consistent look and feel across multiple screens. Moreover, the use of industry-standard protocols such as DLNA, CVP and RUI frees operators from the constraints of proprietary solutions.
SoftAtHome's unique software platform for CPEs enables the best of PayTV and OTT (Over-The-Top) services to be merged into a unified Service Provider experience on any connected screen. SoftAtHome has ported its software across ST's full portfolio of connected-home system-on-chip ICs, allowing operators worldwide to leverage the SoftAtHome Operating Platform (SOP5) to deliver innovative services to their customers.
Today's subscribers are increasingly consuming services via multiple devices such as smartphones, tablets, PCs, game consoles and secondary televisions throughout the home. Operators need to be able to reach all of these screens, via their own managed networks, to deliver the full service portfolio and ensure quality of service and optimal quality of experience.
Taking advantage of ST's set-top box IC portfolio, which covers a broad range of performance and features for applications from gateway/server devices to low-cost zapper boxes, the solution allows an entry-level client such as a mini-box or HDMI dongle connected to a secondary television or PC to receive operator services via the main home gateway.
Built upon ST's competitively priced STiH205, the client device supports higher video quality than other types of devices such as mobiles, and provides a secure platform for conditional-access services.
The STiH416 system-on-chip powering the server/gateway is the world's highest performing set-top box IC, which supports high-speed decoding and transcoding to deliver outstanding user experiences to any home client. The SoftAtHome software platform enables operator services to present a consistent look and feel across multiple screens. Moreover, the use of industry-standard protocols such as DLNA, CVP and RUI frees operators from the constraints of proprietary solutions.
SoftAtHome's unique software platform for CPEs enables the best of PayTV and OTT (Over-The-Top) services to be merged into a unified Service Provider experience on any connected screen. SoftAtHome has ported its software across ST's full portfolio of connected-home system-on-chip ICs, allowing operators worldwide to leverage the SoftAtHome Operating Platform (SOP5) to deliver innovative services to their customers.
Today's subscribers are increasingly consuming services via multiple devices such as smartphones, tablets, PCs, game consoles and secondary televisions throughout the home. Operators need to be able to reach all of these screens, via their own managed networks, to deliver the full service portfolio and ensure quality of service and optimal quality of experience.
Daimler streamlines flagship truck development with Mentor’s Capital electrical design software
USA: Mentor Graphics Corp. and Mercedes-Benz Trucks announced successful application of the Mentor Capital software suite to the development of Daimler’s flagship heavy truck, the new Actros.
Branded “trucks you can trust”, the Actros includes innovative electrical/electronic systems that significantly boost efficiency, safety, and reliability. The sophisticated nature of these systems drives challenges for the truck’s electrical design, particularly with respect to systems integration, design validation and configuration management. To solve these challenges, the Germany-based company used the Capital tools, extending Mentor Graphics software deployment to now span three continents.
“To develop such an advanced truck requires not only powerful design automation, but also robust design data management,” said Wolfgang Appel, senior manager, system architecture, Mechatronic Engineering, Mercedes-Benz Trucks.
“Capital was the natural tool choice because it is so strong in these areas, and is designed to be used by large, multi-site organizations.” Daimler noted that Capital’s powerful design lifecycle management, electrical/mechanical data integration, and standardized communication with suppliers were all key contributors to successful development of the Actros’ complex electrical systems.
The Capital suite spans an extended electrical systems “Define – Design – Build – Service” flow and is particularly targeted at transportation applications. Combining powerful design automation and modern enterprise integration capabilities, the software creates digital continuity within the electrical domain to compress development cycle time and deliver significant cost reductions.
“Capital is broadly adopted across Daimler’s several truck brands. In part this is because Capital supports a number of different design flows,” said Martin O’Brien, GM of the Integrated Electrical Systems Division at Mentor Graphics. “The toolset is both flexible and future-proof, as well as being highly productive. This flexibility and power explains why many of the world’s leading truck manufacturers have adopted Capital, with deployments in multiple locations in Europe, USA, Asia and Japan.”
Branded “trucks you can trust”, the Actros includes innovative electrical/electronic systems that significantly boost efficiency, safety, and reliability. The sophisticated nature of these systems drives challenges for the truck’s electrical design, particularly with respect to systems integration, design validation and configuration management. To solve these challenges, the Germany-based company used the Capital tools, extending Mentor Graphics software deployment to now span three continents.
“To develop such an advanced truck requires not only powerful design automation, but also robust design data management,” said Wolfgang Appel, senior manager, system architecture, Mechatronic Engineering, Mercedes-Benz Trucks.
“Capital was the natural tool choice because it is so strong in these areas, and is designed to be used by large, multi-site organizations.” Daimler noted that Capital’s powerful design lifecycle management, electrical/mechanical data integration, and standardized communication with suppliers were all key contributors to successful development of the Actros’ complex electrical systems.
The Capital suite spans an extended electrical systems “Define – Design – Build – Service” flow and is particularly targeted at transportation applications. Combining powerful design automation and modern enterprise integration capabilities, the software creates digital continuity within the electrical domain to compress development cycle time and deliver significant cost reductions.
“Capital is broadly adopted across Daimler’s several truck brands. In part this is because Capital supports a number of different design flows,” said Martin O’Brien, GM of the Integrated Electrical Systems Division at Mentor Graphics. “The toolset is both flexible and future-proof, as well as being highly productive. This flexibility and power explains why many of the world’s leading truck manufacturers have adopted Capital, with deployments in multiple locations in Europe, USA, Asia and Japan.”
GCT Semiconductor announces 3G/2G IP licensing agreement with LG
USA: GCT Semiconductor, a leading designer and supplier of advanced 4G mobile semiconductor solutions, has entered into a 3G/2G IP licensing agreement with LG Electronics (LG), a global leader and technology innovator in consumer electronics.
This IP will enable GCT to offer proven multi-mode 4G/3G/2G solutions to operators worldwide who are rolling out LTE.
“We believe this licensing agreement with LG will strengthen and enhance our 4G product roadmap, and enable us to support 3G/2G backward compatibility,” said Alex Sum, VP of marketing and business development at GCT Semiconductor Inc.
Based on the successful commercialization of its FDD-LTE single-chip GDM7240, GCT continues to expand its 4G leadership position by offering next-generation FDD/TDD LTE as well as multi-mode LTE/3G/2G solutions. This licensing agreement opens opportunities with HSPA-based operators who are evolving to LTE.
This IP will enable GCT to offer proven multi-mode 4G/3G/2G solutions to operators worldwide who are rolling out LTE.
“We believe this licensing agreement with LG will strengthen and enhance our 4G product roadmap, and enable us to support 3G/2G backward compatibility,” said Alex Sum, VP of marketing and business development at GCT Semiconductor Inc.
Based on the successful commercialization of its FDD-LTE single-chip GDM7240, GCT continues to expand its 4G leadership position by offering next-generation FDD/TDD LTE as well as multi-mode LTE/3G/2G solutions. This licensing agreement opens opportunities with HSPA-based operators who are evolving to LTE.
Wednesday, March 20, 2013
Cypress’s PSoC 4 architecture delivers most-flexible, lowest-power ARM Cortex-M0-based devices for embedded designs
USA: Cypress Semiconductor Corp. has unveiled the PSoC 4 programmable system-on-chip architecture, which combines Cypress’s best-in-class PSoC analog and digital fabric and industry-leading CapSense capacitive touch technology with ARM’s power-efficient Cortex-M0 core.
The truly scalable, cost-efficient architecture delivers PSoC’s trademark flexibility, analog performance and integration, along with access to dozens of free PSoC Components—“virtual chips” represented by icons in Cypress’s PSoC Creator integrated design environment.
The new PSoC 4 device class will challenge proprietary 8-bit and 16-bit microcontrollers (MCUs), along with other 32-bit devices. Cypress plans to announce the availability of new PSoC 4 families in the first half of 2013.
The PSoC 4 architecture enhances Cypress’s patented, industry-leading CapSense capacitive-touch sensing technology by offering significant leadership in noise immunity. In addition to capacitive sensing, PSoC 4 targets field-oriented control (FOC) motor control, temperature sensing, security access, portable medical, and many other applications.
“PSoC 4 enables design engineers to leverage the overall trend toward industry-standard, lower-cost ARM-based solutions, the broad availability of ARM software, and the migration of 8-and 16-bit MCU applications to 32-bit solutions,” said John Weil, senior director of PSoC Marketing for Cypress’s Programmable Systems Division.
“It is the industry’s only fully scalable, infinitely reconfigurable Cortex-M-class MCU with best-in-class analog integration. It can replace entire portfolios of proprietary MCUs and analog solutions, and it is well-positioned to capture significant market share.”
The truly scalable, cost-efficient architecture delivers PSoC’s trademark flexibility, analog performance and integration, along with access to dozens of free PSoC Components—“virtual chips” represented by icons in Cypress’s PSoC Creator integrated design environment.
The new PSoC 4 device class will challenge proprietary 8-bit and 16-bit microcontrollers (MCUs), along with other 32-bit devices. Cypress plans to announce the availability of new PSoC 4 families in the first half of 2013.
The PSoC 4 architecture enhances Cypress’s patented, industry-leading CapSense capacitive-touch sensing technology by offering significant leadership in noise immunity. In addition to capacitive sensing, PSoC 4 targets field-oriented control (FOC) motor control, temperature sensing, security access, portable medical, and many other applications.
“PSoC 4 enables design engineers to leverage the overall trend toward industry-standard, lower-cost ARM-based solutions, the broad availability of ARM software, and the migration of 8-and 16-bit MCU applications to 32-bit solutions,” said John Weil, senior director of PSoC Marketing for Cypress’s Programmable Systems Division.
“It is the industry’s only fully scalable, infinitely reconfigurable Cortex-M-class MCU with best-in-class analog integration. It can replace entire portfolios of proprietary MCUs and analog solutions, and it is well-positioned to capture significant market share.”
e-con Systems launches full HD MIPI camera support for TI’s OMAP4 processor
USA & INDIA: e-con Systems Inc., a leading embedded design services company specializing in development of advanced camera solutions, announced the release of Full HD MIPI Camera Board, e-CAM51_44x for Texas Instruments’ OMAP4 family of processors.
The e-CAM51_44x camera board is interfaced to the PandaBoard which is based on OMAP4430 / OMAP4460 processor. e-CAM51_44x includes e-CAM57_MI5640_MOD, a 5 MP autofocus MIPI CSI-2 camera module.
The e-CAM57_MI5640_MOD camera module is based on OmniVision’s OV5640 sensor. The e-CAM51_44x board comes with full schematics and Linux driver support with source code. e-con Systems will also be announcing support for Android soon.
e-CAM51_44x can stream Full HD 1080p@30fps and also supports HD 720p@60fps. The OMAP4 processor has support for multiple camera interfaces and has the ability to record video at 1080p@30fps and 720p@60fps. Further it can support resolutions up to 20 megapixels. Customers designing virtual reality devices, 3D gaming with gesture recognition, automotive infotainment or sports cameras will benefit immensely from OMAP4’s high speed and performance.
e-CAM57_MI5640_MOD comes with a 70mm flex cable. This provides flexibility in enclosure design as the camera module can be placed as far as 100 mm from the processor interface. This empowers customers who are designing OMAP4 based handhelds / data loggers/ industrial devices with cameras. e-con Systems can also help customers to customize the length of this camera module according to the mechanical requirements.
The e-CAM51_44x camera board is interfaced to the PandaBoard which is based on OMAP4430 / OMAP4460 processor. e-CAM51_44x includes e-CAM57_MI5640_MOD, a 5 MP autofocus MIPI CSI-2 camera module.
The e-CAM57_MI5640_MOD camera module is based on OmniVision’s OV5640 sensor. The e-CAM51_44x board comes with full schematics and Linux driver support with source code. e-con Systems will also be announcing support for Android soon.
e-CAM57_MI5640_MOD comes with a 70mm flex cable. This provides flexibility in enclosure design as the camera module can be placed as far as 100 mm from the processor interface. This empowers customers who are designing OMAP4 based handhelds / data loggers/ industrial devices with cameras. e-con Systems can also help customers to customize the length of this camera module according to the mechanical requirements.
TI speeds and simplifies design of automotive emergency call systems with new reference design
USA: Texas Instruments Inc. (TI) introduced a complete reference design that provides designers all the analog and embedded processing integrated circuits (ICs) required for automotive emergency call (eCall) systems.
Vehicles equipped with eCall systems will automatically place calls to an emergency service center in the event of an accident. Customers can accelerate the design of their eCall systems by taking advantage of this reference solution comprised of AEC-Q100 qualified analog ICs from TI.
Featuring the TPA3111D1-Q1 high efficiency mono Class D audio amplifier and the TPS43330-Q1, single-boost, dual synchronous buck controller with ultra low quiescent current, TI's automotive eCall reference design offers a robust, low-cost solution that is scalable for other automotive applications, such as telematics, stolen vehicle tracking and HEV/EV sound generation.
It also incorporates the TLV70033-Q1 voltage regulator with low quiescent current and the MSP430F2232 16-bit ultra-low power microcontroller.
Vehicles equipped with eCall systems will automatically place calls to an emergency service center in the event of an accident. Customers can accelerate the design of their eCall systems by taking advantage of this reference solution comprised of AEC-Q100 qualified analog ICs from TI.
Featuring the TPA3111D1-Q1 high efficiency mono Class D audio amplifier and the TPS43330-Q1, single-boost, dual synchronous buck controller with ultra low quiescent current, TI's automotive eCall reference design offers a robust, low-cost solution that is scalable for other automotive applications, such as telematics, stolen vehicle tracking and HEV/EV sound generation.
It also incorporates the TLV70033-Q1 voltage regulator with low quiescent current and the MSP430F2232 16-bit ultra-low power microcontroller.
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