USA: It’s official. Renesas Electronics America, a leading supplier of advanced semiconductor solutions, has taken the lead as the top microcontroller (MCU) supplier in the Americas.
According to an IHS iSuppli 2012 Semiconductor Market Shares Report released this year, Renesas Electronics leapfrogged the competition to win 24 percent share in the Americas market. Already the worldwide MCU leader, this win solidifies the company’s role as the top MCU supplier in the Americas for the first time.
The latest ranking from IHS highlights Renesas’ commitment to delivering ground-breaking, low-power MCU solutions that enable emerging applications within the Smart Society, including smart homes and buildings, mobile healthcare and connected cars that offer increased intelligence, energy savings, safety and enhanced user experience.
Monday, May 6, 2013
Freescale demos industry’s first 802.11ac WLAN platform running application-aware software
USA: At Interop this week, Freescale Semiconductor is re-inforcing its enterprise access point market leadership by demonstrating the first QorIQ P1020 reference platform for 802.11ac that simultaneously delivers “gigabit Wi-Fi” while running application identification software required for security and core network offload in next-generation wireless local area network (WLAN) products.
The turnkey reference platform underscores Freescale’s continued leadership in the wireless access space, which Infonetics projects to grow at 12 percent CAGR through 2017. QorIQ communications processors from Freescale have been selected to power solutions for eight of the top 10 manufacturers of enterprise wireless access point equipment.
A key WLAN growth driver is the bring your own device (BYOD) phenomenon, which requires enterprise and service provider networks to manage known users, as well as network guests who may not have the same privileges to access sensitive content.
These access and quality of service (QoS) challenges, together with the demanding performance requirements of gigabit-rate 802.11ac technology and increasing access issues stemming from the introduction of myriad personal wireless devices into the network, combine to present daunting challenges to WLAN equipment OEMs and network administrators.
The turnkey reference platform underscores Freescale’s continued leadership in the wireless access space, which Infonetics projects to grow at 12 percent CAGR through 2017. QorIQ communications processors from Freescale have been selected to power solutions for eight of the top 10 manufacturers of enterprise wireless access point equipment.
A key WLAN growth driver is the bring your own device (BYOD) phenomenon, which requires enterprise and service provider networks to manage known users, as well as network guests who may not have the same privileges to access sensitive content.
These access and quality of service (QoS) challenges, together with the demanding performance requirements of gigabit-rate 802.11ac technology and increasing access issues stemming from the introduction of myriad personal wireless devices into the network, combine to present daunting challenges to WLAN equipment OEMs and network administrators.
Altera Quartus II software v13.0 enables world's fastest FPGA designs
USA: Altera Corp. announced the release of its Quartus II software version 13.0, which delivers the highest levels of FPGA and SoC performance and designer productivity.
Users targeting 28 nm FPGAs and SoCs will experience on average a 25 percent reduction in compile times. The most difficult-to-close designs targeting high-end 28 nm Stratix® V FPGAs will see compilation times slashed by 50 percent on average compared to the previous software release.
Quartus II software v13.0 enables designs targeting Stratix V FPGAs to achieve the fastest Fmax of any FPGA in the industry with a two speed-grade advantage over the nearest competitor.
The release also includes enhancements to the development suite's high-level C-based, system-/IP-based, and model-based design flows:
SDK for OpenCL opens the world of massively-parallel FPGA-based accelerators to software programmers without FPGA experience. The OpenCL parallel programming model delivers the fastest path from code-to-hardware implementation.
Software programmers targeting FPGAs achieve higher performance at significantly lower power compared to alternative hardware architectures. See today's press release for more information on the SDK for OpenCL and for more information on Altera's newly announced Preferred Board Partner Program for OpenCL.
Qsys system integration tool provides expanded support for ARM-based Cyclone V SoCs. Now Qsys can generate industry-standard AMBA AHB and APB bus interfaces in the FPGA fabric. Further, these interfaces comply with ARM's TrustZone requirements, allowing customers to partition an entire SoC-FPGA-based system between a secure world for critical system resources and a non-secure world for everything else.
DSP Builder design tool enables system developers to effectively implement high-performance fixed- and floating-point algorithms into their DSP designs. New features include additional math.h functions with enhanced precision and rounding parameterization, parameterizable FFT blocks for fixed- and floating-point FFTs, more efficient folding capability and improved resource sharing.
Users targeting 28 nm FPGAs and SoCs will experience on average a 25 percent reduction in compile times. The most difficult-to-close designs targeting high-end 28 nm Stratix® V FPGAs will see compilation times slashed by 50 percent on average compared to the previous software release.
Quartus II software v13.0 enables designs targeting Stratix V FPGAs to achieve the fastest Fmax of any FPGA in the industry with a two speed-grade advantage over the nearest competitor.
The release also includes enhancements to the development suite's high-level C-based, system-/IP-based, and model-based design flows:
SDK for OpenCL opens the world of massively-parallel FPGA-based accelerators to software programmers without FPGA experience. The OpenCL parallel programming model delivers the fastest path from code-to-hardware implementation.
Software programmers targeting FPGAs achieve higher performance at significantly lower power compared to alternative hardware architectures. See today's press release for more information on the SDK for OpenCL and for more information on Altera's newly announced Preferred Board Partner Program for OpenCL.
Qsys system integration tool provides expanded support for ARM-based Cyclone V SoCs. Now Qsys can generate industry-standard AMBA AHB and APB bus interfaces in the FPGA fabric. Further, these interfaces comply with ARM's TrustZone requirements, allowing customers to partition an entire SoC-FPGA-based system between a secure world for critical system resources and a non-secure world for everything else.
DSP Builder design tool enables system developers to effectively implement high-performance fixed- and floating-point algorithms into their DSP designs. New features include additional math.h functions with enhanced precision and rounding parameterization, parameterizable FFT blocks for fixed- and floating-point FFTs, more efficient folding capability and improved resource sharing.
TI and Continental to deliver first 65 nm safety ARM Cortex MCU
USA: Texas Instruments Inc. (TI) and Continental, the international automotive supplier, are pleased to announce their collaboration on the first 65 nm ARM Cortex safety microcontrollers with Flash technology in volume production.
The Continental processor for advanced control in electronic braking systems (PACE) is the foundation for the Continental MK 100 family of electronic stability control (ESC) systems. This latest innovation is one of the many technologies jointly developed over the last 15 years to deliver leading automotive safety products that are continually improving with updated safety features, power consumption and reliability.
This 65 nm Flash technology also serves as the foundation for TI's Hercules safety MCU open market products.
"We are excited to be the first automotive ESC system manufacturer to offer leading-edge safety features based on TI's 65 nm FLASH technology," said Dr. Adrian Traskov, IC development manager in the Electronic Brake Systems business unit at Continental's Chassis & Safety division. "Developing this complex safety family required close partnership with TI and Continental design teams to render the final system design, IC modeling and simulation, resulting in our final product for the ESC systems."
The Continental MK 100 ESC systems are unique to the market because of their high level of safety integration and Continental proprietary safety MCU architecture with TI's 65nm embedded Flash enable many benefits to auto makers.
The Continental processor for advanced control in electronic braking systems (PACE) is the foundation for the Continental MK 100 family of electronic stability control (ESC) systems. This latest innovation is one of the many technologies jointly developed over the last 15 years to deliver leading automotive safety products that are continually improving with updated safety features, power consumption and reliability.
This 65 nm Flash technology also serves as the foundation for TI's Hercules safety MCU open market products.
"We are excited to be the first automotive ESC system manufacturer to offer leading-edge safety features based on TI's 65 nm FLASH technology," said Dr. Adrian Traskov, IC development manager in the Electronic Brake Systems business unit at Continental's Chassis & Safety division. "Developing this complex safety family required close partnership with TI and Continental design teams to render the final system design, IC modeling and simulation, resulting in our final product for the ESC systems."
The Continental MK 100 ESC systems are unique to the market because of their high level of safety integration and Continental proprietary safety MCU architecture with TI's 65nm embedded Flash enable many benefits to auto makers.
Kopin acquires majority stake in low-power mixed-signal IC design company
USA: Kopin Corp. announced it has acquired the majority share of privately held e-MDT America Inc. in Santa Clara, California an expert in low-power analog/digital circuit designs.
e-MDT America specializes in designing ultra-low-power driver integrated circuits (ICs) and backplanes for many kinds of displays, including reflective liquid crystal on silicon (LCOS) displays.
“The investment in e-MDT America is part of our strategy to provide our partners the best and most-complete technology portfolio of components and solutions for the emerging wearable computing market,” said Dr. John C.C. Fan, CEO of Kopin. “e-MDT America is a recognized leader in the design of ultra-low-power mixed-signal circuits and should greatly enhance our capability in designing new smaller and lower power chip sets for wearable computing systems.”
“We are delighted to join the Kopin family,” said Jin Kim, president of e-MDT America. “Kopin has been a very close partner to e-MDT America for many years, and we believe we can contribute greatly to Kopin’s strategy by meeting the needs of Kopin’s customers to have low-power components in their wearable computing systems.”
e-MDT America specializes in designing ultra-low-power driver integrated circuits (ICs) and backplanes for many kinds of displays, including reflective liquid crystal on silicon (LCOS) displays.
“The investment in e-MDT America is part of our strategy to provide our partners the best and most-complete technology portfolio of components and solutions for the emerging wearable computing market,” said Dr. John C.C. Fan, CEO of Kopin. “e-MDT America is a recognized leader in the design of ultra-low-power mixed-signal circuits and should greatly enhance our capability in designing new smaller and lower power chip sets for wearable computing systems.”
“We are delighted to join the Kopin family,” said Jin Kim, president of e-MDT America. “Kopin has been a very close partner to e-MDT America for many years, and we believe we can contribute greatly to Kopin’s strategy by meeting the needs of Kopin’s customers to have low-power components in their wearable computing systems.”
Global semiconductor sales outpace last year through Q1 of 2013
USA: The Semiconductor Industry Association (SIA), representing US leadership in semiconductor manufacturing and design, announced that worldwide sales of semiconductors reached $23.48 billion for the month of March 2013, an increase of 1.1 percent from the previous month when sales were $23.23 billion.
Global sales for March 2013 were 0.9 percent higher than the March 2012 total of $23.28 billion, and total sales through the first quarter of 2013 were 0.9 percent higher than sales from the first quarter of 2012. All monthly sales numbers represent a three-month moving average.
“Through the first quarter of 2013, the global semiconductor industry has seen modest but consistent growth compared to last year,” said Brian Toohey, president and CEO, Semiconductor Industry Association.
“Sales have increased across most end product categories, with memory showing the strongest growth. With recent indications that companies could be set to replenish inventories, we are hopeful that growth will continue in the months ahead. Regionally, the Americas slipped slightly in March after a strong start to the year, but Asia Pacific and Europe have seen impressive growth recently.”
Year-over-year sales increased in Asia Pacific (6.9 percent) and Europe (0.7 percent), but decreased slightly in the Americas (-1.5 percent) and sharply in Japan (-18 percent), reflecting in part the devaluation of the Japanese yen.
Sales in Europe increased by 5.7 percent compared to the previous month, the region’s largest sequential monthly increase since March 2010. Sales also increased from the previous month in Asia Pacific (1.7 percent), but fell in Japan (-1.6 percent) and the Americas (-1.9 percent).
Global sales for March 2013 were 0.9 percent higher than the March 2012 total of $23.28 billion, and total sales through the first quarter of 2013 were 0.9 percent higher than sales from the first quarter of 2012. All monthly sales numbers represent a three-month moving average.
“Through the first quarter of 2013, the global semiconductor industry has seen modest but consistent growth compared to last year,” said Brian Toohey, president and CEO, Semiconductor Industry Association.
“Sales have increased across most end product categories, with memory showing the strongest growth. With recent indications that companies could be set to replenish inventories, we are hopeful that growth will continue in the months ahead. Regionally, the Americas slipped slightly in March after a strong start to the year, but Asia Pacific and Europe have seen impressive growth recently.”
Year-over-year sales increased in Asia Pacific (6.9 percent) and Europe (0.7 percent), but decreased slightly in the Americas (-1.5 percent) and sharply in Japan (-18 percent), reflecting in part the devaluation of the Japanese yen.
Sales in Europe increased by 5.7 percent compared to the previous month, the region’s largest sequential monthly increase since March 2010. Sales also increased from the previous month in Asia Pacific (1.7 percent), but fell in Japan (-1.6 percent) and the Americas (-1.9 percent).
ATREG successfully advises Micron on 200mm fab sale in Italy
USA: ATREG Inc., a global advisory firm to the semiconductor industry headquartered in Seattle, USA, announced that it has successfully advised Micron Technology Inc. in the sale of its semiconductor manufacturing subsidiary whose primary asset consists of an advanced 200mm CMOS image sensor fab based in Avezzano, Italy.
The facility was purchased by LFoundry, a leading German analog mixed-signal and specialized technologies foundry. As part of the agreement, Micron assigned the buyer its supply agreement with Aptina to manufacture image sensors at the Italian facility.
“This transaction is a win-win situation,” explains Barnett Silver, senior VP and principal at ATREG. “Aptina secures a long-term wafer supply while LFoundry gains access to an advanced, 200mm manufacturing operation. We are pleased to have been a part in facilitating such a successful outcome.”
The facility was purchased by LFoundry, a leading German analog mixed-signal and specialized technologies foundry. As part of the agreement, Micron assigned the buyer its supply agreement with Aptina to manufacture image sensors at the Italian facility.
“This transaction is a win-win situation,” explains Barnett Silver, senior VP and principal at ATREG. “Aptina secures a long-term wafer supply while LFoundry gains access to an advanced, 200mm manufacturing operation. We are pleased to have been a part in facilitating such a successful outcome.”
Intel board elects Brian Krzanich as CEO
USA: Intel Corp. announced that the board of directors has unanimously elected Brian Krzanich as its next chief executive officer (CEO), succeeding Paul Otellini. Krzanich will assume his new role at the company’s annual stockholders’ meeting on May 16.
Krzanich, Intel’s chief operating officer since January 2012, will become the sixth CEO in Intel’s history. As previously announced, Otellini will step down as CEO and from the board of directors on May 16.
“After a thorough and deliberate selection process, the board of directors is delighted that Krzanich will lead Intel as we define and invent the next generation of technology that will shape the future of computing,” said Andy Bryant, chairman of Intel.
“Brian is a strong leader with a passion for technology and deep understanding of the business,” Bryant added. “His track record of execution and strategic leadership, combined with his open-minded approach to problem solving has earned him the respect of employees, customers and partners worldwide. He has the right combination of knowledge, depth and experience to lead the company during this period of rapid technology and industry change.”
Krzanich, 52, has progressed through a series of technical and leadership roles since joining Intel in 1982.
“I am deeply honored by the opportunity to lead Intel,” said Krzanich. “We have amazing assets, tremendous talent, and an unmatched legacy of innovation and execution. I look forward to working with our leadership team and employees worldwide to continue our proud legacy, while moving even faster into ultra-mobility, to lead Intel into the next era.”
The board of directors elected Renée James, 48, to be president of Intel. She will also assume her new role on May 16, joining Krzanich in Intel’s executive office.
"I look forward to partnering with Renée as we begin a new chapter in Intel’s history," said Krzanich. "Her deep understanding and vision for the future of computing architecture, combined with her broad experience running product R&D and one of the world’s largest software organizations, are extraordinary assets for Intel.”
As chief operating officer, Krzanich led an organization of more than 50,000 employees spanning Intel’s Technology and Manufacturing Group, Intel Custom Foundry, NAND Solutions group, Human Resources, Information Technology and Intel’s China strategy.
James, 48, has broad knowledge of the computing industry, spanning hardware, security, software and services, which she developed through leadership positions at Intel and as chairman of Intel’s software subsidiaries -- Havok, McAfee and Wind River. She also currently serves on the board of directors of Vodafone Group Plc and VMware Inc. and was chief of staff for former Intel CEO Andy Grove.
Krzanich, Intel’s chief operating officer since January 2012, will become the sixth CEO in Intel’s history. As previously announced, Otellini will step down as CEO and from the board of directors on May 16.
“After a thorough and deliberate selection process, the board of directors is delighted that Krzanich will lead Intel as we define and invent the next generation of technology that will shape the future of computing,” said Andy Bryant, chairman of Intel.
“Brian is a strong leader with a passion for technology and deep understanding of the business,” Bryant added. “His track record of execution and strategic leadership, combined with his open-minded approach to problem solving has earned him the respect of employees, customers and partners worldwide. He has the right combination of knowledge, depth and experience to lead the company during this period of rapid technology and industry change.”
Krzanich, 52, has progressed through a series of technical and leadership roles since joining Intel in 1982.
“I am deeply honored by the opportunity to lead Intel,” said Krzanich. “We have amazing assets, tremendous talent, and an unmatched legacy of innovation and execution. I look forward to working with our leadership team and employees worldwide to continue our proud legacy, while moving even faster into ultra-mobility, to lead Intel into the next era.”
The board of directors elected Renée James, 48, to be president of Intel. She will also assume her new role on May 16, joining Krzanich in Intel’s executive office.
"I look forward to partnering with Renée as we begin a new chapter in Intel’s history," said Krzanich. "Her deep understanding and vision for the future of computing architecture, combined with her broad experience running product R&D and one of the world’s largest software organizations, are extraordinary assets for Intel.”
As chief operating officer, Krzanich led an organization of more than 50,000 employees spanning Intel’s Technology and Manufacturing Group, Intel Custom Foundry, NAND Solutions group, Human Resources, Information Technology and Intel’s China strategy.
James, 48, has broad knowledge of the computing industry, spanning hardware, security, software and services, which she developed through leadership positions at Intel and as chairman of Intel’s software subsidiaries -- Havok, McAfee and Wind River. She also currently serves on the board of directors of Vodafone Group Plc and VMware Inc. and was chief of staff for former Intel CEO Andy Grove.
ST increases accessibility of MEMS motion portfolio
SWITZERLAND: STMicroelectronics has simplified the use of MEMS in a wider range of applications by releasing ready-to-use software drivers for communication with Linux systems.
ST’s new driver architecture is supported in the latest revision of Linux Kernel (from revision 3.9), which is available immediately: the drivers make ST’s MEMS devices more easily accessible to developers using Linux open-source software to build consumer, industrial, scientific and healthcare applications with precision movement and position sensing in multiple axes for uses such as remote monitoring, test and measurement, robotic control, machine vision and surveillance.
The new ST driver architecture ensures robustness, maximizes sensor performance, and allows modularity and fast prototyping. Driver access is managed through a standard IIO (Industrial-IO) interface and no additional software is required to interface all the ST Motion MEMS products due to the embedded IIO driver already available into the Linux Kernel.
“The ST IIO driver modules also provide the flexibility to exchange all the ST MEMS devices without any changes at the driver level,” said Paolo Bendiscioli, Motion MEMS Application manager at STMicroelectronics. “This solution allows faster design upgrades and helps our customers improve time to market for their new products.”
The new driver architecture works with the full ST MEMS family including accelerometers, gyroscopes, iNEMO inertial modules, e-compasses and magnetometers, thereby enabling quick and easy connection of any sensor with minimal software overhead. It allows the system to recognize devices, access data, support interrupts and perform polling data acquisitions.
MEMS sensors are widely used in consumer products such as smartphones, tablets and gaming devices for features like indoor navigation, display orientation and gesture recognition. ST has over 800 MEMS-related patents and patent applications worldwide and is the world’s top MEMS manufacturer, with cumulative shipments of more than three billion MEMS devices and production capacity of 4 million devices a day.
Key features of ST’s MEMS Linux Industrial IO driver library:
* Optimized to support all ST MEMS device functionality.
* Code overhead reduction.
* SPI and I2C bus interoperability.
* FIFO embedded at driver level.
ST’s new driver architecture is supported in the latest revision of Linux Kernel (from revision 3.9), which is available immediately: the drivers make ST’s MEMS devices more easily accessible to developers using Linux open-source software to build consumer, industrial, scientific and healthcare applications with precision movement and position sensing in multiple axes for uses such as remote monitoring, test and measurement, robotic control, machine vision and surveillance.
The new ST driver architecture ensures robustness, maximizes sensor performance, and allows modularity and fast prototyping. Driver access is managed through a standard IIO (Industrial-IO) interface and no additional software is required to interface all the ST Motion MEMS products due to the embedded IIO driver already available into the Linux Kernel.
“The ST IIO driver modules also provide the flexibility to exchange all the ST MEMS devices without any changes at the driver level,” said Paolo Bendiscioli, Motion MEMS Application manager at STMicroelectronics. “This solution allows faster design upgrades and helps our customers improve time to market for their new products.”
The new driver architecture works with the full ST MEMS family including accelerometers, gyroscopes, iNEMO inertial modules, e-compasses and magnetometers, thereby enabling quick and easy connection of any sensor with minimal software overhead. It allows the system to recognize devices, access data, support interrupts and perform polling data acquisitions.
MEMS sensors are widely used in consumer products such as smartphones, tablets and gaming devices for features like indoor navigation, display orientation and gesture recognition. ST has over 800 MEMS-related patents and patent applications worldwide and is the world’s top MEMS manufacturer, with cumulative shipments of more than three billion MEMS devices and production capacity of 4 million devices a day.
Key features of ST’s MEMS Linux Industrial IO driver library:
* Optimized to support all ST MEMS device functionality.
* Code overhead reduction.
* SPI and I2C bus interoperability.
* FIFO embedded at driver level.
Friday, May 3, 2013
Rudolph launches S3000SX transparent thin film netrology system for 28nm node and below
USA: Rudolph Technologies Inc., a leading provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, announced the release of the S3000SX thin film metrology system for transparent films in advanced semiconductor fabrication applications at the 28nm node and below.
This latest addition to the S3000 product family uses Rudolph’s proprietary focused beam ellipsometry (FBE) and newly-designed small site measurement optics (SSMO) to measure the thickness of single layer and multi-layer films on product wafers including device area at sites sizes as small as 30x30 µm.
Additionally, the S3000SX System continues Rudolph’s flexible modular approach with a selection of new metrology capabilities that customers can tailor to their specific process requirements, optimizing the balance of performance and cost of ownership.
Rudolph’s proprietary FBE uses three laser sources operating at different wavelengths to measure film thicknesses with industry-leading speed and precision without the need for complicated dispersion models. The laser’s stability and accuracy permit easy matching between systems and its long lifetime minimizes downtime for maintenance.
The S3000SX System adds a new shorter wavelength source (405 nm) and specialized small site measurement optics to permit single wavelength measurements in sites as small as 30X30 µm, and provides improved performance on SOI, thin films and SiGe. Available metrology options include deep UV (190 nm) reflectometry, wafer stress and bow measurements, and next-generation airborne molecular contaminant control.
This latest addition to the S3000 product family uses Rudolph’s proprietary focused beam ellipsometry (FBE) and newly-designed small site measurement optics (SSMO) to measure the thickness of single layer and multi-layer films on product wafers including device area at sites sizes as small as 30x30 µm.
Additionally, the S3000SX System continues Rudolph’s flexible modular approach with a selection of new metrology capabilities that customers can tailor to their specific process requirements, optimizing the balance of performance and cost of ownership.
Rudolph’s proprietary FBE uses three laser sources operating at different wavelengths to measure film thicknesses with industry-leading speed and precision without the need for complicated dispersion models. The laser’s stability and accuracy permit easy matching between systems and its long lifetime minimizes downtime for maintenance.
The S3000SX System adds a new shorter wavelength source (405 nm) and specialized small site measurement optics to permit single wavelength measurements in sites as small as 30X30 µm, and provides improved performance on SOI, thin films and SiGe. Available metrology options include deep UV (190 nm) reflectometry, wafer stress and bow measurements, and next-generation airborne molecular contaminant control.
Entropic achieves MoCA 1.1 band E golden node certification
USA: Entropic, a world leader in semiconductor solutions for the connected home, announced its Multimedia over Coax Alliance (MoCA) 1.1 silicon has received golden node certification by the MoCA Board of Directors for the Band E frequency, which is a mid-RF band used in DIRECTV homes.
Upon today's approval, Entropic's golden node can be leveraged by National Technical Systems (NTS), the MoCA authorized lab, to execute the MoCA certification testing on new MoCA 1.1 Band E devices.
Entropic's MoCA 1.1 Band E solution, embedded in Ethernet-to-Coax Adapters (ECAs), will be used to certify MoCA Band E-compliant devices in the frequency range of 475 -- 625 MHz. Entropic was a key contributor to MoCA's Specification Working Group and Certification Working Group to help define and test the advanced features of the MoCA 1.1 Band E solution, and is proud to drive the standard forward.
Entropic's MoCA 1.1 silicon has been golden node certified for Band D frequencies used by cable, telco/IPTV Pay-TV segments since 2008. With the launch of this new Band E certification, copies of Entropic's MoCA golden node can be released to MoCA members interested in serving all three Pay-TV segments, under the "MoCA Test Bed Participation Agreement."
Upon today's approval, Entropic's golden node can be leveraged by National Technical Systems (NTS), the MoCA authorized lab, to execute the MoCA certification testing on new MoCA 1.1 Band E devices.
Entropic's MoCA 1.1 Band E solution, embedded in Ethernet-to-Coax Adapters (ECAs), will be used to certify MoCA Band E-compliant devices in the frequency range of 475 -- 625 MHz. Entropic was a key contributor to MoCA's Specification Working Group and Certification Working Group to help define and test the advanced features of the MoCA 1.1 Band E solution, and is proud to drive the standard forward.
Entropic's MoCA 1.1 silicon has been golden node certified for Band D frequencies used by cable, telco/IPTV Pay-TV segments since 2008. With the launch of this new Band E certification, copies of Entropic's MoCA golden node can be released to MoCA members interested in serving all three Pay-TV segments, under the "MoCA Test Bed Participation Agreement."
Aehr Test Systems announces $1 million in orders from leading IC manufacturer
USA: Aehr Test Systems has received over $1 million in follow-on production orders for its burn-in and test systems from a leading manufacturer of advanced logic integrated circuits (ICs) for embedded processing, digital signal processing, wireless and analog applications. The systems are expected to ship within the next six months.
"We are pleased to receive these follow-on orders, which further validate that burn-in and test using Aehr Test's systems is a cost-effective solution for production reliability screening of a wide range of ICs," said Larry Anderson, VP of sales at Aehr Test Systems.
"We are seeing a definite increase in activity from many of our customers around the world, especially those who manufacture ICs for the automotive market. We are well-positioned with both our MAX( and ABTS product lines to serve the high-reliability requirements of the automotive IC market, which according to IC Insights, a leading semiconductor research company, is forecast to grow at a rate 20 percent greater than the IC market as a whole over the next five years."
The ABTS family of products is based on a new hardware and software platform that is designed to address not only today's devices, but also future devices for many years to come. It can test and burn-in both logic and memory devices, including resources for high pin-count devices and configurations for high-power and low-power applications.
The ABTS system can be configured with up to 72 burn-in boards with up to 320 I/O channels each and 32M of test vector memory per channel. The ABTS system is optimized for use with the Sensata iSocket Thermal Management Technology, which provides a scalable cost-effective solution using individual device temperature control for ICs up to 75 watts or more. Individual temperature control enables high-power devices with a broad range of power dissipation to be burned-in simultaneously in a single burn-in chamber while maintaining a precise device temperature. The ABTS system also uses N+1 redundancy technology for many key components in the system to maximize system uptime.
"We are pleased to receive these follow-on orders, which further validate that burn-in and test using Aehr Test's systems is a cost-effective solution for production reliability screening of a wide range of ICs," said Larry Anderson, VP of sales at Aehr Test Systems.
"We are seeing a definite increase in activity from many of our customers around the world, especially those who manufacture ICs for the automotive market. We are well-positioned with both our MAX( and ABTS product lines to serve the high-reliability requirements of the automotive IC market, which according to IC Insights, a leading semiconductor research company, is forecast to grow at a rate 20 percent greater than the IC market as a whole over the next five years."
The ABTS family of products is based on a new hardware and software platform that is designed to address not only today's devices, but also future devices for many years to come. It can test and burn-in both logic and memory devices, including resources for high pin-count devices and configurations for high-power and low-power applications.
The ABTS system can be configured with up to 72 burn-in boards with up to 320 I/O channels each and 32M of test vector memory per channel. The ABTS system is optimized for use with the Sensata iSocket Thermal Management Technology, which provides a scalable cost-effective solution using individual device temperature control for ICs up to 75 watts or more. Individual temperature control enables high-power devices with a broad range of power dissipation to be burned-in simultaneously in a single burn-in chamber while maintaining a precise device temperature. The ABTS system also uses N+1 redundancy technology for many key components in the system to maximize system uptime.
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