USA: MEMS Industry Group (MIG) has publicly released “Standardized Sensor Performance Parameter Definitions,” a collaboratively authored document that identifies the performance parameter specifications of accelerometers, magnetometers, gyroscopes, pressure sensors, hygrometers, temperature sensors, ambient light sensors and proximity sensors.
The MIG document, co-authored by Ken Foust of Intel and Carlos Puig of Qualcomm Technologies, Inc. is one of the first to provide apples-to-apples comparisons of disparate micro-electromechanical systems (MEMS) sensors from diverse sensor vendors.
It is designed to allow chipset manufacturers, consumer-platform providers, original equipment manufacturers (OEMs), original design manufacturers (ODMs) and independent software vendors (ISVs) to more easily evaluate sensor solutions for their applications, thereby streamlining the supply chain.
Recognizing that sensors cannot easily proliferate across vertical and horizontal sectors without standardization, Intel and Qualcomm Technologies embraced a leadership role in actualizing this historic document.
“As a leader in the mobile industry, Qualcomm Technologies recognizes the importance of standardizing sensor parameters for the mobile device ecosystem,” said Len Sheynblat, VP of technology, Qualcomm.
“As the mobile sensor space continues to evolve, we will continue to take an active role in developing and supporting a standard that will help the industry, our suppliers and customers. We look forward in continuing to working closely with MIG-member companies responsible for delivering MEMS sensors in consumer products.”
“A future where MEMS are ubiquitous in mobile devices and more readily scalable to other markets expands opportunities for continued product innovation and growth,” said Steve Whalley, director, Sensors, Intel.
“With a long history in industry collaboration and standardizations, Intel recognizes the important role of a specification that breaks down barriers in evaluating MEMS sensors. In the past, this evaluation was either too light to produce credible conclusions or far too heavy, time-consuming and expensive. This specification brings us closer to a more scalable ‘middle’ approach, which we hope will accelerate more meaningful evaluation.”
MEMS Industry Group cited the contributions of Analog Devices, Bosch Sensortec, Freescale Semiconductor, Hillcrest Labs, InvenSense, Kionix, Maxim Integrated, Movea, NIST, PNI Sensor, STMicroelectronics and Xsens Technologies.
“The MEMS industry recognizes the need for standardization,” said Karen Lightman, executive director, MEMS Industry Group.
“The ‘Standardized Performance Parameter Definitions’ document is an important step forward. It provides the sensor industry a much needed standardization heading, truly signifying the arrival of a mature MEMS industry. Under MIG’s guidance and through the tireless leadership of Intel and Qualcomm Technologies, the sensor industry has acknowledged an important product specification issue. Today we bear the fruits of collaboration as we share a common set of performance parameters that will help to improve efficiency throughout the supply chain.”
Thursday, May 2, 2013
RDA Microelectronics announces sampling of multimode front-end module
CHINA: RDA Microelectronics Inc. announced the sampling availability of its RDA6861 front-end module designed for quad-band GSM/EDGE and WCDMA/CDMA/LTE handheld cellular devices and smartphones.
The RDA6861 is a high-power, high-efficiency front-end module consisting of multimode power amplifiers and a multi-throw antenna switch. The product's internal power amplifier supports WCDMA/LTE Band 1 frequency and provides two optional UMTS switch ports for external WCDMA/LTE power amplifier connections.
The power amplifiers, switch and integrated controller are developed with proven GaAs HBT and CMOS process technology and packaged in an ultra-small 6mm x 6mm 40-pin LGA form factor. The complete offering requires few external components, thereby simplifying PCB layout, reducing board space and lowering bill of material cost.
The RDA6861 is a high-power, high-efficiency front-end module consisting of multimode power amplifiers and a multi-throw antenna switch. The product's internal power amplifier supports WCDMA/LTE Band 1 frequency and provides two optional UMTS switch ports for external WCDMA/LTE power amplifier connections.
The power amplifiers, switch and integrated controller are developed with proven GaAs HBT and CMOS process technology and packaged in an ultra-small 6mm x 6mm 40-pin LGA form factor. The complete offering requires few external components, thereby simplifying PCB layout, reducing board space and lowering bill of material cost.
Micron unveils new PCIe I/O accelerator
USA: Micron Technology Inc. announced a new PCIe all-flash I/O accelerator to improve overall performance in enterprise servers, appliances and storage platforms.
The new Micron P420m combines consistent performance with the inherent power efficiency of an all-flash system to deliver improved economics for enterprise data centers. The P420m accelerates the performance of today's demanding data center applications, including online transaction processing (OLTP), data warehousing and virtualization.
Ultimately, Micron's P420m ends the wait game for digital data. It features ultra-low latency performance that enables fast and predictable response times to information frequently used in data center environments.
When tested against competing PCIe solutions in a MySQL server running an OLTP benchmark, the P420m is the fastest and most consistent performer, delivering more than 3,200 web server requests per second. It handily manages online requests during peak traffic times, improving the overall end-user experience.
The new Micron P420m combines consistent performance with the inherent power efficiency of an all-flash system to deliver improved economics for enterprise data centers. The P420m accelerates the performance of today's demanding data center applications, including online transaction processing (OLTP), data warehousing and virtualization.
Ultimately, Micron's P420m ends the wait game for digital data. It features ultra-low latency performance that enables fast and predictable response times to information frequently used in data center environments.
When tested against competing PCIe solutions in a MySQL server running an OLTP benchmark, the P420m is the fastest and most consistent performer, delivering more than 3,200 web server requests per second. It handily manages online requests during peak traffic times, improving the overall end-user experience.
CML releases RF building block CMX972 quadrature demodulator with PLL/VCO
UK: The CMX972 quadrature modulator/demodulator is the latest RF building block from CML Microcircuits, following on from the popular CMX970, CMX971 and CMX973 devices.
The new device features a low-power IF/RF Quadrature Demodulator with PLL/VCO, a wide operating frequency range and optimised power consumption.
The demodulator is suitable for superheterodyne architectures with IF frequencies up to 300MHz and the device may be used in low IF systems or in those converting down to baseband.
An on-chip PLL and VCO, together with uncommitted baseband differential amplifiers, provide additional flexibility. Control of the CMX972 is by serial bus.
The small, RF-optimised 32-pin VQFN package and minimal external components make the device ideal for space-constrained applications.
The new device features a low-power IF/RF Quadrature Demodulator with PLL/VCO, a wide operating frequency range and optimised power consumption.
The demodulator is suitable for superheterodyne architectures with IF frequencies up to 300MHz and the device may be used in low IF systems or in those converting down to baseband.
An on-chip PLL and VCO, together with uncommitted baseband differential amplifiers, provide additional flexibility. Control of the CMX972 is by serial bus.
The small, RF-optimised 32-pin VQFN package and minimal external components make the device ideal for space-constrained applications.
Fabless suppliers play increasing role in IC market
USA: Unlike the relatively close annual market growth relationship between fabless IC suppliers and foundries, fabless IC company sales growth versus IDM (integrated device manufacturer) IC supplier growth has typically been very different.
Except for 2010, fabless company IC sales growth has always outpaced IDM IC sales growth (or the decline was less severe). In 2010, for the first and only time on record, IDM IC sales growth (35 percent) outpaced fabless IC company sales growth (29 percent).
Since very few fabless IC suppliers participate in the memory market, they did not receive a boost from the surging DRAM and NAND flash memory markets in 2010, which grew 75 percent and 44 percent, respectively. Another reason for the relatively poor showing by the fabless IC segment in 2010 was that some of the large fabless IC suppliers like MediaTek and ST-Ericsson registered growth that was less than half the total 2010 IC industry average.
However, the fabless IC suppliers once again grew faster than the total IC market in 2011 by registering a 5 percent increase as compared to a 1 percent decline in sales for the IDM companies. In 2012, the fabless IC suppliers grew by 6 percent, 14 points better than the 8 percent decline registered by the IDMs and 10 points better than the 4 percent decline shown by the total IC market.
Fig. 2 compares fabless-company IC sales to IDM-company IC sales since 1999. As shown, the 1999-2012 worldwide IC market displayed a modest 5 percent average annual growth rate. In contrast, total IC sales from the fabless IC companies during this same timeframe registered a very strong 16 percent CAGR, more than 3x the total IC market rate.
As a result of this trend, fabless IC company sales increased more than 7x from 1999 to 2012 whereas the total IDM IC market was up less than 50 percent over this same timeperiod. Moreover, the IDM companies’ IC sales in 2012 were only 7 percent greater than they were 12 years earlier in 2000 and less than they were five years ago in 2007.
Given the big disparity in the 1999-2012 CAGRs between the fabless IC suppliers and the IDMs, it comes as little surprise that, except in 2010, fabless IC companies have been increasing their share of the total IC market (Fig. 3).
As shown, in 1999, fabless IC company sales accounted for just over 7 percent of the total IC market. However, in 2012, fabless IC suppliers represented 27.8 percent of worldwide IC sales, a new record high.
IC Insights forecasts that, in 2017, fabless IC companies will command at least one-third (33 percent) of the total IC market, especially if more large companies like IDT, LSI, Agere, and AMD become fabless over the next five years.
Over the long-term, IC Insights believes that fabless IC suppliers, and the IC foundries that serve them, will continue to become a stronger force in the total IC industry.
Except for 2010, fabless company IC sales growth has always outpaced IDM IC sales growth (or the decline was less severe). In 2010, for the first and only time on record, IDM IC sales growth (35 percent) outpaced fabless IC company sales growth (29 percent).
However, the fabless IC suppliers once again grew faster than the total IC market in 2011 by registering a 5 percent increase as compared to a 1 percent decline in sales for the IDM companies. In 2012, the fabless IC suppliers grew by 6 percent, 14 points better than the 8 percent decline registered by the IDMs and 10 points better than the 4 percent decline shown by the total IC market.
As a result of this trend, fabless IC company sales increased more than 7x from 1999 to 2012 whereas the total IDM IC market was up less than 50 percent over this same timeperiod. Moreover, the IDM companies’ IC sales in 2012 were only 7 percent greater than they were 12 years earlier in 2000 and less than they were five years ago in 2007.
Given the big disparity in the 1999-2012 CAGRs between the fabless IC suppliers and the IDMs, it comes as little surprise that, except in 2010, fabless IC companies have been increasing their share of the total IC market (Fig. 3).
IC Insights forecasts that, in 2017, fabless IC companies will command at least one-third (33 percent) of the total IC market, especially if more large companies like IDT, LSI, Agere, and AMD become fabless over the next five years.
Over the long-term, IC Insights believes that fabless IC suppliers, and the IC foundries that serve them, will continue to become a stronger force in the total IC industry.
Wednesday, May 1, 2013
CircuitSutra releases SystemC Model Library for virtual platforms
INDIA: CircuitSutra Technologies, a leader in ESL design IP and services, announced the release of their SystemC model library consisting of CircuitSutra Modeling Library (CSTML) and the Virtual Platform - Quick Start Package (VP-QSP), which can be used in the Virtual Platform project.
"Most of SoC companies and Systems companies are starting to develop the virtual platform of their SoC or Electronics System. The virtual platform have to be available early in the cycle so that it can be used to start the embedded software development in parallel to the hardware development resulting in reducing the time to market," says Umesh Sisodia, CEO, CircuitSutra.
"If a company has to develop the entire modeling infrastructure from scratch, then it will require lots of time and efforts to develop the virtual platform. The VP-QSP from CircuitSutra when used in conjunction with CSTML library can reduce the efforts on a virtual platform project upto 80 percent."
"Most of SoC companies and Systems companies are starting to develop the virtual platform of their SoC or Electronics System. The virtual platform have to be available early in the cycle so that it can be used to start the embedded software development in parallel to the hardware development resulting in reducing the time to market," says Umesh Sisodia, CEO, CircuitSutra.
"If a company has to develop the entire modeling infrastructure from scratch, then it will require lots of time and efforts to develop the virtual platform. The VP-QSP from CircuitSutra when used in conjunction with CSTML library can reduce the efforts on a virtual platform project upto 80 percent."
Rochester Electronics to deploy Camstar in specialized semiconductor manufacturing plants
USA: Camstar Systems, Inc. announced that Rochester Electronics, LLC., the leader in comprehensive solutions for mature and end-of-life semiconductors, is deploying Semiconductor Suite, an industry-specific version of Camstar’s Enterprise Manufacturing Execution System (MES) Platform, in its new assembly, test and packaging manufacturing facilities that replace formerly outsourced manufacturing.
Rochester Electronics produces medical, aerospace and government-secured as well as other sensitive semiconductor devices. Camstar’s MES is essential to ensure top quality, quick turn operations and a solid manufacturing systems foundation for rapid growth of the business.
“Rochester Electronics offers 100 percent quality assurance that all products are manufacturer-traceable, reliable, and guaranteed,” said Michael A. Murray, Enterprise Applications manager of Rochester Electronics.
“After a long and detailed search for a Manufacturing Execution System, we chose Camstar for their expertise in semiconductor manufacturing, and for their solution’s industry-specific capabilities that ensure complete visibility, control and real-time feedback throughout our manufacturing process. Based on our research, vendor presentations, evaluations, site visits and conversations with Camstar customers, we’re confident we chose a solution that will meet our business requirements and we anticipate a rapid and smooth implementation.”
“The semiconductor industry is strategic for Camstar. We are pleased to partner with Rochester Electronics, a company known for its products, services and support that are built on a culture of delivering exceptional value,” said Steve Reynolds, senior VP for Camstar. “Rochester Electronics joins other leaders in the semiconductor industry who value Camstar’s proven technology platform as a means to meet their current and long-term growth and profitability goals.”
Rochester Electronics produces medical, aerospace and government-secured as well as other sensitive semiconductor devices. Camstar’s MES is essential to ensure top quality, quick turn operations and a solid manufacturing systems foundation for rapid growth of the business.
“Rochester Electronics offers 100 percent quality assurance that all products are manufacturer-traceable, reliable, and guaranteed,” said Michael A. Murray, Enterprise Applications manager of Rochester Electronics.
“After a long and detailed search for a Manufacturing Execution System, we chose Camstar for their expertise in semiconductor manufacturing, and for their solution’s industry-specific capabilities that ensure complete visibility, control and real-time feedback throughout our manufacturing process. Based on our research, vendor presentations, evaluations, site visits and conversations with Camstar customers, we’re confident we chose a solution that will meet our business requirements and we anticipate a rapid and smooth implementation.”
“The semiconductor industry is strategic for Camstar. We are pleased to partner with Rochester Electronics, a company known for its products, services and support that are built on a culture of delivering exceptional value,” said Steve Reynolds, senior VP for Camstar. “Rochester Electronics joins other leaders in the semiconductor industry who value Camstar’s proven technology platform as a means to meet their current and long-term growth and profitability goals.”
Analog IC market struggles to gain footing in 2012
USA: Worldwide economic uncertainty has given the analog IC market plenty of ups and downs over the last several years; however 2012 was one of the worst years for this segment. Analog was down 7 percent from 2011 with revenues just shy of $40 billion, although this was the unfortunate reality for the entire semiconductor market, which had an average decline of 3 percent in 2012.
All markets within analog did poorly, with the exception of the wired market. Power, automotive and communications were the most resilient, whereas computer, interface, and data conversion products took the worst hit.
Texas Instruments still remains the largest manufacturing company in analog in terms of market share; they finished 2012 with 16.7 percent of the entire market, or $6.6 billion in revenue. In 2011, Texas Instruments completed the acquisition of National Semiconductor; this has proven to be a very profitable purchase as the market share in interface jumped from 23 to 27 percent and analog power IC share went from 21 to 24 percent in 2012.
With TI's recent decision to restructure their business, they have been able to focus their efforts more on their dominating analog market. TI remains resilient, despite the oversupply in the industry caused primarily by China's slowing economy and the ongoing debt crisis in Europe.
STMicroelectronics remains the second largest in market share for 2012 at slightly over 9 percent and $3.6 billion in revenue. Like TI, STMicroelectronics is attempting to better allocate its resources in the midst of a poor market and may dissolve the venture with Ericsson to better focus their efforts in analog products and power management. Being Europe's top chipmaker, they are likely facing similar oversupply problems and other issues regarding the European economy.
Analog Devices, Inc. makes up the third largest market share at 5.7 percent and $2.3 billion, but saw a year over year decline of 8 percent. ADI currently has the largest market share in the data converter segment, making up half of the market share with a $1.1 billion for 2012 revenue.
The overall data converter market was down for all companies by an average of 14 percent; however ADI only took a 12 percent decrease and the company's market share increased slightly from 2011. Within the data converter market, ADI easily has an 84 percent share in high speed ADCs and a 60 percent share in overall ADC revenue, making them the worldwide leaders in both segments.
Source: Datamonitor, USA.
All markets within analog did poorly, with the exception of the wired market. Power, automotive and communications were the most resilient, whereas computer, interface, and data conversion products took the worst hit.
Texas Instruments still remains the largest manufacturing company in analog in terms of market share; they finished 2012 with 16.7 percent of the entire market, or $6.6 billion in revenue. In 2011, Texas Instruments completed the acquisition of National Semiconductor; this has proven to be a very profitable purchase as the market share in interface jumped from 23 to 27 percent and analog power IC share went from 21 to 24 percent in 2012.
With TI's recent decision to restructure their business, they have been able to focus their efforts more on their dominating analog market. TI remains resilient, despite the oversupply in the industry caused primarily by China's slowing economy and the ongoing debt crisis in Europe.
Analog Devices, Inc. makes up the third largest market share at 5.7 percent and $2.3 billion, but saw a year over year decline of 8 percent. ADI currently has the largest market share in the data converter segment, making up half of the market share with a $1.1 billion for 2012 revenue.
The overall data converter market was down for all companies by an average of 14 percent; however ADI only took a 12 percent decrease and the company's market share increased slightly from 2011. Within the data converter market, ADI easily has an 84 percent share in high speed ADCs and a 60 percent share in overall ADC revenue, making them the worldwide leaders in both segments.
Source: Datamonitor, USA.
SRC, NSF intro compact modeling initiative for nanotechnology era
USA: Semiconductor Research Corp. (SRC) recently joined the National Science Foundation (NSF) as a partner in an ongoing NSF project to further develop compact models of emerging nanoelectronic devices such as might be used in next-generation consumer electronics.
The project focuses on nano-engineered electronic device simulation (NEEDS). NEEDS is a node of a larger National Nanotechnology Initiative project called the Network for Computational Nanotechnology (NCN). NCN offers researchers tools to explore nanoscale phenomena through theory, modeling and simulation, while also developing enhancements to science and engineering education.
The existing $3.5 million award from NSF, now bolstered by joint support from NSF and SRC of $2.5 million, supports a five-year program that is the largest of its kind dedicated to realizing the promise of nanoscience in innovative circuits and systems applications.
By enabling the simulation of circuits and systems, compact models connect nanomaterials and devices to potential circuit applications that are simulated with SPICE (Simulation Program with Integrated Circuit Emphasis). NEEDS is charged with creating a complete compact model development environment (NEEDS-SPICE) that supports the creation of high-quality models and provides industrial and academic designers with robust models that run in both commercial and open source SPICE-compatible simulation platforms.
NEEDS will support this platform with a set of best practices and processes and a suite of research and educational resources. During the course of this work, NEEDS will produce an open source platform, open source compact models and open content educational resources, which will be available on nanoHUB.org.
The project focuses on nano-engineered electronic device simulation (NEEDS). NEEDS is a node of a larger National Nanotechnology Initiative project called the Network for Computational Nanotechnology (NCN). NCN offers researchers tools to explore nanoscale phenomena through theory, modeling and simulation, while also developing enhancements to science and engineering education.
The existing $3.5 million award from NSF, now bolstered by joint support from NSF and SRC of $2.5 million, supports a five-year program that is the largest of its kind dedicated to realizing the promise of nanoscience in innovative circuits and systems applications.
By enabling the simulation of circuits and systems, compact models connect nanomaterials and devices to potential circuit applications that are simulated with SPICE (Simulation Program with Integrated Circuit Emphasis). NEEDS is charged with creating a complete compact model development environment (NEEDS-SPICE) that supports the creation of high-quality models and provides industrial and academic designers with robust models that run in both commercial and open source SPICE-compatible simulation platforms.
NEEDS will support this platform with a set of best practices and processes and a suite of research and educational resources. During the course of this work, NEEDS will produce an open source platform, open source compact models and open content educational resources, which will be available on nanoHUB.org.
MEMS suppliers ride Apple’s gravy train to top of microphone business
USA: Once again demonstrating Apple Inc.’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems (MEMS) microphones were those that provided devices for iPhones and iPads.
Suppliers that had significant sales to Apple occupied the Top 4 MEMS microphone ranks in 2012, according to an IHS iSuppli MEMS & Sensors Special Report from information and analytics provider IHS.
These companies were No. 1 Knowles Electronics from Illinois, AAC of China in second place, Massachusetts-based Analog Devices in the third spot, and Goertek of China in fourth. Together the Top 4 players last year commanded combined revenue of $513 million, equivalent to 88 percent of total MEMS microphone industry revenue of $583 million.
Apple gets on the mic
“Microphones continue to be one of the best success stories in MEMS, with mobile device manufacturers adding increasing numbers of these devices to their phones to support advanced features, such as voice command and noise suppression,” said Jérémie Bouchaud, director and senior principal analyst for MEMS & sensors at IHS.
“Multiple microphones now are being adopted in smartphones to cancel ambient sounds—crucial for handsets when carrying out voice command systems, such as Apple’s Siri. Apple has led the way in the adoption of MEMS microphone technology, and has steadily added the number of devices used in each of its mobile products, compelling competitors to follow suit.”
While midrange to high-end smartphones mostly used two microphones in 2010 and 2011, three microphones are fast becoming standard ever since Apple introduced a third device on the back of the iPhone 5 for high-definition video recording, Bouchaud noted.
Noise suppression and voice commands also are seeing increased adoption in tablets and Ultrabooks, resulting in the use of multiple microphones as ultrasonic transducers for hand-gesture commands.
Aside from handsets, MEMS microphones are used in other important applications such as headsets, gaming, cameras, televisions and hearing aids.
Top suppliers, in a nutshell
Knowles continued to dominate the MEMS microphone sphere, outflanking all other suppliers with revenue last year of $291 million—practically half of the industry total. But while it has the most comprehensive product portfolio and ships to virtually every original equipment manufacturer, Knowles has seen its MEMS microphone market share tumble by 16 percentage points from 2011 to 2012 because of erosion in its business with Apple.
Knowles is still the first supplier for the iPad mini, but has slipped to second place behind AAC in providing MEMS microphones for the iPhone.
Knowles, however, has exerted efforts to remain competitive, reducing the size of its MEMS die and most likely migrating soon to larger wafer sizes from 6 to 8 inches as it engages with new foundry partners.
No. 2 and No. 4 AAC and Goertek share similar profiles, both being Chinese electret condenser microphone (ECM) suppliers that now rely almost exclusively on MEMS die technology from Germany’s Infineon Technologies. AAC is the top source for the iPhone and iPad 3 with revenue last year of $98 million, while Goertek is No. 1 for iPhone headsets with $46 million in revenue. Apple was the biggest client in both cases, supplying more than 40 percent of MEMS microphone revenue in 2012 for each company.
Third-ranked Analog Devices basked in revenue of approximately $78 million, thanks to its role as lone supplier of the third microphone for the iPhone 5 and the iPad. The company focuses on high-performance parts and sells at significantly higher prices than other suppliers, accounting for its third-place finish overall.
Infineon’s strategy
Also in a notable development, Infineon has hit upon a successful formula for operating in the market. The German manufacturer focuses only on silicon, developing and then selling MEMS microphone dies as well as application-specific integrated circuits to traditional ECM companies, which then package the chips into MEMS microphones that are sold afterward under their individual brands. Infineon’s customers include AAC and Goertek, as well as two other Top 12 MEMS microphone suppliers—sixth-ranked Hosiden of Japan; and No. 7 BSE of South Korea.
STMicroelectronics on the rise
Rounding out the Top 5 and becoming a serious challenger last year to the incumbents was French-Italian manufacturer STMicroelectronics, which sold 60 million MEMS microphone units in 2012, up from zero in 2010.
Unlike AAC and Goertek that buy their MEMS dies from Infineon, STM sources from Omron Electronics in Japan and also relies on its own application-specific integrated circuit, producing innovatively assembled MEMS microphones that enable a high signal-to-noise ratio. Nokia is STM’s top customer, but STM also supplies product to HTC, Amazon’s Kindle tablet as well as laptops from HP, Dell, Lenovo and Asus.
The other ranking suppliers in the Top 12 provided MEMS microphones for a range of other electronic devices made by companies besides Apple. Hosiden supplied to Nintendo handheld game players and Sony handsets; BSE provided for Samsung and LG smartphones; Germany’s Bosch played mostly in the laptop segment for HP and Dell; and Scotland-based Wolfson Microelectronics broke through at the end of last year by supplying to the Microsoft Surface tablet.
New kids on MEMS block
The newcomers to watch included a clutch of Chinese companies. Among them were startups NeoMEMS and MEMSensing, as well as ECM manufacturers Gettop, XingGang and Kingstate. Other new entrants of note besides the Chinese included TDK-EPC from Germany, Solid State Systems from Taiwan, and Tokyo-based New Japan Radio.
Panasonic of Japan shipped MEMS microphones in 2007 for a limited time like fellow Japanese maker Yamaha, but then exited the market due to high costs. While the company had planned to return in 2011 with new product offerings, IHS believes that Panasonic has given up altogether on the MEMS microphone market.
Source: IHS iSuppli, USA.
Suppliers that had significant sales to Apple occupied the Top 4 MEMS microphone ranks in 2012, according to an IHS iSuppli MEMS & Sensors Special Report from information and analytics provider IHS.
These companies were No. 1 Knowles Electronics from Illinois, AAC of China in second place, Massachusetts-based Analog Devices in the third spot, and Goertek of China in fourth. Together the Top 4 players last year commanded combined revenue of $513 million, equivalent to 88 percent of total MEMS microphone industry revenue of $583 million.
“Microphones continue to be one of the best success stories in MEMS, with mobile device manufacturers adding increasing numbers of these devices to their phones to support advanced features, such as voice command and noise suppression,” said Jérémie Bouchaud, director and senior principal analyst for MEMS & sensors at IHS.
“Multiple microphones now are being adopted in smartphones to cancel ambient sounds—crucial for handsets when carrying out voice command systems, such as Apple’s Siri. Apple has led the way in the adoption of MEMS microphone technology, and has steadily added the number of devices used in each of its mobile products, compelling competitors to follow suit.”
While midrange to high-end smartphones mostly used two microphones in 2010 and 2011, three microphones are fast becoming standard ever since Apple introduced a third device on the back of the iPhone 5 for high-definition video recording, Bouchaud noted.
Noise suppression and voice commands also are seeing increased adoption in tablets and Ultrabooks, resulting in the use of multiple microphones as ultrasonic transducers for hand-gesture commands.
Aside from handsets, MEMS microphones are used in other important applications such as headsets, gaming, cameras, televisions and hearing aids.
Top suppliers, in a nutshell
Knowles continued to dominate the MEMS microphone sphere, outflanking all other suppliers with revenue last year of $291 million—practically half of the industry total. But while it has the most comprehensive product portfolio and ships to virtually every original equipment manufacturer, Knowles has seen its MEMS microphone market share tumble by 16 percentage points from 2011 to 2012 because of erosion in its business with Apple.
Knowles is still the first supplier for the iPad mini, but has slipped to second place behind AAC in providing MEMS microphones for the iPhone.
Knowles, however, has exerted efforts to remain competitive, reducing the size of its MEMS die and most likely migrating soon to larger wafer sizes from 6 to 8 inches as it engages with new foundry partners.
No. 2 and No. 4 AAC and Goertek share similar profiles, both being Chinese electret condenser microphone (ECM) suppliers that now rely almost exclusively on MEMS die technology from Germany’s Infineon Technologies. AAC is the top source for the iPhone and iPad 3 with revenue last year of $98 million, while Goertek is No. 1 for iPhone headsets with $46 million in revenue. Apple was the biggest client in both cases, supplying more than 40 percent of MEMS microphone revenue in 2012 for each company.
Third-ranked Analog Devices basked in revenue of approximately $78 million, thanks to its role as lone supplier of the third microphone for the iPhone 5 and the iPad. The company focuses on high-performance parts and sells at significantly higher prices than other suppliers, accounting for its third-place finish overall.
Infineon’s strategy
Also in a notable development, Infineon has hit upon a successful formula for operating in the market. The German manufacturer focuses only on silicon, developing and then selling MEMS microphone dies as well as application-specific integrated circuits to traditional ECM companies, which then package the chips into MEMS microphones that are sold afterward under their individual brands. Infineon’s customers include AAC and Goertek, as well as two other Top 12 MEMS microphone suppliers—sixth-ranked Hosiden of Japan; and No. 7 BSE of South Korea.
STMicroelectronics on the rise
Rounding out the Top 5 and becoming a serious challenger last year to the incumbents was French-Italian manufacturer STMicroelectronics, which sold 60 million MEMS microphone units in 2012, up from zero in 2010.
Unlike AAC and Goertek that buy their MEMS dies from Infineon, STM sources from Omron Electronics in Japan and also relies on its own application-specific integrated circuit, producing innovatively assembled MEMS microphones that enable a high signal-to-noise ratio. Nokia is STM’s top customer, but STM also supplies product to HTC, Amazon’s Kindle tablet as well as laptops from HP, Dell, Lenovo and Asus.
The other ranking suppliers in the Top 12 provided MEMS microphones for a range of other electronic devices made by companies besides Apple. Hosiden supplied to Nintendo handheld game players and Sony handsets; BSE provided for Samsung and LG smartphones; Germany’s Bosch played mostly in the laptop segment for HP and Dell; and Scotland-based Wolfson Microelectronics broke through at the end of last year by supplying to the Microsoft Surface tablet.
New kids on MEMS block
The newcomers to watch included a clutch of Chinese companies. Among them were startups NeoMEMS and MEMSensing, as well as ECM manufacturers Gettop, XingGang and Kingstate. Other new entrants of note besides the Chinese included TDK-EPC from Germany, Solid State Systems from Taiwan, and Tokyo-based New Japan Radio.
Panasonic of Japan shipped MEMS microphones in 2007 for a limited time like fellow Japanese maker Yamaha, but then exited the market due to high costs. While the company had planned to return in 2011 with new product offerings, IHS believes that Panasonic has given up altogether on the MEMS microphone market.
Source: IHS iSuppli, USA.
TI eases tablet design with interface ICs for connecting displays and keyboards
USA: Texas Instruments Inc. (TI) has introduced two new devices to ease design for tablet designers.
The TCA8424 is the industry's first human interface device (HID) over I2C, 128-key keyboard controller. It eliminates the need to program the device at production, simplifying design and speeding time-to-market. The keyboard controller provides a cost-effective and seamless way to interface keyboards with Windows® 8-based systems.
The SN65DSI85 is a digital serial interface (DSI) to FlatLink interface IC that makes it easier and more cost-effective for designers to connect graphics processors to LCD panels. The SN65DSI85 supports screen resolutions up to 2560 by 1600p in tablets, netbooks, and mobile Internet devices.
The TCA8424EVM showcases the capabilities and benefits of the TCA8424 in keyboard scanner applications. It can be ordered today for US$49. An IBIS model and user's guide are also available.
The TCA8424 is the industry's first human interface device (HID) over I2C, 128-key keyboard controller. It eliminates the need to program the device at production, simplifying design and speeding time-to-market. The keyboard controller provides a cost-effective and seamless way to interface keyboards with Windows® 8-based systems.
The SN65DSI85 is a digital serial interface (DSI) to FlatLink interface IC that makes it easier and more cost-effective for designers to connect graphics processors to LCD panels. The SN65DSI85 supports screen resolutions up to 2560 by 1600p in tablets, netbooks, and mobile Internet devices.
The TCA8424EVM showcases the capabilities and benefits of the TCA8424 in keyboard scanner applications. It can be ordered today for US$49. An IBIS model and user's guide are also available.
NXP acquires Code Red Technologies
USA & UK: NXP Semiconductors N.V. announced its acquisition of Code Red Technologies, an embedded software development tools provider, as a strategic addition to its microcontroller business line.
Code Red Technologies is recognized industry-wide for innovative tools enabling rapid development and debugging of full-featured applications for 32-bit ARM microcontrollers. These tools include the popular LPCXpresso IDE (integrated development environment) -- a very low-cost, end-to-end development platform for NXP LPC microcontrollers -- enabling embedded developers to develop applications from initial evaluation through to final production. The financial terms of the agreement were not disclosed.
LPCXpresso is based on Eclipse, with enhancements specific to LPC microcontrollers. Since its release in 2009, the LPCXpresso community has grown steadily, with over 66,000 unique software activations of the LPCXpresso IDE since January 2010.
"With LPCXpresso, NXP has built a strong foundation for a vibrant embedded development ecosystem around LPC microcontrollers. Bringing the Code Red team into our organization gives us the ability to jump-start our in-house software expertise, deliver world-class software libraries and integrated tools to our customers, and rapidly build on the momentum behind the LPCXpresso IDE," said Jim Trent, VP and GM, microcontroller business line, NXP Semiconductors.
"Joining forces with NXP enables us to focus on what we do best -- simplifying the development experience for customers through tools and software. Through closer integration, we'll also be able to bring our ARM and LPC experience into new market segments on a global scale, developing and tailoring software for specific applications and solutions," said John Rayfield, co-founder and CEO, Code Red Technologies.
Code Red Technologies is recognized industry-wide for innovative tools enabling rapid development and debugging of full-featured applications for 32-bit ARM microcontrollers. These tools include the popular LPCXpresso IDE (integrated development environment) -- a very low-cost, end-to-end development platform for NXP LPC microcontrollers -- enabling embedded developers to develop applications from initial evaluation through to final production. The financial terms of the agreement were not disclosed.
LPCXpresso is based on Eclipse, with enhancements specific to LPC microcontrollers. Since its release in 2009, the LPCXpresso community has grown steadily, with over 66,000 unique software activations of the LPCXpresso IDE since January 2010.
"With LPCXpresso, NXP has built a strong foundation for a vibrant embedded development ecosystem around LPC microcontrollers. Bringing the Code Red team into our organization gives us the ability to jump-start our in-house software expertise, deliver world-class software libraries and integrated tools to our customers, and rapidly build on the momentum behind the LPCXpresso IDE," said Jim Trent, VP and GM, microcontroller business line, NXP Semiconductors.
"Joining forces with NXP enables us to focus on what we do best -- simplifying the development experience for customers through tools and software. Through closer integration, we'll also be able to bring our ARM and LPC experience into new market segments on a global scale, developing and tailoring software for specific applications and solutions," said John Rayfield, co-founder and CEO, Code Red Technologies.
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