USA: Xilinx Inc. announced two major advances in productivity as part of a new major release of the Vivado Design Suite, the programmable industry's first SoC-strength design suite.
The Vivado Design Suite 2013.1 release includes a new IP-centric design environment for accelerating the time to system integration, and a comprehensive set of libraries to accelerate C/C++ system-level design and high-level synthesis (HLS).
To accelerate the creation of highly integrated, complex designs in All Programmable FPGA devices, Xilinx has delivered the early access release of the Vivado IP Integrator (IPI). Vivado IPI accelerates the integration of RTL, Xilinx IP, third party IP and C/C++ synthesized IP.
Based on industry standards such as the ARM AXI interconnect and IP-XACT metadata for IP packaging, Vivado IPI delivers intelligent correct-by-construction assembly of designs co-optimized with Xilinx All Programmable solutions. Built on the foundation of the Vivado Design Suite, IP Integrator is a device and platform aware interactive, graphical and scriptable environment that supports IP-aware automated AXI interconnect, one-click IP subsystem generation, real-time DRC, interface change propagation, and a powerful debug capability.
When targeting a Zynq-7000 All Programmable SoC, embedded design teams can now more rapidly identify, reuse, and integrate both software and hardware IP targeted for the dual-core ARM processing system and high performance FPGA fabric.
To accelerate C/C++ system level design and high-level synthesis (HLS), Xilinx has enhanced its Vivado HLS libraries with support for industry standard floating point math.h operations and real-time video processing functions. Over 350 active users and 1000+ customers evaluating Vivado HLS will now have immediate access to video processing functions integrated into an OpenCV environment for embedded vision running on the dual-core ARM processing system.
The resulting solution enables up to a 100X performance improvement of existing C/C++ algorithms through hardware acceleration. At the same time, Vivado HLS accelerates system verification and implementation times by up to a 100X compared to RTL design entry flows.
When targeting a Zynq-7000 All Programmable SoC, design teams can now more rapidly develop C/C++ code for the dual-core ARM processing system, while compute intensive functions are automatically accelerated in the high performance FPGA fabric.
Wednesday, April 3, 2013
Microsemi unveils high-performance clock management semiconductor timing solutions
USA: Microsemi Corp. has unveiled the dual-channel ZL30240 and single-channel ZL30241 clock generators for multiple applications including communications equipment, enterprise routers and switches, storage area network equipment, and servers.
"With our new clock generators, designers no longer need to rely on expensive oscillators to get high speed output clocks with outstanding jitter performance, flexibility and dependable performance," said Maamoun Seido, VP and business unit manager of Microsemi's timing products.
"The addition of these new generators, coupled with the launch of our first clock buffer family last year, further solidifies our leadership position in timing and synchronization semiconductor solutions. This market segment remains a key area of focus and investment for Microsemi."
Market research firm Databeans estimates the clock generation integrated circuit market to be over $700 million in 2012.
Traditionally, fundamental speed oscillators have a limitation in the range of 50 megahertz (MHz) and third overtone options have a limitation in the range of 150 MHz. Designers depend on analog phase locked loops (APLLs) to multiply low frequency signals and generate the desired high frequencies. The quality of the output signal depends on the performance of the APLL. To achieve high performance, designers are forced to use high cost APLLs, as high performance drives a higher APLL cost.
Microsemi's new, small footprint, high-performance clock generators can generate high frequency output clocks with very low jitter, low power consumption. The dual-channel or single-channel variants feature numerically controlled oscillators (NCO) that can generate any frequency with fine tunability of 0.1ppb (parts per billion).
The new clock generators improve reliability, simplify product development efforts, lower bill-of-material costs and are well-suited for cost-sensitive applications with high performance requirements.
"With our new clock generators, designers no longer need to rely on expensive oscillators to get high speed output clocks with outstanding jitter performance, flexibility and dependable performance," said Maamoun Seido, VP and business unit manager of Microsemi's timing products.
"The addition of these new generators, coupled with the launch of our first clock buffer family last year, further solidifies our leadership position in timing and synchronization semiconductor solutions. This market segment remains a key area of focus and investment for Microsemi."
Market research firm Databeans estimates the clock generation integrated circuit market to be over $700 million in 2012.
Traditionally, fundamental speed oscillators have a limitation in the range of 50 megahertz (MHz) and third overtone options have a limitation in the range of 150 MHz. Designers depend on analog phase locked loops (APLLs) to multiply low frequency signals and generate the desired high frequencies. The quality of the output signal depends on the performance of the APLL. To achieve high performance, designers are forced to use high cost APLLs, as high performance drives a higher APLL cost.
Microsemi's new, small footprint, high-performance clock generators can generate high frequency output clocks with very low jitter, low power consumption. The dual-channel or single-channel variants feature numerically controlled oscillators (NCO) that can generate any frequency with fine tunability of 0.1ppb (parts per billion).
The new clock generators improve reliability, simplify product development efforts, lower bill-of-material costs and are well-suited for cost-sensitive applications with high performance requirements.
Accellera launches working group to standardize interoperability of multiple language verification environments and components
USA: Accellera Systems Initiative (Accellera), an independent non-profit organization focused on the creation and adoption of electronic design automation (EDA) and intellectual property (IP) standards for design and verification, announced the formation of a new Multi-language Working Group (MLWG).
The mission of the MLWG is to create a standard and functional reference for interoperability of multi-language verification environments and components. Accellera is calling for participation in the newly formed group. Accellera members and the industry at large are invited to join the standardization initiative.
The MLWG will consolidate industry requirements and develop a standards-based approach to combine verification environments built in different languages. In addition, a proof-of-concept implementation is proposed to accompany the standard.
The MLWG will also look at ways to enable the introduction of UVM (Universal Verification Methodology) concepts in other environments and languages that come from legacy projects. The UVM standard improves interoperability and reduces the cost of repurchasing and rewriting IP for each new project or electronic design automation tool. It also makes it easier to reuse verification components.
“We are excited about the formation of the Multi-language Working Group,” said Shishpal Rawat, chair of Accellera Systems Initiative. “This is a natural extension of a universal verification methodology by which legacy verification IP can be used natively. It preserves the industry's investment in verification IP for modules that have already been designed and verified in non-native simulation environments. It alleviates the need for redeveloping verification IP and allows development teams to focus on verification IP for new IP modules."
“SoC designs involve integrating pieces of verification environments that are often implemented with different technologies,” said Warren Stapleton, chair of the Multi-language Working Group. “We look forward to the development of a more standardized approach to combining these systems and expanding the influence of the universal verification methodology at the same time.”
In addition to its own technical initiatives and working groups, Accellera supports the activities of IEEE standards including IEEE 1076 VHDL, IEEE 1666 SystemC, IEEE 1685 IP-XACT 2009, IEEE P1735 Encryption and Management of IP, IEEE 1800 SystemVerilog, IEEE 1801 Unified Power Format (UPF) and IEEE 1850 Property Specification Language (PSL).
The mission of the MLWG is to create a standard and functional reference for interoperability of multi-language verification environments and components. Accellera is calling for participation in the newly formed group. Accellera members and the industry at large are invited to join the standardization initiative.
The MLWG will consolidate industry requirements and develop a standards-based approach to combine verification environments built in different languages. In addition, a proof-of-concept implementation is proposed to accompany the standard.
The MLWG will also look at ways to enable the introduction of UVM (Universal Verification Methodology) concepts in other environments and languages that come from legacy projects. The UVM standard improves interoperability and reduces the cost of repurchasing and rewriting IP for each new project or electronic design automation tool. It also makes it easier to reuse verification components.
“We are excited about the formation of the Multi-language Working Group,” said Shishpal Rawat, chair of Accellera Systems Initiative. “This is a natural extension of a universal verification methodology by which legacy verification IP can be used natively. It preserves the industry's investment in verification IP for modules that have already been designed and verified in non-native simulation environments. It alleviates the need for redeveloping verification IP and allows development teams to focus on verification IP for new IP modules."
“SoC designs involve integrating pieces of verification environments that are often implemented with different technologies,” said Warren Stapleton, chair of the Multi-language Working Group. “We look forward to the development of a more standardized approach to combining these systems and expanding the influence of the universal verification methodology at the same time.”
In addition to its own technical initiatives and working groups, Accellera supports the activities of IEEE standards including IEEE 1076 VHDL, IEEE 1666 SystemC, IEEE 1685 IP-XACT 2009, IEEE P1735 Encryption and Management of IP, IEEE 1800 SystemVerilog, IEEE 1801 Unified Power Format (UPF) and IEEE 1850 Property Specification Language (PSL).
ST embraces new RF front-end standard
SWITZERLAND: STMicroelectronics has embraced the new RF front-end standard.
The STHVDAC-304MF3 antenna-tuning circuit has a 4-channel output for adjusting up to four tunable BST capacitors in the antenna-matching circuits of multi-band GSM/WCDMA/3G-LTE smartphones. A key feature is support for the MIPI Alliance RF Front End (RFFE), an emerging industry standard that simplifies cellular radio design.
The STHVDAC-304MF3 is controlled via an RFFE-compliant 1.8V interface, and comprises a High-Voltage Digital-Analog Converter (HVDAC) for generating capacitor-tuning voltages from 2V to 20V. Features include a trigger mode for time critical application, and a shutdown mode allowing longer battery life. This new device joins ST’s 3-channel STHVDAC-303, which has a standard SPI host connection.
The device is in production in a 0.4mm-pitch, 0.6mm-high, chip-scale package. Pricing is from $0.50 for orders over 1,000 units. Samples are available immediately.
The STHVDAC-304MF3 antenna-tuning circuit has a 4-channel output for adjusting up to four tunable BST capacitors in the antenna-matching circuits of multi-band GSM/WCDMA/3G-LTE smartphones. A key feature is support for the MIPI Alliance RF Front End (RFFE), an emerging industry standard that simplifies cellular radio design.
The STHVDAC-304MF3 is controlled via an RFFE-compliant 1.8V interface, and comprises a High-Voltage Digital-Analog Converter (HVDAC) for generating capacitor-tuning voltages from 2V to 20V. Features include a trigger mode for time critical application, and a shutdown mode allowing longer battery life. This new device joins ST’s 3-channel STHVDAC-303, which has a standard SPI host connection.
The device is in production in a 0.4mm-pitch, 0.6mm-high, chip-scale package. Pricing is from $0.50 for orders over 1,000 units. Samples are available immediately.
Tuesday, April 2, 2013
EDA Consortium reports 4.6 percent revenue increase for Q4 2012
USA: The EDA Consortium (EDAC) Market Statistics Service (MSS) announced that the Electronic Design Automation (EDA) industry revenue increased 4.6 percent for Q4 2012 to $1,779.1 million, compared to $1,700.1 million in Q4 2011.
Sequential EDA revenue for Q4 2012 increased 9.8 percent compared to Q3 2012, while the four-quarters moving average, which compares the most recent four quarters to the prior four quarters, increased by 6.7 percent.
“The EDA industry finished 2012 with a record quarter,” said Walden C. Rhines, board sponsor for the EDAC MSS and chairman and CEO of Mentor Graphics. “CAE, IP and PCB were all strong, with PCB at 19.5 percent growth more than double that of any other major category. Geographically, all of the regions reported positive growth, with the Europe/Middle East/Africa region leading the way.”
Companies that were tracked employed 29,578 professionals in Q4 2012, an increase of 7.1 percent compared to the 27,623 people employed in Q4 2011, and up 2.4 percent compared to Q3 2012.
Revenue by product category
The largest category, Computer Aided Engineering (CAE), generated revenue of $693.0 million in Q4 2012, which represents a 7.5 percent increase over Q4 2011. The four-quarters moving average for CAE increased 9.8 percent.
IC Physical Design & Verification revenue decreased to $360.4 million in Q4 2012, an 8.2 percent decrease compared to Q4 2011. The four-quarters moving average increased 2.2 percent.
Printed Circuit Board and Multi-Chip Module (PCB & MCM) revenue of $167.0 million represents an increase of 19.5 percent compared to Q4 2011. The four-quarters moving average for PCB & MCM increased 7.6 percent.
Semiconductor Intellectual Property (SIP) revenue totaled $467.4 million in Q4 2012, an 8.1 percent increase compared to Q4 2011. The four-quarters moving average increased 7.7 percent.
Services revenue was $91.3 million in Q4 2012, an increase of 0.5 percent compared to Q4 2011. The four-quarters moving average decreased 3.0 percent.
Revenue by region
The Americas, EDA’s largest region, purchased $767.1 million of EDA products and services in Q4 2012, an increase of 5.6 percent compared to Q4 2011. The four-quarters moving average for the Americas increased 7.4 percent.
Revenue in Europe, the Middle East, and Africa (EMEA) was up 8.1 percent in Q4 2012 compared to Q4 2011 on revenues of $331 million. The EMEA four-quarters moving average increased 6.8 percent.
Fourth quarter 2012 revenue from Japan increased 4.4 percent to $259.1 million compared to Q4 2011. The four-quarters moving average for Japan decreased 3 percent.
The Asia/Pacific (APAC) region revenue increased to $421.8 million in Q4 2012, an increase of 0.5 percent compared to the fourth quarter in 2011. The four-quarters moving average increased 12.5 percent.
Sequential EDA revenue for Q4 2012 increased 9.8 percent compared to Q3 2012, while the four-quarters moving average, which compares the most recent four quarters to the prior four quarters, increased by 6.7 percent.
“The EDA industry finished 2012 with a record quarter,” said Walden C. Rhines, board sponsor for the EDAC MSS and chairman and CEO of Mentor Graphics. “CAE, IP and PCB were all strong, with PCB at 19.5 percent growth more than double that of any other major category. Geographically, all of the regions reported positive growth, with the Europe/Middle East/Africa region leading the way.”
Companies that were tracked employed 29,578 professionals in Q4 2012, an increase of 7.1 percent compared to the 27,623 people employed in Q4 2011, and up 2.4 percent compared to Q3 2012.
Revenue by product category
The largest category, Computer Aided Engineering (CAE), generated revenue of $693.0 million in Q4 2012, which represents a 7.5 percent increase over Q4 2011. The four-quarters moving average for CAE increased 9.8 percent.
IC Physical Design & Verification revenue decreased to $360.4 million in Q4 2012, an 8.2 percent decrease compared to Q4 2011. The four-quarters moving average increased 2.2 percent.
Printed Circuit Board and Multi-Chip Module (PCB & MCM) revenue of $167.0 million represents an increase of 19.5 percent compared to Q4 2011. The four-quarters moving average for PCB & MCM increased 7.6 percent.
Semiconductor Intellectual Property (SIP) revenue totaled $467.4 million in Q4 2012, an 8.1 percent increase compared to Q4 2011. The four-quarters moving average increased 7.7 percent.
Services revenue was $91.3 million in Q4 2012, an increase of 0.5 percent compared to Q4 2011. The four-quarters moving average decreased 3.0 percent.
Revenue by region
The Americas, EDA’s largest region, purchased $767.1 million of EDA products and services in Q4 2012, an increase of 5.6 percent compared to Q4 2011. The four-quarters moving average for the Americas increased 7.4 percent.
Revenue in Europe, the Middle East, and Africa (EMEA) was up 8.1 percent in Q4 2012 compared to Q4 2011 on revenues of $331 million. The EMEA four-quarters moving average increased 6.8 percent.
Fourth quarter 2012 revenue from Japan increased 4.4 percent to $259.1 million compared to Q4 2011. The four-quarters moving average for Japan decreased 3 percent.
The Asia/Pacific (APAC) region revenue increased to $421.8 million in Q4 2012, an increase of 0.5 percent compared to the fourth quarter in 2011. The four-quarters moving average increased 12.5 percent.
Spreadtrum announces commercial launch of dual-core smartphone chipsets for TD-SCDMA and EDGE
CHINA: Spreadtrum Communications Inc. announced the commercial availability of its dual-core 1.2GHz smartphone chipsets for TD-SCDMA (SC8825) and EDGE (SC6825), following the successful qualification of its platform by China Mobile.
"With our new dual-core chipsets, Spreadtrum has leveraged our expertise in system design to deliver the lowest-cost dual-core platform in combination with high end graphics performance for the TD-SCDMA and EDGE markets," said Dr. Leo Li , chairman and CEO of Spreadtrum. "This combination of low-cost architecture, standout graphics performance, and best-in-class TD-SCDMA technology provides smartphone designers with unprecedented value in bringing high end features to low-cost devices."
Spreadtrum's SC8825, which supports dual-mode TD-SCDMA/HSPA and EDGE/GPRS/GSM and the SC6825, which supports EDGE/GPRS/GSM, are based on a highly efficient multi-core architecture delivering the lowest cost platform available for dual-core TD-SCDMA and EDGE smartphone products.
The single-chip chipsets integrate a dual-core 1.2GHz Cortex-A5 core processor, a dual-core Mali 400 graphics processor and multimedia and hardware accelerators for differentiated performance and user experience. Both chipsets are further paired with a single-chip mutimode RF transceiver for a high level of integration and are pin-to-pin compatible, enabling handset makers to leverage a common handset development effort for products shipping to China as well as to emerging markets.
In addition to their high level of integration and low-cost architecture, Spreadtrum's chipsets further deliver standout graphics performance. The solutions' powerful graphics processing capability enhances the user experience for games and other graphics-rich applications, and enables Spreadtrum to bring high end features such as the larger screen sizes more commonly found in premium smartphones to low-cost devices.
"The benchmark results we are achieving for our dual-core solution, measured by popular benchmark programs such as AnTuTu and GLBenchmark 2.5, significantly outperform other commercial dual-core products," added Dr. Li. "This powerful processing capability provides our customers with an even more cost-effective and power-efficient way to deliver high end features in low-cost smartphones."
Other features of Spreadtrum's SC8825 and SC6825 chipsets include support for HD 1280x720 LCD display, H.264 720p video playback, up to 8 megapixel RGB camera and dual-SIM, dual-standby capability. The chipsets ship with turnkey Android and systems software, reducing the engineering time and resources required by handset makers to bring devices to market, with reference implementations available for both 4-layer and 6-layer PCB layouts.
The SC8825 and SC6825 are commercially available now. The chipsets have already been incorporated by leading China handset makers into smartphone models that are expected to ship commercially during 2Q 2013.
"With our new dual-core chipsets, Spreadtrum has leveraged our expertise in system design to deliver the lowest-cost dual-core platform in combination with high end graphics performance for the TD-SCDMA and EDGE markets," said Dr. Leo Li , chairman and CEO of Spreadtrum. "This combination of low-cost architecture, standout graphics performance, and best-in-class TD-SCDMA technology provides smartphone designers with unprecedented value in bringing high end features to low-cost devices."
Spreadtrum's SC8825, which supports dual-mode TD-SCDMA/HSPA and EDGE/GPRS/GSM and the SC6825, which supports EDGE/GPRS/GSM, are based on a highly efficient multi-core architecture delivering the lowest cost platform available for dual-core TD-SCDMA and EDGE smartphone products.
The single-chip chipsets integrate a dual-core 1.2GHz Cortex-A5 core processor, a dual-core Mali 400 graphics processor and multimedia and hardware accelerators for differentiated performance and user experience. Both chipsets are further paired with a single-chip mutimode RF transceiver for a high level of integration and are pin-to-pin compatible, enabling handset makers to leverage a common handset development effort for products shipping to China as well as to emerging markets.
In addition to their high level of integration and low-cost architecture, Spreadtrum's chipsets further deliver standout graphics performance. The solutions' powerful graphics processing capability enhances the user experience for games and other graphics-rich applications, and enables Spreadtrum to bring high end features such as the larger screen sizes more commonly found in premium smartphones to low-cost devices.
"The benchmark results we are achieving for our dual-core solution, measured by popular benchmark programs such as AnTuTu and GLBenchmark 2.5, significantly outperform other commercial dual-core products," added Dr. Li. "This powerful processing capability provides our customers with an even more cost-effective and power-efficient way to deliver high end features in low-cost smartphones."
Other features of Spreadtrum's SC8825 and SC6825 chipsets include support for HD 1280x720 LCD display, H.264 720p video playback, up to 8 megapixel RGB camera and dual-SIM, dual-standby capability. The chipsets ship with turnkey Android and systems software, reducing the engineering time and resources required by handset makers to bring devices to market, with reference implementations available for both 4-layer and 6-layer PCB layouts.
The SC8825 and SC6825 are commercially available now. The chipsets have already been incorporated by leading China handset makers into smartphone models that are expected to ship commercially during 2Q 2013.
TI's advanced haptic driver makes adding tactile feedback to consumer and industrial products easy
USA: Texas Instruments Inc. (TI) introduced a haptic driver that makes it easy to add realistic tactile feedback effects to consumer and industrial products, such as smartphones, tablets, ebooks, refrigerators, microwave ovens and washing machines.
The DRV2605 is the only eccentric rotating mass actuator (ERM) and linear resonant actuator (LRA) haptic driver pre-loaded with a library of 123 distinct haptic effects designed and licensed by Immersion, the leading developer and licensor of touch feedback technology.
The DRV2605 also features a smart loop architecture that reduces startup and braking time by half, delivers twice the vibration strength, and consumes 50-percent less power to extend battery life, compared to competitive solutions.
Key features and benefits of the DRV2605
Reduced system complexity: The pre-loaded Immersion haptic effects library offers a range of distinct and differentiated tactile effects for touch screen feedback, giving users a more satisfying and realistic experience.
Audio-to-haptics mode: Automatically converts audio from music, movies or games into haptic effects. The audio mode adds a vibrating bass enhancement that allows users to feel and fully experience audio and video content.
Smart loop architecture: Offers automatic overdriving and braking for ERMs and LRAs, which simplifies software programming and reduces startup and braking time by 50 percent. Automatic resonance tracking for the LRA delivers twice the vibration force at half the power of competitive solutions. In addition, the automatic actuator diagnostics and level tracking feature delivers consistent acceleration over a range of environmental conditions.
Smallest solution size: At 1.5-mm by 1.5-mm, the DRV2605 offers designers the industry's smallest package for space-constrained portable applications.
Complete touch solution: The DRV2605 combines with any member of TI's touch screen controller family to create a complete touch screen solution.
The DRV2605 joins the DRV2604 ERM/LRA haptic driver, which shares the same core and industry-leading performance and power-saving features, minus the audio-to-haptics mode and Immersion haptic effects library.
The DRV2605 is the only eccentric rotating mass actuator (ERM) and linear resonant actuator (LRA) haptic driver pre-loaded with a library of 123 distinct haptic effects designed and licensed by Immersion, the leading developer and licensor of touch feedback technology.
The DRV2605 also features a smart loop architecture that reduces startup and braking time by half, delivers twice the vibration strength, and consumes 50-percent less power to extend battery life, compared to competitive solutions.
Key features and benefits of the DRV2605
Reduced system complexity: The pre-loaded Immersion haptic effects library offers a range of distinct and differentiated tactile effects for touch screen feedback, giving users a more satisfying and realistic experience.
Audio-to-haptics mode: Automatically converts audio from music, movies or games into haptic effects. The audio mode adds a vibrating bass enhancement that allows users to feel and fully experience audio and video content.
Smart loop architecture: Offers automatic overdriving and braking for ERMs and LRAs, which simplifies software programming and reduces startup and braking time by 50 percent. Automatic resonance tracking for the LRA delivers twice the vibration force at half the power of competitive solutions. In addition, the automatic actuator diagnostics and level tracking feature delivers consistent acceleration over a range of environmental conditions.
Smallest solution size: At 1.5-mm by 1.5-mm, the DRV2605 offers designers the industry's smallest package for space-constrained portable applications.
Complete touch solution: The DRV2605 combines with any member of TI's touch screen controller family to create a complete touch screen solution.
The DRV2605 joins the DRV2604 ERM/LRA haptic driver, which shares the same core and industry-leading performance and power-saving features, minus the audio-to-haptics mode and Immersion haptic effects library.
Ittiam Systems announces availability of new solutions for ABR, audio loudness and video monitoring
INDIA: Ittiam Systems announced the availability of new solutions, offered as Software Development Kits (SDKs), adding to the current portfolio of solutions for content distribution and delivery in the broadcast market.
These new SDKs are available for high density/high definition (HD) decoding for in-studio multi-viewer and monitoring applications, CALM Act compliant Loudness Measurement and Leveling (LML) solution and audio/video Adaptive Bitrate Streaming (ABR) with support for HTTP Live Streaming (HLS) and Dynamic Adaptive Streaming over HTTP (MPEG-DASH).
Targeting the fast growing OTT/second screen delivery systems, Ittiam Systems' new Adaptive Bit Rate (ABR) SDK provides a comprehensive implementation of server systems with support for both HTTP Live Streaming (HLS) as well as MPEG-DASH.
Utilizing powerful built-in hardware support for video compression and pre-processing on the DaVinci TMS320DM816x video processor from Texas Instruments (TI), the system can support high-channel density transcoding/encoding of HD content to tablets and phones. The Ittiam ABR SDK solution can be completed with a ready to install client for Android devices.
Ittiam Systems' field proven high density, multi-format audio transcoding solution is now enhanced with CALM/EBU R-128 complaint audio loudness monitoring and leveling capabilities, implemented on TI's TMS320C667x (C667x) DSP. The solution is built on an efficient multicore framework that enables efficient scheduling of multiple audio transcodes on many cores achieving best channel densities.
Also available is a new video decode SDK on TI's DM816x DaVinci video processor, capable of realizing multiple HD decodes for video wall and monitoring applications.
The SDKs are complemented by Ittiam Systems' next generation neonCaster Hardware Platform, which offers a modular and flexible approach to building hardware for broadcast equipment.
"TI's broad range of video processors combined with Ittiam Systems' rich technology provides customers with a complete, easy-to-use solution," said Atul Verma , business manager, video and audio infrastructure, TI. "We are happy to once again collaborate with a leader in this space that is committed to enabling advanced broadcast applications, as well as ABR, HLS and MPEG-DASH."
These new SDKs are available for high density/high definition (HD) decoding for in-studio multi-viewer and monitoring applications, CALM Act compliant Loudness Measurement and Leveling (LML) solution and audio/video Adaptive Bitrate Streaming (ABR) with support for HTTP Live Streaming (HLS) and Dynamic Adaptive Streaming over HTTP (MPEG-DASH).
Targeting the fast growing OTT/second screen delivery systems, Ittiam Systems' new Adaptive Bit Rate (ABR) SDK provides a comprehensive implementation of server systems with support for both HTTP Live Streaming (HLS) as well as MPEG-DASH.
Utilizing powerful built-in hardware support for video compression and pre-processing on the DaVinci TMS320DM816x video processor from Texas Instruments (TI), the system can support high-channel density transcoding/encoding of HD content to tablets and phones. The Ittiam ABR SDK solution can be completed with a ready to install client for Android devices.
Ittiam Systems' field proven high density, multi-format audio transcoding solution is now enhanced with CALM/EBU R-128 complaint audio loudness monitoring and leveling capabilities, implemented on TI's TMS320C667x (C667x) DSP. The solution is built on an efficient multicore framework that enables efficient scheduling of multiple audio transcodes on many cores achieving best channel densities.
Also available is a new video decode SDK on TI's DM816x DaVinci video processor, capable of realizing multiple HD decodes for video wall and monitoring applications.
The SDKs are complemented by Ittiam Systems' next generation neonCaster Hardware Platform, which offers a modular and flexible approach to building hardware for broadcast equipment.
"TI's broad range of video processors combined with Ittiam Systems' rich technology provides customers with a complete, easy-to-use solution," said Atul Verma , business manager, video and audio infrastructure, TI. "We are happy to once again collaborate with a leader in this space that is committed to enabling advanced broadcast applications, as well as ABR, HLS and MPEG-DASH."
GLOBALFOUNDRIES demos 3D TSV capabilities on 20nm technology
USA: GLOBALFOUNDRIES announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 campus in Saratoga County, N.Y., the company has demonstrated its first functional 20nm silicon wafers with integrated Through-Silicon Vias (TSVs).
Manufactured using GLOBALFOUNDRIES’ leading-edge 20nm-LPM process technology, the TSV capabilities will allow customers to stack multiple chips on top of each other, providing another avenue for delivering the demanding performance, power, and bandwidth requirements of today’s electronic devices.
TSVs are vertical vias etched in a silicon wafer that are filled with a conducting material, enabling communication between vertically stacked integrated circuits. The adoption of three-dimensional (3D) chip stacking is increasingly being viewed as an alternative to traditional technology node scaling at the transistor level. However, TSVs present a number of new challenges to semiconductor manufacturers.
GLOBALFOUNDRIES utilizes a “via-middle” approach to TSV integration, inserting the TSVs into the silicon after the wafers have completed the Front End of the Line (FEOL) flow and prior to starting the Back End of the Line (BEOL) process. This approach avoids the high temperatures of the FEOL manufacturing process, allowing the use of copper as the TSV fill material.
To overcome the challenges associated with the migration of TSV technology from 28nm to 20nm, GLOBALFOUNDRIES engineers have developed a proprietary contact protection scheme. This scheme enabled the company to integrate the TSVs with minimal disruption to the 20nm-LPM platform technology, demonstrating SRAM functionality with critical device characteristics in line with those of standard 20nm-LPM silicon.
“Our industry has been talking about the promise of 3D chip stacking for years, but this development is another sign that the promise will soon be a reality,” said David McCann, VP of packaging R&D at GLOBALFOUNDRIES. “Our next step is to leverage Fab 8’s advanced TSV capabilities in conjunction with our OSAT partners to assemble and qualify 3D test vehicles for our open supply chain model, providing customers with the flexibility to choose their preferred back-end supply chain.”
As the fabless-foundry business model evolves to address the realities of today’s dynamic market, foundries are taking on increasing responsibility for managing the supply chain to deliver end-to-end solutions that meet the requirements of the broad range of leading-edge designs.
To help address these challenges, GLOBALFOUNDRIES is engaging early with partners to jointly develop solutions that will enable the next wave of innovation in the industry. This open and collaborative approach will give customers maximum choice and flexibility, while delivering cost savings, faster time-to-volume, and a reduction in the technical risk associated with developing new technologies.
Manufactured using GLOBALFOUNDRIES’ leading-edge 20nm-LPM process technology, the TSV capabilities will allow customers to stack multiple chips on top of each other, providing another avenue for delivering the demanding performance, power, and bandwidth requirements of today’s electronic devices.
TSVs are vertical vias etched in a silicon wafer that are filled with a conducting material, enabling communication between vertically stacked integrated circuits. The adoption of three-dimensional (3D) chip stacking is increasingly being viewed as an alternative to traditional technology node scaling at the transistor level. However, TSVs present a number of new challenges to semiconductor manufacturers.
GLOBALFOUNDRIES utilizes a “via-middle” approach to TSV integration, inserting the TSVs into the silicon after the wafers have completed the Front End of the Line (FEOL) flow and prior to starting the Back End of the Line (BEOL) process. This approach avoids the high temperatures of the FEOL manufacturing process, allowing the use of copper as the TSV fill material.
To overcome the challenges associated with the migration of TSV technology from 28nm to 20nm, GLOBALFOUNDRIES engineers have developed a proprietary contact protection scheme. This scheme enabled the company to integrate the TSVs with minimal disruption to the 20nm-LPM platform technology, demonstrating SRAM functionality with critical device characteristics in line with those of standard 20nm-LPM silicon.
“Our industry has been talking about the promise of 3D chip stacking for years, but this development is another sign that the promise will soon be a reality,” said David McCann, VP of packaging R&D at GLOBALFOUNDRIES. “Our next step is to leverage Fab 8’s advanced TSV capabilities in conjunction with our OSAT partners to assemble and qualify 3D test vehicles for our open supply chain model, providing customers with the flexibility to choose their preferred back-end supply chain.”
As the fabless-foundry business model evolves to address the realities of today’s dynamic market, foundries are taking on increasing responsibility for managing the supply chain to deliver end-to-end solutions that meet the requirements of the broad range of leading-edge designs.
To help address these challenges, GLOBALFOUNDRIES is engaging early with partners to jointly develop solutions that will enable the next wave of innovation in the industry. This open and collaborative approach will give customers maximum choice and flexibility, while delivering cost savings, faster time-to-volume, and a reduction in the technical risk associated with developing new technologies.
IXYS intros smallest footprint surface mount package for 1.2KV to 1.8KV power semiconductors
SWITZERLAND: IXYS Corp. has announced the D2-Pak (TO-263) and D3-Pak (TO-268) packages with higher ‘creepage’ spacing which enables higher voltage power semiconductors to be used in these Surface Mount Devices (SMD).
Jeroen van Zeeland, head of marketing at IXYS Germany, said: “The market demands smaller footprint solutions for 1.2KV to 1.8KV power semiconductors. The main reason for this is the higher power demands which are realized by higher voltages instead of higher current. By using a higher voltage the conduction losses in copper wires are less for power control circuits; therefore, thinner copper conductors or traces on PCB circuits can be used. These SMDs improve energy efficiency, reduce cost, reduce size and reduce weight when used in power electronics.”
SMDs are preferred for lower cost alternatives to modules and to other bulkier discrete components in integrated power designs. Until now there was no such solution for applications higher than 1.2KV. The new IXYS D2-Pak and D3-Pak designs now offer the standard footprint, but with compliance to the high voltage ‘creepage’ specifications.
For D3-Pak the creepage distance between the terminal to the copper of the backside is greater than or equal to 5.80 mm. The same value for the D2-Pak is greater than or equal to 4.70 mm. This enables the use of 1.2KV D3-Pak in pollution degree 2 industrial designs. In addition to industrial power control applications, these devices target other 1.2KV to 1.8KV power supply, UPS, renewable energy, motor drives and medical applications.
Jeroen van Zeeland, head of marketing at IXYS Germany, said: “The market demands smaller footprint solutions for 1.2KV to 1.8KV power semiconductors. The main reason for this is the higher power demands which are realized by higher voltages instead of higher current. By using a higher voltage the conduction losses in copper wires are less for power control circuits; therefore, thinner copper conductors or traces on PCB circuits can be used. These SMDs improve energy efficiency, reduce cost, reduce size and reduce weight when used in power electronics.”
SMDs are preferred for lower cost alternatives to modules and to other bulkier discrete components in integrated power designs. Until now there was no such solution for applications higher than 1.2KV. The new IXYS D2-Pak and D3-Pak designs now offer the standard footprint, but with compliance to the high voltage ‘creepage’ specifications.
For D3-Pak the creepage distance between the terminal to the copper of the backside is greater than or equal to 5.80 mm. The same value for the D2-Pak is greater than or equal to 4.70 mm. This enables the use of 1.2KV D3-Pak in pollution degree 2 industrial designs. In addition to industrial power control applications, these devices target other 1.2KV to 1.8KV power supply, UPS, renewable energy, motor drives and medical applications.
High-value MEMS market growth slows because of weak medical electronics and industrial sectors
USA: The high-value microelectromechanical system (MEMS) market experienced soft growth last year, mainly due to weakness in the mainstay medical electronics and industrial sectors, according to an IHS iSuppli MEMS High-Value MEMS Market Tracker Report.
Revenue in 2012 for high-value MEMS, a market characterized by the lofty average selling prices compared to other MEMS devices, amounted to $1.63 billion, equivalent to growth of 6.5 percent from $1.53 billion in 2011. While revenue was up, growth was noticeably down from the 12.5 percent expansion of 2011.
This year will see a slightly improved 7.4 percent increase to $1.8 billion as the industry starts to recover during the second half. Growth then picks up by 2014 and rises to 10.3 percent, with 2015 and 2016 also forecast to experience solid upturns north of 9.0 percent, as shown in the attached figure.
“The high-value MEMS market last year suffered a deceleration in growth because of continuing slow sales in medical electronics as well as a broad-based downturn in the industrial segment,” said Richard Dixon, Ph.D., principal analyst for MEMS & Sensors at IHS.
“In medical electronics, the market performance has been sluggish for the last 18 months, echoing global economic uncertainties. The same macroeconomic headwinds also curtailed end-user demand in industrial electronics semiconductors, inflicting further pain. The high-value MEMS market was aided slightly by strong performance in the telecom, aerospace, and oil and gas sectors, which served to ameliorate the negative effects of the slow-moving sectors.”
Higher growth expected for high-value MEMS
Despite the diminished growth of 2012, the high-value MEMS market remains the second-fastest-expanding area in the broader MEMS space, coming in after the mobile and consumer market but leading the data processing and automotive segments. High-value MEMS accounted for 19 percent of the total MEMS industry last year, despite extreme fragmentation of the space with well over 100 suppliers.
The average selling prices of sensors used in high-value MEMS are also much higher than the prices of sensors used in other MEMS segments, which gives the high-value MEMS industry its strength and importance.
Results sluggish in most high-value MEMS segments
Six sectors make up approximately 95 percent of the high-value MEMS market. The largest is medical electronics, accounting for more than 80 percent of total high-value MEMS shipments last year.
The majority of medical electronics sensors are used for diagnostics, patient monitoring and therapy.
For instance, tens of millions of pressure sensors are used and thrown away annually, with the sensors deployed to monitor the blood pressure of patients during and after major operations. Pressure and flow sensors are also used in devices like ventilators and respirators; implantable devices such as cardiac monitors; thermometers; and infusion pumps for introducing fluids, medication or nutrients into a patient’s circulatory system.
The depressed performance in medical electronics was also present in other high-value MEMS segments.
The test and measurement space, especially in semiconductor testing and wafer processing, was flat to down last year. Likewise, the industrial segment governing power tools and transportation exhibited anemic results.
Weak growth expected
Two high-value MEMS segments registered growth but were weak at best: building and home control on the one hand, with smart meters declining last year; and manufacturing and process automation on the other, because of low growth in areas like industrial motors.
In the energy generation and distribution segment, results were mixed. Spending on utilities was down and wind turbine deployments were slowing, but oil and gas showed strong demand in the third quarter based on shale discoveries.
The one segment of the high-value MEMS industry that was up strongly last year was military and civil aerospace. Despite a decelerating missiles and munitions market, the segment more than made up with the extremely robust commercial aircraft sales of the Airbus from Pan-European maker EADS, as well as of the Dreamliner planes made by US maker Boeing.
Six devices made up 83 percent of the high-value MEMS market last year. The biggest was microbolometers—tiny arrays of heat-detecting sensors sensitive to infrared radiation—used in firefighting, law enforcement and surveillance systems.
Other prominent high-value MEMS devices include pressure sensors, optical MEMS in telecommunications, wafer probes for semiconductor testing, inkjet printer heads, and accelerometers for gadgets like pacemakers.
Source: IHS iSuppli, USA.
Revenue in 2012 for high-value MEMS, a market characterized by the lofty average selling prices compared to other MEMS devices, amounted to $1.63 billion, equivalent to growth of 6.5 percent from $1.53 billion in 2011. While revenue was up, growth was noticeably down from the 12.5 percent expansion of 2011.
This year will see a slightly improved 7.4 percent increase to $1.8 billion as the industry starts to recover during the second half. Growth then picks up by 2014 and rises to 10.3 percent, with 2015 and 2016 also forecast to experience solid upturns north of 9.0 percent, as shown in the attached figure.
“The high-value MEMS market last year suffered a deceleration in growth because of continuing slow sales in medical electronics as well as a broad-based downturn in the industrial segment,” said Richard Dixon, Ph.D., principal analyst for MEMS & Sensors at IHS.
“In medical electronics, the market performance has been sluggish for the last 18 months, echoing global economic uncertainties. The same macroeconomic headwinds also curtailed end-user demand in industrial electronics semiconductors, inflicting further pain. The high-value MEMS market was aided slightly by strong performance in the telecom, aerospace, and oil and gas sectors, which served to ameliorate the negative effects of the slow-moving sectors.”
Higher growth expected for high-value MEMS
Despite the diminished growth of 2012, the high-value MEMS market remains the second-fastest-expanding area in the broader MEMS space, coming in after the mobile and consumer market but leading the data processing and automotive segments. High-value MEMS accounted for 19 percent of the total MEMS industry last year, despite extreme fragmentation of the space with well over 100 suppliers.
The average selling prices of sensors used in high-value MEMS are also much higher than the prices of sensors used in other MEMS segments, which gives the high-value MEMS industry its strength and importance.
Results sluggish in most high-value MEMS segments
Six sectors make up approximately 95 percent of the high-value MEMS market. The largest is medical electronics, accounting for more than 80 percent of total high-value MEMS shipments last year.
The majority of medical electronics sensors are used for diagnostics, patient monitoring and therapy.
For instance, tens of millions of pressure sensors are used and thrown away annually, with the sensors deployed to monitor the blood pressure of patients during and after major operations. Pressure and flow sensors are also used in devices like ventilators and respirators; implantable devices such as cardiac monitors; thermometers; and infusion pumps for introducing fluids, medication or nutrients into a patient’s circulatory system.
The depressed performance in medical electronics was also present in other high-value MEMS segments.
The test and measurement space, especially in semiconductor testing and wafer processing, was flat to down last year. Likewise, the industrial segment governing power tools and transportation exhibited anemic results.
Weak growth expected
Two high-value MEMS segments registered growth but were weak at best: building and home control on the one hand, with smart meters declining last year; and manufacturing and process automation on the other, because of low growth in areas like industrial motors.
In the energy generation and distribution segment, results were mixed. Spending on utilities was down and wind turbine deployments were slowing, but oil and gas showed strong demand in the third quarter based on shale discoveries.
The one segment of the high-value MEMS industry that was up strongly last year was military and civil aerospace. Despite a decelerating missiles and munitions market, the segment more than made up with the extremely robust commercial aircraft sales of the Airbus from Pan-European maker EADS, as well as of the Dreamliner planes made by US maker Boeing.
Six devices made up 83 percent of the high-value MEMS market last year. The biggest was microbolometers—tiny arrays of heat-detecting sensors sensitive to infrared radiation—used in firefighting, law enforcement and surveillance systems.
Other prominent high-value MEMS devices include pressure sensors, optical MEMS in telecommunications, wafer probes for semiconductor testing, inkjet printer heads, and accelerometers for gadgets like pacemakers.
Source: IHS iSuppli, USA.
Altis intros next generation of embedded CBRAM technology
FRANCE: Altis announced the next generation of embedded CBRAM (eCBRAM) technology, a new platform available for demonstration in Q2 2013.
The new technology features design and manufacturing improvements which deliver higher reliability and faster write speeds. eCBRAM technology was developed through Altis’ partnership with Adesto Technologies and will enhance the Altis eNVM (embedded non-volatile memory) foundry service portfolio, today based on 130nm CMOS technologies.
eCBRAM is an innovative embedded memory, combining EEPROM flexibility with embedded Flash density. Altis’ 130nm eCBRAM technology is 100 percent compatible with the Altis 130nm Low Power Platform.
To improve cost efficiency for prospective new customer designs, Altis offers customers the shared cost benefits of its “multi-product wafer” program (MPW). The MPW program for new eCBRAM designs is now open to customers.
eCBRAM technology is well-suited for consumer, wireless, contactless and smart secure applications that require ultra-low power and fast access time.
The new technology features design and manufacturing improvements which deliver higher reliability and faster write speeds. eCBRAM technology was developed through Altis’ partnership with Adesto Technologies and will enhance the Altis eNVM (embedded non-volatile memory) foundry service portfolio, today based on 130nm CMOS technologies.
eCBRAM is an innovative embedded memory, combining EEPROM flexibility with embedded Flash density. Altis’ 130nm eCBRAM technology is 100 percent compatible with the Altis 130nm Low Power Platform.
To improve cost efficiency for prospective new customer designs, Altis offers customers the shared cost benefits of its “multi-product wafer” program (MPW). The MPW program for new eCBRAM designs is now open to customers.
eCBRAM technology is well-suited for consumer, wireless, contactless and smart secure applications that require ultra-low power and fast access time.
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