USA: Plasma-Therm was recently selected by the University of Southampton to provide deep silicon etching capability for the Southampton Nanofabrication Centre (SNC).
Housed in the Zepler Institute’s new cleanroom facility the institute also houses the nationally renowned Optoelectronics Research Centre. Together they provide research facilities for users from universities and industry, locally and internationally from a wide range of disciplines. In addition to serving a key role in their academic mission, the centers encourage commercialization of internal and external research efforts managed by a dedicated university business unit.
The new VERSALINE DSE etching system will target silicon based applications that include MEMS and BioMEMS sensors, MOEMs, solar cells, and optical component devices. This expected diverse use requires system flexibility which led Iain Anteney, Cleanroom Manager to comment: “The VERSALINE’s array of capabilities was an important part of the decision criteria.”
“In addition to having broad process latitude to successfully etch many structures using an operating system that offered superior control, we were interested in process stability. The uniquely heated source and substrate temperature management strongly influenced our assessment.”
John Davidson, procurement manager, expressed: “We were pleased to see Plasma-Therm’s focus on service support, partnership and quality construction. The company culture, competence, and attitudes were evident during our site visit. These things are not easily discernible or conveyed when reading a tender response.”
Dr. David Lishan, Plasma-Therm principal scientist and director, Technical Marketing, noted: “We are pleased to have been selected by the SNC and look forward to a closely connected on-going relationship with another leading research institution. Centers such as SNC are playing critical roles in developing the sensors and optical devices that importantly influence how we interact with our world. At the rate technology is changing our world, being on the leading edge is definitely exciting and a welcome challenge.”
Tuesday, April 2, 2013
ARM and TSMC tape-out first ARM Cortex-A57 processor on TSMC's 16nm FinFET technology
TAIWAN & UK: ARM and TSMC announced the first tape-out of an ARM Cortex-A57 processor on FinFET process technology.
The Cortex-A57 processor is ARM’s highest performing processor, designed to further extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end computer, tablet and server products. This is the first milestone in the collaboration between ARM and TSMC to jointly optimize the 64-bit ARMv8 processor series on TSMC FinFET process technologies.
The two companies cooperated in the implementation from RTL to tape-out in six months using ARM Artisan physical IP, TSMC memory macros, and EDA technologies enabled by TSMC’s Open Innovation Platform (OIP) design ecosystem.
ARM and TSMC’s collaboration produces optimized, power-efficient Cortex-A57 processors and libraries to support early customer implementations on 16nm FinFET for high-performance, ARM technology-based SoCs.
“This first ARM Cortex-A57 processor implementation paves the way for our mutual customers to leverage the performance and power efficiency of 16nm FinFET technology,” said Tom Cronk, executive VP and GM, Processor Division, ARM. “The joint effort of ARM, TSMC, and TSMC’s OIP design ecosystem partners demonstrates the strong commitment to provide industry-leading technology for customer designs to benefit from our latest 64-bit ARMv8 architecture, big.LITTLE processing and ARM POP IP across a wide variety of market segments.”
“Our multi-year, multi-node collaboration with ARM continues to deliver advanced technologies to enable market-leading SoCs across mobile, server, and enterprise infrastructure applications,” said Dr. Cliff Hou, TSMC VP of R&D. “This achievement demonstrates that the next-generation ARMv8 processor is FinFET-ready for TSMC’s advanced technology.”
This announcement highlights the enhanced and intensified collaboration between ARM and TSMC. The test chip was implemented using a commercially available 16nm FinFET tool chain and design services provided by the OIP ecosystem and ARM Connected Community partners. This successful collaborative milestone is confirmation of the roles that TSMC’s OIP and ARM’s Connected Community play in promoting innovation for the semiconductor design industry.
The Cortex-A57 processor is ARM’s highest performing processor, designed to further extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end computer, tablet and server products. This is the first milestone in the collaboration between ARM and TSMC to jointly optimize the 64-bit ARMv8 processor series on TSMC FinFET process technologies.
The two companies cooperated in the implementation from RTL to tape-out in six months using ARM Artisan physical IP, TSMC memory macros, and EDA technologies enabled by TSMC’s Open Innovation Platform (OIP) design ecosystem.
ARM and TSMC’s collaboration produces optimized, power-efficient Cortex-A57 processors and libraries to support early customer implementations on 16nm FinFET for high-performance, ARM technology-based SoCs.
“This first ARM Cortex-A57 processor implementation paves the way for our mutual customers to leverage the performance and power efficiency of 16nm FinFET technology,” said Tom Cronk, executive VP and GM, Processor Division, ARM. “The joint effort of ARM, TSMC, and TSMC’s OIP design ecosystem partners demonstrates the strong commitment to provide industry-leading technology for customer designs to benefit from our latest 64-bit ARMv8 architecture, big.LITTLE processing and ARM POP IP across a wide variety of market segments.”
“Our multi-year, multi-node collaboration with ARM continues to deliver advanced technologies to enable market-leading SoCs across mobile, server, and enterprise infrastructure applications,” said Dr. Cliff Hou, TSMC VP of R&D. “This achievement demonstrates that the next-generation ARMv8 processor is FinFET-ready for TSMC’s advanced technology.”
This announcement highlights the enhanced and intensified collaboration between ARM and TSMC. The test chip was implemented using a commercially available 16nm FinFET tool chain and design services provided by the OIP ecosystem and ARM Connected Community partners. This successful collaborative milestone is confirmation of the roles that TSMC’s OIP and ARM’s Connected Community play in promoting innovation for the semiconductor design industry.
Microchip expands PIC24 lite MCU portfolio with advanced analog integration and 5V operation
USA: Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, has announced a new addition to its 16-bit PIC microcontroller (MCU) portfolio with the low cost PIC24F "KM" family.
This family offers up to 16 KB Flash, 2 KB RAM and 512B EEPROM, along with advanced analog integration, in low pin-count options for cost-sensitive automotive, consumer, medical and industrial applications.
The PIC24F "KM" family provides a new level of integrated analog functionality such as a 12-bit ADC with threshold detection, 8-bit DACs for analog control loops and precision comparator references, and op amps to assist in sensor amplifications. The PIC24 "KM" MCUs are the first to feature the new Multiple-output Capture Compare PWM Module (MCCP) and Single-output Capture Compare PWM Module (SCCP) peripherals, which include integrated timers and advanced PWM control to enable motor-control, power-supply and lighting applications.
The MCCP and SCCP modules combine timers, input captures, output compare and PWM functions in a single time base for optimal flexibility. These modules include 16/32-bit timer support, and can operate from a high-speed clock for higher resolution due to their ability to operate asynchronously. They allow for automatic operations during sleep mode, to optimise power consumption.
This is also the first PIC24 family to offer a Configurable Logic Cell (CLC) for increased on-chip interconnection of peripherals. The CLC module helps in creating custom real-time logic functions on-chip and is supported by the CLC configuration tool, which helps in coding the circuit graphically instead of in assembly or C, thereby saving time for the programmers.
In addition to advanced peripheral integration, the "KM" family includes support for both 3V and 5V applications. Many customers prefer 3V operation for portable, battery-operated applications, and the 3V "KM" products all include eXtreme Low Power XLP for optimal battery life. Other customers prefer 5V operation with the PIC24FV16KM product variants, for applications where more dynamic range, noise immunity and robustness are the key factors.
The PIC24F "KM", with its extreme low power and advanced analog integration, is an excellent solution for customers working on cost-sensitive applications, such as flow meters, smoke detectors, stepper and BLDC motors, LED dimming, battery charging, environmental sensors and portable disposable medical products.
This family offers up to 16 KB Flash, 2 KB RAM and 512B EEPROM, along with advanced analog integration, in low pin-count options for cost-sensitive automotive, consumer, medical and industrial applications.
The PIC24F "KM" family provides a new level of integrated analog functionality such as a 12-bit ADC with threshold detection, 8-bit DACs for analog control loops and precision comparator references, and op amps to assist in sensor amplifications. The PIC24 "KM" MCUs are the first to feature the new Multiple-output Capture Compare PWM Module (MCCP) and Single-output Capture Compare PWM Module (SCCP) peripherals, which include integrated timers and advanced PWM control to enable motor-control, power-supply and lighting applications.
The MCCP and SCCP modules combine timers, input captures, output compare and PWM functions in a single time base for optimal flexibility. These modules include 16/32-bit timer support, and can operate from a high-speed clock for higher resolution due to their ability to operate asynchronously. They allow for automatic operations during sleep mode, to optimise power consumption.
This is also the first PIC24 family to offer a Configurable Logic Cell (CLC) for increased on-chip interconnection of peripherals. The CLC module helps in creating custom real-time logic functions on-chip and is supported by the CLC configuration tool, which helps in coding the circuit graphically instead of in assembly or C, thereby saving time for the programmers.
In addition to advanced peripheral integration, the "KM" family includes support for both 3V and 5V applications. Many customers prefer 3V operation for portable, battery-operated applications, and the 3V "KM" products all include eXtreme Low Power XLP for optimal battery life. Other customers prefer 5V operation with the PIC24FV16KM product variants, for applications where more dynamic range, noise immunity and robustness are the key factors.
The PIC24F "KM", with its extreme low power and advanced analog integration, is an excellent solution for customers working on cost-sensitive applications, such as flow meters, smoke detectors, stepper and BLDC motors, LED dimming, battery charging, environmental sensors and portable disposable medical products.
Global semiconductor sales remain ahead of 2012 pace in February
USA: The Semiconductor Industry Association (SIA), representing US leadership in semiconductor manufacturing and design, announced that worldwide sales of semiconductors reached $23.25 billion for the month of February 2013, an increase of 1.4 percent from February 2012 when sales were $22.93 billion.
Global sales from February 2013 were 3.8 percent lower than the January 2013 total of $24.17 billion, reflecting seasonal trends, but year-to-date sales through February 2013 were 2 percent higher than at the same point last year. All monthly sales numbers represent a three-month moving average.
“Despite persistent economic uncertainty, the global semiconductor industry is off to a promising start in 2013 – led by strength in memory sales – and is ahead of last year’s pace,” said Brian Toohey, president and CEO, Semiconductor Industry Association.
“To help spur stronger growth, Congress and the Administration should invest in basic research to boost American innovation, reform the high-skilled immigration system to welcome the top scientific minds from around the world, and modify the tax system so businesses can expand, invest and hire new workers.”
Regionally, year-over-year sales increased in Asia Pacific (6.7 percent) and the Americas (1.6 percent), but decreased in Europe (-1.5 percent) and Japan (-15.7 percent). Sales increased in Europe (1.4 percent) compared to the previous month, but decreased in Asia Pacific (-3.6 percent), Japan (-5 percent) and the Americas (-6.2 percent).
Global sales from February 2013 were 3.8 percent lower than the January 2013 total of $24.17 billion, reflecting seasonal trends, but year-to-date sales through February 2013 were 2 percent higher than at the same point last year. All monthly sales numbers represent a three-month moving average.
“Despite persistent economic uncertainty, the global semiconductor industry is off to a promising start in 2013 – led by strength in memory sales – and is ahead of last year’s pace,” said Brian Toohey, president and CEO, Semiconductor Industry Association.
“To help spur stronger growth, Congress and the Administration should invest in basic research to boost American innovation, reform the high-skilled immigration system to welcome the top scientific minds from around the world, and modify the tax system so businesses can expand, invest and hire new workers.”
Monday, April 1, 2013
Fairchild enhances power supply WebDesigner
USA: Fairchild Semiconductor has enhanced Power Supply WebDesigner – an online design and simulation tool that provides complete designs in under a minute – to include complete continuous conduction mode (CCM), non-isolated active PFC buck and buck LED driver designs.
From user-specified design inputs, the Power Supply WebDesigner (PSW) tool allows designers to choose all the components used in a design or have the tool automatically recommend the design values – providing Fairchild part numbers where applicable. PSW can automatically recommend design values, or allows the user to evaluate their own component choices.
While using the tool, designers can accept default recommended values, or spend time optimizing the important details to their unique design needs. Designers can get quick, accurate estimates on design performance, and refine design choices as they go. The tool also allows them to spend the time to perform detailed simulation analysis and learn the insights of how their design and its hardware prototype will work with higher degree of confidence.
When a design is complete, PSW creates a BOM which can be sent to their procurement department or instantly procure the components online, saving time on documentation or sourcing parts elsewhere. Additionally, they can save their design for future reference or pass the design on to other engineers.
Using the Power Supply WebDesigner tool provides the inexperienced designer a quick guided design, while the experienced designer can take their requirements and further customize critical design factors.
From user-specified design inputs, the Power Supply WebDesigner (PSW) tool allows designers to choose all the components used in a design or have the tool automatically recommend the design values – providing Fairchild part numbers where applicable. PSW can automatically recommend design values, or allows the user to evaluate their own component choices.
While using the tool, designers can accept default recommended values, or spend time optimizing the important details to their unique design needs. Designers can get quick, accurate estimates on design performance, and refine design choices as they go. The tool also allows them to spend the time to perform detailed simulation analysis and learn the insights of how their design and its hardware prototype will work with higher degree of confidence.
When a design is complete, PSW creates a BOM which can be sent to their procurement department or instantly procure the components online, saving time on documentation or sourcing parts elsewhere. Additionally, they can save their design for future reference or pass the design on to other engineers.
Using the Power Supply WebDesigner tool provides the inexperienced designer a quick guided design, while the experienced designer can take their requirements and further customize critical design factors.
Emulex completes acquisition of Endace
USA: Emulex Corp. has announced the completion of its acquisition of Endace Ltd.
Emulex acquired control of Endace, and beneficial ownership of 89 percent of the shares of Endace, on February 26, 2013. Emulex has now completed the acquisition of beneficial ownership of 99.9 percent of the shares of Endace, and the process for the compulsory acquisition of the remaining Endace shares by Emulex pursuant to the New Zealand Takeovers Code has commenced.
"I'm pleased to report progress during the last month in combining Endace into the Emulex organization, and now obtaining complete ownership," said Jim McCluney, CEO of Emulex. "The reactions we have received from customers and employees have reinforced our conclusions that Emulex and Endace make a great combination. Together, we are creating a new class of end-to-end network convergence and visibility solutions that will enable optimal delivery of applications for the enterprise, mobile applications and the Cloud."
The receiving agent has reported that 212 acceptances have been received for a total of 15,199,588 shares, which is 99.9 percent of the 15,220,068 shares of Endace outstanding. The receiving agent reported that there are 18 non-acceptors who hold a total of 20,480 shares, which is 0.1 percent of the 15,220,068 shares of Endace outstanding.
The 99.9 percent of shares received by March 28, 2013 have been purchased at the offer price of GBP 5.00 per share, for a total of GBP 75,997,940, which is equal to USD 119,783,303 at the reference exchange rate. The reference exchange rate of 0.6345 GBP per 1 USD is based on the actual rates obtained by Emulex for the currency conversion.
The Endace employee stock options were purchased for GBP 4,555,929 which is equal to $7,180,777 at the reference exchange rate. The remaining 0.1 percent of the Endace shares will result in an additional payment of GBP 102,400, which is equal to $161,397 at the reference exchange rate.
Emulex acquired control of Endace, and beneficial ownership of 89 percent of the shares of Endace, on February 26, 2013. Emulex has now completed the acquisition of beneficial ownership of 99.9 percent of the shares of Endace, and the process for the compulsory acquisition of the remaining Endace shares by Emulex pursuant to the New Zealand Takeovers Code has commenced.
"I'm pleased to report progress during the last month in combining Endace into the Emulex organization, and now obtaining complete ownership," said Jim McCluney, CEO of Emulex. "The reactions we have received from customers and employees have reinforced our conclusions that Emulex and Endace make a great combination. Together, we are creating a new class of end-to-end network convergence and visibility solutions that will enable optimal delivery of applications for the enterprise, mobile applications and the Cloud."
The receiving agent has reported that 212 acceptances have been received for a total of 15,199,588 shares, which is 99.9 percent of the 15,220,068 shares of Endace outstanding. The receiving agent reported that there are 18 non-acceptors who hold a total of 20,480 shares, which is 0.1 percent of the 15,220,068 shares of Endace outstanding.
The 99.9 percent of shares received by March 28, 2013 have been purchased at the offer price of GBP 5.00 per share, for a total of GBP 75,997,940, which is equal to USD 119,783,303 at the reference exchange rate. The reference exchange rate of 0.6345 GBP per 1 USD is based on the actual rates obtained by Emulex for the currency conversion.
The Endace employee stock options were purchased for GBP 4,555,929 which is equal to $7,180,777 at the reference exchange rate. The remaining 0.1 percent of the Endace shares will result in an additional payment of GBP 102,400, which is equal to $161,397 at the reference exchange rate.
TI intros 10-A SWIFT DC/DC converter with highest current density
USA: Texas Instruments Inc. (TI) introduced a new synchronous step-down DC/DC converter with integrated MOSFETs in a very small 3.5-mm by 3.5-mm HotRod QFN package.
The SWIFT\ 10-A TPS54020 features the highest power density and includes frequency synchronization, 180-degree out-of-phase switching and selectable current limit to power FPGAs, system-on-chip (SoC), DSPs and processors in high-voltage, space-constrained communication, gaming and industrial computing applications.
Using the converter together with TI's WEBENCH online design tool simplifies high-voltage DC/DC conversion and speeds the design process.
The new HotRod integrated circuit package protects the integrated MOSFETs from parasitic inductance and allows low resistance, enabling high current and efficiency and small size. The thermally enhanced, 15-lead package is 50 percent smaller than similar offerings.
The TPS54020 joins TI's point-of-load DC/DC converter family, which includes the 6-A TPS54623 in a 3-mm by 3-mm QFN package, and the 12-A LM21212-1 and 15-A LM21215 converters, offered in a thermally enhanced eTSSOP-20 exposed pad package.
The SWIFT\ 10-A TPS54020 features the highest power density and includes frequency synchronization, 180-degree out-of-phase switching and selectable current limit to power FPGAs, system-on-chip (SoC), DSPs and processors in high-voltage, space-constrained communication, gaming and industrial computing applications.
Using the converter together with TI's WEBENCH online design tool simplifies high-voltage DC/DC conversion and speeds the design process.
The new HotRod integrated circuit package protects the integrated MOSFETs from parasitic inductance and allows low resistance, enabling high current and efficiency and small size. The thermally enhanced, 15-lead package is 50 percent smaller than similar offerings.
The TPS54020 joins TI's point-of-load DC/DC converter family, which includes the 6-A TPS54623 in a 3-mm by 3-mm QFN package, and the 12-A LM21212-1 and 15-A LM21215 converters, offered in a thermally enhanced eTSSOP-20 exposed pad package.
Touchstone intros four one-resistor-tunable timer ICs
USA: Touchstone Semiconductor, a leading developer of high-performance, low-power analog integrated circuit solutions, has added four new, high-accuracy, micropower timer ICs to its rapidly expanding family of “NanoWatt Analog timer integrated circuits.
In addition to all other Touchstone Semiconductor ICs, these new analog timers are all in stock and ready to ship from Digi-Key, Touchstone’s authorized distributor.
These new, higher-single-supply voltage, second-generation timer ICs to the company’s very popular TS3001 and TS3002 operate over a wider supply voltage range (1.55V to 5.25V) and consume very little supply current.
To set the output frequency (or period) in these new timers, only a single resistor is needed. For the TS3003 and TS3006, the output frequency can be set from 9kHz to 300kz. For the TS3004 and TS3005, an internal 3-bit counter was added that can program the output period from 3.3µs to 233s (TS3004) or from 1.7ms to 33hrs (TS3005).
Three of the timers include a dc-voltage-controlled pulse-width modulation (PWM) output (the TS3003, the TS3004, and the TS3005). All four timers are available in space-saving, low-profile, exposed-backside-paddle TDFN packaging.
TS3003: A higher supply voltage version of the very successful TS3001, the new TS3003 timer IC consumes 1.9µA supply current and its output frequency is single-resistor-tunable from 9kHz to 300kHz. Available in a 10-pin TDFN-EP package, TS3003 pricing starts at $0.95 in 1k quantities.
TS3004: Including an internal 3-bit counter, he TS3004 timer IC also consumes 1.9µA supply current. With a single external resistor, the user can set the output frequency to one of eight settings from 0.0043Hz to 300kHz. Available in a 10-pin TDFN-EP package, TS3004 pricing starts at $0.95 in 1k quantities.
TS3005: Functionally similar to the TS3004 while only consuming less than 1.35µA, the TS3005 is an extended range timer where the user can set the output frequency from 0.0084 mHz (the reciprocal of 33hrs) to 588 Hz (the reciprocal of 1.7ms). This is three times longer than the next closest solution. Available in a 10-pin TDFN package, TS3005 pricing starts at $0.95 in 1k quantities.
TS3006: Functionally similar to the TS3003, the TS3006 is designed for cost-sensitive applications where a fixed frequency output is all that is needed. Available in an 8-pin TDFN package, TS3006 pricing starts at $0.55 in 1k quantities.
In addition to all other Touchstone Semiconductor ICs, these new analog timers are all in stock and ready to ship from Digi-Key, Touchstone’s authorized distributor.
These new, higher-single-supply voltage, second-generation timer ICs to the company’s very popular TS3001 and TS3002 operate over a wider supply voltage range (1.55V to 5.25V) and consume very little supply current.
To set the output frequency (or period) in these new timers, only a single resistor is needed. For the TS3003 and TS3006, the output frequency can be set from 9kHz to 300kz. For the TS3004 and TS3005, an internal 3-bit counter was added that can program the output period from 3.3µs to 233s (TS3004) or from 1.7ms to 33hrs (TS3005).
Three of the timers include a dc-voltage-controlled pulse-width modulation (PWM) output (the TS3003, the TS3004, and the TS3005). All four timers are available in space-saving, low-profile, exposed-backside-paddle TDFN packaging.
TS3003: A higher supply voltage version of the very successful TS3001, the new TS3003 timer IC consumes 1.9µA supply current and its output frequency is single-resistor-tunable from 9kHz to 300kHz. Available in a 10-pin TDFN-EP package, TS3003 pricing starts at $0.95 in 1k quantities.
TS3004: Including an internal 3-bit counter, he TS3004 timer IC also consumes 1.9µA supply current. With a single external resistor, the user can set the output frequency to one of eight settings from 0.0043Hz to 300kHz. Available in a 10-pin TDFN-EP package, TS3004 pricing starts at $0.95 in 1k quantities.
TS3005: Functionally similar to the TS3004 while only consuming less than 1.35µA, the TS3005 is an extended range timer where the user can set the output frequency from 0.0084 mHz (the reciprocal of 33hrs) to 588 Hz (the reciprocal of 1.7ms). This is three times longer than the next closest solution. Available in a 10-pin TDFN package, TS3005 pricing starts at $0.95 in 1k quantities.
TS3006: Functionally similar to the TS3003, the TS3006 is designed for cost-sensitive applications where a fixed frequency output is all that is needed. Available in an 8-pin TDFN package, TS3006 pricing starts at $0.55 in 1k quantities.
MaxLinear ATSC tuner technology enables OTA reception in emerging US over-the-top STB market
USA: MaxLinear Inc., a leading provider of integrated radio frequency (RF) and mixed-signal integrated circuits for broadband communications applications, announced that leading OEMs are using its MxL603 silicon tuner device in new Internet video set-top boxes (STBs) shipping into the US market.
A major trend in recent years is the increasing availability of quality over-the-top (OTT) video content from providers like Netflix, YouTube, Hulu and Amazon Instant Video. US consumers are boosting their Internet speeds from their broadband providers to improve their experience in watching videos and movies from online sources.
Only recently have video-streaming STBs with the ability to receive free, over-the-air local broadcast channels become available. Access to local high-definition (HD) broadcast channels is considered “must have” content by most TV viewers.
“Evolving user habits, combined with the huge quantity of content available on OTT services has resulted in a market for non-traditional ways of getting video content. These new STBs deliver broadcast video content over IP to allow users to receive traditional broadcast content on their smart phones, tablets and other IP-enabled devices,” said Yves Rasse, senior director, Consumer Product Line at MaxLinear.
“STBs targeted at this market are a perfect fit for MaxLinear’s technology because it delivers a low power, lower cost system with very high performance.”
A major trend in recent years is the increasing availability of quality over-the-top (OTT) video content from providers like Netflix, YouTube, Hulu and Amazon Instant Video. US consumers are boosting their Internet speeds from their broadband providers to improve their experience in watching videos and movies from online sources.
Only recently have video-streaming STBs with the ability to receive free, over-the-air local broadcast channels become available. Access to local high-definition (HD) broadcast channels is considered “must have” content by most TV viewers.
“Evolving user habits, combined with the huge quantity of content available on OTT services has resulted in a market for non-traditional ways of getting video content. These new STBs deliver broadcast video content over IP to allow users to receive traditional broadcast content on their smart phones, tablets and other IP-enabled devices,” said Yves Rasse, senior director, Consumer Product Line at MaxLinear.
“STBs targeted at this market are a perfect fit for MaxLinear’s technology because it delivers a low power, lower cost system with very high performance.”
TI adds more memory, flexible package options and general purpose IO pins to MSP430 Value Line MCUs
USA: Further advancing its low-cost portfolio, Texas Instruments Inc. announced the expansion of the MSP430 Value Line microcontroller series with new G2xx4 and G2xx5 devices.
These new devices offer a code-compatible upgrade path for TI’s MSP430 Value Line series, expanding memory from 16kB up to 56kB Flash and up to 4kB SRAM, enabling customers to migrate existing solutions and support connectivity protocols such as wireless MBUS and near field communications (NFC).
By combining the increased memory resources and integrated capacitive touch IOs on the MSP430G2xx5 devices, developers can implement more sophisticated capacitive touch capabilities like swipe, gesturing, double tap and proximity effects within their applications. Developers can also add reliable high bit-rate serial communications to designs by taking advantage of the G2xx4 and G2xx5 microcontrollers’ high-frequency crystal input, another first for the MSP430 Value Line.
For design flexibility within space-constrained applications, the new devices will be available in the MSP portfolio’s smallest package, die-sized ball grid array (DSBGA). Additionally, MSP430G2xx4 and G2xx5 devices provide more GPIOs, timers and serial ports to ensure developers do not sacrifice performance for cost.
MSP430G2xx4 and G2xx5 microcontrollers are backed by free software resources, including the MSP430 capacitive touch sense library supporting buttons, sliders, wheels and proximity sensing, Grace software, MSP430Ware, ULP Advisor and Energia, a community-driven, open-source development platform, as well as TI’s broad third party support network.
Existing MSP430 LaunchPad users will also be able to take advantage of the expanded memory and IO capabilities of G2xx4 devices with a new MSP430 LaunchPad expansion board available in May.
These new devices offer a code-compatible upgrade path for TI’s MSP430 Value Line series, expanding memory from 16kB up to 56kB Flash and up to 4kB SRAM, enabling customers to migrate existing solutions and support connectivity protocols such as wireless MBUS and near field communications (NFC).
By combining the increased memory resources and integrated capacitive touch IOs on the MSP430G2xx5 devices, developers can implement more sophisticated capacitive touch capabilities like swipe, gesturing, double tap and proximity effects within their applications. Developers can also add reliable high bit-rate serial communications to designs by taking advantage of the G2xx4 and G2xx5 microcontrollers’ high-frequency crystal input, another first for the MSP430 Value Line.
For design flexibility within space-constrained applications, the new devices will be available in the MSP portfolio’s smallest package, die-sized ball grid array (DSBGA). Additionally, MSP430G2xx4 and G2xx5 devices provide more GPIOs, timers and serial ports to ensure developers do not sacrifice performance for cost.
MSP430G2xx4 and G2xx5 microcontrollers are backed by free software resources, including the MSP430 capacitive touch sense library supporting buttons, sliders, wheels and proximity sensing, Grace software, MSP430Ware, ULP Advisor and Energia, a community-driven, open-source development platform, as well as TI’s broad third party support network.
Existing MSP430 LaunchPad users will also be able to take advantage of the expanded memory and IO capabilities of G2xx4 devices with a new MSP430 LaunchPad expansion board available in May.
Sankalp Semiconductor appoints new CEO
INDIA: Sankalp Semiconductor announced the elevation of Samir Patel as its CEO.
Sankalp Semiconductor , which started in year 2005, has established itself as a leading analog mixed-signal technology solutions company from India. Its unique approach of building technology centers across various cities of India has helped it to profitably scale its delivery model and acquire good customer base.
The recent successful merger of Semiconductor Solutions Group of KPIT Cummins Infosystems Ltd. has strengthened its digital offering complimenting to its flagship analog mixed-signal services.
Samir Patel , who is a technology leader with over 25 years of executive leadership in global semiconductor industry, will assume the role with immediate effect. Samir has been with Sankalp for five years as president and set up its operations in North America.
Previously, he has worked at Rambus where he managed their engineering. He was instrumental in setting up Rambus India operations and also championed the acquisitions of several IP businesses.
Prior to Rambus, Samir worked at companies like: SUN Microsystems, Catalyst Semiconductor and National Semiconductor. Samir has a B.S. degree from Indian Institute of Technology Bombay and MS from University of Santa Barbara. He also has to his credit several executive courses from Stanford University.
Vivek Pawar, in his new role of executive chairman, would chair the Board of Directors and work on leadership and technical talent development programs. Vivek would continue to drive his passion by managing Mixed-Signal Solutions Business Unit of the company and would continue to be the executive sponsor for some of their key customers.
Under Vivek's leadership since inception, Sankalp Semiconductor has evolved itself into a leading mixed-signal services and solutions company with over 450 engineers and more than 20 global customers. The company has grown multiple folds on its revenue in last seven years and made its mark in the semiconductor industry.
Sankalp Semiconductor , which started in year 2005, has established itself as a leading analog mixed-signal technology solutions company from India. Its unique approach of building technology centers across various cities of India has helped it to profitably scale its delivery model and acquire good customer base.
The recent successful merger of Semiconductor Solutions Group of KPIT Cummins Infosystems Ltd. has strengthened its digital offering complimenting to its flagship analog mixed-signal services.
Samir Patel , who is a technology leader with over 25 years of executive leadership in global semiconductor industry, will assume the role with immediate effect. Samir has been with Sankalp for five years as president and set up its operations in North America.
Previously, he has worked at Rambus where he managed their engineering. He was instrumental in setting up Rambus India operations and also championed the acquisitions of several IP businesses.
Prior to Rambus, Samir worked at companies like: SUN Microsystems, Catalyst Semiconductor and National Semiconductor. Samir has a B.S. degree from Indian Institute of Technology Bombay and MS from University of Santa Barbara. He also has to his credit several executive courses from Stanford University.
Vivek Pawar, in his new role of executive chairman, would chair the Board of Directors and work on leadership and technical talent development programs. Vivek would continue to drive his passion by managing Mixed-Signal Solutions Business Unit of the company and would continue to be the executive sponsor for some of their key customers.
Under Vivek's leadership since inception, Sankalp Semiconductor has evolved itself into a leading mixed-signal services and solutions company with over 450 engineers and more than 20 global customers. The company has grown multiple folds on its revenue in last seven years and made its mark in the semiconductor industry.
Air Products to feature gas technologies and equipment for foundries
CastExpo 2013, USA: Air Products will feature a range of gas technologies and equipment that can help foundry operators improve efficiency and reduce costs throughout their operations at CastExpo 2013 in St. Louis, Mo., from April 6-9.
CastExpo attendees can stop by booth #3047 to speak with an Air Products specialist about the company's complete portfolio of gases, equipment, and technology solutions, including oxygen enrichment and solids injection in cupolas, oxygen-enhanced combustion, molten metal blanketing, degassing, refining, and die cooling. Air Products offers unique combustion options for a wide variety of furnace types and metals. These custom-tailored solutions help optimize the melting and casting processes of iron, steel, and non-ferrous foundries.
Attendees can also learn about Air Products' world-class combustion laboratory facilities, where state-of-the-art instrumentation and process control capabilities enable testing of a customer's application to its full potential.
With decades of experience serving the metals industry, Air Products' application engineers can evaluate foundry operations using advanced methods for furnace modeling, data collection, and process monitoring to help identify solutions to problems and recommend process improvements.
From dependable gas supply and proper equipment installation, to continued technical and operations support, Air Products has helped foundry customers around the world increase productivity and yield, reduce fuel costs and emissions, and improve safety.
Air Products will also highlight its full line of gases - including argon, helium, hydrogen, nitrogen, and oxygen - which are available in a variety of delivery options to match each customer's requirements.
For small volume users, the company's CryoEase microbulk solution offers an alternative to cylinder supply that eliminates the hassle of cylinder handling. Air Products also provides traditional bulk liquid and gas supply for large volume users, with an outstanding global reliability record of over 99.9 percent.
CastExpo attendees can stop by booth #3047 to speak with an Air Products specialist about the company's complete portfolio of gases, equipment, and technology solutions, including oxygen enrichment and solids injection in cupolas, oxygen-enhanced combustion, molten metal blanketing, degassing, refining, and die cooling. Air Products offers unique combustion options for a wide variety of furnace types and metals. These custom-tailored solutions help optimize the melting and casting processes of iron, steel, and non-ferrous foundries.
Attendees can also learn about Air Products' world-class combustion laboratory facilities, where state-of-the-art instrumentation and process control capabilities enable testing of a customer's application to its full potential.
With decades of experience serving the metals industry, Air Products' application engineers can evaluate foundry operations using advanced methods for furnace modeling, data collection, and process monitoring to help identify solutions to problems and recommend process improvements.
From dependable gas supply and proper equipment installation, to continued technical and operations support, Air Products has helped foundry customers around the world increase productivity and yield, reduce fuel costs and emissions, and improve safety.
Air Products will also highlight its full line of gases - including argon, helium, hydrogen, nitrogen, and oxygen - which are available in a variety of delivery options to match each customer's requirements.
For small volume users, the company's CryoEase microbulk solution offers an alternative to cylinder supply that eliminates the hassle of cylinder handling. Air Products also provides traditional bulk liquid and gas supply for large volume users, with an outstanding global reliability record of over 99.9 percent.
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