USA: Touchstone Semiconductor, a developer of high-performance, low power analog integrated circuit solutions, has announced the TS9002 dual and the TS9004 quad low power analog comparators plus 1.182-V reference integrated circuits.
As an improved, pin-for-pin functional equivalent to the MAX923, the TS9002’s 3.2-µA supply current is 16 percent lower and its ±0.75% initial accuracy voltage reference is 25 percent lower in both specifications compared to the MAX923. As an improved, pin-for-pin functional equivalent to the MAX934, the TS9004’s 4.1-µA supply current is 25 percent lower and its ±1 percent initial accuracy reference is 50 percent lower in both specifications compared to the MAX934.
Ideal for 3V or 5V single-supply applications, the TS9002 dual and the TS9004 quad comparator can operate from single +2.5V to +11V supplies or from ±1.25V to ±5V dual supplies. Other common features include: a) an input voltage range from the negative supply rail to within 1.3V of the positive supply; b) 7-µs propagation delay; c) a push-pull output stage with 40mA source-current drive capability; and d) crowbar-current free output stage switching.
Both comparators are designed for low-voltage, low-power applications, including threshold detectors/discriminators, oscillator circuits, window comparators, level translators, and other battery-powered systems.
TS9002 dual comparator
* Priced at $0.75 in 1000-piece quantities - $2.10 Less Expensive than MAX923.
* 16 percent lower supply current: 3.2µA vs 4.1µA
* 25 percent lower VREF initial accuracy: ±0.75 percent vs ±1 percent.
* User-adjustable hysteresis via external HYST pin.
TS9004 quad comparator
* Priced at $1.15 in 1000-piece quantities - $0.60 less expensive than MAX934.
* 25 percent lower supply current: 4.1µA vs 5.5µA.
* 50 percent lower VREF initial accuracy: ±1 percent vs ±2 percent.
* Separate GND pin for output drivers.
Both parts are fully specified over the -40ºC to +85ºC temperature range. The TS9002 is available in an 8-pin MSOP package and the TS9004 is available in a narrow 16-pin SOIC package. Both products are in stock and ready to ship from Digi-Key, Touchstone’s authorized distributor.
Monday, January 7, 2013
Excess capacity to trigger massive consolidation and attrition: Will cell phone display covers come to the rescue?
FRANCE: Yole Développement announced its report “Sapphire Substrates 2013”. This report provides a detailed analysis of the sapphire industry, including revenue, volume and price trends for all major substrate applications. It also includes an extensive list of manufacturers with current and planned capacity, and an analysis of established and emerging manufacturing technologies. The drivers and dynamics of the LED and SoS markets are analyzed, and a preliminary view and plausible scenario are provided on emerging non-substrate applications in cell phones.
Significant overcapacity and low LED substrate prices will affect the profitability and viability of many sapphire players in 2013 and beyond, but emerging applications could transform the industry.
The sapphire material shortage experienced from 2010 to early 2011 created a window of opportunity for new entrants. In the last two years, more than 80 companies announced their intention to enter the industry, bringing the potential number of players to 130+ -- with more than 50 of these potential new entrants located in China.
Coupled with slow demand from LED makers in 2012, this has created a very challenging environment with cores and wafers often selling at prices at or below manufacturing cost. Revenues increased 15 percent in 2011, but are expected to drop 9 percent in 2012 due to lower average selling prices, despite volume increase and a favorable product mix with the percentage of PSS wafers increasing dramatically.
These difficult market conditions will trigger an industry rationalization through consolidation and attrition that should take place in 2013 and 2014; activities that the Yole Finance business unit is monitoring closely. In the long-term, as the environment remains extremely competitive, Yole Développement’s team expects the industry to evolve toward a more vertically integrated model in order to limit margin stacking. A handful of tier-1 worldwide leaders should emerge from this rationalization, along with smaller tier-2 regional players.
Yole Développement’s report presents historical and future price trends for material and finished wafers, as well as a detailed supply/demand analysis. Volume forecasts are presented for material, standard and PSS wafers, along with a revenue forecast for finished wafers.
LED-on-Si: a looming threat for sapphire makers
“All major LED makers are currently exploring opportunities for transitioning from a sapphire-based technology platform to a silicon-based one (“LED-on-Si”); this interest is driven by a potential cost savings of up to 60% at the die level”, explains Eric Virey, Senior analyst, LED, Yole Développement.
But while significant progress has been made, the technology still faces hurdles, and it remains to be seen whether the leading proponents of LED-on-Si, like Bridgelux/Toshiba and Lattice Power, will be able to tackle all of the remaining challenges and transition to mass manufacturing in a cost-effective manner.
For most other LED companies, LED-on-Si is often an important development axis, but not a necessary milestone on their manufacturing roadmap. The jury is still out, but in the meantime, investments in the large-diameter sapphire platform are often postponed pending the outcome of LED-on-Si.
In this report, Yole Développement’s team presents a in-depth analysis of the requisite conditions for the success of LED-on-Si, and reveals how GaN could capture some niche markets thanks to higher performance and competitive system-level cost of ownership.
SoS to provide welcome upsides, but could cell phone windows be the next killer application?
The Silicon on Sapphire (SoS) application could represent a nice upside for the happy few that enter the supply chain. Demand more than doubled in 2012 and could do the same in 2013. Leading SoS company Peregrine has developed a compelling Antenna Switch technology that has already achieved vast success in smart phones.
The company benefits from strong macro trends in the cell phone market and is developing new components that could further increase not only SoS content per phone, but also wafer demand. Opportunities for these new components (Power Amplifiers and tunable capacitors), as well as for competing technologies developed by companies like Paratek (now part of cell phone maker RIM), may bring new volume applications to sapphire wafer manufacturers.
The significant capability and capacity build-up and dramatic cost reduction achieved by the sapphire industry in the last three years could open the door for a whole new range of applications. Amongst these, the use of sapphire for small display covers has the potential to be a game-changer and raise the sapphire industry to a completely new level. Despite significant hurdles in terms of cost and manufacturing technologies, all major cell phone OEMs are currently investigating this option.
While mass adoption remains uncertain, it is not completely unrealistic -- and due to the current dire situation of their LED-related business, most sapphire makers are eager to help it materialize.
This report analyzes the most recent trends and potential SoS-related upsides, and provides a revenue forecast. Also, the pros and cons of using sapphire in cell phone cover applications are discussed, and various scenarios are presented to illustrate the potential impact in terms of global sapphire demand.
Significant overcapacity and low LED substrate prices will affect the profitability and viability of many sapphire players in 2013 and beyond, but emerging applications could transform the industry.
Coupled with slow demand from LED makers in 2012, this has created a very challenging environment with cores and wafers often selling at prices at or below manufacturing cost. Revenues increased 15 percent in 2011, but are expected to drop 9 percent in 2012 due to lower average selling prices, despite volume increase and a favorable product mix with the percentage of PSS wafers increasing dramatically.
These difficult market conditions will trigger an industry rationalization through consolidation and attrition that should take place in 2013 and 2014; activities that the Yole Finance business unit is monitoring closely. In the long-term, as the environment remains extremely competitive, Yole Développement’s team expects the industry to evolve toward a more vertically integrated model in order to limit margin stacking. A handful of tier-1 worldwide leaders should emerge from this rationalization, along with smaller tier-2 regional players.
Yole Développement’s report presents historical and future price trends for material and finished wafers, as well as a detailed supply/demand analysis. Volume forecasts are presented for material, standard and PSS wafers, along with a revenue forecast for finished wafers.
LED-on-Si: a looming threat for sapphire makers
“All major LED makers are currently exploring opportunities for transitioning from a sapphire-based technology platform to a silicon-based one (“LED-on-Si”); this interest is driven by a potential cost savings of up to 60% at the die level”, explains Eric Virey, Senior analyst, LED, Yole Développement.
But while significant progress has been made, the technology still faces hurdles, and it remains to be seen whether the leading proponents of LED-on-Si, like Bridgelux/Toshiba and Lattice Power, will be able to tackle all of the remaining challenges and transition to mass manufacturing in a cost-effective manner.
For most other LED companies, LED-on-Si is often an important development axis, but not a necessary milestone on their manufacturing roadmap. The jury is still out, but in the meantime, investments in the large-diameter sapphire platform are often postponed pending the outcome of LED-on-Si.
In this report, Yole Développement’s team presents a in-depth analysis of the requisite conditions for the success of LED-on-Si, and reveals how GaN could capture some niche markets thanks to higher performance and competitive system-level cost of ownership.
SoS to provide welcome upsides, but could cell phone windows be the next killer application?
The Silicon on Sapphire (SoS) application could represent a nice upside for the happy few that enter the supply chain. Demand more than doubled in 2012 and could do the same in 2013. Leading SoS company Peregrine has developed a compelling Antenna Switch technology that has already achieved vast success in smart phones.
The company benefits from strong macro trends in the cell phone market and is developing new components that could further increase not only SoS content per phone, but also wafer demand. Opportunities for these new components (Power Amplifiers and tunable capacitors), as well as for competing technologies developed by companies like Paratek (now part of cell phone maker RIM), may bring new volume applications to sapphire wafer manufacturers.
The significant capability and capacity build-up and dramatic cost reduction achieved by the sapphire industry in the last three years could open the door for a whole new range of applications. Amongst these, the use of sapphire for small display covers has the potential to be a game-changer and raise the sapphire industry to a completely new level. Despite significant hurdles in terms of cost and manufacturing technologies, all major cell phone OEMs are currently investigating this option.
While mass adoption remains uncertain, it is not completely unrealistic -- and due to the current dire situation of their LED-related business, most sapphire makers are eager to help it materialize.
This report analyzes the most recent trends and potential SoS-related upsides, and provides a revenue forecast. Also, the pros and cons of using sapphire in cell phone cover applications are discussed, and various scenarios are presented to illustrate the potential impact in terms of global sapphire demand.
Dialog announces audio codec to enhance smartphone sound quality
GERMANY: Dialog Semiconductor plc announced its latest ultra low power audio CODEC, designed to provide full range, high fidelity audio capture and playback to a variety of portable devices and audio accessories.
Dialog's new DA7320 audio CODEC features a programmable Digital Signal Processor (DSP) to offload audio software from the host processor. The use of Dialog's audio algorithms has been market proven by leading smartphone OEMs to help deliver a consistent and enhanced user experience under a wide variety of use cases.
By using a multi-channel architecture that digitally mixes and routes multiple audio streams, combined with programmable N-band parametric equalisation (EQ) and Dynamic Range Compressor (DRC), Dialog's technology ensures louder and cleaner audio delivery on headphone and speaker peripherals. A psychoacoustic bass boost (PBB) can be enabled for improved perceived low frequency response for playback on low cost small form factor speakers.
DA7320 is the first release in a new family of products that will be expanded to include third party branded audio software, such as noise suppression, acoustic echo cancellation and microphone beamforming.
Udo Kratz, senior VP and GM of Dialog's Mobile Systems business group, commented: 'Dialog's new DA7320 delivers natural, immersive audio to wired headphones, headsets, earpieces and extremely small form factor speakers as demanded by the thinner products that consumers increasingly want to use. The device's built-in flexibility and multiple ways to connect audio has already resulted in a reference design win for a broad-based platform coming to market in 2013.'
The new audio CODEC uses a single supply voltage of just 1.6V, has an ultra-low power consumption of 3.85mW and supports common sample rates between 8 to 96kHz in master and slave modes. The DA7320 comes in a 64 pin BGA package with a 0.5mm pitch and has an operating temperature range of -400C to +85oC. The product is sampling now.
Bosch Sensortec sets size, performance and integration benchmarks in consumer MEMS
USA: Bosch Sensortec, a leading global provider of consumer MEMS, launched new sensors for smartphones, tablets, global positioning systems (GPS) and other consumer electronics for which sensing motion and location are critical.
At the 2013 International CES, the company will showcase three new products that reflect its ongoing strategy to offer customers greater design flexibility through the delivery of smaller, energy-efficient, higher-performance and more tightly integrated sensor-software combinations.
"Bosch Sensortec’s MEMS-product portfolio sets the industry standard for small size, scalable performance and ease of integration," said Dr. Stefan Finkbeiner, CEO of Bosch Sensortec.
"This includes single-function MEMS inertial sensors, integrated system-in-package products, and highly intelligent sensor-fusion software. Our new products reflect these attributes, supporting our goal for sustained technology leadership. They also empower our customers to add with ease the intelligent sensing required for so many consumer electronics. "
BMA355: Featuring wafer-level chip scale package with a size of just 1.2 x 1.5 x 0.8 mm3, the BMA355 is the smallest 3-axis MEMS accelerometer on the market. It enables designers to embed accelerometer functionality in space-constrained applications.
Featuring low power consumption, 12-bit digital resolution and a flexible integrated interrupt engine, the BMA355 is ideally suited for applications requiring extremely small form factors, such as power management for hearing aids and sensor nodes in ubiquitous sensor networks (USN) for the Internet of Things.
Designers of consumer devices such as smartphones, tablets, game consoles and digital cameras will also benefit from the space and power savings derived from the BMA355. The BMA355 supports motion detection, portrait-landscape orientation-switching, flat detection, tap/double-tap sensing, shock detection and free-fall protection as well as advanced power management for mobile devices.
BNO055: The BNO055 is the first in a new family of Application Specific Sensor Nodes (ASSN) implementing an intelligent 9-axis "Absolute Orientation Sensor," which includes sensors and sensor fusion in a single package.
The BNO055 is a system-in-package (SiP), integrating a triaxial 12-bit accelerometer, a triaxial 16-bit gyroscope with a range of ±2000 degrees per second, a triaxial geomagnetic sensor and a 32-bit microcontroller running the company’s BSX3.0 FusionLib software. At just 5.0 x 4.5 mm2, it is significantly smaller than comparable discrete or system-on-board solutions.
By integrating sensors and sensor fusion in a single device, the BNO055 eases the integration process for customers, freeing them from the complexities of multi-vendor solutions so they can spend more time on product innovation, including novel applications such as wearable hardware. It is also the perfect choice for augmented reality (AR), more immersive gaming, personal health and fitness, indoor navigation and any other application requiring context awareness.
BSX3.0 FusionLib: BSX3.0, the third generation of Bosch Sensortec’s FusionLib sensor-fusion software, intelligently fuses raw data from multiple sensors for optimal performance. The FusionLib software supports 9-axis and 6-axis implementations and can be scaled to run optimally on both embedded microcontroller and application processors, thus, supporting both Android and Microsoft Windows 8 operating systems today. The software’s scalable architecture also means that it can be easily adapted for other operating systems.
The FusionLib software provides a ready-to-use advanced sensor-fusion system that reduces the complexity for OEMs and helps in the rapid development of advanced sensor applications, such as AR, image stabilization, pedestrian tracking and gesture recognition.
In mid 2013, Bosch Sensortec will start sampling the new sensors BMA355 and BNO055 to key development partners. BSX FusionLib is available today under software license agreement to customers developing 6- and 9-axis solutions with Bosch Sensortec MEMS devices.
At the 2013 International CES, the company will showcase three new products that reflect its ongoing strategy to offer customers greater design flexibility through the delivery of smaller, energy-efficient, higher-performance and more tightly integrated sensor-software combinations.
"Bosch Sensortec’s MEMS-product portfolio sets the industry standard for small size, scalable performance and ease of integration," said Dr. Stefan Finkbeiner, CEO of Bosch Sensortec.
"This includes single-function MEMS inertial sensors, integrated system-in-package products, and highly intelligent sensor-fusion software. Our new products reflect these attributes, supporting our goal for sustained technology leadership. They also empower our customers to add with ease the intelligent sensing required for so many consumer electronics. "
BMA355: Featuring wafer-level chip scale package with a size of just 1.2 x 1.5 x 0.8 mm3, the BMA355 is the smallest 3-axis MEMS accelerometer on the market. It enables designers to embed accelerometer functionality in space-constrained applications.
Featuring low power consumption, 12-bit digital resolution and a flexible integrated interrupt engine, the BMA355 is ideally suited for applications requiring extremely small form factors, such as power management for hearing aids and sensor nodes in ubiquitous sensor networks (USN) for the Internet of Things.
Designers of consumer devices such as smartphones, tablets, game consoles and digital cameras will also benefit from the space and power savings derived from the BMA355. The BMA355 supports motion detection, portrait-landscape orientation-switching, flat detection, tap/double-tap sensing, shock detection and free-fall protection as well as advanced power management for mobile devices.
BNO055: The BNO055 is the first in a new family of Application Specific Sensor Nodes (ASSN) implementing an intelligent 9-axis "Absolute Orientation Sensor," which includes sensors and sensor fusion in a single package.
The BNO055 is a system-in-package (SiP), integrating a triaxial 12-bit accelerometer, a triaxial 16-bit gyroscope with a range of ±2000 degrees per second, a triaxial geomagnetic sensor and a 32-bit microcontroller running the company’s BSX3.0 FusionLib software. At just 5.0 x 4.5 mm2, it is significantly smaller than comparable discrete or system-on-board solutions.
By integrating sensors and sensor fusion in a single device, the BNO055 eases the integration process for customers, freeing them from the complexities of multi-vendor solutions so they can spend more time on product innovation, including novel applications such as wearable hardware. It is also the perfect choice for augmented reality (AR), more immersive gaming, personal health and fitness, indoor navigation and any other application requiring context awareness.
BSX3.0 FusionLib: BSX3.0, the third generation of Bosch Sensortec’s FusionLib sensor-fusion software, intelligently fuses raw data from multiple sensors for optimal performance. The FusionLib software supports 9-axis and 6-axis implementations and can be scaled to run optimally on both embedded microcontroller and application processors, thus, supporting both Android and Microsoft Windows 8 operating systems today. The software’s scalable architecture also means that it can be easily adapted for other operating systems.
The FusionLib software provides a ready-to-use advanced sensor-fusion system that reduces the complexity for OEMs and helps in the rapid development of advanced sensor applications, such as AR, image stabilization, pedestrian tracking and gesture recognition.
In mid 2013, Bosch Sensortec will start sampling the new sensors BMA355 and BNO055 to key development partners. BSX FusionLib is available today under software license agreement to customers developing 6- and 9-axis solutions with Bosch Sensortec MEMS devices.
INSIDE Secure provides end-to-end security solutions for Telechips
FRANCE: INSIDE Secure announced that Korea-based Telechips is integrating a host of INSIDE Secure security solutions into its new family of set-top box processor chips.
Telechips will add INSIDE Secure DRM Fusion Agent solutions for HDCP and DTCP-IP and the SafeZone secure platform into its new TCC89XX multimedia application processors to help ensure secure boot up and end-to-end content protection.
“The integration of INSIDE secure boot and HDCP/DTCP-IP protection solutions eliminates the need for add-on security software and greatly enhances the many built-in features and benefits of our newest family of set-top box processors, and enables Telechips to provide trustworthy security solutions for IP/OTT service providers,” said Jangkyu Lee, VP of marketing and sales at Telechips. “INSIDE Secure was able to step up quickly and provide exactly what we needed to support in-home digital content protection for high-value and premium content through HDCP and DTCP-IP technologies.”
The INSIDE Secure HDCP and DTCP-IP solutions allow consumers to share high-definition and high-value content among multiple devices by protecting delivery of premium content between transmitter devices (consumer tablets, smartphones, game consoles, PCs, set-top boxes) and receiver devices (TVs, projectors, monitors).
Compatible with the latest HDCP2.2 and DTCP-IP v 1.7 specifications, they allow semiconductor and appliance vendors to implement a complete content protection solution into silicon and consumer devices, where it protects all of the encryption keys and secure computations. The security modules of the HDCP and DTCP-IP protocols are available for integration on a Trusted Execution Environment-based platform or as a dedicated, highly secure and optimized hardware module.
“The need for content security assurance is growing in lock step with the global expansion of content delivery services, and forward-thinking chip makers like Telechips are building security into their silicon instead of treating it as an afterthought,” said Dr. Simon Blake-Wilson, executive VP, Embedded Security Solutions Division, at INSIDE Secure. “This design win underscores our ability to deliver a bundled security solution, and we appreciate the trust placed in us by Telechips and a growing number of other semiconductor providers integrating our mobile and network security.”
The INSIDE DRM Fusion Agent supports HDCP, Microsoft PlayReady, Windows Media DRM, Open Mobile Alliance (OMA) and DECE UltraViolet standards. The DRM Fusion Agent is available as a downloadable application for both Android and Apple iOS-based smartphones and tablets.
As an embedded solution, it is available on Android and many other embedded platforms for mobile phones, set-top boxes and other devices. The DRM Fusion Agent also supports in-home digital content protection through HDCP and DTCP-IP solutions. With DRM Fusion Agent, content is protected from content owners and distributors all the way to rendering devices such as TVs, monitors and projectors.
INSIDE Secure also offers an end-to-end media security solution through its DRM Fusion Server for carriers and network service providers. The INSIDE Secure DRM Fusion Server handles the entire DRM process from content protection, rights creation and rights and condition management to license generation and delivery.
Telechips will add INSIDE Secure DRM Fusion Agent solutions for HDCP and DTCP-IP and the SafeZone secure platform into its new TCC89XX multimedia application processors to help ensure secure boot up and end-to-end content protection.
“The integration of INSIDE secure boot and HDCP/DTCP-IP protection solutions eliminates the need for add-on security software and greatly enhances the many built-in features and benefits of our newest family of set-top box processors, and enables Telechips to provide trustworthy security solutions for IP/OTT service providers,” said Jangkyu Lee, VP of marketing and sales at Telechips. “INSIDE Secure was able to step up quickly and provide exactly what we needed to support in-home digital content protection for high-value and premium content through HDCP and DTCP-IP technologies.”
The INSIDE Secure HDCP and DTCP-IP solutions allow consumers to share high-definition and high-value content among multiple devices by protecting delivery of premium content between transmitter devices (consumer tablets, smartphones, game consoles, PCs, set-top boxes) and receiver devices (TVs, projectors, monitors).
Compatible with the latest HDCP2.2 and DTCP-IP v 1.7 specifications, they allow semiconductor and appliance vendors to implement a complete content protection solution into silicon and consumer devices, where it protects all of the encryption keys and secure computations. The security modules of the HDCP and DTCP-IP protocols are available for integration on a Trusted Execution Environment-based platform or as a dedicated, highly secure and optimized hardware module.
“The need for content security assurance is growing in lock step with the global expansion of content delivery services, and forward-thinking chip makers like Telechips are building security into their silicon instead of treating it as an afterthought,” said Dr. Simon Blake-Wilson, executive VP, Embedded Security Solutions Division, at INSIDE Secure. “This design win underscores our ability to deliver a bundled security solution, and we appreciate the trust placed in us by Telechips and a growing number of other semiconductor providers integrating our mobile and network security.”
The INSIDE DRM Fusion Agent supports HDCP, Microsoft PlayReady, Windows Media DRM, Open Mobile Alliance (OMA) and DECE UltraViolet standards. The DRM Fusion Agent is available as a downloadable application for both Android and Apple iOS-based smartphones and tablets.
As an embedded solution, it is available on Android and many other embedded platforms for mobile phones, set-top boxes and other devices. The DRM Fusion Agent also supports in-home digital content protection through HDCP and DTCP-IP solutions. With DRM Fusion Agent, content is protected from content owners and distributors all the way to rendering devices such as TVs, monitors and projectors.
INSIDE Secure also offers an end-to-end media security solution through its DRM Fusion Server for carriers and network service providers. The INSIDE Secure DRM Fusion Server handles the entire DRM process from content protection, rights creation and rights and condition management to license generation and delivery.
Cisco, NXP invest in Cohda Wireless to enable connected car
SINGAPORE: Cisco and NXP Semiconductors N.V. have each made an investment in Cohda Wireless to advance intelligent transportation systems (ITS) and car-to-X communications.
Cohda Wireless is a leading specialist in wireless communication for automotive safety applications. The announcement brings together the expertise of the three organizations to make the Internet of Everything a reality for the automotive industry, creating a safer and more enjoyable driving experience while improving the traffic flow.
Car-to-Car (C2C) and Car-to-Infrastructure (C2I) communications enable active safety systems that can affect 81 percent of all crash scenarios, as a result helping to reduce fatalities and injuries on the roads. In addition to improving safety, car-to-infrastructure (C2I) communication holds great potential for intelligent transport system (ITS) management and reducing greenhouse gas emissions from vehicles.
This progress in traffic management and road safety can be realized with the help of applications that warn of hazards such as the potential of a collision ahead, alerting if a nearby vehicle is losing control, or of upcoming traffic congestion, and others – all enabled by the combined expertise and technologies of the three companies.
By allowing vehicles to reliably interact with each other when travelling at high-speeds, each vehicle can give drivers warnings about potential hazards and allow them to avoid accidents, or even automatically respond to changing driving conditions faster than typical human reaction times. Warnings about traffic blockages ahead also allow early re-routing to avoid traffic congestion.
C2C and C2I communications require highly reliable and secure data exchange between fast moving vehicles and infrastructure in a range of conditions – from rural highway to dense urban canyons. NXP and Cohda Wireless have built a market-ready, flexible wireless communication solution for onboard-units based on Cohda’s existing advanced radio and NXP’s market-proven software-defined radio technology. This makes it a key element to connect to Cisco’s vision of a ubiquitous and highly-secure Internet of Everything.
Onboard and road side units developed using technologies from the three companies have been tested to global standards in major field trials. In August 2012, the “Safety Pilot Model Deployment” trial by the US Department of Transport was initiated, and other major field trials include simTD in Germany, ScoreF in France, and ERP2 in Singapore.
The three companies will apply their collective expertise and technologies to help automotive OEMs, suppliers, enterprises and consumers to connect vehicles with ITS infrastructure. This will be spearheaded by producing the first automotive-qualified IEEE 802.11p products for onboard and road‑side units that are ready for C2C and C2I deployments across the globe.
Cohda’s technology enhances wireless communications to quality levels far beyond commercial off-the-shelf IEEE 802.11p transceivers, allowing cars to more effectively “see” through obstacles or around corners. NXP, as global number one supplier of car radio semiconductors and security chips, brings its software-defined radio platform and ensures industry-ready data security, cost efficiency, form factor, power consumption, and performance.
Together, Cisco, NXP, and Cohda will develop a complete market-ready solution for the automotive and ITS industry.
NXP will exclusively license the Cohda 802.11p technology together with its chipsets as a one-stop shop to automotive customers. Cohda will be NXP’s preferred partner for automotive 802.11p reference designs.
Cisco is helping the automotive and transportation systems industries deliver new functionality, enhanced safety and driver experience. By incorporating an intelligent network, OEMs, suppliers, enterprises and consumers can benefit from intelligent transportation systems, connected commercial fleets and smart connected vehicles.
Cohda Wireless is a leading specialist in wireless communication for automotive safety applications. The announcement brings together the expertise of the three organizations to make the Internet of Everything a reality for the automotive industry, creating a safer and more enjoyable driving experience while improving the traffic flow.
Car-to-Car (C2C) and Car-to-Infrastructure (C2I) communications enable active safety systems that can affect 81 percent of all crash scenarios, as a result helping to reduce fatalities and injuries on the roads. In addition to improving safety, car-to-infrastructure (C2I) communication holds great potential for intelligent transport system (ITS) management and reducing greenhouse gas emissions from vehicles.
This progress in traffic management and road safety can be realized with the help of applications that warn of hazards such as the potential of a collision ahead, alerting if a nearby vehicle is losing control, or of upcoming traffic congestion, and others – all enabled by the combined expertise and technologies of the three companies.
By allowing vehicles to reliably interact with each other when travelling at high-speeds, each vehicle can give drivers warnings about potential hazards and allow them to avoid accidents, or even automatically respond to changing driving conditions faster than typical human reaction times. Warnings about traffic blockages ahead also allow early re-routing to avoid traffic congestion.
C2C and C2I communications require highly reliable and secure data exchange between fast moving vehicles and infrastructure in a range of conditions – from rural highway to dense urban canyons. NXP and Cohda Wireless have built a market-ready, flexible wireless communication solution for onboard-units based on Cohda’s existing advanced radio and NXP’s market-proven software-defined radio technology. This makes it a key element to connect to Cisco’s vision of a ubiquitous and highly-secure Internet of Everything.
Onboard and road side units developed using technologies from the three companies have been tested to global standards in major field trials. In August 2012, the “Safety Pilot Model Deployment” trial by the US Department of Transport was initiated, and other major field trials include simTD in Germany, ScoreF in France, and ERP2 in Singapore.
The three companies will apply their collective expertise and technologies to help automotive OEMs, suppliers, enterprises and consumers to connect vehicles with ITS infrastructure. This will be spearheaded by producing the first automotive-qualified IEEE 802.11p products for onboard and road‑side units that are ready for C2C and C2I deployments across the globe.
Cohda’s technology enhances wireless communications to quality levels far beyond commercial off-the-shelf IEEE 802.11p transceivers, allowing cars to more effectively “see” through obstacles or around corners. NXP, as global number one supplier of car radio semiconductors and security chips, brings its software-defined radio platform and ensures industry-ready data security, cost efficiency, form factor, power consumption, and performance.
Together, Cisco, NXP, and Cohda will develop a complete market-ready solution for the automotive and ITS industry.
NXP will exclusively license the Cohda 802.11p technology together with its chipsets as a one-stop shop to automotive customers. Cohda will be NXP’s preferred partner for automotive 802.11p reference designs.
Cisco is helping the automotive and transportation systems industries deliver new functionality, enhanced safety and driver experience. By incorporating an intelligent network, OEMs, suppliers, enterprises and consumers can benefit from intelligent transportation systems, connected commercial fleets and smart connected vehicles.
PC OEMs restock, DRAM contract price uptrend continues in 2HDec.
TAIWAN: According to DRAMeXchange, a research division of TrendForce, affected by spot market prices, DRAM contract prices increased by 2 percent on average in 1HDec., and the uptrend continues in 2HDec.
Prices for mainstream 4GB modules in particular rose, by 3.17 percent. Deals were concluded at around $16.25, $0.50 higher than average contract price ($15.75) and indication that some DRAM suppliers have more negotiating power than others. From the market perspective, as the Korean makers plan to drastically cut PC DRAM production levels in 2013, focusing capex and technology migration on mobile DRAM products, PC OEMs are left with fewer suppliers to choose from, and subsequently, less bargaining power.
DRAM manufacturers are gradually gaining more control over price. While PC demand visibility is limited, due to supply side factors and PC OEMs’ inventory restocking, DRAM prices will likely stay on an uptrend at least until it hits the Korean manufacturers’ break-even point.
Looking towards the first quarter, past experiences show that there is generally no strong demand growth aside from Chinese New Year purchasing. However, due to the aforementioned supply side changes, the sufficiency ratio is expected to improve significantly compared to the previous quarter.
While the market is not likely to see short supply, certain types of chips will see significant increases as technology migrates to the next-generation process. As long as the necessary capacity cuts continue to be made, TrendForce forecasts supply and demand will likely balance out in 2013, with the six-month commodity DRAM downtrend finally coming to an end.
Five major trends in DRAM industry for 2013
Year 2012 has been a tough year for the DRAM industry, as evidenced by Micron’s official merger with Elpida, the decision of Taiwanese DRAM makers to quit and transition to the foundry business, and the fact that 2Gb prices have dropped to as low as $0.6—an indication of the financial woes encountered by manufacturers within the industry.
Luckily, there have been a few promising signs; the DRAM manufacturers’ implementation of capacity-adjustments, for example, has contributed to an astounding 20 percent growth in DRAM spot prices. These movements, in turn, helped provide stimulation for the contract prices, which have exhibited an uptrend recently. Heading into 2013, TrendForce expects the following five trends to emerge:
1. Samsung, SK Hynix and Micron to grow stronger and dominate the market.
Although Micron is still in the process of merging with Elpida, the procedures are expected to be complete by sometime around 2H13. Taking into account the fact that Micron’s revenue is on par with that of SK Hynix, and considering the position Samsung currently holds within the DRAM industry, the three companies’ combined market share is projected to amount to more than 90 percent.
Not only is this indicative of the big players’ growing stature, it also confirms the market’s movement towards an oligopolistic state. With their own DRAM and NAND Flash technology, each of the three companies will be able to utilize efficient and appropriate product mixes, and in turn charge prices at a level similar to those in an oligopolistic market. These will be beneficial to the DRAM industry in that DRAM prices may be propelled back to healthy levels.
2. Mobile and server DRAM will become market mainstream while production for PC DRAM decreases.
Given the popularity of smartphones and tablets, TrendForce predicts that for 2H13, mobile DRAM will replace PC DRAM as the next mainstream item within the market. LPDDR2 will still be the standard format in 2013, and with Intel’s Haswell ready to launch, mobile DRAM will make its first major entrance into the NB market.
At the same time, benefiting from the growing interest in online cloud services, server DRAM has shown a 30 percent increase in terms of density growth, and is expected to account for approximately 20 percent of the overall DRAM production for 2013. Output for PC DRAM, on the other hand, will likely experience further cuts, with bit growth forecasted to drop by around 27 percent compared to the same period of last year.
3. 20nm and 30nm technology will become mainstream in 2013.
Given that the state of the DRAM market had not been promising in recent years, the majority of DRAM manufacturers have found themselves facing a lot of financial pressure. Making matters more difficult is the fact that the migration towards 20nm technology requires the purchase of EUV machinery, which costs substantially greater than immersion scanners, and in turn led various DRAM makers to delay the 20nm-and-under process migrations to next year.
TrendForce predicts that the 20nm and 30nm manufacturing process will be the mainstream for DRAM manufacturers this year, breaking the previous two-migrations-a-year tradition.
4. Taiwanese DRAM makers to quit PC DRAM market in 2013, transition to specialty DRAM and foundry business.
During the second half of last year, Nanya’s official announcement to quit the PC DRAM market marked the end of the Taiwanese brands’ presence in commodity DRAM territory. Similar to Winbond, Nanya will now direct the majority of its focus to manufacturing specialty DRAM.
Powerchip has gone on a similar route by transitioning to the foundry business and ending its PC DRAM production. Providing support to Micron, Rexchip and Inotera have stuck to their foundry business model, continuing their production of PC DRAM.
5. Production cuts taking effect, 2013 momentum to bring new opportunities.
When the 2Gb PC DRAM prices dropped to as low as $0.6 during the second half of last year, various manufacturers took gradual steps to not only lower production, but also transition to the production of mobile and server DRAM. PC-OEMs, on the other hand, replenished their inventory in preparation for the end of the year.
In December, spot prices soared by 20 percent, whereas contract prices rebounded and begun to go on an uptrend. Despite the future of PC demand still being uncertain, with production of PC DRAM continuing to drop, 2013 prices are likely to continue increasing, and may gradually return to healthy levels in the future.
Prices for mainstream 4GB modules in particular rose, by 3.17 percent. Deals were concluded at around $16.25, $0.50 higher than average contract price ($15.75) and indication that some DRAM suppliers have more negotiating power than others. From the market perspective, as the Korean makers plan to drastically cut PC DRAM production levels in 2013, focusing capex and technology migration on mobile DRAM products, PC OEMs are left with fewer suppliers to choose from, and subsequently, less bargaining power.
DRAM manufacturers are gradually gaining more control over price. While PC demand visibility is limited, due to supply side factors and PC OEMs’ inventory restocking, DRAM prices will likely stay on an uptrend at least until it hits the Korean manufacturers’ break-even point.
Looking towards the first quarter, past experiences show that there is generally no strong demand growth aside from Chinese New Year purchasing. However, due to the aforementioned supply side changes, the sufficiency ratio is expected to improve significantly compared to the previous quarter.
While the market is not likely to see short supply, certain types of chips will see significant increases as technology migrates to the next-generation process. As long as the necessary capacity cuts continue to be made, TrendForce forecasts supply and demand will likely balance out in 2013, with the six-month commodity DRAM downtrend finally coming to an end.
Five major trends in DRAM industry for 2013
Year 2012 has been a tough year for the DRAM industry, as evidenced by Micron’s official merger with Elpida, the decision of Taiwanese DRAM makers to quit and transition to the foundry business, and the fact that 2Gb prices have dropped to as low as $0.6—an indication of the financial woes encountered by manufacturers within the industry.
Luckily, there have been a few promising signs; the DRAM manufacturers’ implementation of capacity-adjustments, for example, has contributed to an astounding 20 percent growth in DRAM spot prices. These movements, in turn, helped provide stimulation for the contract prices, which have exhibited an uptrend recently. Heading into 2013, TrendForce expects the following five trends to emerge:
1. Samsung, SK Hynix and Micron to grow stronger and dominate the market.
Although Micron is still in the process of merging with Elpida, the procedures are expected to be complete by sometime around 2H13. Taking into account the fact that Micron’s revenue is on par with that of SK Hynix, and considering the position Samsung currently holds within the DRAM industry, the three companies’ combined market share is projected to amount to more than 90 percent.
Not only is this indicative of the big players’ growing stature, it also confirms the market’s movement towards an oligopolistic state. With their own DRAM and NAND Flash technology, each of the three companies will be able to utilize efficient and appropriate product mixes, and in turn charge prices at a level similar to those in an oligopolistic market. These will be beneficial to the DRAM industry in that DRAM prices may be propelled back to healthy levels.
2. Mobile and server DRAM will become market mainstream while production for PC DRAM decreases.
Given the popularity of smartphones and tablets, TrendForce predicts that for 2H13, mobile DRAM will replace PC DRAM as the next mainstream item within the market. LPDDR2 will still be the standard format in 2013, and with Intel’s Haswell ready to launch, mobile DRAM will make its first major entrance into the NB market.
At the same time, benefiting from the growing interest in online cloud services, server DRAM has shown a 30 percent increase in terms of density growth, and is expected to account for approximately 20 percent of the overall DRAM production for 2013. Output for PC DRAM, on the other hand, will likely experience further cuts, with bit growth forecasted to drop by around 27 percent compared to the same period of last year.
3. 20nm and 30nm technology will become mainstream in 2013.
Given that the state of the DRAM market had not been promising in recent years, the majority of DRAM manufacturers have found themselves facing a lot of financial pressure. Making matters more difficult is the fact that the migration towards 20nm technology requires the purchase of EUV machinery, which costs substantially greater than immersion scanners, and in turn led various DRAM makers to delay the 20nm-and-under process migrations to next year.
TrendForce predicts that the 20nm and 30nm manufacturing process will be the mainstream for DRAM manufacturers this year, breaking the previous two-migrations-a-year tradition.
4. Taiwanese DRAM makers to quit PC DRAM market in 2013, transition to specialty DRAM and foundry business.
During the second half of last year, Nanya’s official announcement to quit the PC DRAM market marked the end of the Taiwanese brands’ presence in commodity DRAM territory. Similar to Winbond, Nanya will now direct the majority of its focus to manufacturing specialty DRAM.
Powerchip has gone on a similar route by transitioning to the foundry business and ending its PC DRAM production. Providing support to Micron, Rexchip and Inotera have stuck to their foundry business model, continuing their production of PC DRAM.
5. Production cuts taking effect, 2013 momentum to bring new opportunities.
When the 2Gb PC DRAM prices dropped to as low as $0.6 during the second half of last year, various manufacturers took gradual steps to not only lower production, but also transition to the production of mobile and server DRAM. PC-OEMs, on the other hand, replenished their inventory in preparation for the end of the year.
In December, spot prices soared by 20 percent, whereas contract prices rebounded and begun to go on an uptrend. Despite the future of PC demand still being uncertain, with production of PC DRAM continuing to drop, 2013 prices are likely to continue increasing, and may gradually return to healthy levels in the future.
Analog Devices launches university program in India revolutionizing analog circuit design learning
INDIA: Analog Devices Inc. announced the launch of its University Program for engineering students in India. This program will provide engineering students with a unique hands-on learning opportunity to supplement their core engineering curriculum.
As part of the program, the company’s portable electronic design kits will transform the manner in which engineering students learn and experiment with analog circuit design without the need for expensive lab equipment. Analog Devices is showcasing and demonstrating the Analog Design Kits at the VLSI and Systems Design Conference 2013 at the Hyatt Regency Hotel in Pune from January 7- 9th 2013.
The Analog Kits will allow engineering students to build and test a wide range of analog and digital circuits outside their university labs, using their own PC without the need for any additional lab equipment like oscilloscopes, waveform generators, logic analysers and power supplies.
Students will also have easy access to online and downloadable software and teaching materials, circuit simulation tools, online support, textbooks, reference designs and lab projects to design and implement analog circuits as a supplement to their core engineering curriculum. This approach eliminates the time and space limitations of traditional university lab settings and allows students more flexibility to experiment with real circuits through direct hands-on experience.
Somshubro Pal Choudhury, MD, Analog Devices India, said: “Analog Devices has been operating in India for close to 20 years and has been a pioneer in helping to establish India as a centre of excellence for high end engineering design. The company is focused on bringing together the industry and academia and building strong system design expertise across multiple industry segments.
"The University Program enhances the engineering students’ educational experience with a hands-on learning approach giving them the freedom and creativity to expand the scope of course materials and explore, design, build and test real-world real-time circuits with their personal lab right in the classroom or outside, anytime and anywhere.”
The kits come in three variants - an Analog Discovery Kit, an Analog Parts Kit and an Analog Discovery Training Pack. The Analog Discovery kit combines a dual-channel oscilloscope, a two-channel waveform generator, a 16-channel logic analyser, power supply and many other circuit analysis tools in a USB-powered, low-cost device.
The USB-powered Analog Discovery kit lets students work outside of the lab on their laptop, so they can spend more time designing, testing and analyzing circuits. The Analog Parts Kit offers a large selection of Analog and mixed signal components designed to create a wide variety of useful experiments and devices.
The Analog Discovery Training Pack combines the Analog Discovery and Analog Parts kit together along with the Student version of the TINA Design Suite, a powerful and affordable circuit simulation and PCB design suite. With this hands-on exposure, students will be able to understand both basic and complex analog design, signal processing concepts like analysis of biasing, time/frequency domain, noise, interference, error budgeting, stability etc. and will be able to build sub systems like Amplifiers, Oscillators, Comparators, Converters, Filters, and Regulators. The kits are now available for purchase in India.
The launch of the current Analog Devices University Program is an extension of the company’s commitment to support and enhance the knowledge and system design skills among the engineering student community in India. Analog Devices recently conducted its Anveshan 2012 Project Fellowship to encourage and nurture the system level engineering expertise among engineering students at the university level by aligning the selected team with Industry mentors to guide them during the design phase. The fellowship saw a tremendous response from the student community across India.
As part of the program, the company’s portable electronic design kits will transform the manner in which engineering students learn and experiment with analog circuit design without the need for expensive lab equipment. Analog Devices is showcasing and demonstrating the Analog Design Kits at the VLSI and Systems Design Conference 2013 at the Hyatt Regency Hotel in Pune from January 7- 9th 2013.
The Analog Kits will allow engineering students to build and test a wide range of analog and digital circuits outside their university labs, using their own PC without the need for any additional lab equipment like oscilloscopes, waveform generators, logic analysers and power supplies.
Students will also have easy access to online and downloadable software and teaching materials, circuit simulation tools, online support, textbooks, reference designs and lab projects to design and implement analog circuits as a supplement to their core engineering curriculum. This approach eliminates the time and space limitations of traditional university lab settings and allows students more flexibility to experiment with real circuits through direct hands-on experience.
Somshubro Pal Choudhury, MD, Analog Devices India, said: “Analog Devices has been operating in India for close to 20 years and has been a pioneer in helping to establish India as a centre of excellence for high end engineering design. The company is focused on bringing together the industry and academia and building strong system design expertise across multiple industry segments.
"The University Program enhances the engineering students’ educational experience with a hands-on learning approach giving them the freedom and creativity to expand the scope of course materials and explore, design, build and test real-world real-time circuits with their personal lab right in the classroom or outside, anytime and anywhere.”
The kits come in three variants - an Analog Discovery Kit, an Analog Parts Kit and an Analog Discovery Training Pack. The Analog Discovery kit combines a dual-channel oscilloscope, a two-channel waveform generator, a 16-channel logic analyser, power supply and many other circuit analysis tools in a USB-powered, low-cost device.
The USB-powered Analog Discovery kit lets students work outside of the lab on their laptop, so they can spend more time designing, testing and analyzing circuits. The Analog Parts Kit offers a large selection of Analog and mixed signal components designed to create a wide variety of useful experiments and devices.
The Analog Discovery Training Pack combines the Analog Discovery and Analog Parts kit together along with the Student version of the TINA Design Suite, a powerful and affordable circuit simulation and PCB design suite. With this hands-on exposure, students will be able to understand both basic and complex analog design, signal processing concepts like analysis of biasing, time/frequency domain, noise, interference, error budgeting, stability etc. and will be able to build sub systems like Amplifiers, Oscillators, Comparators, Converters, Filters, and Regulators. The kits are now available for purchase in India.
The launch of the current Analog Devices University Program is an extension of the company’s commitment to support and enhance the knowledge and system design skills among the engineering student community in India. Analog Devices recently conducted its Anveshan 2012 Project Fellowship to encourage and nurture the system level engineering expertise among engineering students at the university level by aligning the selected team with Industry mentors to guide them during the design phase. The fellowship saw a tremendous response from the student community across India.
Friday, January 4, 2013
Speed up ZigBee development with BoosterPack for TI's MSP430 and Stellaris LaunchPad evaluation kits
USA: Texas Instruments Inc. (TI) announced the full availability of a new ZigBee BoosterPack based on TI's CC2530 ZigBee system-on-chip (SoC) that enables developers to jumpstart their designs.
The BoosterPack comes with the hardware and software needed for ZigBee development to quickly bring-up the ZigBee modem, create a network and send and receive packets. Developed, offered and supported by Anaren Inc., the ZigBee BoosterPack (A2530E24A-LPZ) works with the MSP430 and Stellaris LaunchPad evaluation kits providing developers with more microcontroller (MCU) choices when adding ZigBee wireless connectivity to home gateway, smart meter, and lighting control applications.
To speed time to market of new 802.15.4 ZigBee designs, the BoosterPack comes with everything a developer needs to get started including:
* Three ZigBee BoosterPacks based on the Anaren AIR module A2530E24A for connection to the MSP430 or Stellaris LaunchPad evaluation kit (LaunchPad sold separately).
* Each BoosterPack includes an on-board MSP430G2553IN20 Value Line MCU, pre-flashed with Anaren's AIR-ZNP firmware (based on TI's Z-Stack ZigBee stack).
* For Stellaris MCU operation, simply remove the MSP430 MCU, and load the Stellaris firmware via USB from the included CD.
* CD with all the software, MSP430 and Stellaris drivers, application notes, quick start guide, and more.
* One 2xAA battery holder for remote.
RDA announces sampling of high band WCDMA power amplifiers
CHINA: RDA Microelectronics, a fabless semiconductor company that designs, develops and markets wireless SoC and Radio Frequency (RF) semiconductors for cellular, connectivity and broadcast applications, announced sampling of its RDA6821 and RDA6822 High Band WCDMA PA products for Band 1 (2100 MHz) and Band 2 (1900 MHz) applications.
With the launch of these products, RDA now provides a complete 3G WCDMA PA offering for emerging markets.
RDA's WCDMA PAs are developed on proven GaAs HBT and SOI CMOS process technology, enabling the highest level of efficiency and linearity. GaAs HBT provides superior performance for medium and high-power modes, while SOI CMOS offers integrated switching capabilities, excellent low-power performance and an additional bypass option.
This unique process architecture combined with an innovative two-layer substrate solution provides additional cost savings for customers choosing RDA's 3G PA solutions. The RDA 6821 and RDA 6822 are packaged in a small 3x3mm form factor and pin-compatible with all industry standard counterparts.
Global semiconductor sales post best month of 2012 in Nov.
USA: The Semiconductor Industry Association (SIA) announced that worldwide sales of semiconductors reached $25.73 billion for the month of November 2012, the largest monthly total of 2012 and a 2 percent increase from the prior month when sales were $25.22 billion.
Sales from November 2012 also topped the November 2011 total of $25.22 billion by 2 percent, marking the global industry's first year-over-year gain of 2012. Regionally, the Americas posted its largest year-over-year increase (9.7 percent) since April 2011. All monthly sales numbers represent a three-month moving average.
Source: Semiconductor Industry Association (SIA), USA.
"The global semiconductor industry navigated difficult macroeconomic conditions in 2012, but encouraging growth led by the Americas in recent months has the industry pointed in the right direction heading into 2013," said Brian Toohey , president and CEO, Semiconductor Industry Association. "To ensure that the industry's momentum continues, Congress should remove ongoing economic uncertainty by enacting long-term, reliable fiscal policies that boost America's economic strength and global competitiveness."
Regionally, sequential monthly sales increased in the Americas (5.1 percent), Asia Pacific (2.7 percent) and Europe (0.4 percent), but decreased in Japan (-3.4 percent). In the Americas, combined sales from September through November grew sharply (20.2 percent) compared to sales from June through August, marking the region's largest increase on a three-month moving average in the last decade.
Sales from November 2012 also topped the November 2011 total of $25.22 billion by 2 percent, marking the global industry's first year-over-year gain of 2012. Regionally, the Americas posted its largest year-over-year increase (9.7 percent) since April 2011. All monthly sales numbers represent a three-month moving average.
"The global semiconductor industry navigated difficult macroeconomic conditions in 2012, but encouraging growth led by the Americas in recent months has the industry pointed in the right direction heading into 2013," said Brian Toohey , president and CEO, Semiconductor Industry Association. "To ensure that the industry's momentum continues, Congress should remove ongoing economic uncertainty by enacting long-term, reliable fiscal policies that boost America's economic strength and global competitiveness."
Regionally, sequential monthly sales increased in the Americas (5.1 percent), Asia Pacific (2.7 percent) and Europe (0.4 percent), but decreased in Japan (-3.4 percent). In the Americas, combined sales from September through November grew sharply (20.2 percent) compared to sales from June through August, marking the region's largest increase on a three-month moving average in the last decade.
Marvell unveils Dragonfly NVDRIVE PCIe SSD cache accelerator
USA: Marvell announced the availability of the Marvell DragonFly NVDRIVE, a turnkey enterprise-class PCIe SSD caching solution with built-in SSD modules that extends the company’s award-winning DragonFly NVCACHE and NVRAM adapter product offerings first announced last August.
Targeted for large-scale Internet and cloud computing datacenters, the DragonFly NVDRIVE dramatically scales both bare metal and virtualized server applications, including Web servers, OLTP and analytic databases, as well as NoSQL and big data distributed applications.
“The NVDRIVE is a game-changing extension of the popular DragonFly NVRAM and NVCACHE family. It delivers the same unprecedented application acceleration as the existing NVCACHE solution, but now seamlessly integrates with onboard SSD modules for plug-and-play ease of use,” said Alan Armstrong, VP of marketing of Marvell Semiconductor’s Storage Business Group.
“The innovative application of non-volatile DDR memory, highly optimized caching algorithms, and entry enterprise SSD modules creates a converged solution that is ideally suited for mixed-workload cloud data centers. The NVDRIVE raises the bar on affordability and performance, and its unique cache automation and consistent write latency capabilities will be sought after by both OEM and cloud computing customers who require predictable performance at reasonable costs.”
The DragonFly NVDRIVE is powered by Marvell’s world-class storage SoC technology and seamlessly merges large capacity non-volatile DRAM with onboard SSD modules to enable up to 100 times higher performance for random read- and write-heavy application workloads as compared to traditional disk-based solutions.
Additionally, automated caching removes the guesswork, maintenance and high capital costs required by manual data tiering approaches. Unique to the industry, DragonFly writeback caching is fully powered by ARM-based storage processors and enables storage administrators to configure granular cache policies at either a file or block level.
Data protection and reliability are ensured via intelligent RAID software and peer-to-peer synchronous mirroring to prevent data loss against any failure – server, adapter, SSD module or NAND components. An ultra-thin filter driver residing in Linux or Xen is transparent to applications and supports caching across all storage protocols, including SCSI (local DAS), NFS, iSCSI, FCoE and FCP.
Marvell’s partners and OEMs are already expressing strong enthusiasm for the Dragonfly NVDRIVE. “The SanDisk X100 mSATA SSDs provide small form factor, low-latency, high-performance and cost-effective non-volatile storage for the Marvell DragonFly NVDRIVE,” said Kevin Conley, senior VP and GM, Client Storage Solutions at SanDisk. “Optimized for entry level enterprise workloads, the Marvell NVDRIVE based on the X100 SSDs provides an ideal solution for customers seeking performance demanding business-critical data center applications.”
“As organizations increasingly adopt both virtualization and cloud storage solutions, their demand for powerful and intelligent plug-and-play acceleration of their IO and applications will only increase,” said Mark Peters, senior analyst at Enterprise Strategy Group. “And, of course, this enhanced performance should ideally be delivered with a simultaneous TCO reduction to help IT professionals juggle demands where the only certainty is growth. Solutions such as Marvell’s DragonFly NVDRIVE possess the ability to deliver this desired combination, and reflect an entire industry that's focused on delivering a storage model - whether on premise or in the cloud - that is effective, efficient and sustainable.”
Feature highlights of the Dragonfly NVDRIVE include:
* Up to 1.5 TB of useable SSD capacity with the [industry’s largest] integrated non-volatile DRAM cache.
* Highly predictable performance across mixed write/read workloads.
* Cache mode sustained performance exceeds 200,000 4K random IOPS, 3GBps throughput and sub-10us average latency.
* Enterprise-class embedded write-back cache software. Simple, smart and fully automated.
* Robust data protection, including RAID and HA peer-to-peer synchronous mirroring software.
* Rich command line interface (CLI) and cache policies for granular file/block object level configurations.
* Application-transparent OS filter driver supports all major protocols – SCSI, iSCSI, NFS, FCoE and FCP.
* Hypervisor integration enables virtual machine migration, HA, snapshots, clones and more.
* Fully integrated DragonFly Manager for GUI-based administration and performance monitoring.
The Marvell DragonFly NVDRIVE will be sampling later in Q1 with OEM and cloud computing customers. DragonFly NVDRIVE is offered at 750GB and 1.5TB capacity points. Pricing starts at a manufacturer’s suggested retail price (MSRP) of $2,995.
Targeted for large-scale Internet and cloud computing datacenters, the DragonFly NVDRIVE dramatically scales both bare metal and virtualized server applications, including Web servers, OLTP and analytic databases, as well as NoSQL and big data distributed applications.
“The NVDRIVE is a game-changing extension of the popular DragonFly NVRAM and NVCACHE family. It delivers the same unprecedented application acceleration as the existing NVCACHE solution, but now seamlessly integrates with onboard SSD modules for plug-and-play ease of use,” said Alan Armstrong, VP of marketing of Marvell Semiconductor’s Storage Business Group.
“The innovative application of non-volatile DDR memory, highly optimized caching algorithms, and entry enterprise SSD modules creates a converged solution that is ideally suited for mixed-workload cloud data centers. The NVDRIVE raises the bar on affordability and performance, and its unique cache automation and consistent write latency capabilities will be sought after by both OEM and cloud computing customers who require predictable performance at reasonable costs.”
The DragonFly NVDRIVE is powered by Marvell’s world-class storage SoC technology and seamlessly merges large capacity non-volatile DRAM with onboard SSD modules to enable up to 100 times higher performance for random read- and write-heavy application workloads as compared to traditional disk-based solutions.
Additionally, automated caching removes the guesswork, maintenance and high capital costs required by manual data tiering approaches. Unique to the industry, DragonFly writeback caching is fully powered by ARM-based storage processors and enables storage administrators to configure granular cache policies at either a file or block level.
Data protection and reliability are ensured via intelligent RAID software and peer-to-peer synchronous mirroring to prevent data loss against any failure – server, adapter, SSD module or NAND components. An ultra-thin filter driver residing in Linux or Xen is transparent to applications and supports caching across all storage protocols, including SCSI (local DAS), NFS, iSCSI, FCoE and FCP.
Marvell’s partners and OEMs are already expressing strong enthusiasm for the Dragonfly NVDRIVE. “The SanDisk X100 mSATA SSDs provide small form factor, low-latency, high-performance and cost-effective non-volatile storage for the Marvell DragonFly NVDRIVE,” said Kevin Conley, senior VP and GM, Client Storage Solutions at SanDisk. “Optimized for entry level enterprise workloads, the Marvell NVDRIVE based on the X100 SSDs provides an ideal solution for customers seeking performance demanding business-critical data center applications.”
“As organizations increasingly adopt both virtualization and cloud storage solutions, their demand for powerful and intelligent plug-and-play acceleration of their IO and applications will only increase,” said Mark Peters, senior analyst at Enterprise Strategy Group. “And, of course, this enhanced performance should ideally be delivered with a simultaneous TCO reduction to help IT professionals juggle demands where the only certainty is growth. Solutions such as Marvell’s DragonFly NVDRIVE possess the ability to deliver this desired combination, and reflect an entire industry that's focused on delivering a storage model - whether on premise or in the cloud - that is effective, efficient and sustainable.”
Feature highlights of the Dragonfly NVDRIVE include:
* Up to 1.5 TB of useable SSD capacity with the [industry’s largest] integrated non-volatile DRAM cache.
* Highly predictable performance across mixed write/read workloads.
* Cache mode sustained performance exceeds 200,000 4K random IOPS, 3GBps throughput and sub-10us average latency.
* Enterprise-class embedded write-back cache software. Simple, smart and fully automated.
* Robust data protection, including RAID and HA peer-to-peer synchronous mirroring software.
* Rich command line interface (CLI) and cache policies for granular file/block object level configurations.
* Application-transparent OS filter driver supports all major protocols – SCSI, iSCSI, NFS, FCoE and FCP.
* Hypervisor integration enables virtual machine migration, HA, snapshots, clones and more.
* Fully integrated DragonFly Manager for GUI-based administration and performance monitoring.
The Marvell DragonFly NVDRIVE will be sampling later in Q1 with OEM and cloud computing customers. DragonFly NVDRIVE is offered at 750GB and 1.5TB capacity points. Pricing starts at a manufacturer’s suggested retail price (MSRP) of $2,995.
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