LEHIGH VALLEY, USA: Air Products has entered into a definitive agreement to acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), the two companies' 50-50 joint venture serving the global semiconductor and wafer polishing industries. Terms of the agreement were not disclosed.
DA NanoMaterials manufactures chemical mechanical planarization (CMP) slurries for the semiconductor and wafer polishing industries. Headquartered in Tempe, Ariz., with regional headquarters in Hsinchu County, Taiwan, the company operates state-of-the-art applications and formulation laboratories in Tempe and Taiwan. DA NanoMaterials has established a portfolio of colloidal silica-based products for copper CMP, tungsten CMP and wafer polishing applications.
"We are pleased to complete the conversion of DA NanoMaterials, and to continue to build on our electronic materials portfolio," said Wayne Mitchell, VP and GM of Electronics for Air Products. "This acquisition provides additional scale and synergies to our differentiated materials business within Electronics."
Thursday, March 1, 2012
Altera's Stratix V FPGAs break through performance barriers
SAN JOSE, USA: Altera Corp. announced the industry's first single-chip, dual 100G transponder solution implemented in a 28-nm high-performance Stratix V FPGA. Altera's solution integrates two independent 100G transponders into a single FPGA, enabling optical equipment manufacturers to keep pace with network performance and bandwidth demands while lowering capital costs.
A live hardware demonstration of Altera's dual 100G transponder solution will be shown in its booth #2825 at the Optical Fiber Communication Conference and Exhibition/National Fiber Optic Engineers Conference 2012 (OFC/NFOEC) in Los Angeles the week of March 5.
The growing number of Internet-enabled devices today is resulting in an order of magnitude increase in network bandwidth demands and is driving the need for large-scale network-upgrades. Optical Transport Networks (OTN) allows carriers to scale quickly and support the tremendous growth of traffic on their networks. Altera's OTN solutions enable carriers and service providers to increase the number of optical links across the transport layer and support higher data rates across a variety of applications (voice, video, storage).
Altera's single-chip, dual 100G transponder simplifies the move by carrier and service providers to higher-density 100G transport by providing a fully integrated standards-based solution. The solution leverages the enhanced performance of Stratix V FPGAs and industry-leading OTN IP to increase the density of 100G transport solutions beyond the capability of any other ASSP- or FPGA-based solution in the industry. Altera's latest FPGA-based OTN offerings include 28-nm high-performance silicon optimized for transport applications, industry-leading high-speed transceivers and OTN system IP.
Demo of a single-chip, dual 100G transponder at OFC
Altera's demonstration at OFC/NFOEC leverages a single Stratix V GX FPGA and shows two independent transponders carrying live 100G traffic over optical fiber. Altera will also be showcasing its latest innovations in OTN IP and 28-nm FPGA technology at the show. The company will share information on key building blocks that enable system and equipment manufacturers to develop higher density and lower power optical networks for tomorrow's communication systems.
"Altera is committed to supporting optical transport networks with our leading-edge FPGAs, best-in-class transceiver technology and OTN IP," said Dan Mansur, senior director of strategic marketing in Altera's Communications Business Unit. "Our production-grade, single-chip 100G transponder is deployed today in top-tier carrier networks. Now with our dual 100G transponder solution we are able to deliver density that is unachievable with current solutions and puts us on the path to support data rates of 400G and beyond."
A live hardware demonstration of Altera's dual 100G transponder solution will be shown in its booth #2825 at the Optical Fiber Communication Conference and Exhibition/National Fiber Optic Engineers Conference 2012 (OFC/NFOEC) in Los Angeles the week of March 5.
The growing number of Internet-enabled devices today is resulting in an order of magnitude increase in network bandwidth demands and is driving the need for large-scale network-upgrades. Optical Transport Networks (OTN) allows carriers to scale quickly and support the tremendous growth of traffic on their networks. Altera's OTN solutions enable carriers and service providers to increase the number of optical links across the transport layer and support higher data rates across a variety of applications (voice, video, storage).
Altera's single-chip, dual 100G transponder simplifies the move by carrier and service providers to higher-density 100G transport by providing a fully integrated standards-based solution. The solution leverages the enhanced performance of Stratix V FPGAs and industry-leading OTN IP to increase the density of 100G transport solutions beyond the capability of any other ASSP- or FPGA-based solution in the industry. Altera's latest FPGA-based OTN offerings include 28-nm high-performance silicon optimized for transport applications, industry-leading high-speed transceivers and OTN system IP.
Demo of a single-chip, dual 100G transponder at OFC
Altera's demonstration at OFC/NFOEC leverages a single Stratix V GX FPGA and shows two independent transponders carrying live 100G traffic over optical fiber. Altera will also be showcasing its latest innovations in OTN IP and 28-nm FPGA technology at the show. The company will share information on key building blocks that enable system and equipment manufacturers to develop higher density and lower power optical networks for tomorrow's communication systems.
"Altera is committed to supporting optical transport networks with our leading-edge FPGAs, best-in-class transceiver technology and OTN IP," said Dan Mansur, senior director of strategic marketing in Altera's Communications Business Unit. "Our production-grade, single-chip 100G transponder is deployed today in top-tier carrier networks. Now with our dual 100G transponder solution we are able to deliver density that is unachievable with current solutions and puts us on the path to support data rates of 400G and beyond."
Xilinx releases first 28nm FPGAs to production
SAN JOSE, USA: Xilinx Inc. has reached another industry milestone with its limited production release of the industry's first 28nm FPGAs. Having shipped thousands of sample units of its latest 7 series families, the release of the lead Kintex-7 FPGA into production is the latest step in executing the industry's fastest PLD rollout in history. This achievement enables Xilinx customers to start ramping their products into production and serving their customers' demand sooner than ever before.
"We are extremely pleased with the customer acceptance of the entire 7 series FPGA portfolio," said Xilinx president and CEO, Moshe Gavrielov. "Moving into the production phase of our rollout is paramount in our ability to serve the demand created by that outstanding acceptance. This limited production milestone is not only great for the Kintex-7 family but accelerates the pace of the remaining members of our 7 series FPGA portfolio."
The Kintex-7 325T FPGA that is now in limited production was specifically developed to meet the application need for major customers in the communications market. By focusing on key applications, Xilinx was able to accelerate the production of the Kintex-7 325T FPGA and enable lead customers to get into production with their critical programs. The Kintex-7 325T FPGA has passed all of Xilinx's standard verification, quality and reliability requirements required to meet production release criteria.
"We are extremely pleased with the customer acceptance of the entire 7 series FPGA portfolio," said Xilinx president and CEO, Moshe Gavrielov. "Moving into the production phase of our rollout is paramount in our ability to serve the demand created by that outstanding acceptance. This limited production milestone is not only great for the Kintex-7 family but accelerates the pace of the remaining members of our 7 series FPGA portfolio."
The Kintex-7 325T FPGA that is now in limited production was specifically developed to meet the application need for major customers in the communications market. By focusing on key applications, Xilinx was able to accelerate the production of the Kintex-7 325T FPGA and enable lead customers to get into production with their critical programs. The Kintex-7 325T FPGA has passed all of Xilinx's standard verification, quality and reliability requirements required to meet production release criteria.
Altera demos industry-leading optical solutions at OFC/NFOEC 2012
SAN JOSE, USA: Altera Corp. will demonstrate its industry-leading optical transport network (OTN) and IP solutions at the Optical Fiber Communication Conference and Exposition (OFC) and the National Fiber Optic Engineers Conference (NFOEC) in Los Angeles, California.
Experts from Altera will share information on key building blocks that enable system and equipment manufacturers to develop higher density and lower power optical networks for tomorrow's communication systems. Altera will demonstrate how they are breaking industry bandwidth barriers using its Stratix V FPGAs with 28-Gbps transceiver technology. The company's integrated OTN solutions efficiently solve the implementation complexity issues associated with 100-Gbps data rates, and dramatically accelerate communications customers' time to market with next-generation optical networks.
Altera's in-booth demonstrations showcasing its integrated FPGA and IP technologies include:
* Demonstration of a single-chip, dual 100G transponder solution, implemented in a 28-nm Stratix V FPGA. Altera's solution integrates two independent 100G transponders into a single FPGA, enabling optical equipment manufacturers to keep pace with network performance and bandwidth demands while lowering capital costs.
* LMR interoperability demonstration includes a Stratix V Signal Integrity development kit with one transceiver routed to the SFP+ cage. An Avago SFP+ LRM module is plugged in and the electrical interface is running at 10.3125 Gbps using a PRBS31 data pattern generated by the FPGA. Using 220 m of legacy OM‑1 multimode fiber, the optical signal is looped back to the module and eventually to the receiver of the FPGA.
* Demonstration of the industry's first Optical FPGA technology. The demonstration shows Altera's Optical FPGA technology on a test board derived from the company's Stratix IV FPGA 100G development kit, integrated with Avago Technologies' 12-Channel MicroPOD optical modules capable of running at 10G. In an optical loopback, the demonstration will send and receive internally generated 100G data and measure the bit error rate (BER).
* Demonstration of a 100-Gbps optical module system by the Optical Internetworking Forum (OIF) members (Altera, Gennum, and Molex) supporting CEI-28G-VSR. Altera's 28-nm Stratix V GT FPGAs will interface to a 100-Gbps optical module with 28-Gbps transceivers. This demonstration will be showcased in the Optical Internetworking Forum (OIF) multi-vendor booth #713.
Experts from Altera will share information on key building blocks that enable system and equipment manufacturers to develop higher density and lower power optical networks for tomorrow's communication systems. Altera will demonstrate how they are breaking industry bandwidth barriers using its Stratix V FPGAs with 28-Gbps transceiver technology. The company's integrated OTN solutions efficiently solve the implementation complexity issues associated with 100-Gbps data rates, and dramatically accelerate communications customers' time to market with next-generation optical networks.
Altera's in-booth demonstrations showcasing its integrated FPGA and IP technologies include:
* Demonstration of a single-chip, dual 100G transponder solution, implemented in a 28-nm Stratix V FPGA. Altera's solution integrates two independent 100G transponders into a single FPGA, enabling optical equipment manufacturers to keep pace with network performance and bandwidth demands while lowering capital costs.
* LMR interoperability demonstration includes a Stratix V Signal Integrity development kit with one transceiver routed to the SFP+ cage. An Avago SFP+ LRM module is plugged in and the electrical interface is running at 10.3125 Gbps using a PRBS31 data pattern generated by the FPGA. Using 220 m of legacy OM‑1 multimode fiber, the optical signal is looped back to the module and eventually to the receiver of the FPGA.
* Demonstration of the industry's first Optical FPGA technology. The demonstration shows Altera's Optical FPGA technology on a test board derived from the company's Stratix IV FPGA 100G development kit, integrated with Avago Technologies' 12-Channel MicroPOD optical modules capable of running at 10G. In an optical loopback, the demonstration will send and receive internally generated 100G data and measure the bit error rate (BER).
* Demonstration of a 100-Gbps optical module system by the Optical Internetworking Forum (OIF) members (Altera, Gennum, and Molex) supporting CEI-28G-VSR. Altera's 28-nm Stratix V GT FPGAs will interface to a 100-Gbps optical module with 28-Gbps transceivers. This demonstration will be showcased in the Optical Internetworking Forum (OIF) multi-vendor booth #713.
Docea Power unveils thermal modeling solution for early architecture exploration and optimization
GRENOBLE, FRANCE & SAN JOSE, USA: Docea Power, the design-for-low-power company that delivers software solutions for power and thermal analysis at the architectural level, today announced the release of its AceThermalModeler (ATM) software, a solution for generating compact thermal models for System on Chips (SoCs), 3D ICs, Systems in Package (SiPs) or complete boards.
Compact thermal models enable early system floorplan exploration or partitioning, new system packaging and integration architectures, and early exploration of power management policies to reduce temperature’s peaks, and manage temperature gradients across the system.
ATM bridges the gap between thermal experts and the system architecture teams to improve productivity. With ATM, thermal experts can give system architects a solution that generates RC compact thermal models for 3D devices that are fast to create and simulate. The system architecture team can then work autonomously to estimate various corner use cases, floorplans, architecture options for multi-core designs, operating points or power management policies impact on temperature across the system.
Ghislain Kaiser, CEO, Docea Power commented: “We anticipated very early that temperature will become a challenge for next generation devices. Because of this, we developed a simulator that closes the loop between power and temperature for the first versions of Aceplorer, our solution for Electronic System Level power modeling and optimization. Now, we complete the flow with ATM, a tool that is easy to use and generates thermal models. With it, system architects can perform both thermal steady state or coupled power and thermal analysis for dynamic application profiles running on different architecture configurations.”
Compact thermal models enable early system floorplan exploration or partitioning, new system packaging and integration architectures, and early exploration of power management policies to reduce temperature’s peaks, and manage temperature gradients across the system.
ATM bridges the gap between thermal experts and the system architecture teams to improve productivity. With ATM, thermal experts can give system architects a solution that generates RC compact thermal models for 3D devices that are fast to create and simulate. The system architecture team can then work autonomously to estimate various corner use cases, floorplans, architecture options for multi-core designs, operating points or power management policies impact on temperature across the system.
Ghislain Kaiser, CEO, Docea Power commented: “We anticipated very early that temperature will become a challenge for next generation devices. Because of this, we developed a simulator that closes the loop between power and temperature for the first versions of Aceplorer, our solution for Electronic System Level power modeling and optimization. Now, we complete the flow with ATM, a tool that is easy to use and generates thermal models. With it, system architects can perform both thermal steady state or coupled power and thermal analysis for dynamic application profiles running on different architecture configurations.”
ST completes most extensive NFC product portfolio
GENEVA, SWITZERLAND: STMicroelectronics has unveiled its second-generation Near Field Communications (NFC) controller. ST says the new IC, in combination with its wide Secure Element portfolio, will speed up the arrival of a new world of secure contactless apps and services accessible through next-generation smartphones.
Near Field Communication allows smartphones and other mobile appliances to connect wirelessly over a wide range of contactless cards and devices. Mobile payment is acknowledged as a major near-term application for the technology; transactions made using NFC will exceed $30 billion globally in 2012, according to Juniper Research. With support for reader/writer, peer-to-peer and card-emulation modes, NFC can be used to deliver many additional innovative services and personalized marketing messages through customers’ smartphones.
ST’s new NFC controller IC, the ST21NFCA, supports all NFC use cases, and is able to coordinate multiple NFC secure apps stored in several secure locations, such as the SWP-SIM and SWP-microSD Card or Embedded Secure Element. The corresponding NFC software stack, running on the terminal host, supports all Google Android versions, including the latest Ice Cream Sandwich operating system, and will also be available for forthcoming Microsoft Windows 8 OS. The controller is perfectly compatible with the wide choice of ST Secure Elements.
“Our complete and diversified NFC portfolio now gives us the unique ability to provide a technical answer to all possible NFC business models,” said Laurent Degauque, Embedded Security business line manager, Secure Microcontrollers Division, STMicroelectronics. “This will maximize freedom for customers to integrate their chosen selection of applications into a smartphone or any mobile device, and thereby deliver innovative contactless services quickly and easily for end users.”
ST’s Secure Element product range is based on the Secure ARM SC300 32-bit core, and offers a wide choice of Embedded Flash sizes, ranging from 512Kbytes to 1.2Mbytes; it meets all the latest EMVCo and Common Criteria EAL5+ security certifications. Such performance satisfies today’s most advanced Java Card 3.0.1 and Global Platform GP2.2 Secure Operating Systems, which enable shared access to a Secure Element by various service providers.
These Secure Element ICs can be used in all possible form factors, covering SWP-SIM, SWP-MicroSD, Embedded Secure Element, and an advanced System in Package solution that stacks the Secure Element together with the NFC controller.
The entire STMicroelectronics Secure Element portfolio comes with optional support for MIFARE Classic and MIFARE DESFire technologies which allows customers to comply safely with the most popular transportation and ticketing scheme worldwide.
The ST21NFCA controller, in combination with the ST33 product family, covers the full range of NFC use cases and requirements for handset manufacturers and Mobile Network Operators, minimizing development effort, reducing time to market and ensuring its ability to meet the future demands of an ever-evolving NFC market.
All products mentioned are currently in mass production. The ST21NFCA is available in package options including 4.5 x 4.5mm BGA64 or 5 x 5mm QFN32. The custom System-in-Package with embedded Secure Element is available to special order.
Near Field Communication allows smartphones and other mobile appliances to connect wirelessly over a wide range of contactless cards and devices. Mobile payment is acknowledged as a major near-term application for the technology; transactions made using NFC will exceed $30 billion globally in 2012, according to Juniper Research. With support for reader/writer, peer-to-peer and card-emulation modes, NFC can be used to deliver many additional innovative services and personalized marketing messages through customers’ smartphones.
ST’s new NFC controller IC, the ST21NFCA, supports all NFC use cases, and is able to coordinate multiple NFC secure apps stored in several secure locations, such as the SWP-SIM and SWP-microSD Card or Embedded Secure Element. The corresponding NFC software stack, running on the terminal host, supports all Google Android versions, including the latest Ice Cream Sandwich operating system, and will also be available for forthcoming Microsoft Windows 8 OS. The controller is perfectly compatible with the wide choice of ST Secure Elements.
“Our complete and diversified NFC portfolio now gives us the unique ability to provide a technical answer to all possible NFC business models,” said Laurent Degauque, Embedded Security business line manager, Secure Microcontrollers Division, STMicroelectronics. “This will maximize freedom for customers to integrate their chosen selection of applications into a smartphone or any mobile device, and thereby deliver innovative contactless services quickly and easily for end users.”
ST’s Secure Element product range is based on the Secure ARM SC300 32-bit core, and offers a wide choice of Embedded Flash sizes, ranging from 512Kbytes to 1.2Mbytes; it meets all the latest EMVCo and Common Criteria EAL5+ security certifications. Such performance satisfies today’s most advanced Java Card 3.0.1 and Global Platform GP2.2 Secure Operating Systems, which enable shared access to a Secure Element by various service providers.
These Secure Element ICs can be used in all possible form factors, covering SWP-SIM, SWP-MicroSD, Embedded Secure Element, and an advanced System in Package solution that stacks the Secure Element together with the NFC controller.
The entire STMicroelectronics Secure Element portfolio comes with optional support for MIFARE Classic and MIFARE DESFire technologies which allows customers to comply safely with the most popular transportation and ticketing scheme worldwide.
The ST21NFCA controller, in combination with the ST33 product family, covers the full range of NFC use cases and requirements for handset manufacturers and Mobile Network Operators, minimizing development effort, reducing time to market and ensuring its ability to meet the future demands of an ever-evolving NFC market.
All products mentioned are currently in mass production. The ST21NFCA is available in package options including 4.5 x 4.5mm BGA64 or 5 x 5mm QFN32. The custom System-in-Package with embedded Secure Element is available to special order.
RFID- and NFC-enabled smart washing machine detects fabric, supports remote maintenance
SINGAPORE: What if your washing machine could detect what you’ve put in the laundry and adjust its own settings automatically? This week, NXP Semiconductors is showcasing its RFID- and NFC-enabled smart washing machine demonstrator at Embedded World in Nuremberg, Germany, featuring advanced yet practical wireless functionality.
The most popular feature of the demo is fabric detection: The washing machine reads information about the fabric type and color from RFID-tagged buttons, helps you avoid mixing white and dark laundry, and optimizes the washing program based on the characteristics it reads from both the clothing and the detergent itself.
Another popular feature of the demo is NFC-based maintenance: Using an NFC-enabled phone, an authorized maintenance technician can perform diagnostics on the smart washing machine onsite, change its status, upgrade firmware, and launch an app that communicates directly with the manufacturer’s service center using the phone’s built-in 3G connection.
“Major home appliances are becoming ‘smarter’ by the day – yet we’ve only started to explore the universe of possibilities when it comes to two-way communication,” said Jan Willem Vogel, senior director, industrial applications marketing, NXP Semiconductors. “We’re particularly excited about our new smart washing demonstrator, which brings together our advanced application insights, our expertise in RFID and NFC, as well as our broad-based understanding of the complex sub-systems driving white goods today. The demo also showcases the breadth of NXP’s portfolio – the most extensive in the semiconductor industry when it comes to home appliances.”
Other sub-systems highlighted in NXP’s smart washing machine demonstrator include:
* User interface and system management for complex washing programs. Washing machines today offer consumers a wide range of settings for different temperatures, cycles and fabric types, all controlled via a single board. The NXP demonstrator features the LPC1227, a robust 32-bit microcontroller based on the low-gate-count ARM Cortex-M0 platform. The LPC1227 provides significantly higher performance and functionality compared to 8-bit MCUs – with up to 50-percent better code density – enabling the same NXP microcontroller to be used not only for system management, but also to run software stacks for power monitoring, NFC and RFID. It also features an internal RC oscillator with one-percent accuracy.
* Reliable motor and load control. The same LPC1227 microcontroller is used to drive and control multiple loads in the washing machine, including the motor. As part of the demo, NXP will show how the 32-bit microcontroller is used to directly drive high-noise-immunity triacs – the BTA316 and ACT108 – eliminating the need to use any driving scheme in between. The LPC1227 features particularly relevant here include high current GPIOs, deterministic division algorithms in ROM, and certified compliance with IEC 60730 safety standards.
* High-efficiency power supply with very low standby power. The washing machine power supply consumes less than 10 mW in standby mode, thanks to the high-efficiency GreenChip TEA1721 SMPS controller IC with integrated MOSFET. The system also offers quick wake-up from standby to full operation.
* AC power metering. Power consumption of the smart washing machine can be monitored and displayed cost-effectively, encouraging stronger energy awareness among consumers. Data on power consumption can also be transmitted to a remote service center or to the electricity provider – all controlled via the main 32-bit host controller.
* Wireless communication via IEEE 802.15.4 with a smart meter or home automation/energy gateway. The smart washing machine demo features an FCC- and ETS-compliant module based on the ultra-low-power JN5148 wireless microcontroller. The wireless module supports a wide range of protocol stacks, including ZigBee PRO Smart Energy and Home Automation, JenNet-IP (6LoWPAN), and RF4CE for remote controls.
The most popular feature of the demo is fabric detection: The washing machine reads information about the fabric type and color from RFID-tagged buttons, helps you avoid mixing white and dark laundry, and optimizes the washing program based on the characteristics it reads from both the clothing and the detergent itself.
Another popular feature of the demo is NFC-based maintenance: Using an NFC-enabled phone, an authorized maintenance technician can perform diagnostics on the smart washing machine onsite, change its status, upgrade firmware, and launch an app that communicates directly with the manufacturer’s service center using the phone’s built-in 3G connection.
“Major home appliances are becoming ‘smarter’ by the day – yet we’ve only started to explore the universe of possibilities when it comes to two-way communication,” said Jan Willem Vogel, senior director, industrial applications marketing, NXP Semiconductors. “We’re particularly excited about our new smart washing demonstrator, which brings together our advanced application insights, our expertise in RFID and NFC, as well as our broad-based understanding of the complex sub-systems driving white goods today. The demo also showcases the breadth of NXP’s portfolio – the most extensive in the semiconductor industry when it comes to home appliances.”
Other sub-systems highlighted in NXP’s smart washing machine demonstrator include:
* User interface and system management for complex washing programs. Washing machines today offer consumers a wide range of settings for different temperatures, cycles and fabric types, all controlled via a single board. The NXP demonstrator features the LPC1227, a robust 32-bit microcontroller based on the low-gate-count ARM Cortex-M0 platform. The LPC1227 provides significantly higher performance and functionality compared to 8-bit MCUs – with up to 50-percent better code density – enabling the same NXP microcontroller to be used not only for system management, but also to run software stacks for power monitoring, NFC and RFID. It also features an internal RC oscillator with one-percent accuracy.
* Reliable motor and load control. The same LPC1227 microcontroller is used to drive and control multiple loads in the washing machine, including the motor. As part of the demo, NXP will show how the 32-bit microcontroller is used to directly drive high-noise-immunity triacs – the BTA316 and ACT108 – eliminating the need to use any driving scheme in between. The LPC1227 features particularly relevant here include high current GPIOs, deterministic division algorithms in ROM, and certified compliance with IEC 60730 safety standards.
* High-efficiency power supply with very low standby power. The washing machine power supply consumes less than 10 mW in standby mode, thanks to the high-efficiency GreenChip TEA1721 SMPS controller IC with integrated MOSFET. The system also offers quick wake-up from standby to full operation.
* AC power metering. Power consumption of the smart washing machine can be monitored and displayed cost-effectively, encouraging stronger energy awareness among consumers. Data on power consumption can also be transmitted to a remote service center or to the electricity provider – all controlled via the main 32-bit host controller.
* Wireless communication via IEEE 802.15.4 with a smart meter or home automation/energy gateway. The smart washing machine demo features an FCC- and ETS-compliant module based on the ultra-low-power JN5148 wireless microcontroller. The wireless module supports a wide range of protocol stacks, including ZigBee PRO Smart Energy and Home Automation, JenNet-IP (6LoWPAN), and RF4CE for remote controls.
LDRA and MathWorks tool integration moves unit testing upstream to the model
embedded world 2012, NÜRNBERG, GERMANY: LDRA, the leader in standards compliance, automated software verification, source code analysis and test tools, and MathWorks, the leading developer of mathematical computing software, have extended the integration of the LDRA tool suite with MathWorks Simulink modelling tools.
The integration enables joint customers to benefit from full test reuse and bidirectional traceability throughout the software development lifecycle. By bringing all components of the development cycle into one workflow, project teams save time by reusing tests, and more easily track progress toward requirements fulfillment and certification readiness.
Rigorous testing is bottom-line for avionics and automotive certifications such as DO-178B/C or ISO 26262 where on-target testing is required. With LDRA’s integration of the LDRA tool suite and MathWorks Simulink, Simulink model test vectors can confirm the application is running as expected on the target, and LDRA-generated tests can be fed back into Simulink and used to refine the simulation.
Code can then be regenerated to create the highest caliber code, minimizing risk. Tests are reused for both target and model, significantly reducing time otherwise used to generate and prove test regimens for both phases.
When this testing capability is coupled with standard-specific templates, companies gain a streamlined process that details both the process and requirements needed for compliance. TBmanager, a requirements traceability and test product within the LDRA tool suite, links and graphically depicts relationships between requirements and relevant models, code and test artifacts.
This information matrix highlights the linkages between software components that auditors can review to see how companies have identified and corrected program errors and addressed non-compliance until the entire application fulfils requirement specifications. Such transparency into application relationships organizes and speeds team progress by automating development and documentation.
“Many industries―-whether aerospace, automotive, medical or industrial—face the twin challenges of undergoing rigorous design and testing while managing projects with time and budget constraints,” noted Ian Hennell, LDRA Operations director. “Because of this, companies are seeking ways to update their methodology to generate good quality code that is easier to certify, maintain, and reuse without compromising schedule or budget. The requirements traceability and test reuse of this LDRA-MathWorks integration gives companies concrete ways to improve processes, increase code quality and reduce costs.”
“Model-Based Design generates consistent code and saves time, but it still should be fully exercised and independently verified,” commented Tom Erkkinen, Embedded Applications manager, MathWorks. “Model-Based Design and LDRA capabilities help verify the entire application spanning model- and hand-generated code, and supports tailoring project requirements, processes and application artifacts to DO-178B/C, IEC 62304, ISO 26262, IEC 61508 and other industry standards.”
Together, MathWorks Simulink and the LDRA tool suite create instrumented code that can be built using the selected compiler and executed via the LDRA tool suite to achieve full code coverage whether statement, branch or decision, or modified condition/decision coverage (MC/DC) of code created from Simulink models and manual code.
In addition, data values used to exercise the model in simulated environments can be leveraged to test generated code for SIL (software-in-the-loop) and PIL (processor-in-the-loop) on the target as well as generating additional tests through LDRA’s unit test facility. The textural and graphical output indicates coverage both as absolute values and in relation to a set of limits required by a standards body like DO-178.
With automotive, medical and industrial markets following the gold-standard of the avionics community, industry trends suggest that all industries will soon formalize certification procedures for model-driven design similar to those outlined by DO-178C or ISO 26262. The integration enables verification and validation engineers to prove that the executable code meets design criteria, and that the underlying code is sufficiently exercised to the relevant standard.
The integration enables joint customers to benefit from full test reuse and bidirectional traceability throughout the software development lifecycle. By bringing all components of the development cycle into one workflow, project teams save time by reusing tests, and more easily track progress toward requirements fulfillment and certification readiness.
Rigorous testing is bottom-line for avionics and automotive certifications such as DO-178B/C or ISO 26262 where on-target testing is required. With LDRA’s integration of the LDRA tool suite and MathWorks Simulink, Simulink model test vectors can confirm the application is running as expected on the target, and LDRA-generated tests can be fed back into Simulink and used to refine the simulation.
Code can then be regenerated to create the highest caliber code, minimizing risk. Tests are reused for both target and model, significantly reducing time otherwise used to generate and prove test regimens for both phases.
When this testing capability is coupled with standard-specific templates, companies gain a streamlined process that details both the process and requirements needed for compliance. TBmanager, a requirements traceability and test product within the LDRA tool suite, links and graphically depicts relationships between requirements and relevant models, code and test artifacts.
This information matrix highlights the linkages between software components that auditors can review to see how companies have identified and corrected program errors and addressed non-compliance until the entire application fulfils requirement specifications. Such transparency into application relationships organizes and speeds team progress by automating development and documentation.
“Many industries―-whether aerospace, automotive, medical or industrial—face the twin challenges of undergoing rigorous design and testing while managing projects with time and budget constraints,” noted Ian Hennell, LDRA Operations director. “Because of this, companies are seeking ways to update their methodology to generate good quality code that is easier to certify, maintain, and reuse without compromising schedule or budget. The requirements traceability and test reuse of this LDRA-MathWorks integration gives companies concrete ways to improve processes, increase code quality and reduce costs.”
“Model-Based Design generates consistent code and saves time, but it still should be fully exercised and independently verified,” commented Tom Erkkinen, Embedded Applications manager, MathWorks. “Model-Based Design and LDRA capabilities help verify the entire application spanning model- and hand-generated code, and supports tailoring project requirements, processes and application artifacts to DO-178B/C, IEC 62304, ISO 26262, IEC 61508 and other industry standards.”
Together, MathWorks Simulink and the LDRA tool suite create instrumented code that can be built using the selected compiler and executed via the LDRA tool suite to achieve full code coverage whether statement, branch or decision, or modified condition/decision coverage (MC/DC) of code created from Simulink models and manual code.
In addition, data values used to exercise the model in simulated environments can be leveraged to test generated code for SIL (software-in-the-loop) and PIL (processor-in-the-loop) on the target as well as generating additional tests through LDRA’s unit test facility. The textural and graphical output indicates coverage both as absolute values and in relation to a set of limits required by a standards body like DO-178.
With automotive, medical and industrial markets following the gold-standard of the avionics community, industry trends suggest that all industries will soon formalize certification procedures for model-driven design similar to those outlined by DO-178C or ISO 26262. The integration enables verification and validation engineers to prove that the executable code meets design criteria, and that the underlying code is sufficiently exercised to the relevant standard.
Camera phone shipments jump; digital still camera sales suffer
USA: With most cellphones now containing multi-megapixel cameras, many users have left digital still cameras (DSCs) and video camcorders at home and opting to take snapshots and HD-movie clips with cellular handsets instead.
For several years, camera makers fought off the encroachment of camera phones by continuously increasing the megapixel resolution, but most camera phones have reached the point of providing "good enough" picture quality to satisfy most consumers. The figure underscores the threat coming from camera phones with 3Mpixel and greater picture resolution.
Source: IC Insights, USA.
Shipments of ≥3Mpixel camera phones are forecast to grow much more quickly than DSCs and exceed one billion units for the first time in 2014. Direct wireless connectivity to the Internet has become a major issue for standalone DSCs, which are losing marketshare to "good-enough" embedded cameras in smartphones that can quickly connect and upload photo files to websites and e-mail. This convenience is now trumping higher picture quality in DSCs, especially when it comes to the high-volume point-and-shoot digital cameras.
To compete with camera phones, many DSC makers are packing new models with more features and capabilities--many of them similar to what's found in smartphones. Also, the market has seen the emergence of a new breed of digital camera that combines the small body of compact point-and-shoot DSCs with interchangeable lens-mounting systems of D-SLR models.
These new systems are called electronic viewfinder interchangeable lens (EVIL) cameras, which are thinner than bulky D-SRL cameras because they do not use mirrors between the image sensor and optical-eyepiece viewfinders but instead have all-electronic viewfinders built with LCD technology.
DSC unit shipments increased by a CAGR of slightly more than 37 percent in the 2000-2005 period, but slowed to 9 percent per year between 2005 and 2010, and are projected to rise by merely 2.1 percent annually from 2010 through 2015.
For several years, camera makers fought off the encroachment of camera phones by continuously increasing the megapixel resolution, but most camera phones have reached the point of providing "good enough" picture quality to satisfy most consumers. The figure underscores the threat coming from camera phones with 3Mpixel and greater picture resolution.
Source: IC Insights, USA.Shipments of ≥3Mpixel camera phones are forecast to grow much more quickly than DSCs and exceed one billion units for the first time in 2014. Direct wireless connectivity to the Internet has become a major issue for standalone DSCs, which are losing marketshare to "good-enough" embedded cameras in smartphones that can quickly connect and upload photo files to websites and e-mail. This convenience is now trumping higher picture quality in DSCs, especially when it comes to the high-volume point-and-shoot digital cameras.
To compete with camera phones, many DSC makers are packing new models with more features and capabilities--many of them similar to what's found in smartphones. Also, the market has seen the emergence of a new breed of digital camera that combines the small body of compact point-and-shoot DSCs with interchangeable lens-mounting systems of D-SLR models.
These new systems are called electronic viewfinder interchangeable lens (EVIL) cameras, which are thinner than bulky D-SRL cameras because they do not use mirrors between the image sensor and optical-eyepiece viewfinders but instead have all-electronic viewfinders built with LCD technology.
DSC unit shipments increased by a CAGR of slightly more than 37 percent in the 2000-2005 period, but slowed to 9 percent per year between 2005 and 2010, and are projected to rise by merely 2.1 percent annually from 2010 through 2015.
Fujitsu intros next-gen multimode, multiband transceiver IC for 2G/3G/4G mobile products
SINGAPORE: Fujitsu Semiconductor Asia Pte Ltd (FSAL) introduced the MB86L11A, the company’s next-generation, single-chip 2G/3G/4G transceiver. The multiband, multimode device supports all modes, including LTE (FDD and TDD), HSPA+, WCDMA, GSM, EDGE, EDGE-EVO, CDMA, and TD-SCDMA. Sampling of the MB86L11A will begin in Q2 2012.
“Fujitsu’s transceivers solve major challenges for wireless device manufacturers planning to introduce both regional and global devices with roaming capabilities in almost any combination of bands and modes,” said Andy Chang, associate VP of Fujitsu Semiconductor. “The new device augments Fujitsu’s growing family of state-of-the-art multimode, multiband single-chip transceivers, which are available in production quantities. Our family of devices offers world-class performance, with millions of transceivers shipped to date.”
Next-generation MB86L11A 2G/3G/4G transceiver
The MB86L11A 2G/3G/4G multimode, multiband transceiver supports benchmark performance for current drain and RF parameters. The transceiver includes many innovative features in a smaller package with enhanced power control, envelope tracking (ET) and antenna tuning (AT). Envelope tracking technology helps to significantly lower the radio system power consumption, while improving transmitter efficiency. Antenna tuning optimizes the total radiated power output from the antenna. Both features optimize the battery life of mobile devices.
An advanced programming interface (API) feature minimizes factory calibration time, provides flexible port mapping and adds customized key performance indicator (KPI) features. The MB86L11A is built using the SAW-less architecture pioneered by Fujitsu, which also eliminates the need for external low noise amplifiers (LNAs).
Other features of the MB86L11A include eight RF outputs on the transmitter, nine primary RF inputs and six diversity RF inputs on the IC, giving greater flexibility to map ports and bands for different market requirements. The transceiver uses an open standard MIPI DigRFSM interface to the baseband, and has both DigRF 4G and DigRF 3G interfaces to work with existing 2G/3G baseband platforms as well as with newer multimode 4G basebands.
The device supports all global FDD and TDD bands, including 1-21, 23-25, and 33-41. The MB86L11A, like earlier Fujitsu LTE multimode, multiband transceivers, supports 2G/3G/4G networks up to 20MHz bandwidth. Future transceivers on the roadmap include a 4G LTE optimized device and a 3GPP Release 10, carrier-aggregation-compliant, single RFIC solution.
Fujitsu MB86Lxxx family
Fujitsu began shipping the industry’s first SAW-less transceiver for 2G/3G networks, the MB86L01A, in 2009. In 2010, Fujitsu introduced the MB86L10A, the industry’s first 3G and LTE SAW-less transceiver, which has been successfully integrated into dongles, tablets and multimode 2G/3G/4G smartphones.
The MB86L12A, the third production-ready Fujitsu 2G/3G/4G SAW-less transceiver, conforms to the upgraded MIPI DigRF standard. The Fujitsu MB86Lxxx family transceivers are deployed by multiple baseband providers worldwide, with millions of units shipped to date. The addition of the next-generation MB86L11A 2G/3G/4G transceiver, following the success of the MB86L10A and MB86L12A, enhances the Fujitsu family of transceivers with the compact design and latest advanced features required by device manufacturers.
“The Fujitsu MB86Lxxx family transceivers offer advanced features, low power consumption, a small footprint and a highly flexible API to bring down the total cost of the device and dramatically speed up time to market for new products,” said Chang.
“Fujitsu’s transceivers solve major challenges for wireless device manufacturers planning to introduce both regional and global devices with roaming capabilities in almost any combination of bands and modes,” said Andy Chang, associate VP of Fujitsu Semiconductor. “The new device augments Fujitsu’s growing family of state-of-the-art multimode, multiband single-chip transceivers, which are available in production quantities. Our family of devices offers world-class performance, with millions of transceivers shipped to date.”
Next-generation MB86L11A 2G/3G/4G transceiver
The MB86L11A 2G/3G/4G multimode, multiband transceiver supports benchmark performance for current drain and RF parameters. The transceiver includes many innovative features in a smaller package with enhanced power control, envelope tracking (ET) and antenna tuning (AT). Envelope tracking technology helps to significantly lower the radio system power consumption, while improving transmitter efficiency. Antenna tuning optimizes the total radiated power output from the antenna. Both features optimize the battery life of mobile devices.
An advanced programming interface (API) feature minimizes factory calibration time, provides flexible port mapping and adds customized key performance indicator (KPI) features. The MB86L11A is built using the SAW-less architecture pioneered by Fujitsu, which also eliminates the need for external low noise amplifiers (LNAs).
Other features of the MB86L11A include eight RF outputs on the transmitter, nine primary RF inputs and six diversity RF inputs on the IC, giving greater flexibility to map ports and bands for different market requirements. The transceiver uses an open standard MIPI DigRFSM interface to the baseband, and has both DigRF 4G and DigRF 3G interfaces to work with existing 2G/3G baseband platforms as well as with newer multimode 4G basebands.
The device supports all global FDD and TDD bands, including 1-21, 23-25, and 33-41. The MB86L11A, like earlier Fujitsu LTE multimode, multiband transceivers, supports 2G/3G/4G networks up to 20MHz bandwidth. Future transceivers on the roadmap include a 4G LTE optimized device and a 3GPP Release 10, carrier-aggregation-compliant, single RFIC solution.
Fujitsu MB86Lxxx family
Fujitsu began shipping the industry’s first SAW-less transceiver for 2G/3G networks, the MB86L01A, in 2009. In 2010, Fujitsu introduced the MB86L10A, the industry’s first 3G and LTE SAW-less transceiver, which has been successfully integrated into dongles, tablets and multimode 2G/3G/4G smartphones.
The MB86L12A, the third production-ready Fujitsu 2G/3G/4G SAW-less transceiver, conforms to the upgraded MIPI DigRF standard. The Fujitsu MB86Lxxx family transceivers are deployed by multiple baseband providers worldwide, with millions of units shipped to date. The addition of the next-generation MB86L11A 2G/3G/4G transceiver, following the success of the MB86L10A and MB86L12A, enhances the Fujitsu family of transceivers with the compact design and latest advanced features required by device manufacturers.
“The Fujitsu MB86Lxxx family transceivers offer advanced features, low power consumption, a small footprint and a highly flexible API to bring down the total cost of the device and dramatically speed up time to market for new products,” said Chang.
Smartphones/tablets propel silicon MEMS microphones
Dr. Robert Castellano, The Information Network, USA
NEW TRIPOLI, USA: High-Flying Silicon MEMs microphone installations caught a tailwind in 2011 as shipments grew 85 percent, according to our report Silicon Microphones and Speakers: Technology, Market Analysis, and End-Applications.
The main propellant was the increased use of MEMs microphones in smartphones and tablets. Smartphone shipments grew 61 percent in 2011 to nearly 500 million units while 72 million tablets were shipped.
MEMS microphone shipments reached 1.3 million units in 2011, up from 700,000 in 2010. The growth in shipments was coupled with an increase in the number of microphones per smartphone. Apple, for example has designed two MEMS microphones into its iPhone 4 and 4S models.
Because Apple leads the market in smartphones and tablets, it was the volume user in 2011 with nearly 350,000 purchased, well ahead of second-place Samsung with 250,000 units purchased.
MEMS microphone supplier Knowles continued to dominate the market, since it supplies units to both Apple and Samsung. Infineon was a distant second with a 17 percent share. Also supplying MEMs microphones to Apple in 2011 was Analog Devices, and sales to the iPad 2 moved the company to number three in the rankings.
NEW TRIPOLI, USA: High-Flying Silicon MEMs microphone installations caught a tailwind in 2011 as shipments grew 85 percent, according to our report Silicon Microphones and Speakers: Technology, Market Analysis, and End-Applications.
The main propellant was the increased use of MEMs microphones in smartphones and tablets. Smartphone shipments grew 61 percent in 2011 to nearly 500 million units while 72 million tablets were shipped.
MEMS microphone shipments reached 1.3 million units in 2011, up from 700,000 in 2010. The growth in shipments was coupled with an increase in the number of microphones per smartphone. Apple, for example has designed two MEMS microphones into its iPhone 4 and 4S models.
Because Apple leads the market in smartphones and tablets, it was the volume user in 2011 with nearly 350,000 purchased, well ahead of second-place Samsung with 250,000 units purchased.
MEMS microphone supplier Knowles continued to dominate the market, since it supplies units to both Apple and Samsung. Infineon was a distant second with a 17 percent share. Also supplying MEMs microphones to Apple in 2011 was Analog Devices, and sales to the iPad 2 moved the company to number three in the rankings.
PMC-Sierra acquires server storage 12Gb/s Expander product line from Maxim
SUNNYVALE, USA: PMC-Sierra Inc. has acquired Maxim Integrated Products Inc.’s 12Gb/s SAS expander technology. PMC expects the acquisition will strengthen its SAS design footprint with leading server OEMs. Combined with PMC’s 12Gb/s SAS RAID-on-Chip (RoC) products, Maxim’s expander technology enables PMC to offer end-to-end 12Gb/s SAS solutions tailored for server platforms. Continued support for Maxim’s industry-leading server expander firmware will preserve OEM investment as they transition from 6Gb/s SAS to 12Gb/s SAS.
“The acquisition of Maxim’s 12Gb/s SAS technology allows PMC to strengthen our relationships with tier-one server OEMs and provides future growth opportunities in this market segment,” said Greg Lang, PMC’s president and CEO. “I’m excited about this acquisition and the strong strategic fit between PMC’s core strengths in enterprise storage, and Maxim’s established traction with expander solutions at the largest server storage OEMs. Our server and storage OEM customers will benefit from a broader 12Gb/s SAS portfolio that includes Maxim’s highly valued feature set and innovations.”
“This transfer of our SAS and PCIe switch IP, know-how, and development team allows PMC to continue the 12G SAS expander roadmap that builds on Maxim’s current 3G and 6G SAS expander technology and products,” said Chris Neil, senior VP, Maxim. “PMC will manage these next-generation products, roadmaps, IP, firmware, and technologies going forward. Maxim will continue to support the production, delivery, and technical support of Maxim’s existing 3G and 6G SAS expanders, signal conditioners, and enclosure and baseboard management controllers. This arrangement will provide for a smooth transition at our customers.”
The majority of the personnel employed from Maxim are located in Colorado Springs, CO.
“The acquisition of Maxim’s 12Gb/s SAS technology allows PMC to strengthen our relationships with tier-one server OEMs and provides future growth opportunities in this market segment,” said Greg Lang, PMC’s president and CEO. “I’m excited about this acquisition and the strong strategic fit between PMC’s core strengths in enterprise storage, and Maxim’s established traction with expander solutions at the largest server storage OEMs. Our server and storage OEM customers will benefit from a broader 12Gb/s SAS portfolio that includes Maxim’s highly valued feature set and innovations.”
“This transfer of our SAS and PCIe switch IP, know-how, and development team allows PMC to continue the 12G SAS expander roadmap that builds on Maxim’s current 3G and 6G SAS expander technology and products,” said Chris Neil, senior VP, Maxim. “PMC will manage these next-generation products, roadmaps, IP, firmware, and technologies going forward. Maxim will continue to support the production, delivery, and technical support of Maxim’s existing 3G and 6G SAS expanders, signal conditioners, and enclosure and baseboard management controllers. This arrangement will provide for a smooth transition at our customers.”
The majority of the personnel employed from Maxim are located in Colorado Springs, CO.
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