ALISO VIEJO, USA: Microsemi Corp. announced a DDR3 SDRAM memory device that is the first of its kind to be packaged in a single plastic ball grid array (PBGA) and offered as a compact x64/x72 unregistered dual in-line memory module (UDIMM )/small outline dual in-line memory module (SODIMM).
The solution provides up to 4GByte compact memory densities that support high-performance processors and chipsets in mission-critical applications such as avionics, UAVs, missile systems and other defense applications that require high reliability in harsh environments.
"With this expansion of Microsemi's DDR3 SDRAM family, we are able to provide a full range of high-performance memory products for today's demanding military applications," said Jack Bogdanski, director of marketing for Microsemi. "Product designers also benefit from the high-density packaging as it saves board space. This enables designers to include additional features and functionality into existing designs."
Microsemi's commercial off-the-shelf (COTS) DDR3 SDRAM devices give customers a standalone, high-density memory solution that also meets the data widths necessary for many applications. The DDR3 devices significantly reduce space requirements as compared to systems built from discrete memory components, and also use less board space than memory solutions using chip scale packages (CSPs) and other single-die solutions. Microsemi's memory devices also streamline I/O routing and reduce component count and placements while delivering superior signal integrity.
Wednesday, November 2, 2011
Freescale intros advanced airbag sensors for improved vehicle safety
MEMS Executive Congress, MONTEREY, USA: Freescale Semiconductor is offering a family of automotive acceleration sensors designed to expedite development of advanced airbag systems that help save lives and protect against injuries caused by vehicle collisions.
Freescale’s new Xtrinsic MMA65xxKW family of accelerometers employs intelligent sensing technologies designed for front and side crash detection that can be easily and efficiently integrated into vehicle airbag systems.
The MMA65xxKW family is based on high-aspect-ratio micro-electromechanical systems (HARMEMS) technology. The family offers better resolution (precision) and a wider dynamic range than competing solutions on the market today, resulting in higher performance capabilities. Featuring a robust, streamlined in-vehicle communication system, the MMA65xxKW family has sophisticated crash detection capabilities that enable fast and dependable deployment of the total passive safety system when collisions are unavoidable.
The US National Highway Traffic Safety Administration (NHTSA) estimates that airbags saved more than 25,780 lives between 1987 and 2008. As airbags become more advanced and driver and passenger safety is improved, automotive suppliers face expectations to continue improving performance while decreasing cost.
“Freescale’s latest family of accelerometers contributes to the automotive industry’s goal to reach zero automotive-related fatalities by providing the performance capabilities necessary to streamline airbag detection and deployment,” said Seyed Paransun, VP and GM of Freescale’s sensor & actuator solutions division. “The new family of sensors delivers a simplified approach for the airbag system that supplies a higher sensor resolution without necessary programming by automotive manufacturers – resulting in greater design efficiency and lower associated costs.”
Freescale’s new Xtrinsic MMA65xxKW family of accelerometers employs intelligent sensing technologies designed for front and side crash detection that can be easily and efficiently integrated into vehicle airbag systems.
The MMA65xxKW family is based on high-aspect-ratio micro-electromechanical systems (HARMEMS) technology. The family offers better resolution (precision) and a wider dynamic range than competing solutions on the market today, resulting in higher performance capabilities. Featuring a robust, streamlined in-vehicle communication system, the MMA65xxKW family has sophisticated crash detection capabilities that enable fast and dependable deployment of the total passive safety system when collisions are unavoidable.
The US National Highway Traffic Safety Administration (NHTSA) estimates that airbags saved more than 25,780 lives between 1987 and 2008. As airbags become more advanced and driver and passenger safety is improved, automotive suppliers face expectations to continue improving performance while decreasing cost.
“Freescale’s latest family of accelerometers contributes to the automotive industry’s goal to reach zero automotive-related fatalities by providing the performance capabilities necessary to streamline airbag detection and deployment,” said Seyed Paransun, VP and GM of Freescale’s sensor & actuator solutions division. “The new family of sensors delivers a simplified approach for the airbag system that supplies a higher sensor resolution without necessary programming by automotive manufacturers – resulting in greater design efficiency and lower associated costs.”
AMD FirePro V4900 professional graphics card delivers best-in-class features, performance and unparalleled value
USA & INDIA: AMD has launched the AMD FirePro V4900, which delivers unequalled performance for Digital Content Creation (DCC) and Computer Aided Design (CAD) professionals at an entry-level price point.
By leveraging AMD’s most advanced graphics technology, including AMD Eyefinity2 technology, the AMD FirePro V4900 significantly improves application performance and drives efficiency in the workplace. In fact, the AMD FirePro V4900 more than doubled the performance of competitive offerings in many CAD and DCC application tests3.
“The AMD FirePro V4900 stands in a league of its own and redefines entry-level professional graphics card capabilities,” says Sandeep Gupte, GM of Professional Graphics, AMD. “The AMD FirePro V4900 leverages AMD’s most advanced graphics technology, which not only enhances user experience and boosts performance of professional applications, but also features AMD Eyefinity multi-display technology that supports up to six displays4, increasing user productivity.”
The AMD FirePro V4900 is designed to exceed the needs of graphics professionals. The GPU’s 1GB of 128-bit GDDR5 RAM drives memory bandwidth of 64 GB/s5, allowing rapid data access, while Microsoft DirectX11, OpenGL 4.2 and OpenCL support empowers users to render and manipulate models using the broadest range of tools and applications.
Enhanced AMD Eyefinity and DisplayPort 1.2 technology enables six-screen multi-display set ups, which deliver higher resolutions and increased productivity when working with multiple applications, while reducing the complexity and cost of a typical multi-monitor set up. Through AMD’s productive relationship with workstation solution providers, the AMD FirePro V4900 will be available in a range of industry-leading systems from HP and others.
“HP workstation customers operate at the highest levels in every industry – they demand solutions that deliver optimum performance and the latest technologies,” says Jeff Wood, VP, Worldwide Marketing, Commercial Solutions, HP. “By integrating the AMD FirePro V4900 into its workstations, HP is providing customers with a powerful graphics solution – at an affordable price.”
AMD FirePro products are tested and certified with many leading software applications to ensure compatibility, stability, and optimal performance. The AMD FirePro V4900 has received certification for a variety of applications including Abaqus/CAE 6.11, ANSYS 13.0, Autodesk 2012 3D design software solutions, Bentley System’s Microstation V8i, BETA CAE Systems’ ANSA and mETA, CEI’s EnSight, and EnSight CFD.
Additionally, the AMD FirePro V4900 received certification from COMSOL Multiphysics, Esri ArcGIS 9.3.1, and 10, Missler Software TopSolid 2012 CAD/CAM solutions, MSC Software, Patran and SimXpert 2011, Robert McNeel and Associates’ Rhinoceros, SolidWorks Corp.’s SolidWorks 2011 and 2012 3D CAD software, SpaceClaim, Vision Numeric 3DESIGN and several solutions from Siemens PLM Software.
“Siemens PLM Software works closely with AMD to ensure its product lifecycle management software meets the needs of its professional users,” says Bill Boswell, senior director, Partner Strategy, Siemens PLM Software. “The AMD FirePro V4900 delivers outstanding performance with value, while AMD’s industry-leading product support makes certain our users receive the attention they need when they need it. Through our partnership with AMD, Siemens PLM helps our customers make smarter decisions and better products.”
The AMD FirePro V4900 will be available in select Dell and Fujitsu systems and HP workstations. As of November 1, 2011 it will be sold for $189 USD MSRP at select online resellers.
By leveraging AMD’s most advanced graphics technology, including AMD Eyefinity2 technology, the AMD FirePro V4900 significantly improves application performance and drives efficiency in the workplace. In fact, the AMD FirePro V4900 more than doubled the performance of competitive offerings in many CAD and DCC application tests3.
“The AMD FirePro V4900 stands in a league of its own and redefines entry-level professional graphics card capabilities,” says Sandeep Gupte, GM of Professional Graphics, AMD. “The AMD FirePro V4900 leverages AMD’s most advanced graphics technology, which not only enhances user experience and boosts performance of professional applications, but also features AMD Eyefinity multi-display technology that supports up to six displays4, increasing user productivity.”
The AMD FirePro V4900 is designed to exceed the needs of graphics professionals. The GPU’s 1GB of 128-bit GDDR5 RAM drives memory bandwidth of 64 GB/s5, allowing rapid data access, while Microsoft DirectX11, OpenGL 4.2 and OpenCL support empowers users to render and manipulate models using the broadest range of tools and applications.
Enhanced AMD Eyefinity and DisplayPort 1.2 technology enables six-screen multi-display set ups, which deliver higher resolutions and increased productivity when working with multiple applications, while reducing the complexity and cost of a typical multi-monitor set up. Through AMD’s productive relationship with workstation solution providers, the AMD FirePro V4900 will be available in a range of industry-leading systems from HP and others.
“HP workstation customers operate at the highest levels in every industry – they demand solutions that deliver optimum performance and the latest technologies,” says Jeff Wood, VP, Worldwide Marketing, Commercial Solutions, HP. “By integrating the AMD FirePro V4900 into its workstations, HP is providing customers with a powerful graphics solution – at an affordable price.”
AMD FirePro products are tested and certified with many leading software applications to ensure compatibility, stability, and optimal performance. The AMD FirePro V4900 has received certification for a variety of applications including Abaqus/CAE 6.11, ANSYS 13.0, Autodesk 2012 3D design software solutions, Bentley System’s Microstation V8i, BETA CAE Systems’ ANSA and mETA, CEI’s EnSight, and EnSight CFD.
Additionally, the AMD FirePro V4900 received certification from COMSOL Multiphysics, Esri ArcGIS 9.3.1, and 10, Missler Software TopSolid 2012 CAD/CAM solutions, MSC Software, Patran and SimXpert 2011, Robert McNeel and Associates’ Rhinoceros, SolidWorks Corp.’s SolidWorks 2011 and 2012 3D CAD software, SpaceClaim, Vision Numeric 3DESIGN and several solutions from Siemens PLM Software.
“Siemens PLM Software works closely with AMD to ensure its product lifecycle management software meets the needs of its professional users,” says Bill Boswell, senior director, Partner Strategy, Siemens PLM Software. “The AMD FirePro V4900 delivers outstanding performance with value, while AMD’s industry-leading product support makes certain our users receive the attention they need when they need it. Through our partnership with AMD, Siemens PLM helps our customers make smarter decisions and better products.”
The AMD FirePro V4900 will be available in select Dell and Fujitsu systems and HP workstations. As of November 1, 2011 it will be sold for $189 USD MSRP at select online resellers.
GSI reports developments related to pending patent litigation with Cypress
SUNNYVALE, USA: GSI Technology Inc. reported on recent developments related to its pending patent litigation with Cypress Semiconductor Corp.
Lee-Lean Shu, GSI’s president and CEO, noted: “In our October 5, 2011 press release, we reported that the United States Patent and Trademark Office had instituted a reexamination proceeding with respect to one of the Cypress patents that it claims we infringe (U.S. Patent No. 7,142,477, or the “’477 patent”) and was reviewing whether to institute such a proceeding against another of the allegedly infringing Cypress patents (U.S. Patent No. 6,534,805, or the “’805 patent”).
“I am pleased to report that the PTO subsequently instituted a reexamination proceeding against the ‘805 patent and issued initial office actions in both proceedings in which it rejected a number of the claims of both patents, including all of the claims that relate to Cypress’ infringement claims against GSI in the pending International Trade Commission investigation, as invalid on the basis of prior art. Although the PTO’s rejection of these patent claims is not final, we believe that the existence of relevant prior art is clear, and we are confident that completion of the reexamination will result in a final rejection of these claims.”
Shu concluded, “We continue to vigorously defend Cypress’ claims before the ITC while prosecuting our antitrust claims against Cypress.”
Lee-Lean Shu, GSI’s president and CEO, noted: “In our October 5, 2011 press release, we reported that the United States Patent and Trademark Office had instituted a reexamination proceeding with respect to one of the Cypress patents that it claims we infringe (U.S. Patent No. 7,142,477, or the “’477 patent”) and was reviewing whether to institute such a proceeding against another of the allegedly infringing Cypress patents (U.S. Patent No. 6,534,805, or the “’805 patent”).
“I am pleased to report that the PTO subsequently instituted a reexamination proceeding against the ‘805 patent and issued initial office actions in both proceedings in which it rejected a number of the claims of both patents, including all of the claims that relate to Cypress’ infringement claims against GSI in the pending International Trade Commission investigation, as invalid on the basis of prior art. Although the PTO’s rejection of these patent claims is not final, we believe that the existence of relevant prior art is clear, and we are confident that completion of the reexamination will result in a final rejection of these claims.”
Shu concluded, “We continue to vigorously defend Cypress’ claims before the ITC while prosecuting our antitrust claims against Cypress.”
NXP Semiconductors reports Q3 2011 results
SINGAPORE: NXP Semiconductors N.V. reported financial results for the third quarter 2011, ended October 2, 2011, and provided guidance for the fourth quarter 2011.
Q3 2011 GAAP results
Product revenue from continuing operations was $970 million, an increase of 3.6 percent from the $936 million reported in the third quarter of 2010, and a decrease of 5.4 percent from the $1,025 million reported in the second quarter of 2011. Product revenue is the combination of revenue from the HPMS and Standard Products segments.
Total revenue from continuing operations was $1,060 million, a decrease of 5.4 percent from the $1,120 million reported in third quarter of 2010 and a decrease of 5.4 percent from the $1,121 million reported in the second quarter of 2011.
Revenue attributable to the combination of the Manufacturing Operations and Corporate and Other segments was $90 million, a 51.1 percent decrease from the $184 million reported in the third quarter of 2010, and a 6.3 percent decrease from the $96 million reported in the second quarter of 2011. The anticipated decline was primarily due to lower revenue in the Manufacturing Operations segment, as contractual obligations to provide manufacturing services for previously divested businesses continue to expire.
Included in the total revenue for the third quarter of 2010 was $24 million related to the divested NuTune business.
Gross profit from continuing operations for the third quarter of 2011 was $488 million, or 46.0 percent of revenue, as compared to $476 million, or 42.5 percent of revenue reported in the third quarter of 2010. This compares to the $523 million, or 46.7 percent of revenue reported in the second quarter 2011.
Operating income from continuing operations for the third quarter of 2011 was $109 million, or 10.3 percent of revenue, as compared to an operating income of $106 million reported in the third quarter of 2010, or 9.5 percent of revenue. This compares to an operating income of $133 million, or 11.9 percent of revenue as reported in the second quarter of 2011.
Net income for the third quarter of 2011 was $301 million or $1.21 per share. This compares to a net income of $369 million, or $1.55 per share (diluted) reported in the third quarter of 2010, and net income of $84 million or $0.33 per share (diluted) reported in the second quarter of 2011. Net income for the second quarter of 2011 and the third quarter of 2010 was positively impacted due to currency fluctuations on the company’s US dollar-denominated debt.
On July 4, 2011 NXP closed the previously announced sale of the Sound Solutions business and received gross proceeds of $855 million. During the third quarter of 2011 NXP realized $411 million of net profit, or $1.69 per share from the sale of the Sound Solutions business. All current and all prior period financial figures have been restated to reflect the divesture of the Sound Solutions business. The historical results of the Sound Solutions business are treated as a discontinued operation in NXP’s financial statements.
Q3 2011 GAAP results
Product revenue from continuing operations was $970 million, an increase of 3.6 percent from the $936 million reported in the third quarter of 2010, and a decrease of 5.4 percent from the $1,025 million reported in the second quarter of 2011. Product revenue is the combination of revenue from the HPMS and Standard Products segments.
Total revenue from continuing operations was $1,060 million, a decrease of 5.4 percent from the $1,120 million reported in third quarter of 2010 and a decrease of 5.4 percent from the $1,121 million reported in the second quarter of 2011.
Revenue attributable to the combination of the Manufacturing Operations and Corporate and Other segments was $90 million, a 51.1 percent decrease from the $184 million reported in the third quarter of 2010, and a 6.3 percent decrease from the $96 million reported in the second quarter of 2011. The anticipated decline was primarily due to lower revenue in the Manufacturing Operations segment, as contractual obligations to provide manufacturing services for previously divested businesses continue to expire.
Included in the total revenue for the third quarter of 2010 was $24 million related to the divested NuTune business.
Gross profit from continuing operations for the third quarter of 2011 was $488 million, or 46.0 percent of revenue, as compared to $476 million, or 42.5 percent of revenue reported in the third quarter of 2010. This compares to the $523 million, or 46.7 percent of revenue reported in the second quarter 2011.
Operating income from continuing operations for the third quarter of 2011 was $109 million, or 10.3 percent of revenue, as compared to an operating income of $106 million reported in the third quarter of 2010, or 9.5 percent of revenue. This compares to an operating income of $133 million, or 11.9 percent of revenue as reported in the second quarter of 2011.
Net income for the third quarter of 2011 was $301 million or $1.21 per share. This compares to a net income of $369 million, or $1.55 per share (diluted) reported in the third quarter of 2010, and net income of $84 million or $0.33 per share (diluted) reported in the second quarter of 2011. Net income for the second quarter of 2011 and the third quarter of 2010 was positively impacted due to currency fluctuations on the company’s US dollar-denominated debt.
On July 4, 2011 NXP closed the previously announced sale of the Sound Solutions business and received gross proceeds of $855 million. During the third quarter of 2011 NXP realized $411 million of net profit, or $1.69 per share from the sale of the Sound Solutions business. All current and all prior period financial figures have been restated to reflect the divesture of the Sound Solutions business. The historical results of the Sound Solutions business are treated as a discontinued operation in NXP’s financial statements.
Renesas Electronics America showcases low-power, connectivity and human-machine interface technologies
MD&M Minneapolis 2011, SANTA CLARA, USA: Renesas Electronics America Inc. will showcase its embedded semiconductor technologies at the Medical Design & Manufacturing Conference Minneapolis 2011 (MD&M) (booth #956), Nov. 1-2, at the Minneapolis Convention Center. Demonstrations will highlight several of the company’s microcontroller (MCU)-based solutions, optimized for portable healthcare applications such as devices for blood pressure, blood glucose and heart rate monitoring.
Renesas offers a complete portfolio of components, tools and solutions for its MCU-based solutions, which provide the low-power, connectivity, high-performance and high-integration elements required for current and next-generation portable medical devices. Renesas is an active member of the Continua Health Alliance and ANT+ Alliance, and continues to develop solutions that support these standards, as well as Wi-Fi, USB and Ethernet protocols, which are essential for connectivity in mobile health devices.
Renesas Product and Technology Demonstrations (Booth #956)
ANT+ Wearable Sensor Solution: Renesas’ ANT+ demonstration will pair a low-power RL78 with an ANT+ radio module, showcasing the advantages of this low-power combination for portable healthcare devices. ANT+ is a low-power radio technology that supports simple data exchanges between devices such as heart rate monitors and sport watches, which help users track and manage their fitness and personal health more effectively, and enables them to proactively work on their personal health.
Continua Demonstration Platform for Renesas V850 MCUs: Renesas’ low-power V850 MCUs support the Continua medical software without sacrificing battery life – critical for portable healthcare applications such as blood glucose monitors. Featuring the Lamprey Network HealthLink, which relays the stored data to the Google Health Gadget, the Continua demonstration platform will measure actual MCU power consumption during the execution of application and power modes for a real-world illustration of this low-power, high-reliability healthcare solution.
Continua Blood Pressure Monitoring with Renesas R8C MCUs: Renesas also will demonstrate its support of the Continua standard with an R8C Continua dongle, which connects to a commercial blood pressure monitor as a simple method to support Continua on an existing medical system.
Wi-Fi for Renesas RX MCU: Renesas will showcase a quick and easy Wi-Fi connectivity solution designed to help engineers of embedded systems meet the growing demand for Wi-Fi connectivity. Featuring a Renesas RX MCU and a fully certified Wi-Fi module, the demo highlights everything that an engineer would need to begin development to add Wi-Fi to an RX-based design. The Wi-Fi module balances ultra-low power and high performance, as well as future proofing 802.11n connectivity.
Renesas RX600 Direct-Drive TFT-LCD Solution: Renesas will showcase the processing performance of its RX CPU and the utility of its external DMA controller, demonstrating how graphic information is moved with minimal loading on the RX CPU. Connectivity options for Ethernet, USB and CAN expand the RX CPU’s performance capabilities to easily manage the touchscreen interface of a TFT-LCD panel, and other types of human-machine interface (HMI) applications.
Renesas offers a complete portfolio of components, tools and solutions for its MCU-based solutions, which provide the low-power, connectivity, high-performance and high-integration elements required for current and next-generation portable medical devices. Renesas is an active member of the Continua Health Alliance and ANT+ Alliance, and continues to develop solutions that support these standards, as well as Wi-Fi, USB and Ethernet protocols, which are essential for connectivity in mobile health devices.
Renesas Product and Technology Demonstrations (Booth #956)
ANT+ Wearable Sensor Solution: Renesas’ ANT+ demonstration will pair a low-power RL78 with an ANT+ radio module, showcasing the advantages of this low-power combination for portable healthcare devices. ANT+ is a low-power radio technology that supports simple data exchanges between devices such as heart rate monitors and sport watches, which help users track and manage their fitness and personal health more effectively, and enables them to proactively work on their personal health.
Continua Demonstration Platform for Renesas V850 MCUs: Renesas’ low-power V850 MCUs support the Continua medical software without sacrificing battery life – critical for portable healthcare applications such as blood glucose monitors. Featuring the Lamprey Network HealthLink, which relays the stored data to the Google Health Gadget, the Continua demonstration platform will measure actual MCU power consumption during the execution of application and power modes for a real-world illustration of this low-power, high-reliability healthcare solution.
Continua Blood Pressure Monitoring with Renesas R8C MCUs: Renesas also will demonstrate its support of the Continua standard with an R8C Continua dongle, which connects to a commercial blood pressure monitor as a simple method to support Continua on an existing medical system.
Wi-Fi for Renesas RX MCU: Renesas will showcase a quick and easy Wi-Fi connectivity solution designed to help engineers of embedded systems meet the growing demand for Wi-Fi connectivity. Featuring a Renesas RX MCU and a fully certified Wi-Fi module, the demo highlights everything that an engineer would need to begin development to add Wi-Fi to an RX-based design. The Wi-Fi module balances ultra-low power and high performance, as well as future proofing 802.11n connectivity.
Renesas RX600 Direct-Drive TFT-LCD Solution: Renesas will showcase the processing performance of its RX CPU and the utility of its external DMA controller, demonstrating how graphic information is moved with minimal loading on the RX CPU. Connectivity options for Ethernet, USB and CAN expand the RX CPU’s performance capabilities to easily manage the touchscreen interface of a TFT-LCD panel, and other types of human-machine interface (HMI) applications.
Tuesday, November 1, 2011
Silicon-IP Inc. adds Intel as client
MOUNTAIN VIEW, USA: Silicon-IP Inc. an independent 3rd party IP advisory services company, announced that Intel Corp. has joined its impressive and growing list of customers for a near term project.
Silicon-IP, Inc. provides independent advisory services for the acquisition and management of 3rd party IP to SoC design companies. For the first time, SoC companies now have a partner they can rely on to get industry best practices and methodologies for identifying, selecting and acquiring third party IP for use in their next SoC.
As most next generation SoCs contain more than 60% of third-party IP by area and hundreds of 3rd party IPs available to chose from, designers increasingly require independent and objective information about this third-party IP to drive the evaluation and implementation decision-making process.
“Today, it is possible to develop and implement a rigorous methodology, based on well-defined best practices for selecting and conducting due diligence when acquiring IP,” noted Kurt Wolf, president and CEO of Silicon-IP.
“The benefit for designers and IP providers is a repeatable, structured business process that successfully reduces the time and cost associated with the licensing of semiconductor IP. As an independent service, Silicon-IP provides SoC design teams with this proprietary knowledge, insight, and implementation skills while saving the expense of a dedicated, full-time team of technical and business professionals,” he added. SoC chip designers are now able to capture the full benefits of 3rd party semiconductor IP outsourcing.
Silicon-IP, Inc. provides independent advisory services for the acquisition and management of 3rd party IP to SoC design companies. For the first time, SoC companies now have a partner they can rely on to get industry best practices and methodologies for identifying, selecting and acquiring third party IP for use in their next SoC.
As most next generation SoCs contain more than 60% of third-party IP by area and hundreds of 3rd party IPs available to chose from, designers increasingly require independent and objective information about this third-party IP to drive the evaluation and implementation decision-making process.
“Today, it is possible to develop and implement a rigorous methodology, based on well-defined best practices for selecting and conducting due diligence when acquiring IP,” noted Kurt Wolf, president and CEO of Silicon-IP.
“The benefit for designers and IP providers is a repeatable, structured business process that successfully reduces the time and cost associated with the licensing of semiconductor IP. As an independent service, Silicon-IP provides SoC design teams with this proprietary knowledge, insight, and implementation skills while saving the expense of a dedicated, full-time team of technical and business professionals,” he added. SoC chip designers are now able to capture the full benefits of 3rd party semiconductor IP outsourcing.
Aldec releases Active-HDL 9.1 supporting simulation of newest FPGA devices
HENDERSON, USA: Aldec Inc. announced the immediate availability of Active-HDL version 9.1, an award-winning HDL-based FPGA Design and Simulation solution that supports the newest FPGA devices available from all leading FPGA vendors.
The high-performance, mixed-language solution interfaces with nearly one hundred (100) third-party vendor tools and provides FPGA designers a single platform that can be used independently of the targeted FPGA design flow. Active-HDL 9.1 supports design creation and simulation of the newest industry-leading FPGA devices from Altera, Atmel, Lattice, Microsemi (Actel), Tabula, Quicklogic and Xilinx.
Known to FPGA designers as a tool-of-choice for ease and convenience (with design creation, documentation, code coverage and simulation bundled into one product), the latest release of Active-HDL includes even more benefits, such as:
* Integration with Aldec Riviera-PRO verification products - providing a gateway to 64-bit simulation and SystemVerilog Verification;
* HDL Code Browser Tool for on-the-fly error detection prior to compilation;
* Unified Coverage Database – a new single source database to manage different types of coverage;
* Extended documentation support to assist in DO-254 compliance requirements;
* Enhanced support of VHDL-2008 and PSL/SVA Assertions;
* Time-saving new features within the HDL Editor; and
* Improvements to the Block Diagram Editor and Waveform Viewer.
“This release of Active-HDL allows users to switch between Aldec products during different stages of design and verification,” said Satyam Jani, Aldec Software Division Product Manager. “The advanced verification interface allows users to move between products effortlessly and automatically generates scripts which can be used to run simulation on 64-bit machines using Aldec’s Riviera-PRO verification products.”
The enhanced level of automation that Active-HDL 9.1 brings within the design creation tools enables customers to save a significant amount of time and detect errors in the source code even before compilation with the new HDL code browser tool. The robust auto-complete technology built into the HDL Editor, language templates and phrase highlighting will enable design teams to quickly and efficiently develop, search and share their HDL code.
The high-performance, mixed-language solution interfaces with nearly one hundred (100) third-party vendor tools and provides FPGA designers a single platform that can be used independently of the targeted FPGA design flow. Active-HDL 9.1 supports design creation and simulation of the newest industry-leading FPGA devices from Altera, Atmel, Lattice, Microsemi (Actel), Tabula, Quicklogic and Xilinx.
Known to FPGA designers as a tool-of-choice for ease and convenience (with design creation, documentation, code coverage and simulation bundled into one product), the latest release of Active-HDL includes even more benefits, such as:
* Integration with Aldec Riviera-PRO verification products - providing a gateway to 64-bit simulation and SystemVerilog Verification;
* HDL Code Browser Tool for on-the-fly error detection prior to compilation;
* Unified Coverage Database – a new single source database to manage different types of coverage;
* Extended documentation support to assist in DO-254 compliance requirements;
* Enhanced support of VHDL-2008 and PSL/SVA Assertions;
* Time-saving new features within the HDL Editor; and
* Improvements to the Block Diagram Editor and Waveform Viewer.
“This release of Active-HDL allows users to switch between Aldec products during different stages of design and verification,” said Satyam Jani, Aldec Software Division Product Manager. “The advanced verification interface allows users to move between products effortlessly and automatically generates scripts which can be used to run simulation on 64-bit machines using Aldec’s Riviera-PRO verification products.”
The enhanced level of automation that Active-HDL 9.1 brings within the design creation tools enables customers to save a significant amount of time and detect errors in the source code even before compilation with the new HDL code browser tool. The robust auto-complete technology built into the HDL Editor, language templates and phrase highlighting will enable design teams to quickly and efficiently develop, search and share their HDL code.
High-speed powerline transceiver ensures reliable broadband powerline communications in industrial environments
SUNNYVALE, USA: Maxim Integrated Products introduced the MAX2982, the first broadband, HomePlug(R) 1.0-compliant, powerline communications transceiver for harsh industrial environments. The MAX2982 is highly integrated and offers significant design flexibility.
An enhanced “Robust” mode provides a receiver that operates at -1dB signal-to-noise (SNR) to ensure reliable communications in the presence of noise. The device operates from -40 degrees Celsius to +105 degrees Celsius and is qualified under AEC-Q100-Rev-G for harsh applications. The MAX2982 is an easy-to-use, industrial, broadband powerline communications solution for automation and control, remote monitoring, energy management, wireless base-station control and monitoring, and LANs.
Industry-standard, HomePlug 1.0 powerline communications chipsets have become commonplace in residential applications. Nonetheless, many industrial and commercial applications could not take advantage of the technology because existing products lacked the reliability and temperature ratings necessary for those uses. Further, commercial and industrial powerline environments have unique, high-noise characteristics not found in the residential environments where most HomePlug modems are used. Consequently, industrial applications need the powerline receiver and narrowband interference rejection circuitry to be optimized for reliable performance in their environments.
Ultimately, the automation industry wants to deploy a single-cable power and communications network that provides long operating life, operates with high accuracy in their harsh environment, and reliably monitors and controls remote sensors, system, and motors. They want a proven reliable powerline network that functions for them. Now with the MAX2982, their solution has arrived.
The MAX2982 is optimized for high-performance, real-time control, and automation applications. The device’s low-latency 333us response time and 14Mbps data rate support high-bandwidth data from large arrays of automated equipment in a single network. With its 512-address bridge table and point-to-multipoint addressing, the MAX2982 records, monitors, and controls hundreds of HomePlug modems in a network. This technology eliminates the traditional need for long, dedicated communication cables. Optional firmware delivers additional noise immunity to improve the communication range even further. The 56-bit DES/triple-DES (3DES) encryption with key management ensures secure communication.
“We partnered with Maxim to supply the optimized powerline communication solution needed for our high-reliability industrial automation products. Maxim brought us experience in both powerline technology and extended-temperature-range components,” said Rochus Hien, R&D senior expert of SEW Eurodrive.
“The MAX2982 provides the reliable powerline communications, low latency, and high speed that we require to deliver our industry-leading products,” Hien added. “We were pleased to work with SEW Eurodrive and prove the value that Maxim(R) powerline products can provide to industrial applications,” James Bates, VP, Signal Processing and Conversion for Maxim, concluded.
An enhanced “Robust” mode provides a receiver that operates at -1dB signal-to-noise (SNR) to ensure reliable communications in the presence of noise. The device operates from -40 degrees Celsius to +105 degrees Celsius and is qualified under AEC-Q100-Rev-G for harsh applications. The MAX2982 is an easy-to-use, industrial, broadband powerline communications solution for automation and control, remote monitoring, energy management, wireless base-station control and monitoring, and LANs.
Industry-standard, HomePlug 1.0 powerline communications chipsets have become commonplace in residential applications. Nonetheless, many industrial and commercial applications could not take advantage of the technology because existing products lacked the reliability and temperature ratings necessary for those uses. Further, commercial and industrial powerline environments have unique, high-noise characteristics not found in the residential environments where most HomePlug modems are used. Consequently, industrial applications need the powerline receiver and narrowband interference rejection circuitry to be optimized for reliable performance in their environments.
Ultimately, the automation industry wants to deploy a single-cable power and communications network that provides long operating life, operates with high accuracy in their harsh environment, and reliably monitors and controls remote sensors, system, and motors. They want a proven reliable powerline network that functions for them. Now with the MAX2982, their solution has arrived.
The MAX2982 is optimized for high-performance, real-time control, and automation applications. The device’s low-latency 333us response time and 14Mbps data rate support high-bandwidth data from large arrays of automated equipment in a single network. With its 512-address bridge table and point-to-multipoint addressing, the MAX2982 records, monitors, and controls hundreds of HomePlug modems in a network. This technology eliminates the traditional need for long, dedicated communication cables. Optional firmware delivers additional noise immunity to improve the communication range even further. The 56-bit DES/triple-DES (3DES) encryption with key management ensures secure communication.
“We partnered with Maxim to supply the optimized powerline communication solution needed for our high-reliability industrial automation products. Maxim brought us experience in both powerline technology and extended-temperature-range components,” said Rochus Hien, R&D senior expert of SEW Eurodrive.
“The MAX2982 provides the reliable powerline communications, low latency, and high speed that we require to deliver our industry-leading products,” Hien added. “We were pleased to work with SEW Eurodrive and prove the value that Maxim(R) powerline products can provide to industrial applications,” James Bates, VP, Signal Processing and Conversion for Maxim, concluded.
Xilinx ISE Design Suite 13.3 full custom precision floating-point support extends productivity for DSP designers
SAN JOSE, USA: Xilinx Inc. announced the availability of ISE Design Suite 13.3 featuring new capabilities for DSP designers to easily implement bit-accurate single, double and full custom precision floating-point math operations in their designs targeting wireless, medical, aerospace and defense, high-performance computing and video applications.
This flow is available through System Generator for DSP and leverages the Xilinx Floating-Point Operator IP LogiCORE. The combination of single, double and the industry's only full custom precision floating-point with the award winning productivity of System Generator for DSP, provides DSP designers a powerful environment to easily create, simulate and implement floating-point designs, as well as have more control over the silicon area and power required by their systems.
"Compared to competing solutions, only System Generator for DSP provides developers with a bit accurate solution, meaning we can guarantee that the simulation model will match the hardware implementation," said Tom Feist, senior marketing director, Design Methodology Marketing at Xilinx. "Xilinx 7 series 28nm FPGAs can deliver up to 1.33 teraflops of single-precision floating-point performance on one device, which is driving the demand for an easy-to-use design flow that delivers hand crafted results."
The Xilinx Floating-Point Operator core allows a range of floating-point arithmetic operations that can be performed in an FPGA. The operation is specified when the core is generated through the CORE Generator tool and now System Generator, and each operation variant has a common AXI-4 streaming interface. Previously, it was possible to implement a floating-point design in a Xilinx FPGA leveraging the full custom precision floating-point IP available in CORE Generator.
However, the design flow required an understanding of VHDL or Verilog and simulation could be challenging for DSP developers. With the availability of ISE Design Suite 13.3, designers can now realize their systems from a higher level of abstraction and by leveraging the simulation capabilities in The MathWorks' Simulink tool enable the confidence that their design meets their fidelity requirements.
ISE Design Suite 13.3 also adds Red Hat Enterprise Linux 6 and provides productivity enhancements for Logic, Embedded and System Edition users. All editions contain enhancements to Plug-and-Play IP and device support for 7 series devices. Embedded and System Editions contain significant Platform Studio ease-of-use enhancements including a new Graphical Design View. Logic Edition contains productivity enhancement to the PlanAhead design analysis tool, including a graphical hierarchy viewer for HDL files.
Customers can get started today by downloading ISE Design Suite13.3. They can learn more about how IDS 13.3 can improve productivity by downloading Xilinx's latest whitepaper on floating-point support in System Generator.
ISE Design Suite 13 is immediately available for all ISE Editions and list priced starting at $2,995 for the Logic Edition and now supports 32 and 64 bit Windows 7. Customers can download full-featured 30-day evaluation versions at no charge from the Xilinx web site.
This flow is available through System Generator for DSP and leverages the Xilinx Floating-Point Operator IP LogiCORE. The combination of single, double and the industry's only full custom precision floating-point with the award winning productivity of System Generator for DSP, provides DSP designers a powerful environment to easily create, simulate and implement floating-point designs, as well as have more control over the silicon area and power required by their systems.
"Compared to competing solutions, only System Generator for DSP provides developers with a bit accurate solution, meaning we can guarantee that the simulation model will match the hardware implementation," said Tom Feist, senior marketing director, Design Methodology Marketing at Xilinx. "Xilinx 7 series 28nm FPGAs can deliver up to 1.33 teraflops of single-precision floating-point performance on one device, which is driving the demand for an easy-to-use design flow that delivers hand crafted results."
The Xilinx Floating-Point Operator core allows a range of floating-point arithmetic operations that can be performed in an FPGA. The operation is specified when the core is generated through the CORE Generator tool and now System Generator, and each operation variant has a common AXI-4 streaming interface. Previously, it was possible to implement a floating-point design in a Xilinx FPGA leveraging the full custom precision floating-point IP available in CORE Generator.
However, the design flow required an understanding of VHDL or Verilog and simulation could be challenging for DSP developers. With the availability of ISE Design Suite 13.3, designers can now realize their systems from a higher level of abstraction and by leveraging the simulation capabilities in The MathWorks' Simulink tool enable the confidence that their design meets their fidelity requirements.
ISE Design Suite 13.3 also adds Red Hat Enterprise Linux 6 and provides productivity enhancements for Logic, Embedded and System Edition users. All editions contain enhancements to Plug-and-Play IP and device support for 7 series devices. Embedded and System Editions contain significant Platform Studio ease-of-use enhancements including a new Graphical Design View. Logic Edition contains productivity enhancement to the PlanAhead design analysis tool, including a graphical hierarchy viewer for HDL files.
Customers can get started today by downloading ISE Design Suite13.3. They can learn more about how IDS 13.3 can improve productivity by downloading Xilinx's latest whitepaper on floating-point support in System Generator.
ISE Design Suite 13 is immediately available for all ISE Editions and list priced starting at $2,995 for the Logic Edition and now supports 32 and 64 bit Windows 7. Customers can download full-featured 30-day evaluation versions at no charge from the Xilinx web site.
Diversified Engineering chosen as Microchip medical design partner specialist
CHANDLER, USA: Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, has signed Milford, CT-based Diversified Engineering as a new Medical Design Partner Specialist.
Diversified Engineering joins Microchip’s program of Design Partner Specialists in areas such as medical electronics, wireless design, touch sensing, motor control, and smart energy. Diversified is an ideal addition to Microchip’s elite Medical Design Partner Specialist program, because of its extensive knowledge of Microchip’s broad product portfolio, coupled with a proven track record of taking concepts to production within the unique requirements of the embedded medical-products market.
The company is familiar with the regulatory requirements for medical product development, and is a long-term, trusted design partner for Microchip, having designed with Microchip products for more than 17 years.
The proliferation of electronics in the medical market space is growing. However, medical-device companies often begin the development of products with chemical or mechanical engineers who may not have experience with embedded electronics. Diversified Engineering has the knowledge and expertise needed to bring medical products to market, which helps medical-device companies to quickly move ideas from concept through prototype to production.
“As Microchip’s presence in the medical market continues to grow, more of our clients are looking for ways to reduce design risk and time to market,” said Dan Termer, VP of Microchip’s Vertical Markets Group. “The addition of Diversified Engineering as our latest Medical Design Partner Specialist further enables new devices to take advantage of our PIC microcontrollers, dsPIC Digital Signal Controllers, analog and wireless products, and memory devices.”
“Not only are we familiar with the ins and outs of FDA regulatory approvals, but we are very familiar with Microchip’s embedded product portfolio, having successfully completed more than 100 designs,” said Dave Ross, president of Diversified Engineering. “We can help medical device companies get their innovative products to market on time and within budget.”
Diversified Engineering joins Microchip’s program of Design Partner Specialists in areas such as medical electronics, wireless design, touch sensing, motor control, and smart energy. Diversified is an ideal addition to Microchip’s elite Medical Design Partner Specialist program, because of its extensive knowledge of Microchip’s broad product portfolio, coupled with a proven track record of taking concepts to production within the unique requirements of the embedded medical-products market.
The company is familiar with the regulatory requirements for medical product development, and is a long-term, trusted design partner for Microchip, having designed with Microchip products for more than 17 years.
The proliferation of electronics in the medical market space is growing. However, medical-device companies often begin the development of products with chemical or mechanical engineers who may not have experience with embedded electronics. Diversified Engineering has the knowledge and expertise needed to bring medical products to market, which helps medical-device companies to quickly move ideas from concept through prototype to production.
“As Microchip’s presence in the medical market continues to grow, more of our clients are looking for ways to reduce design risk and time to market,” said Dan Termer, VP of Microchip’s Vertical Markets Group. “The addition of Diversified Engineering as our latest Medical Design Partner Specialist further enables new devices to take advantage of our PIC microcontrollers, dsPIC Digital Signal Controllers, analog and wireless products, and memory devices.”
“Not only are we familiar with the ins and outs of FDA regulatory approvals, but we are very familiar with Microchip’s embedded product portfolio, having successfully completed more than 100 designs,” said Dave Ross, president of Diversified Engineering. “We can help medical device companies get their innovative products to market on time and within budget.”
GSA president named as finalist in 8th Annual Stevie Awards for Women in Business
DALLAS, USA: The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, announced that Jodi Shelton, co-founder and president, is a finalist in Best Executive - Non-Profit or Government (Up to 100 Employees) category in the 8th Annual Stevie Awards for Women in Business.
The Stevie Awards for Women in Business honor women executives, entrepreneurs, and the companies they run - worldwide. The Stevie Awards have been hailed as the world’s premier business awards.
There were more than 1,300 entries - a record for the competition - submitted for this year’s consideration. The winners will be announced during a gala event on Friday, November 11 at the Marriott Marquis Hotel in New York City.
Shelton is the co-founder and president of the GSA, serving on its board of directors since inception in 1994. Under her leadership, the GSA has grown into a global organization that includes more than 400 corporate members and spans 30 countries. Shelton has also become one of the leading spokespersons for the semiconductor industry, and is often a Keynote speaker at high-level financial and industry conferences.
“I am extremely honored to be recognized for my work with the GSA by this prestigious organization,” said Jodi Shelton. “It’s a privilege to be nominated among such well-respected women entrepreneurs and executives. We are all winners just to be acknowledged for our contributions in our respective industries.”
Finalists were chosen by business professionals worldwide during preliminary judging. Members of the six final judging committees will select Stevie Award winners from among the Finalists during final judging.
“Women entrepreneurs and executives continue to innovate, excel and impress,” said Michael Gallagher, president of the Stevie Awards. “Regardless of general economic conditions, the achievements of women-owned and run organizations around the world remain high, and are reflected in this year’s impressive body of Finalists.”
The Stevie Awards for Women in Business honor women executives, entrepreneurs, and the companies they run - worldwide. The Stevie Awards have been hailed as the world’s premier business awards.
There were more than 1,300 entries - a record for the competition - submitted for this year’s consideration. The winners will be announced during a gala event on Friday, November 11 at the Marriott Marquis Hotel in New York City.
Shelton is the co-founder and president of the GSA, serving on its board of directors since inception in 1994. Under her leadership, the GSA has grown into a global organization that includes more than 400 corporate members and spans 30 countries. Shelton has also become one of the leading spokespersons for the semiconductor industry, and is often a Keynote speaker at high-level financial and industry conferences.
“I am extremely honored to be recognized for my work with the GSA by this prestigious organization,” said Jodi Shelton. “It’s a privilege to be nominated among such well-respected women entrepreneurs and executives. We are all winners just to be acknowledged for our contributions in our respective industries.”
Finalists were chosen by business professionals worldwide during preliminary judging. Members of the six final judging committees will select Stevie Award winners from among the Finalists during final judging.
“Women entrepreneurs and executives continue to innovate, excel and impress,” said Michael Gallagher, president of the Stevie Awards. “Regardless of general economic conditions, the achievements of women-owned and run organizations around the world remain high, and are reflected in this year’s impressive body of Finalists.”
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