2010 COMPUTEX TAIPEI, TAIWAN: NetLogic Microsystems, Inc., a leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, has announced two new members to the Au1300 Ultra Low-Power Alchemy processor family with the introduction of the high-performance Au1384 and the cost-effective Au1310 devices.
NetLogic Microsystems’ new Au1384 and Au1310 processors deliver the powerful processing performance, robust media acceleration and ultra low-power functionality required for intelligent next-generation connected automotive infotainment, audio/video navigation (AVN), heads-up display (HUD) and telematics systems.
Multiple original equipment manufacturers (OEMs) have adopted the new Au1384 and Au1310 processors for advanced connected car products. These connected car products allow users to access on-line information, watch videos and broadcast television, listen to audio files or tune in to Internet radio, and get real-time navigation maps and traffic from the comfort of the automobile.
“Our innovative Alchemy processors are powering and ushering in a new class of advanced digital solutions for the connected car,” said Mike Wodopian, vice president of marketing, Ultra Low-Power Alchemy Processors at NetLogic Microsystems.
“The addition of the Au1384 and Au1310 processor models demonstrates our continued leadership in delivering superior processing performance, broad feature set and functionality at the lowest power profile and highest scalability. Our Alchemy processors are enabling the convergence of media-rich entertainment, high-speed Internet connectivity and intelligent navigation for tomorrow’s automobiles, as evidenced by our strong design win leadership with multiple Tier One customers.”
The ultra low-power Au1384 processor operates at 800MHz, with a system bus speed of 400MHz, which improves overall performance and supports memory speeds up to DDR2-800. The Au1384 integrates a high-definition (HD) version of the second generation Media Acceleration Engine (MAE2) video processor for media decode and a 3D graphics processor supporting both OpenVG and OpenGL-ES standards. The Au1384 is available in both commercial and industrial temperature configurations.
Fine Digital’s automotive infotainment solution is the first commercial product to incorporate NetLogic Microsystems’ ultra low-power Au1384 processor. It features a 7-inch wide-VGA (800 X 480) LCD display, 3D navigation, and rich media playback. This market-leading solution also includes SD and USB expansion ports for media and mobile TV (DMB) functionality. Fine Digital will introduce its automotive infotainment solution in mass production in June 2010.
“We selected NetLogic Microsystems’ Au1384 Alchemy processor because it provides superior 3D performance, very rich media capabilities and extremely low standby power required for our next-generation automotive infotainment solutions,” said Dr. ByungSoo Kim, CTO of Fine Digital.
“As a leading provider of media-rich automotive infotainment solutions, we are excited to be working with NetLogic Microsystems and its market-leading Alchemy processors to help us deliver an innovative infotainment solution to the Korea market.”
The ultra low-power Au1310 processor operates at 533MHz and takes advantage of NetLogic Microsystems’ innovative Au1300 family architecture to deliver the performance and a rich media experience while maintaining typical overall system power rates of approximately 1/2 watt.
The Au1310 is socket- and software-compatible with other members of the Au1300 family, and enables customers to reduce cost by eliminating the 3D functions and supporting a version of the MAE2 capable of Wide-CIF (480x288) video decode, which leaves the 533MHz CPU performance “headroom” for enabling multi-tasking capabilities such as navigation, advanced user interface, media playback and other communication features.
Thinkware, a leading provider of navigation and location-based services (LBS) in Korea, has selected the Alchemy Au1310 for its upcoming “I-Navi AE” navigation system. The “I-Navi AE” is an on-dash navigation system that features an intuitive user interface on an integrated 7-inch diagonal, wide screen display, and is pre-loaded with the newly upgraded “Navi SE 3.2” navigation application software.
Thinkware’s “I-Navi AE” also supports a variety of passenger entertainment options such as digital TV broadcast (DMB), a karaoke player, several entertaining games, and multimedia playback features (audio and video) to enable user media playback from an external USB memory device.
“We are pleased to have selected NetLogic Microsystems’ ultra low-power Alchemy Au1310 media processor in our latest navigation system," said Konan Kim, CTO of Thinkware. “We have built a strong relationship with NetLogic Microsystems and the strong processor performance, multimedia capability, and ultra low-power consumption of the Au1310 Alchemy processor are what we have come to expect from the team and we look forward to continued success as we begin volume production.”
Building on the leadership of the ultra low-power Alchemy Au1300 family, both the Au1384 and Au1310 processors are based on a high-performance MIPS32 architecture and integrate a full complement of on-chip peripherals and connectivity functions.
NetLogic Microsystems’ Au1384 and Au1310 processors also include a best-in-class LCD controller with four graphics planes for 32-bit aRGB, and a second generation Media Acceleration Engine (MAE2) for H.264, MPEG 1/2/4, DivX, XviD, WMV9 and VC-1 media playback and are available in a 21mm x 21mm, LF-PBGA537 package.
NetLogic Microsystems’ ultra low-power Alchemy Au1384 and Au1380 processors are available for mass production today.
Tuesday, June 1, 2010
Lucid HYDRA multi-GPU enabled ASUS ROG motherboards rock high performance, optimal Power PC gaming
KFAR NETTER, ISRAEL, TAIPEI, TAIWAN & SANTA CLARA, USA: Marking the two companies’ first product collaboration, LucidLogix and ASUS will be showing the Lucid HYDRA 200 real time distributed processor in ASUS’s new ROG Crosshair IV Extreme motherboard and ROG Immensity concept at the Computex tradeshow in Taiwan this week.
The new motherboards will provide ultra high-performance gaming using the unique multi-GPU sharing capabilities of the HYDRA Engine that allows consumers to mix and match up to three GPUs (new or repurposed) regardless of brand, series or price.
Furthermore, ASUS leveraged the flexible nature of the HYDRA Engine to create the concept board Immensity, a desktop motherboard implementation that uses a on-board discrete GPU to add performance and balance power. With this motherboard, a gamer can use a single video card in a multi-GPU configuration to gain a competitive edge.
“HYDRA’s unique offering enables leading vendors like ASUS to unleash their creative freedom,” said LucidLogix Co-founder and President, Offir Remez. “For the first time, ASUS is now offering a desktop motherboard that allows for mix and match graphics performance and power with an on-board discrete GPU, an industry first motherboard concept.”
Designed with the PC gamer in mind, the HYDRA Engine offers a flexible solution for performance hungry consumers who may wish to upgrade to multiple GPUs from a variety of vendors. This new approach provides interoperability among GPUs and chipsets, auto-correct load balancing and multiple GPUs that simultaneously process a single frame within a game, thus resolving bottlenecks and inter-frame dependencies prior to rendering.
ROG ASUS crosshair and ROG immensity concept motherboards
The ROG Crosshair IV Extreme with the HYDRA 200 is based on the AMD 890FX chipset. The board supports AM3 processors, including the recently released Phenom II X6 models. It offers five PCIex16 slots along with the innovative overclocking interface called RC Bluetooth. The Immensity, also featuring HYDRA 200, can include a built-in discrete GPU.
ASUS and HYDRA 200 enabled motherboard owners can enjoy playing hundreds of AAA PC games, including DirectX 11 titles with a wide range of graphics card combinations including support for the new NVIDIA Fermi based boards. Additionally, they can expect accelerated ATI Eyefinity support and compatibility with NVIDIA’s CUDA and PHYSX technologies.
The boards are being showcased this week at Computex, which runs from June 1 to 5 in Taipei, Taiwan. ASUS will be providing the release date for the Crosshair IV Extreme motherboard shortly.
“Thanks to Lucid’s HYDRA technology we are able to display two of the most powerful and flexible motherboards in the industry,” said Joe Hseih, General Manager of Open Platform BG-MB Business Unit of ASUS. “We’ve used the compatibility of the HYDRA technology to bring a new class of product to market.”
The new motherboards will provide ultra high-performance gaming using the unique multi-GPU sharing capabilities of the HYDRA Engine that allows consumers to mix and match up to three GPUs (new or repurposed) regardless of brand, series or price.
Furthermore, ASUS leveraged the flexible nature of the HYDRA Engine to create the concept board Immensity, a desktop motherboard implementation that uses a on-board discrete GPU to add performance and balance power. With this motherboard, a gamer can use a single video card in a multi-GPU configuration to gain a competitive edge.
“HYDRA’s unique offering enables leading vendors like ASUS to unleash their creative freedom,” said LucidLogix Co-founder and President, Offir Remez. “For the first time, ASUS is now offering a desktop motherboard that allows for mix and match graphics performance and power with an on-board discrete GPU, an industry first motherboard concept.”
Designed with the PC gamer in mind, the HYDRA Engine offers a flexible solution for performance hungry consumers who may wish to upgrade to multiple GPUs from a variety of vendors. This new approach provides interoperability among GPUs and chipsets, auto-correct load balancing and multiple GPUs that simultaneously process a single frame within a game, thus resolving bottlenecks and inter-frame dependencies prior to rendering.
ROG ASUS crosshair and ROG immensity concept motherboards
The ROG Crosshair IV Extreme with the HYDRA 200 is based on the AMD 890FX chipset. The board supports AM3 processors, including the recently released Phenom II X6 models. It offers five PCIex16 slots along with the innovative overclocking interface called RC Bluetooth. The Immensity, also featuring HYDRA 200, can include a built-in discrete GPU.
ASUS and HYDRA 200 enabled motherboard owners can enjoy playing hundreds of AAA PC games, including DirectX 11 titles with a wide range of graphics card combinations including support for the new NVIDIA Fermi based boards. Additionally, they can expect accelerated ATI Eyefinity support and compatibility with NVIDIA’s CUDA and PHYSX technologies.
The boards are being showcased this week at Computex, which runs from June 1 to 5 in Taipei, Taiwan. ASUS will be providing the release date for the Crosshair IV Extreme motherboard shortly.
“Thanks to Lucid’s HYDRA technology we are able to display two of the most powerful and flexible motherboards in the industry,” said Joe Hseih, General Manager of Open Platform BG-MB Business Unit of ASUS. “We’ve used the compatibility of the HYDRA technology to bring a new class of product to market.”
Mindspeed showcases semiconductor solutions for demanding enterprise apps
2010 COMPUTEX TAIPEI, TAIWAN: Mindspeed Technologies Inc., a leading supplier of semiconductor solutions for network infrastructure applications, is showcasing new semiconductor solutions for enterprise applications at Computex Taipei 2010.
Mindspeed will demonstrate signal integrity solutions that enable storage and server systems to support the industry’s migration to higher data rates over long backplanes and cabling media and broadband gateway processors that deliver robust quality of service (QoS).
Mindspeed will be demonstrating its enterprise solutions June 1 through June 5, 2010, in Booth 1200 (Area H – 2nd Floor Hall 1) at the Taipei World Trade Center (TWTC) Exhibition Hall in Taipei, Taiwan.
"Mindspeed has a broad and growing portfolio of products and solutions that have very important applications in the high-growth enterprise infrastructure markets,” said Kurt Busch, senior vice president and general manager, high-performance analog business unit at Mindspeed. “The high-performance analog products we are showcasing at Computex solve critical signal integrity design challenges created by accelerating data rates in growing enterprise applications.”
Mindspeed will be showing its recently introduced Amplif-Eye line of signal-conditioning products for enterprise systems at Computex, including re-driving signal conditioners that use transmit and receive equalization to correct for insertion loss, and re-timing signal conditioners that add a clock data recovery (CDR) circuit to resolve jitter caused by crosstalk and reflections.
Computex demonstrations include the eight-channel CDR, M21362’s ability to maintain high PCI Express data rates while transmitting data to and from a video card (as both a driver and receiver) across channel lengths up to 10 meters. The same capability will be demonstrated with Mindspeed’s dual-channel M21450 with an adaptive equalizer embedded in an internal hard disk drive allowing data communication using the Serial Attached SCSI (SAS) protocol.
By delivering error-free high speed data transmission across long cables and backplane traces, Mindspeed’s Amplif-Eye solutions have become increasingly critical for supporting enterprise data rates that have doubled to 5 Gbps for PCI Express and 6 Gbps for SAS.
Mindspeed’s Amplif-Eye family is expanding support to include emerging high-speed protocol standard of DisplayPort. DisplayPort delivers high-performance digital display connectivity over standard cables with high resolutions, fast refresh rates and deep color depths. The company will highlight its quad-channel M21030 re-driving signal conditioner at Computex in a demonstration implemented over DisplayPort’s high-speed video channel.
In addition to its signal-conditioning portfolio, Mindspeed will also be featuring its award-winning Comcerto 1000 embedded packet processor, which delivers triple-play and additional advanced value-added services over fiber-access networks in small- and medium-sized business (SMB) smart security appliances and Voice-over-Internet Protocol (VoIP) gateways.
The Comcerto 1000 will be shown distributing multiple simultaneous high definition (HD) video streams plus VoIP, at gigabit data rates and with robust QoS and no degradation in the user’s quality of experience.
Mindspeed will demonstrate signal integrity solutions that enable storage and server systems to support the industry’s migration to higher data rates over long backplanes and cabling media and broadband gateway processors that deliver robust quality of service (QoS).
Mindspeed will be demonstrating its enterprise solutions June 1 through June 5, 2010, in Booth 1200 (Area H – 2nd Floor Hall 1) at the Taipei World Trade Center (TWTC) Exhibition Hall in Taipei, Taiwan.
"Mindspeed has a broad and growing portfolio of products and solutions that have very important applications in the high-growth enterprise infrastructure markets,” said Kurt Busch, senior vice president and general manager, high-performance analog business unit at Mindspeed. “The high-performance analog products we are showcasing at Computex solve critical signal integrity design challenges created by accelerating data rates in growing enterprise applications.”
Mindspeed will be showing its recently introduced Amplif-Eye line of signal-conditioning products for enterprise systems at Computex, including re-driving signal conditioners that use transmit and receive equalization to correct for insertion loss, and re-timing signal conditioners that add a clock data recovery (CDR) circuit to resolve jitter caused by crosstalk and reflections.
Computex demonstrations include the eight-channel CDR, M21362’s ability to maintain high PCI Express data rates while transmitting data to and from a video card (as both a driver and receiver) across channel lengths up to 10 meters. The same capability will be demonstrated with Mindspeed’s dual-channel M21450 with an adaptive equalizer embedded in an internal hard disk drive allowing data communication using the Serial Attached SCSI (SAS) protocol.
By delivering error-free high speed data transmission across long cables and backplane traces, Mindspeed’s Amplif-Eye solutions have become increasingly critical for supporting enterprise data rates that have doubled to 5 Gbps for PCI Express and 6 Gbps for SAS.
Mindspeed’s Amplif-Eye family is expanding support to include emerging high-speed protocol standard of DisplayPort. DisplayPort delivers high-performance digital display connectivity over standard cables with high resolutions, fast refresh rates and deep color depths. The company will highlight its quad-channel M21030 re-driving signal conditioner at Computex in a demonstration implemented over DisplayPort’s high-speed video channel.
In addition to its signal-conditioning portfolio, Mindspeed will also be featuring its award-winning Comcerto 1000 embedded packet processor, which delivers triple-play and additional advanced value-added services over fiber-access networks in small- and medium-sized business (SMB) smart security appliances and Voice-over-Internet Protocol (VoIP) gateways.
The Comcerto 1000 will be shown distributing multiple simultaneous high definition (HD) video streams plus VoIP, at gigabit data rates and with robust QoS and no degradation in the user’s quality of experience.
Freescale’s flagship applications processor product line enjoys marketplace momentum, spawns new offering
2010 COMPUTEX TAIPEI, TAiWAN: Eighteen months since its introduction, Freescale’s i.MX51 product family has sparked compelling new product categories, cemented the company’s leadership position in fast-growing markets and secured more than 50 design wins across a broad range of consumer applications.
Freescale has introduced the i.MX535 processor, the first member of the new i.MX53 product family, offering HD playback and integrating key technologies that boost performance and help lower the costs of next generation consumer products.
Exploding demand for touch-screen consumer devices that deliver all-day battery life and engaging end-user experiences has fueled tremendous market acceptance for Freescale’s i.MX51 processor. More than 50 OEM and ODM customers have selected the i.MX51 to power a wide array of consumer products including tablets, smartbooks, eReaders, smartphones and video-enabled IP phones.
Building on the market momentum and technical innovation of the i.MX51, Freescale’s new i.MX535 processor debuts at Computex 2010 to deliver new levels of performance, integration and software optimization for smart mobile devices.
The processor features 1080p video decode, 720p video encode, improved graphics performance, and a 400MHz-capable external memory bus that enables larger LCD screens. The device also integrates a vast array of key peripherals including DDR3, Serial ATA, LVDS, Ethernet and four USB ports, thereby boosting scalability and lowering bill of material costs.
The i.MX535 is based on an enhanced version of the ARM Cortex-A8 core running at up to 1 GHz, and a derivative part designed to deliver up to 1.2 GHz of performance is planned for later this year.
“Freescale’s long track record of optimizing the advantages of advanced ARM technology continues with the newest addition to Freescale’s pacesetting i.MX product line,” said Bernd Lienhard, vice president and general manager of Freescale’s Multimedia Applications Division. “The i.MX535 delivers a compelling blend of features, functionality, performance and energy efficiency that consumer device manufacturers need to take smart mobile device design to new levels.”
The i.MX535 processor’s rich feature set supports a number of highly compelling use cases:
* HD capability with 1080p video decode provides access to HD content available on popular online video platforms, while duplex video in HD delivers outstanding video conferencing experiences and supports the growing media/V2IP market.
* Adobe Flash Player 10.1 is optimized to run on the i.MX535’s OpenGL ES graphics engine and H.264 video cores to deliver outstanding video experiences and long battery life.
* Integrated LVDS and support for analog TV outputs up to 1080p60 are ideal for tablets and enable the creation of “next-gen ready” consumer products that don’t require additional or costly external components.
* External memory support up to 2GB prepares end devices for cloud computing applications, as well as future operating systems and browsers. And improved graphics performance means faster windowing, accelerated gaming, and more responsive user interfaces.
Optimal code reuse and broad software support
Since the i.MX535 shares operating system support and multiple peripherals with the i.MX51, manufacturers can preserve the value of their i.MX51 software investments and simplify code migration to the newer device.
The i.MX535 also enjoys support from a deep pool of software partners. Many popular operating systems integrate tightly with the processor’s ARM Cortex-A8 core, including Android OS, Microsoft Windows Embedded Compact 7, Linux OS and Chromium OS.
“Opportunities for OEMs to deliver rich, immersive user experiences and streamlined connectivity on a range of specialized consumer devices, such as slates, feature phones and other CIDs, continue to grow,” said David Wurster, senior product manager for Windows Embedded at Microsoft Corp. “We are excited to work with Freescale and our entire ecosystem of global partners to drive differentiated devices that are easy to use and provide seamless connections to the world of Windows 7-based PCs, servers and online services through Windows Embedded Compact 7.”
The i.MX535 processor is expected to ship in volume quantities in Q1 2011.
Freescale has introduced the i.MX535 processor, the first member of the new i.MX53 product family, offering HD playback and integrating key technologies that boost performance and help lower the costs of next generation consumer products.
Exploding demand for touch-screen consumer devices that deliver all-day battery life and engaging end-user experiences has fueled tremendous market acceptance for Freescale’s i.MX51 processor. More than 50 OEM and ODM customers have selected the i.MX51 to power a wide array of consumer products including tablets, smartbooks, eReaders, smartphones and video-enabled IP phones.
Building on the market momentum and technical innovation of the i.MX51, Freescale’s new i.MX535 processor debuts at Computex 2010 to deliver new levels of performance, integration and software optimization for smart mobile devices.
The processor features 1080p video decode, 720p video encode, improved graphics performance, and a 400MHz-capable external memory bus that enables larger LCD screens. The device also integrates a vast array of key peripherals including DDR3, Serial ATA, LVDS, Ethernet and four USB ports, thereby boosting scalability and lowering bill of material costs.
The i.MX535 is based on an enhanced version of the ARM Cortex-A8 core running at up to 1 GHz, and a derivative part designed to deliver up to 1.2 GHz of performance is planned for later this year.
“Freescale’s long track record of optimizing the advantages of advanced ARM technology continues with the newest addition to Freescale’s pacesetting i.MX product line,” said Bernd Lienhard, vice president and general manager of Freescale’s Multimedia Applications Division. “The i.MX535 delivers a compelling blend of features, functionality, performance and energy efficiency that consumer device manufacturers need to take smart mobile device design to new levels.”
The i.MX535 processor’s rich feature set supports a number of highly compelling use cases:
* HD capability with 1080p video decode provides access to HD content available on popular online video platforms, while duplex video in HD delivers outstanding video conferencing experiences and supports the growing media/V2IP market.
* Adobe Flash Player 10.1 is optimized to run on the i.MX535’s OpenGL ES graphics engine and H.264 video cores to deliver outstanding video experiences and long battery life.
* Integrated LVDS and support for analog TV outputs up to 1080p60 are ideal for tablets and enable the creation of “next-gen ready” consumer products that don’t require additional or costly external components.
* External memory support up to 2GB prepares end devices for cloud computing applications, as well as future operating systems and browsers. And improved graphics performance means faster windowing, accelerated gaming, and more responsive user interfaces.
Optimal code reuse and broad software support
Since the i.MX535 shares operating system support and multiple peripherals with the i.MX51, manufacturers can preserve the value of their i.MX51 software investments and simplify code migration to the newer device.
The i.MX535 also enjoys support from a deep pool of software partners. Many popular operating systems integrate tightly with the processor’s ARM Cortex-A8 core, including Android OS, Microsoft Windows Embedded Compact 7, Linux OS and Chromium OS.
“Opportunities for OEMs to deliver rich, immersive user experiences and streamlined connectivity on a range of specialized consumer devices, such as slates, feature phones and other CIDs, continue to grow,” said David Wurster, senior product manager for Windows Embedded at Microsoft Corp. “We are excited to work with Freescale and our entire ecosystem of global partners to drive differentiated devices that are easy to use and provide seamless connections to the world of Windows 7-based PCs, servers and online services through Windows Embedded Compact 7.”
The i.MX535 processor is expected to ship in volume quantities in Q1 2011.
QLogic to optimize InfiniBand performance on NVIDIA Tesla GPUs using NVIDIA GPUDirect
ALISO VIEJO, USA: QLogic Corp. is working closely with NVIDIA to optimize performance of NVIDIA Tesla GPUs in multi-node configurations interconnected with QLogic TrueScale InfiniBand fabrics.
By tapping into the new NVIDIA GPUDirect technology, QLogic InfiniBand adapters, switches and directors communicate directly with NVIDIA GPUs with reduced CPU involvement, reducing communication overhead for optimal results.
"HPC environments increasingly deploy multiple nodes with NVIDIA GPUs to speed up processing for computationally-intensive applications such as seismic processing and molecular dynamics modeling," said Andy Keane, general manager, Tesla business at NVIDIA.
"QLogic's TrueScale InfiniBand architecture, optimized with our GPUDirect technology, natively supports this distributed computing environment with fully optimized NVIDIA-based GPU performance and industry-leading message passing performance."
QLogic's TrueScale InfiniBand architecture requires no application re-compilation or software patches to deliver computational performance with NVIDIA GPUs, and still maintain the industry-leading scalable latency and high message rate for which QLogic InfiniBand solutions are known.
"Our work with NVIDIA is another demonstration of how QLogic TrueScale InfiniBand goes beyond basic OpenFabrics implementations to fully optimize the performance of key cluster technologies," said Jesse Parker, vice president and general manager, Network Solutions Group, QLogic.
"Our software development groups continually strive to anticipate and meet the needs of HPC users who are implementing the latest technologies to maximize application performance, and our support of NVIDIA and its innovative GPUDirect technology is a great example of how those efforts benefit customers."
By tapping into the new NVIDIA GPUDirect technology, QLogic InfiniBand adapters, switches and directors communicate directly with NVIDIA GPUs with reduced CPU involvement, reducing communication overhead for optimal results.
"HPC environments increasingly deploy multiple nodes with NVIDIA GPUs to speed up processing for computationally-intensive applications such as seismic processing and molecular dynamics modeling," said Andy Keane, general manager, Tesla business at NVIDIA.
"QLogic's TrueScale InfiniBand architecture, optimized with our GPUDirect technology, natively supports this distributed computing environment with fully optimized NVIDIA-based GPU performance and industry-leading message passing performance."
QLogic's TrueScale InfiniBand architecture requires no application re-compilation or software patches to deliver computational performance with NVIDIA GPUs, and still maintain the industry-leading scalable latency and high message rate for which QLogic InfiniBand solutions are known.
"Our work with NVIDIA is another demonstration of how QLogic TrueScale InfiniBand goes beyond basic OpenFabrics implementations to fully optimize the performance of key cluster technologies," said Jesse Parker, vice president and general manager, Network Solutions Group, QLogic.
"Our software development groups continually strive to anticipate and meet the needs of HPC users who are implementing the latest technologies to maximize application performance, and our support of NVIDIA and its innovative GPUDirect technology is a great example of how those efforts benefit customers."
EDOM and LucidLogix bring HYDRA to Asia
KFAR NETTER, ISRAEL & TAIPEI, TAIWAN: To better serve its customers around the world, LucidLogix Technologies announced today during the Computex trade event that EDOM Technology, based in Taiwan with offices throughout the Pacific Rim, will now be the Asian distributor of the HYDRA 200 and other Lucid products.
“We’re pleased to announce that EDOM Technology will now be our distribution partner in Asia,” said Pat Chiumiento, VP of sales and marketing at Lucid. “The capabilities of a large and successful distributor like EDOM will help us to further expand our customer base in the Pacific Rim.”
EDOM’s experienced sales team will augment Lucid’s efforts. In addition, the company provides significant resources dedicated to customer technical support. EDOM also offers a complementary line card and professional fulfillment system.
Designed with the PC gamer in mind, The HYDRA engine offers a flexible solution for performance hungry consumers who may wish to upgrade to multiple GPUs from a variety of vendors. This LucidLogix approach provides interoperability among GPUs and chipsets, auto-correct load balancing and multiple GPUs that simultaneously process a single frame within a game, thus resolving bottlenecks and inter-frame dependencies prior to rendering.
“EDOM welcomes Lucid to our prestigious list of vendors,” said Jonathan Lin, President of EDOM. “Adding Lucid’s unique Hydra solution to our product portfolio offers significant new business opportunities to both EDOM and our esteemed customers.
“We’re pleased to announce that EDOM Technology will now be our distribution partner in Asia,” said Pat Chiumiento, VP of sales and marketing at Lucid. “The capabilities of a large and successful distributor like EDOM will help us to further expand our customer base in the Pacific Rim.”
EDOM’s experienced sales team will augment Lucid’s efforts. In addition, the company provides significant resources dedicated to customer technical support. EDOM also offers a complementary line card and professional fulfillment system.
Designed with the PC gamer in mind, The HYDRA engine offers a flexible solution for performance hungry consumers who may wish to upgrade to multiple GPUs from a variety of vendors. This LucidLogix approach provides interoperability among GPUs and chipsets, auto-correct load balancing and multiple GPUs that simultaneously process a single frame within a game, thus resolving bottlenecks and inter-frame dependencies prior to rendering.
“EDOM welcomes Lucid to our prestigious list of vendors,” said Jonathan Lin, President of EDOM. “Adding Lucid’s unique Hydra solution to our product portfolio offers significant new business opportunities to both EDOM and our esteemed customers.
Spotlight on the future @ Computex 2010!
TAIWAN: Given the delicate contents and support from telecom carriers, iPad and iPhone 4G are definitely the hottest products in 2010.
DRAMeXchange forecasts 1H10 iPad shipment will likely be 1.7 million units, while 7~8 million units will be targeted for 2010. Meanwhile, NAND Flash consumption of iPad will account around 3 percent of total NAND Flash consumption.
The 2010 iPhone shipment is expected to reach 40 million units, while NAND Flash consumption will account for 9 percent of the total. We believe that the NAND Flash demand will be boosted by Apple products, which will likely result in the mild shortage in 2H'10.
Given the shining sale of iPad, DRAMeXchange expects that many PC-OEMs will start to penetrate into tablet PC market. Compared with million units sold at 74 days for iPhone, it took only less than a month for iPad to reach 1 million units sold. Generally speaking, we see seldom overlapping customer base from netbook and tablet PC.
Furthermore, iPad offers brand new using experience in terms of multi-touch and software/hardware application rather than the netbook. That is, DRAMeXchange expects that the tablet PC will create another new market after netbook.
In the 3D TV market, there are sveral developing technologies booming recently. With outstanding 3D image performance, the shutter glasses technology will most likely become a market mainstream.
In addition, for coding/decoding technology, 2D+Delta is the mainstream for its high performance and file size capability. As for Lenticular technology, in addition to performance and viewing angle, which need to be enhanced, the high cost involved in achieving 2D/3D switchable is also a major issue in its penetration.
Hardware-based 3D technology is expected to take off next year, though chips used are mainly those produced in-house by brand vendors. And demand for 3D will mainly be driven by movies and gaming.
However, in addition to high prices of 3D displays, the prices of other peripheral devices are also high due to their low penetration, which makes viewing 3D content at home an expensive form of entertainment. Therefore, consumers will have to wait another two~three years for the price of 3D display to reach the acceptable sweet spot.
DRAMeXchange forecasts 1H10 iPad shipment will likely be 1.7 million units, while 7~8 million units will be targeted for 2010. Meanwhile, NAND Flash consumption of iPad will account around 3 percent of total NAND Flash consumption.
The 2010 iPhone shipment is expected to reach 40 million units, while NAND Flash consumption will account for 9 percent of the total. We believe that the NAND Flash demand will be boosted by Apple products, which will likely result in the mild shortage in 2H'10.
Given the shining sale of iPad, DRAMeXchange expects that many PC-OEMs will start to penetrate into tablet PC market. Compared with million units sold at 74 days for iPhone, it took only less than a month for iPad to reach 1 million units sold. Generally speaking, we see seldom overlapping customer base from netbook and tablet PC.
Furthermore, iPad offers brand new using experience in terms of multi-touch and software/hardware application rather than the netbook. That is, DRAMeXchange expects that the tablet PC will create another new market after netbook.
In the 3D TV market, there are sveral developing technologies booming recently. With outstanding 3D image performance, the shutter glasses technology will most likely become a market mainstream.
In addition, for coding/decoding technology, 2D+Delta is the mainstream for its high performance and file size capability. As for Lenticular technology, in addition to performance and viewing angle, which need to be enhanced, the high cost involved in achieving 2D/3D switchable is also a major issue in its penetration.
Hardware-based 3D technology is expected to take off next year, though chips used are mainly those produced in-house by brand vendors. And demand for 3D will mainly be driven by movies and gaming.
However, in addition to high prices of 3D displays, the prices of other peripheral devices are also high due to their low penetration, which makes viewing 3D content at home an expensive form of entertainment. Therefore, consumers will have to wait another two~three years for the price of 3D display to reach the acceptable sweet spot.
NXP releases two 2x2mm leadless discretes packages with industry’s lowest height of 0.65mm
EINDHOVEN, THE NETHERLANDS: NXP Semiconductors has announced two new small-signal discrete leadless packages measuring 2x2mm with industry‘s lowest height of 0.65mm.
Available in a 3-lead (SOT1061) and a 6-lead (SOT1118) version, the plastic SMD (Surface Mount Device) packages offer an increased lifetime with an exposed heat sink for excellent thermal and electrical conductivity.
The new products – including 26 types of FET-KYs, dual P-channel MOSFET, low VCEsat transistors and Schottky rectifiers – achieve power dissipation Ptot up to 2.1 Watt. This performance is comparable to products in industry standard package SOT89 (SC-62) while only taking less than half it‘s space on a PCB.
“As board space and power consumption are critical factors in the design of today‘s thin, compact and battery-driven devices, NXP provides a broad portfolio of small packages supporting the industry drive towards smaller form-factor end-user devices,” says Ralf Euler, product marketing manager for small-signal discretes, NXP Semiconductors.
“The new portfolio is ideal for applications such as high performance charging circuits, load switches and Switch Mode Power Supply (SMPS) in mobile equipment, smart phones and laptops.”
The SOT1061 and SOT1118 are free of halogens and antimony oxides and comply with non-flammability classification UL 94V-0 and RoHS standards.
Samples of all new discrete devices in SOT1061 and SOT1118 are available immediately for design-in. The low VCEsat (BISS) transistors and low VF single Schottky rectifiers in SOT1061 are ready for ordering. The NXP P-Channel MOSFET and FET-KY portfolio in SOT1118 as well as the dual Schottky rectifiers in SOT1061 will available in volume end of June.
Available in a 3-lead (SOT1061) and a 6-lead (SOT1118) version, the plastic SMD (Surface Mount Device) packages offer an increased lifetime with an exposed heat sink for excellent thermal and electrical conductivity.
The new products – including 26 types of FET-KYs, dual P-channel MOSFET, low VCEsat transistors and Schottky rectifiers – achieve power dissipation Ptot up to 2.1 Watt. This performance is comparable to products in industry standard package SOT89 (SC-62) while only taking less than half it‘s space on a PCB.
“As board space and power consumption are critical factors in the design of today‘s thin, compact and battery-driven devices, NXP provides a broad portfolio of small packages supporting the industry drive towards smaller form-factor end-user devices,” says Ralf Euler, product marketing manager for small-signal discretes, NXP Semiconductors.
“The new portfolio is ideal for applications such as high performance charging circuits, load switches and Switch Mode Power Supply (SMPS) in mobile equipment, smart phones and laptops.”
The SOT1061 and SOT1118 are free of halogens and antimony oxides and comply with non-flammability classification UL 94V-0 and RoHS standards.
Samples of all new discrete devices in SOT1061 and SOT1118 are available immediately for design-in. The low VCEsat (BISS) transistors and low VF single Schottky rectifiers in SOT1061 are ready for ordering. The NXP P-Channel MOSFET and FET-KY portfolio in SOT1118 as well as the dual Schottky rectifiers in SOT1061 will available in volume end of June.
LSI storage system integrated with new Cray CX1000 supercomputer
HAMBURG, GERMANY: LSI Corp. announced that Cray Inc. has selected the LSI Engenio 2600 storage system for integration with the new Cray CX1000 supercomputer. The Engenio 2600 is an entry-level storage system designed to provide customers with midrange performance and advanced functionality without sacrificing simplicity or affordability.
The Cray CX1000 supercomputer is a dense, energy-efficient and powerful rack-mounted system designed for data-intensive, high-performance computing (HPC) environments. The Cray CX1000 system redefines HPC by delivering hybrid capabilities through a choice of chassis and other components that can be mixed-and-matched in a single rack, creating a customized hybrid computing platform to meet a variety of scientific workloads.
The flexibility of the Cray CX1000 supercomputer is complemented by the integration of the highly adaptable LSI Engenio 2600 storage system. The 2600 system is the newest member of the Engenio line of modular storage systems and the first to feature 6Gb/s SAS technology. The system combines multi-protocol host connectivity, flexible drive support, an intuitive management interface and advanced energy-saving features, delivering a fully featured storage system integrated with the Cray CX1000 supercomputer.
"The Cray CX1000 supercomputer is our first system based on Intel processors and an InfiniBand interconnect designed to fit between our Cray CX1 desktop line and our Cray XT family of supercomputers," said Ian Miller, senior vice president of the productivity solutions group and marketing at Cray.
"The Cray CX1000 system is tightly integrated with the LSI Engenio 2600 to allow customers to address both computational and storage requirements within a single system. The 2600 system is the perfect complement to the new Cray CX1000 supercomputer and our overall vision of adaptive supercomputing."
The Engenio 2600 system combines proven LSI controller technology with leading host interface connectivity to deliver a 4X improvement in throughput performance compared to the previous generation product. The system also delivers 2X IOPS (input/output operations per second) improvement in random disk reads compared to its predecessor.
The system's balanced and sustainable performance allows it to support a wide range of HPC workloads by being equally adept both at delivering throughput to bandwidth-intensive applications and IOPS to transaction-oriented applications.
"HPC professionals in the lower end of the market have the same need for maximum computational efficiency and continuous data access as those in the high end," said Steve Hochberg, senior director, HPC segment, LSI.
"However, system attributes such as storage density, power efficiency and ease of use often play a larger role in the purchase decisions of these customers. The Cray CX1000 supercomputer with integrated LSI storage technology delivers on these requirements while providing the flexibility to meet future project needs."
With over 100 petabytes deployed in HPC environments and more than 400,000 systems shipped across a wide range of workloads and market segments, LSI storage systems are helping to accelerate scientific research and innovation for many of the world's largest government and university-based research centers.
The LSI Engenio 2600 is available today through select OEM partners, including Cray.
The Cray CX1000 supercomputer is a dense, energy-efficient and powerful rack-mounted system designed for data-intensive, high-performance computing (HPC) environments. The Cray CX1000 system redefines HPC by delivering hybrid capabilities through a choice of chassis and other components that can be mixed-and-matched in a single rack, creating a customized hybrid computing platform to meet a variety of scientific workloads.
The flexibility of the Cray CX1000 supercomputer is complemented by the integration of the highly adaptable LSI Engenio 2600 storage system. The 2600 system is the newest member of the Engenio line of modular storage systems and the first to feature 6Gb/s SAS technology. The system combines multi-protocol host connectivity, flexible drive support, an intuitive management interface and advanced energy-saving features, delivering a fully featured storage system integrated with the Cray CX1000 supercomputer.
"The Cray CX1000 supercomputer is our first system based on Intel processors and an InfiniBand interconnect designed to fit between our Cray CX1 desktop line and our Cray XT family of supercomputers," said Ian Miller, senior vice president of the productivity solutions group and marketing at Cray.
"The Cray CX1000 system is tightly integrated with the LSI Engenio 2600 to allow customers to address both computational and storage requirements within a single system. The 2600 system is the perfect complement to the new Cray CX1000 supercomputer and our overall vision of adaptive supercomputing."
The Engenio 2600 system combines proven LSI controller technology with leading host interface connectivity to deliver a 4X improvement in throughput performance compared to the previous generation product. The system also delivers 2X IOPS (input/output operations per second) improvement in random disk reads compared to its predecessor.
The system's balanced and sustainable performance allows it to support a wide range of HPC workloads by being equally adept both at delivering throughput to bandwidth-intensive applications and IOPS to transaction-oriented applications.
"HPC professionals in the lower end of the market have the same need for maximum computational efficiency and continuous data access as those in the high end," said Steve Hochberg, senior director, HPC segment, LSI.
"However, system attributes such as storage density, power efficiency and ease of use often play a larger role in the purchase decisions of these customers. The Cray CX1000 supercomputer with integrated LSI storage technology delivers on these requirements while providing the flexibility to meet future project needs."
With over 100 petabytes deployed in HPC environments and more than 400,000 systems shipped across a wide range of workloads and market segments, LSI storage systems are helping to accelerate scientific research and innovation for many of the world's largest government and university-based research centers.
The LSI Engenio 2600 is available today through select OEM partners, including Cray.
Fraunhofer IZM-ASSID selects EV Group temporary bonding and debonding equipment
ST. FLORIAN, AUSTRIA: EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs.
ASSID (All Silicon System Integration Dresden), a new project group of Fraunhofer IZM, will use EVG's systems for advanced 3D wafer-level process integration flow development for Fraunhofer's industrial partners. Both EVG systems will be installed later this year at ASSID's state-of-the-art facility in Dresden—the first Fraunhofer Center with a 300-mm line dedicated to developing processes for high-volume manufacturing of 3D ICs.
This latest order from Fraunhofer IZM-ASSID bolsters EVG's market-leading installed base of temporary bonding and debonding systems—currently totaling more than 60 system installations worldwide.
The 3D IC technology is gaining momentum as the technology of choice in addressing consumer demand for smaller, lower-power electronic devices with greater functionality. However, unlike manufacturing conventional ICs, which are built on silicon wafers approximately 750-microns thick, 3D ICs require the use of much thinner wafers of about 100 microns or less.
Given the inherent fragility of these ultra-thin wafers, thin-wafer processing requires TB/DB technology to ensure the structural integrity of the wafer—particularly when it undergoes high-temperature, high-stress processes such as etching and metallization.
By temporarily bonding the ultra-thin wafer to a carrier substrate and then leveraging a stress-free debonding approach after back side processing, TB/DB technology offers integrity-assured processing, which results in higher yield.
EVG's industry-proven TB/DB technology is designed to support a wide variety of processes—including those already established and in industrial use today, as well as those outlined in roadmap requirements for future 3D device generations.
"At Fraunhofer IZM-ASSID, we develop highly tailored processes for leading semiconductor manufacturers with very different requirements, and we need flexible and scalable process solutions to meet a wide variety of needs," said Jurgen Wolf, manager and coordinator of ASSID.
"EV Group's temporary bonding and debonding platforms enable seamless development and evolution of the 3D integration processes and technologies for our customers. The success we have had with previous EV Group systems, combined with superior demo results and EVG's overall process expertise in 3D packaging, were all key factors in our selection criteria for this order."
"This is a very important win for EV Group, as Fraunhofer is one of the premiere research facilities in Europe dedicated to 3D IC technology advancement," noted EV Group executive technology director, Paul Lindner.
"This marks another step forward in establishing EV Group's technology solutions as the industry standard for wafer-level packaging applications, particularly 3D ICs. We look forward to a mutually beneficial cooperation with Fraunhofer IZM and its ASSID project, and taking our industry-leading technology and process expertise in 3D packaging to a new level."
The wafer bonding and thin-wafer handling equipment market represents another high-growth segment in which EVG has successfully established its technology process and expertise. Its dominant position in this market contributed to EVG's financial success in 2009, when the company continued to see an increase in both order intake and revenue despite the global economic recession.
EVG and Fraunhofer-IZM are both members of the EMC-3D Consortium, where they have collaborated closely, along with other consortium members, on lowering 3D IC manufacturing costs to incite greater technology adoption.
ASSID (All Silicon System Integration Dresden), a new project group of Fraunhofer IZM, will use EVG's systems for advanced 3D wafer-level process integration flow development for Fraunhofer's industrial partners. Both EVG systems will be installed later this year at ASSID's state-of-the-art facility in Dresden—the first Fraunhofer Center with a 300-mm line dedicated to developing processes for high-volume manufacturing of 3D ICs.
This latest order from Fraunhofer IZM-ASSID bolsters EVG's market-leading installed base of temporary bonding and debonding systems—currently totaling more than 60 system installations worldwide.
The 3D IC technology is gaining momentum as the technology of choice in addressing consumer demand for smaller, lower-power electronic devices with greater functionality. However, unlike manufacturing conventional ICs, which are built on silicon wafers approximately 750-microns thick, 3D ICs require the use of much thinner wafers of about 100 microns or less.
Given the inherent fragility of these ultra-thin wafers, thin-wafer processing requires TB/DB technology to ensure the structural integrity of the wafer—particularly when it undergoes high-temperature, high-stress processes such as etching and metallization.
By temporarily bonding the ultra-thin wafer to a carrier substrate and then leveraging a stress-free debonding approach after back side processing, TB/DB technology offers integrity-assured processing, which results in higher yield.
EVG's industry-proven TB/DB technology is designed to support a wide variety of processes—including those already established and in industrial use today, as well as those outlined in roadmap requirements for future 3D device generations.
"At Fraunhofer IZM-ASSID, we develop highly tailored processes for leading semiconductor manufacturers with very different requirements, and we need flexible and scalable process solutions to meet a wide variety of needs," said Jurgen Wolf, manager and coordinator of ASSID.
"EV Group's temporary bonding and debonding platforms enable seamless development and evolution of the 3D integration processes and technologies for our customers. The success we have had with previous EV Group systems, combined with superior demo results and EVG's overall process expertise in 3D packaging, were all key factors in our selection criteria for this order."
"This is a very important win for EV Group, as Fraunhofer is one of the premiere research facilities in Europe dedicated to 3D IC technology advancement," noted EV Group executive technology director, Paul Lindner.
"This marks another step forward in establishing EV Group's technology solutions as the industry standard for wafer-level packaging applications, particularly 3D ICs. We look forward to a mutually beneficial cooperation with Fraunhofer IZM and its ASSID project, and taking our industry-leading technology and process expertise in 3D packaging to a new level."
The wafer bonding and thin-wafer handling equipment market represents another high-growth segment in which EVG has successfully established its technology process and expertise. Its dominant position in this market contributed to EVG's financial success in 2009, when the company continued to see an increase in both order intake and revenue despite the global economic recession.
EVG and Fraunhofer-IZM are both members of the EMC-3D Consortium, where they have collaborated closely, along with other consortium members, on lowering 3D IC manufacturing costs to incite greater technology adoption.
DiBcom to launch DVB-T and ISDB-T tuner-demodulator SoCs for TV receivers
PARIS, FRANCE: DiBcom, leader in the market for components dedicated to digital fixed and mobile TV reception, unveils its 2 new tuner-demodulator SoC for DVB-T and ISDB-T full-seg, offering digital TV high performance technology for portable or fixed reception. Set top boxes, TV sets or PCTV can be addressed by these components at a very low cost.
Analog switch-off is happening step by step in Europe, maintaining a constant high demand for DVB-T receivers. Also, South America and Russia have launched digital terrestrial TV in ISDB-T and DVB-T, extending this big demand to the next coming years.
These twp DiBcom SoCs, pin-to-pin compatible, are designed to be at the heart of these booming world wide markets.
Packaged in QFN 64 pins, they got the benefit of long TV reception experience as DiBcom already deployed millions of integrated tuner-demodulator chips around the world during the last 4 years.
The DVB-T DIB7090P is not only Nordig 2.0 and DTG compliant, but is designed to achieve MBRAI (IEC62002) specifications for portable receivers.
In the same way, the ISDB-T full-seg (and 1-seg) DIB8096P outperforms ARIB and SBTVD specifications to offer outstanding performance.
The COFDM demodulation includes the patented algorithms that established DiBcoms reputation in signal processing for many years. Digital processing suppresses impulse noise, multipath, adjacent and co-channel interference, allowing the retrieval of any useful signal for an unrivalled reception quality.
Diversity or dual reception is easily obtained by daisy-chaining 2 chips.
“After having developed innovative applications to receive TV in mobile conditions, we are now proud to launch cost effective high performance solutions for the STB and Digital TV consumer electronics. It is a great time to develop this market, due to many new countries launching digital TV in Latin America, Eastern Europe and South East Asia” says Yannick Levy, DiBcom CEO.
The new DIB7090P and DIB8096P are available for sampling. Price for DIB7090P is $2 for 1 million units.
Analog switch-off is happening step by step in Europe, maintaining a constant high demand for DVB-T receivers. Also, South America and Russia have launched digital terrestrial TV in ISDB-T and DVB-T, extending this big demand to the next coming years.
These twp DiBcom SoCs, pin-to-pin compatible, are designed to be at the heart of these booming world wide markets.
Packaged in QFN 64 pins, they got the benefit of long TV reception experience as DiBcom already deployed millions of integrated tuner-demodulator chips around the world during the last 4 years.
The DVB-T DIB7090P is not only Nordig 2.0 and DTG compliant, but is designed to achieve MBRAI (IEC62002) specifications for portable receivers.
In the same way, the ISDB-T full-seg (and 1-seg) DIB8096P outperforms ARIB and SBTVD specifications to offer outstanding performance.
The COFDM demodulation includes the patented algorithms that established DiBcoms reputation in signal processing for many years. Digital processing suppresses impulse noise, multipath, adjacent and co-channel interference, allowing the retrieval of any useful signal for an unrivalled reception quality.
Diversity or dual reception is easily obtained by daisy-chaining 2 chips.
“After having developed innovative applications to receive TV in mobile conditions, we are now proud to launch cost effective high performance solutions for the STB and Digital TV consumer electronics. It is a great time to develop this market, due to many new countries launching digital TV in Latin America, Eastern Europe and South East Asia” says Yannick Levy, DiBcom CEO.
The new DIB7090P and DIB8096P are available for sampling. Price for DIB7090P is $2 for 1 million units.
Ubiquitous and Wistron showcase 'QuickBoot' on Freescale's i.MX51 processor
TOKYO, JAPAN: Ubiquitous Corp., a Tokyo based leading embedded software company announced that "Ubiquitous QuickBoot", the ultimate instant boot solution software for embedded devices, supports Freescale Semiconductor's i.MX application processors as a primary platform among other ARM based processors.
Wistron Corp., a Taiwan based major ODM company, will showcase products with QuickBoot running on Freescale's i.MX51 processors this week at Taipei, demonstrating "Instant-on without standby power" as a solution for its various product lines.
"We have chosen Freescale's i.MX products as a primary platform for QuickBoot because the processors are now widely used for various devices like smartbooks, tablets, e-books and automotive infotainments where the instant-on user experience is essential" said Tomoyuki Ietaka, President of Ubiquitous.
"Manufacturers who use Freescale's i.MX processors are now ready to utilize QuickBoot without further intensive engineering works, and hence they can quickly release products which boot up within a few seconds from cold start, enabling short time-to-market".
"We are glad to see Ubiquitous' QuickBoot has proven that consumer applications run instantaneously from power on, enhancing the consumer experience across a wide range of devices using i.MX application processors." said Sridharan Subramanian, Senior Product Manager for Freescale's Multimedia Applications Division.
"Freescale is committed to support the Android platform on i.MX51 and follow on application processors. Technologies like QuickBoot are designed to add value to Android based Freescale devices by enabling zero standby power, without sacrificing booting time."
Ubiquitous QuickBoot is a software product of a break-through booting technology, and enabled Android and Linux to boot from a cold start in about 1 second by using Freescale's i.MX31 processor, restoring the 128MB memory image. QuickBoot can restore necessary portions of the memory image by automatically determining the priority of memory usage of the system. The QuickBoot SDK uses Freescale's i.MX31 and i.MX51 based boards as its reference hardware.
The Ubiquitous QuickBoot will be demonstrated at Freescale's demo room and Wistron's private demo held in conjunction with Computex Taipei this week. Ubiquitous have implemented QuickBoot on Wistron's smartbook product N900Z which uses the Freescale i.MX51 processor.
Wistron Corp., a Taiwan based major ODM company, will showcase products with QuickBoot running on Freescale's i.MX51 processors this week at Taipei, demonstrating "Instant-on without standby power" as a solution for its various product lines.
"We have chosen Freescale's i.MX products as a primary platform for QuickBoot because the processors are now widely used for various devices like smartbooks, tablets, e-books and automotive infotainments where the instant-on user experience is essential" said Tomoyuki Ietaka, President of Ubiquitous.
"Manufacturers who use Freescale's i.MX processors are now ready to utilize QuickBoot without further intensive engineering works, and hence they can quickly release products which boot up within a few seconds from cold start, enabling short time-to-market".
"We are glad to see Ubiquitous' QuickBoot has proven that consumer applications run instantaneously from power on, enhancing the consumer experience across a wide range of devices using i.MX application processors." said Sridharan Subramanian, Senior Product Manager for Freescale's Multimedia Applications Division.
"Freescale is committed to support the Android platform on i.MX51 and follow on application processors. Technologies like QuickBoot are designed to add value to Android based Freescale devices by enabling zero standby power, without sacrificing booting time."
Ubiquitous QuickBoot is a software product of a break-through booting technology, and enabled Android and Linux to boot from a cold start in about 1 second by using Freescale's i.MX31 processor, restoring the 128MB memory image. QuickBoot can restore necessary portions of the memory image by automatically determining the priority of memory usage of the system. The QuickBoot SDK uses Freescale's i.MX31 and i.MX51 based boards as its reference hardware.
The Ubiquitous QuickBoot will be demonstrated at Freescale's demo room and Wistron's private demo held in conjunction with Computex Taipei this week. Ubiquitous have implemented QuickBoot on Wistron's smartbook product N900Z which uses the Freescale i.MX51 processor.
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