EINDHOVEN, THE NETHERLANDS: NXP Semiconductors announced a major milestone for its ICODE product line, as the company successfully shipped over its billionth ICODE chip.
As one of the most popular RFID chip on the market, NXP’s ICODE interface platform has become the first choice for high frequency (HF) smart tag and label solutions. As a result, the technology is regularly used around the world in more than 3000 libraries to keep track of books and other library media.
ICODE-powered tags and labels also effectively identify patients, track medical devices and tag blood samples within hospitals, and support the tracking and tracing of components within factory automation environments.
To continue the success of the ICODE family, NXP has now launched the ICODE SLIx platform, which is pushing beyond existing limits of RF performance and offering enhanced flexibility and 100 percent backward compatibility with existing solutions.
“More than one billion ICODE HF RFID ICs shipped is an impressive achievement for NXP and reflects the strong HF adoption ABI has observed within the broader RFID industry,” states Michael Liard, Practice Director, RFID, at ABI Research (Oyster Bay, NY, USA). “The addition of ICODE SLIx to NXP’s HF RFID IC portfolio solidifies the company’s commitment to continued innovation and performance improvement in the HF tag and label market.”
“NXP is very proud to have reached this important milestone within our business for tag and label applications. Since the initial ICODE product launch, it’s been incredible watching the demand for the technology grow as it became a viable business option across numerous industries,” said Chris Feige, general manager, tagging and authentication product line, NXP Semiconductors.
“Our new ICODE platform combines our expertise and research as we drive forward as the leader in RFID ICs, helping us create a product with the lowest possible power consumption and best-in-market read range.”
With the launch of the ICODE SLIx, NXP has introduced various new features unique to the market for HF tags and labels. ICODE SLIx provides up to 20 percent higher read range than existing ICODE SLI products. All different chip configurations are also available in high capacitance versions for smaller label designs.
ICODE SLIx provides a unique set of value-added custom commands including 32-bit password capability for Electronic Article Surveillance (EAS) and for the standardized Application Family Identifier (AFI). These two functionalities are broadly used in library installations to efficiently protect library media from intentional change and theft.
The ICODE SLIx has been designed to be fully backward compatible with existing SLI commands and is therefore usable in all existing ICODE SLI installations.
ICODE SLIx ICs are available in volume from NXP in the second quarter of 2010.
Monday, March 1, 2010
Korea’s leading fabless semicon firms selects Sonics for mobile digital multimedia product
MILPITAS, USA: Sonics Inc., a premier supplier of intelligent on-chip communications solutions, said that its SonicsMX product has been selected by Core Logic as part of the company’s chip design for a multimedia product with HD video. Core Logic expects to ship its design by end of Q4 2010.
The selection of SonicsMX provides Core Logic a full-featured, high-speed on-chip network that simplifies SoC design. SMX provides a “socket-based” interface that allows isolation of each core in the system making it easy to integrate IP cores with different interfaces from multiple vendors. It also provides advanced data flow services including quality-of-service (QoS), error management and data security.
“We looked at a number of options for the design of our semiconductor, but none could match the optimal blend of performance and ease of integration advantages that SonicsMX could,” said Jae-Young Jang, Director of SoC Development Team. “This design is the first in what we hope is a long collaboration and will help us continue our market edge as a global leader in digital IC design.”
“This agreement with Core Logic is further evidence of our commitment to providing best-of-breed solutions for the mobile multimedia and HD video markets,” said Jack Browne, Senior Vice President of Sales and Marketing. “Our products are well-suited for semiconductor leaders, such as Core Logic, who strive for design reuse, top performance and a faster time-to-market. We look forward to working with Core Logic as the company expands its award-winning product portfolio for digital consumer devices.”
SonicsMX provides multimedia device designers a tested and established solution that gives them the design edge needed to compete in the highly competitive consumer market.
The selection of SonicsMX provides Core Logic a full-featured, high-speed on-chip network that simplifies SoC design. SMX provides a “socket-based” interface that allows isolation of each core in the system making it easy to integrate IP cores with different interfaces from multiple vendors. It also provides advanced data flow services including quality-of-service (QoS), error management and data security.
“We looked at a number of options for the design of our semiconductor, but none could match the optimal blend of performance and ease of integration advantages that SonicsMX could,” said Jae-Young Jang, Director of SoC Development Team. “This design is the first in what we hope is a long collaboration and will help us continue our market edge as a global leader in digital IC design.”
“This agreement with Core Logic is further evidence of our commitment to providing best-of-breed solutions for the mobile multimedia and HD video markets,” said Jack Browne, Senior Vice President of Sales and Marketing. “Our products are well-suited for semiconductor leaders, such as Core Logic, who strive for design reuse, top performance and a faster time-to-market. We look forward to working with Core Logic as the company expands its award-winning product portfolio for digital consumer devices.”
SonicsMX provides multimedia device designers a tested and established solution that gives them the design edge needed to compete in the highly competitive consumer market.
Netronome announces first SSL inspection appliance for 10Gbps networks
RSA Conference 2010, SAN FRANCISCO, USA: Netronome, a leading developer of network flow processing solutions for high-performance security and deep packet inspection applications, announced the industry’s first SSL inspection appliance for 10Gbps networks.
The Netronome SSL Inspector Appliance is the only device that can be deployed in 1Gbps and 10Gbps networks without negatively impacting network throughput or latency. As a result the SSL Inspector Appliance is the only device available today that is guaranteed to accurately detect and decrypt 100% of encrypted communications for inspection. Netronome is demonstrating the SSL Inspector Appliance at RSA Conference 2010 in booth 656.
With the rise of cloud computing and Web 2.0, many applications are using encryption by default to secure information while in transit over public networks. As a result, enterprise networks are more susceptible to attacks and malware that bypass intrusion detection and prevention systems because the traffic is encrypted. Encryption also enables accidental and intentional data leaks that are not detected by network forensics and data loss prevention systems.
“Encrypted communications help enterprises comply with government regulations and fulfill corporate compliance by securing confidential data. At the same time encryption can provide an easy vehicle for criminals to hide their activities," said David Wells, vice president of technology and co-founder at Netronome.
"Several recent well publicized attacks at Fortune 1000 companies, global Internet search providers and U.S. government agencies were advanced persistent threats that made significant use of SSL encryption. These sophisticated criminal activities that continue to evade enterprise security solutions can easily be exposed by the SSL Inspector Appliance.”
The Netronome SSL Inspector Appliance is the only device that can be deployed in 1Gbps and 10Gbps networks without negatively impacting network throughput or latency. As a result the SSL Inspector Appliance is the only device available today that is guaranteed to accurately detect and decrypt 100% of encrypted communications for inspection. Netronome is demonstrating the SSL Inspector Appliance at RSA Conference 2010 in booth 656.
With the rise of cloud computing and Web 2.0, many applications are using encryption by default to secure information while in transit over public networks. As a result, enterprise networks are more susceptible to attacks and malware that bypass intrusion detection and prevention systems because the traffic is encrypted. Encryption also enables accidental and intentional data leaks that are not detected by network forensics and data loss prevention systems.
“Encrypted communications help enterprises comply with government regulations and fulfill corporate compliance by securing confidential data. At the same time encryption can provide an easy vehicle for criminals to hide their activities," said David Wells, vice president of technology and co-founder at Netronome.
"Several recent well publicized attacks at Fortune 1000 companies, global Internet search providers and U.S. government agencies were advanced persistent threats that made significant use of SSL encryption. These sophisticated criminal activities that continue to evade enterprise security solutions can easily be exposed by the SSL Inspector Appliance.”
Amulet launches capacitive touch support for Graphical OS chips and GEMstudio GUI design tool
CAMPBELL, USA: Amulet Technologies, a leader in graphic user interface (GUI) solutions, announced that its Graphical OS Chips and GUI design tool, GEMstudio, now support capacitive touch.
A reference design illustrating the new GUI solution will be showcased at Embedded World held in Nuremberg, Germany, March 2-4, 2010. The solution is targeted at any embedded application requiring a graphic user interface and capacitive touch. The first reference design for capacitive touch support is a refrigerator with a built-in GUI touchscreen.
“We are excited to provide our customers with the ability to easily integrate capacitive touch interfaces,” stated Ken Klask, Amulet’s CTO. “The user interface storyboard and graphics were created in two weeks and the entire production-ready GUI was then put together in just two days using GEMstudio. This is remarkable considering if we would have coded the GUI from scratch it would have taken over a year.”
Nicole Coleman, marketing director at Amulet, added: “Capacitive touch is becoming increasingly important for various markets, including appliance. It is a challenge and very costly for our customers to put these technologies together using traditional methods and we are making it easy for them to integrate a full turn-key solution.”
A reference design illustrating the new GUI solution will be showcased at Embedded World held in Nuremberg, Germany, March 2-4, 2010. The solution is targeted at any embedded application requiring a graphic user interface and capacitive touch. The first reference design for capacitive touch support is a refrigerator with a built-in GUI touchscreen.
“We are excited to provide our customers with the ability to easily integrate capacitive touch interfaces,” stated Ken Klask, Amulet’s CTO. “The user interface storyboard and graphics were created in two weeks and the entire production-ready GUI was then put together in just two days using GEMstudio. This is remarkable considering if we would have coded the GUI from scratch it would have taken over a year.”
Nicole Coleman, marketing director at Amulet, added: “Capacitive touch is becoming increasingly important for various markets, including appliance. It is a challenge and very costly for our customers to put these technologies together using traditional methods and we are making it easy for them to integrate a full turn-key solution.”
ZTESec selects NetLogic for intelligent layer 7 NICs
MOUNTAIN VIEW, USA: NetLogic Microsystems Inc., a leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, announced that ZTE Special Equipment Co. (ZTESec), a subsidiary of ZTE Corp., selected NetLogic Microsystems’ XLS multi-core processors and 10 Gigabit Ethernet (10GbE) PHY devices for ZTESec’s next-generation intelligent Layer 7 network interface cards (NICs).
The intelligent secure NICs from ZTESec provide 10G network connectivity, Layer 7 content security and TCP/IP processing for next-generation servers and storage appliances to enable advanced cloud computing applications.
ZTESec’s intelligent NIC design comprises NetLogic Microsystems’ industry-leading XLS416 multi-core processor and AEL1001 10GbE PHY device. The XLS416 processor performs Layer 7 content processing and network security acceleration as well as critical network TCP/IP functions such as hashing, flow termination, assembly and forwarding at wire speeds. The AEL1001 PHY device provides best-in-class 10 Gigabit network interface at industry-leading performance, low jitter and low power.
“We are very pleased to have selected NetLogic Microsystems for ZTESec’s innovative 10G NICs for high-performance data center and security applications,” said Dong-Sheng Ling, general manager of ZTE Special Equipment Company. “NetLogic Microsystems’ market-leading multi-core processors and 10GbE PHYs deliver the unparalleled performance, flexibility and scalability required for our most advanced NIC solutions, and we value the superior quality and support we have received from NetLogic Microsystems.”
ZTESec’s intelligent Layer 7 NICs support simultaneous processing of network, storage, compute clustering and traffic management while enabling the convergence of different traffic types over a single Ethernet fabric. In addition, by supporting Layers 2 through 7 processing, ZTESec’s NIC solutions enable application-aware services and in-line unified network security while boosting server and storage performance for next-generation data center cloud-computing and specialized applications.
“We are excited to be part of ZTESec’s new 10G intelligent Layer 7 NIC product and look forward to our mutual success as ZTESec drives this innovative product into the security, server and storage markets,” said Dr. Sunny Siu, president and general manager of Asia-Pacific operations at NetLogic Microsystems.
NetLogic Microsystems’ XLS family of multi-core, multi-threaded processors comprises highly scalable, high-performance and feature-rich processor solutions for a wide variety of telecommunications infrastructure, enterprise, data center, security and storage systems.
The XLS processor family is optimized for applications such as 3G/4G mobile infrastructure, integrated security, Web services, content and application-aware networking, multi-service routing and switching, virtualized storage, load balancing and server offload.
The intelligent secure NICs from ZTESec provide 10G network connectivity, Layer 7 content security and TCP/IP processing for next-generation servers and storage appliances to enable advanced cloud computing applications.
ZTESec’s intelligent NIC design comprises NetLogic Microsystems’ industry-leading XLS416 multi-core processor and AEL1001 10GbE PHY device. The XLS416 processor performs Layer 7 content processing and network security acceleration as well as critical network TCP/IP functions such as hashing, flow termination, assembly and forwarding at wire speeds. The AEL1001 PHY device provides best-in-class 10 Gigabit network interface at industry-leading performance, low jitter and low power.
“We are very pleased to have selected NetLogic Microsystems for ZTESec’s innovative 10G NICs for high-performance data center and security applications,” said Dong-Sheng Ling, general manager of ZTE Special Equipment Company. “NetLogic Microsystems’ market-leading multi-core processors and 10GbE PHYs deliver the unparalleled performance, flexibility and scalability required for our most advanced NIC solutions, and we value the superior quality and support we have received from NetLogic Microsystems.”
ZTESec’s intelligent Layer 7 NICs support simultaneous processing of network, storage, compute clustering and traffic management while enabling the convergence of different traffic types over a single Ethernet fabric. In addition, by supporting Layers 2 through 7 processing, ZTESec’s NIC solutions enable application-aware services and in-line unified network security while boosting server and storage performance for next-generation data center cloud-computing and specialized applications.
“We are excited to be part of ZTESec’s new 10G intelligent Layer 7 NIC product and look forward to our mutual success as ZTESec drives this innovative product into the security, server and storage markets,” said Dr. Sunny Siu, president and general manager of Asia-Pacific operations at NetLogic Microsystems.
NetLogic Microsystems’ XLS family of multi-core, multi-threaded processors comprises highly scalable, high-performance and feature-rich processor solutions for a wide variety of telecommunications infrastructure, enterprise, data center, security and storage systems.
The XLS processor family is optimized for applications such as 3G/4G mobile infrastructure, integrated security, Web services, content and application-aware networking, multi-service routing and switching, virtualized storage, load balancing and server offload.
Analog Devices Blackfin development tools discount reduces cost of new application designs
NORWOOD, USA: Analog Devices Inc. has announced a development tool discount program that offers “bundles” of their robust VisualDSP++ Integrated Development and Debugging Environment (IDDE) and powerful emulator (s) at significant discounts.
The low priced development tool bundles are available through authorized worldwide Analog Devices’ distributors from March 1, 2010 through May 28, 2010. All development tool bundle orders received on or after March 1st and shipped from the distributors by May 28th will be eligible for the discounted price.
“Our development tools have proven to be a powerful resource for developers to get their designs up and running on the Blackfin processor family,” said Stephen Daly, channel marketing director, Analog Devices DSP Division. “This bundle discount program is a great opportunity for new developers to take advantage of these state-of-the-art tools at a significantly reduced price.”
The discount program includes two separate purchase options: Bundle option one includes VisualDSP++ and the new low cost JTAG emulator for $995 (a 73 percent price reduction) and bundle option two which includes VisualDSP++ plus the High Performance USB Emulator for $1995 (a 74 percent price reduction).
VisualDSP ++ Integrated Development Environment
Streamlining a design’s time to market, Analog Devices’ VisualDSP++ integrated development and debug environment integrates a graphical user interface and code generation and debugging tools, enabling programmers to move easily between editing, building, debugging and deployment of new products. Easy to use, it allows developers to efficiently manage the full development cycle with a single interface.
High Performance USB-based Emulator
Analog Devices’ High Performance USB-based emulator (ADZS-HPUSB-ICE) with up to 1.7 MB/sec download speed provides an easy, portable, non-intrusive, target-based debugging solution. The HP USB-based emulator also supports the Background Telemetry Channel (BTC), a non-intrusive method for exchanging data between the host and target application without affecting the target system's real-time characteristics.
Low Cost Blackfin JTAG Emulator
The ADZS-ICE-100B Blackfin emulator performs a wide range of functions, including single-step and full-speed execution with predefined breakpoints, and viewing and/or altering of register and memory contents. The ADZS-ICE-100B emulator enables users to communicate with Blackfin processors using a high speed USB 2.0 port on the host PC. Applications and data can easily and rapidly be tested and transferred between the emulator and the VisualDSP++.
The low priced development tool bundles are available through authorized worldwide Analog Devices’ distributors from March 1, 2010 through May 28, 2010. All development tool bundle orders received on or after March 1st and shipped from the distributors by May 28th will be eligible for the discounted price.
“Our development tools have proven to be a powerful resource for developers to get their designs up and running on the Blackfin processor family,” said Stephen Daly, channel marketing director, Analog Devices DSP Division. “This bundle discount program is a great opportunity for new developers to take advantage of these state-of-the-art tools at a significantly reduced price.”
The discount program includes two separate purchase options: Bundle option one includes VisualDSP++ and the new low cost JTAG emulator for $995 (a 73 percent price reduction) and bundle option two which includes VisualDSP++ plus the High Performance USB Emulator for $1995 (a 74 percent price reduction).
VisualDSP ++ Integrated Development Environment
Streamlining a design’s time to market, Analog Devices’ VisualDSP++ integrated development and debug environment integrates a graphical user interface and code generation and debugging tools, enabling programmers to move easily between editing, building, debugging and deployment of new products. Easy to use, it allows developers to efficiently manage the full development cycle with a single interface.
High Performance USB-based Emulator
Analog Devices’ High Performance USB-based emulator (ADZS-HPUSB-ICE) with up to 1.7 MB/sec download speed provides an easy, portable, non-intrusive, target-based debugging solution. The HP USB-based emulator also supports the Background Telemetry Channel (BTC), a non-intrusive method for exchanging data between the host and target application without affecting the target system's real-time characteristics.
Low Cost Blackfin JTAG Emulator
The ADZS-ICE-100B Blackfin emulator performs a wide range of functions, including single-step and full-speed execution with predefined breakpoints, and viewing and/or altering of register and memory contents. The ADZS-ICE-100B emulator enables users to communicate with Blackfin processors using a high speed USB 2.0 port on the host PC. Applications and data can easily and rapidly be tested and transferred between the emulator and the VisualDSP++.
Tessera, UTAC sign updated technology licensing agreement
SAN JOSE, USA: Tessera Technologies Inc. announced that its semiconductor packaging subsidiary, Tessera, Inc., has signed an updated technology licensing agreement with United Test and Assembly Center Ltd (UTAC), an independent provider of test and assembly services for a wide range of semiconductor devices.
The initial term of the updated license agreement runs through the end of 2016. UTAC has the option to renew the license for an additional five year term.
Among other consideration to Tessera, under the terms of the agreement UTAC will pay $15.0 million in cash to address past royalties owed under the initial license. Tessera will receive three separate payments, the first of which will occur in the first quarter of 2010 with the remainder in the second half of 2010.
As a result of this initial payment, Tessera is raising its first quarter 2010 total revenue guidance range to be between $63 million and $64 million. This compares to previous first quarter 2010 total revenue guidance given on January 28, 2010, of between $58 million and $61 million.
The updated license agreement and payment for past royalties resolves all outstanding litigation between the companies, settling the parties’ pending action in the Superior Court of the State of California (Alameda County).
The initial term of the updated license agreement runs through the end of 2016. UTAC has the option to renew the license for an additional five year term.
Among other consideration to Tessera, under the terms of the agreement UTAC will pay $15.0 million in cash to address past royalties owed under the initial license. Tessera will receive three separate payments, the first of which will occur in the first quarter of 2010 with the remainder in the second half of 2010.
As a result of this initial payment, Tessera is raising its first quarter 2010 total revenue guidance range to be between $63 million and $64 million. This compares to previous first quarter 2010 total revenue guidance given on January 28, 2010, of between $58 million and $61 million.
The updated license agreement and payment for past royalties resolves all outstanding litigation between the companies, settling the parties’ pending action in the Superior Court of the State of California (Alameda County).
January chip sales increase 0.3 percent from December
SAN JOSE, USA: The Semiconductor Industry Association (SIA) today reported that worldwide semiconductor sales in January were $22.5 billion, an increase of 0.3 percent from December sales of $22.4 billion. Sales increased by 47.2 percent from January 2009 when sales were $15.3 billion. All monthly sales numbers represent a three-month moving average.
Source: SIA, USA
“Worldwide semiconductor sales in January increased significantly compared to one year ago, reflecting today’s improving business environment for the industry,” said SIA President George Scalise. “January and February of 2009 were the low point of the industry downturn as the semiconductor industry and electronics manufacturers quickly responded to the global economic recession.
“We are currently seeing strength across a range of demand drivers for semiconductors, including personal computers, cell phones, automobiles, and industrial applications,” Scalise continued.
“If the current trends continue, there is upside potential for 2010 growth above our November forecast of $242.1 billion, but a growing global economy driven by consumer purchasing will be key to sustaining these trends,” Scalise concluded.
Source: SIA, USA
Source: SIA, USA“Worldwide semiconductor sales in January increased significantly compared to one year ago, reflecting today’s improving business environment for the industry,” said SIA President George Scalise. “January and February of 2009 were the low point of the industry downturn as the semiconductor industry and electronics manufacturers quickly responded to the global economic recession.
“We are currently seeing strength across a range of demand drivers for semiconductors, including personal computers, cell phones, automobiles, and industrial applications,” Scalise continued.
“If the current trends continue, there is upside potential for 2010 growth above our November forecast of $242.1 billion, but a growing global economy driven by consumer purchasing will be key to sustaining these trends,” Scalise concluded.
Source: SIA, USA
iSuppli issues fast facts on SIA’s global sales report
EL SEGUNDO, USA: To support media coverage of the Global Sales Report for January of the US Semiconductor Industry Association (SIA), iSuppli Corp. is issuing the following fast facts on the worldwide chip market:
* The SIA reported that worldwide semiconductor sales rose slightly in January 2010 compared to December 2009.
* Global semiconductor revenue in the first quarter will amount to $66.5 billion, down 4.4 percent from $69.6 billion in the fourth quarter, iSuppli predicts.
* However, revenue will show impressive growth compared to the first quarter of 2009, when the global semiconductor industry suffered a severe downturn. Global chip revenue in the first quarter will surge a whopping 48.5 percent compared to $44.8 billion during the same period in 2009. The figure presents iSuppli’s forecast of global quarterly semiconductor revenue in 2010.
Source: iSuppli, USA
* "The 48.5 percent year-over-year growth in the first quarter will lay the foundation for a robust rebound in the global semiconductor business in 2010,” said Dale Ford, senior vice president at iSuppli. “iSuppli predicts global semiconductor revenue in 2010 will rise to $279.7 billion, up 21.5 percent from $230.2 billion in 2009. This will mark the first year of double-digit percentage revenue growth for the semiconductor industry since 2006. Following the 11.1 percent decline in revenue in 2009, the strong growth in 2010 represents a major improvement in market conditions for the global semiconductor industry. Semiconductor revenue growth this year will swing by 32.6 percentage points in the positive direction, from negative 11.1 percent in 2009 to positive 21.5 percent in 2010.”
* In terms of semiconductor products, the strongest chip segment in the first quarter of 2010 will be memory, a category including DRAM and NAND flash, which will experience a 99.3 percent increase in revenue compared to the same period in 2009.
* DRAM’s strong revenue growth in 2010 is due to the suppliers’ deft management of manufacturing capacity, which will keep inventories in check and prevent prices from eroding too precipitously.
* On the NAND flash memory side, strong sales growth of smart phones is expected to generate insatiable demand for NAND-type flash memory in 2010. This will contribute to strained supplies for the year and help to boost pricing.
* Wireless communications, an area dominated by cell phones, is expected to generate major growth in semiconductor consumption in the first quarter of 2010. Semiconductor sales to the wireless communications market will amount to $13.1 billion in the first quarter, up a strong 53 percent from $8.6 billion in the first quarter of 2009.
Source: iSuppli, USA
* The SIA reported that worldwide semiconductor sales rose slightly in January 2010 compared to December 2009.
* Global semiconductor revenue in the first quarter will amount to $66.5 billion, down 4.4 percent from $69.6 billion in the fourth quarter, iSuppli predicts.
* However, revenue will show impressive growth compared to the first quarter of 2009, when the global semiconductor industry suffered a severe downturn. Global chip revenue in the first quarter will surge a whopping 48.5 percent compared to $44.8 billion during the same period in 2009. The figure presents iSuppli’s forecast of global quarterly semiconductor revenue in 2010.
Source: iSuppli, USA* "The 48.5 percent year-over-year growth in the first quarter will lay the foundation for a robust rebound in the global semiconductor business in 2010,” said Dale Ford, senior vice president at iSuppli. “iSuppli predicts global semiconductor revenue in 2010 will rise to $279.7 billion, up 21.5 percent from $230.2 billion in 2009. This will mark the first year of double-digit percentage revenue growth for the semiconductor industry since 2006. Following the 11.1 percent decline in revenue in 2009, the strong growth in 2010 represents a major improvement in market conditions for the global semiconductor industry. Semiconductor revenue growth this year will swing by 32.6 percentage points in the positive direction, from negative 11.1 percent in 2009 to positive 21.5 percent in 2010.”
* In terms of semiconductor products, the strongest chip segment in the first quarter of 2010 will be memory, a category including DRAM and NAND flash, which will experience a 99.3 percent increase in revenue compared to the same period in 2009.
* DRAM’s strong revenue growth in 2010 is due to the suppliers’ deft management of manufacturing capacity, which will keep inventories in check and prevent prices from eroding too precipitously.
* On the NAND flash memory side, strong sales growth of smart phones is expected to generate insatiable demand for NAND-type flash memory in 2010. This will contribute to strained supplies for the year and help to boost pricing.
* Wireless communications, an area dominated by cell phones, is expected to generate major growth in semiconductor consumption in the first quarter of 2010. Semiconductor sales to the wireless communications market will amount to $13.1 billion in the first quarter, up a strong 53 percent from $8.6 billion in the first quarter of 2009.
Source: iSuppli, USA
IPL Alliance announces first open standard for interoperable process design kits (PDKs)
MOUNTAN VIEW, USA: The Interoperable PDK Libraries (IPL) Alliance has released the semiconductor industry's first open standard for interoperable Process Design Kits (iPDKs).
This release is a major accomplishment achieved through the collaboration of IPL Alliance member companies. Semiconductor foundries and integrated device manufacturers (IDMs) can use this standard to build a single iPDK that works with multiple OpenAccess-based custom design tools, reducing development costs and the need to support vendor-specific PDKs.
Electronic design automation (EDA) vendors can use this standard to validate that their tools work with the iPDKs delivered by the foundries and IDMs. IPL 1.0 reference kit includes an iPDK developer's guide, a sample 90nm reference iPDK, a reference design and a user guide. Ciranova, SpringSoft, Synopsys and TSMC were major contributors to the release and validation of IPL 1.0.
A PDK is a comprehensive set of foundry-verified data files including schematic symbols, component descriptions, parameterized cells (PCells), and callbacks used in a complete analog and mixed signal design flow. In the past, each foundry had to create specialized PDKs for each and every EDA vendor. In contrast, using IPL 1.0, PDK development teams need to only develop a single PDK for each process node, reducing development costs, shortening delivery schedules and providing designers earlier access to new advanced process technologies across multiple tools.
Synopsys was the lead developer of the sample 90nm reference iPDK and reference design included in IPL 1.0. This kit was validated in multiple custom design flows and tools by IPL Alliance members. The validation process covered a comprehensive set of tests including schematic capture, circuit simulation, layout, physical verification and extraction.
"As the first foundry member of the IPL Alliance, TSMC has collaborated from very early stages with several IPL Alliance members to specify, develop, validate, and deliver the first foundry-specific 65nm iPDK that is interoperable between several custom EDA platforms," said Tom Quan, deputy director of design methodology and service marketing at TSMC.
"TSMC's commitment and leadership in fostering collaboration among the IPL Alliance members played a vital role in achieving this significant IPL 1.0 release milestone. With the open and interoperable iPDK format, we expect to realize substantial cost savings in the development and support of TSMC iPDKs, while delivering greater choice and advanced design features to our end customers."
IPL 1.0 reference kit is available for immediate, free download under the open source licensing agreement at IPL Alliance web site.
This release is a major accomplishment achieved through the collaboration of IPL Alliance member companies. Semiconductor foundries and integrated device manufacturers (IDMs) can use this standard to build a single iPDK that works with multiple OpenAccess-based custom design tools, reducing development costs and the need to support vendor-specific PDKs.
Electronic design automation (EDA) vendors can use this standard to validate that their tools work with the iPDKs delivered by the foundries and IDMs. IPL 1.0 reference kit includes an iPDK developer's guide, a sample 90nm reference iPDK, a reference design and a user guide. Ciranova, SpringSoft, Synopsys and TSMC were major contributors to the release and validation of IPL 1.0.
A PDK is a comprehensive set of foundry-verified data files including schematic symbols, component descriptions, parameterized cells (PCells), and callbacks used in a complete analog and mixed signal design flow. In the past, each foundry had to create specialized PDKs for each and every EDA vendor. In contrast, using IPL 1.0, PDK development teams need to only develop a single PDK for each process node, reducing development costs, shortening delivery schedules and providing designers earlier access to new advanced process technologies across multiple tools.
Synopsys was the lead developer of the sample 90nm reference iPDK and reference design included in IPL 1.0. This kit was validated in multiple custom design flows and tools by IPL Alliance members. The validation process covered a comprehensive set of tests including schematic capture, circuit simulation, layout, physical verification and extraction.
"As the first foundry member of the IPL Alliance, TSMC has collaborated from very early stages with several IPL Alliance members to specify, develop, validate, and deliver the first foundry-specific 65nm iPDK that is interoperable between several custom EDA platforms," said Tom Quan, deputy director of design methodology and service marketing at TSMC.
"TSMC's commitment and leadership in fostering collaboration among the IPL Alliance members played a vital role in achieving this significant IPL 1.0 release milestone. With the open and interoperable iPDK format, we expect to realize substantial cost savings in the development and support of TSMC iPDKs, while delivering greater choice and advanced design features to our end customers."
IPL 1.0 reference kit is available for immediate, free download under the open source licensing agreement at IPL Alliance web site.
LTE chipset makers position for long term endeavor
SCOTTSDALE, USA: LTE is a truly evolutionary communications platform and will become the dominant 4G technology. However, LTE deployment will be gradual and protracted.
Nevertheless, chipset manufacturers, such as Broadcom, Infineon and Qualcomm, have established LTE product development plans, according to market research firm In-Stat. Further, market entrants, such as Altair Semiconductor, Beceem, BitWave, Comsys, Sequans and Wavesat, are hoping the LTE shift opens new opportunity.
“Leading 3G baseband chipset providers will not necessarily keep their leadership in LTE,” says Allen Nogee, In-Stat analyst. “The changes in platforms and technologies are disruptive enough to create major competitive shifts.”
Recent research by In-Stat found the following:
* By 2013, the total value of global end-use device silicon will exceed US$2 billion, but still be early in the growth cycle.
* Much of the success in silicon will be made in low-noise amplifiers, power amplification, analog-to-digital conversion, SAW filters, and battery-life.
* The “LTE-dedicated” silicon BOM for mobile handsets will be slightly over $125 in 2011 and decline by nearly 30 percent by 2013.
Nevertheless, chipset manufacturers, such as Broadcom, Infineon and Qualcomm, have established LTE product development plans, according to market research firm In-Stat. Further, market entrants, such as Altair Semiconductor, Beceem, BitWave, Comsys, Sequans and Wavesat, are hoping the LTE shift opens new opportunity.
“Leading 3G baseband chipset providers will not necessarily keep their leadership in LTE,” says Allen Nogee, In-Stat analyst. “The changes in platforms and technologies are disruptive enough to create major competitive shifts.”
Recent research by In-Stat found the following:
* By 2013, the total value of global end-use device silicon will exceed US$2 billion, but still be early in the growth cycle.
* Much of the success in silicon will be made in low-noise amplifiers, power amplification, analog-to-digital conversion, SAW filters, and battery-life.
* The “LTE-dedicated” silicon BOM for mobile handsets will be slightly over $125 in 2011 and decline by nearly 30 percent by 2013.
ChipMOS enters into definite agreements with SPIL
HSINCHU, TAIWAN: ChipMOS Technologies (Bermuda) Ltd has entered into a share purchase agreement with Siliconware Precision Industries Co. Ltd (SPIL) to sell to SPIL Company's holding of 133,000,000 common shares of its wholly owned subsidiary, ChipMOS Technologies Inc. (ChipMOS Taiwan), with a consideration of approximately NT$1.63 billion (approximately $51 million).
The purchased shares represent approximately 15.8 percent of the total number of ChipMOS Taiwan's outstanding shares. Under the terms and conditions of the Share Purchase Agreement, SPIL will pay the purchase price in four installments to the Company with the final installment scheduled to be paid on or about March 31, 2011.
SPIL will not effect the transfer of the purchased shares until Company has fulfilled certain closing conditions of the Share Purchase Agreement. The Company plans to use the net proceeds from the Share Purchase Agreement as repayment to sums owed under the US$74.5 million syndication loan agreement executed in July 2008.
The Company also announced that ChipMOS Taiwan has entered into an equipment purchase agreement with SPIL to purchase SPIL's DRAM test and LCD driver assembly and test operation lines with purchase price of approximately NT$1.63 billion (approximately $51 million).
Under the terms and conditions of the Equipment Purchase Agreement, ChipMOS Taiwan will pay the purchase price in four installments to SPIL with the final installment scheduled to be paid on or before March 31, 2011. All the purchased equipments will be shipped to and installed at ChipMOS' plant by no later than July 31, 2010.
Under the terms and conditions of the Equipment Purchase Agreement, SPIL commits not to purchase DRAM testers and LCD driver assembly and test equipments within five years from the effective date of the Equipment Purchase Agreement.
The purchased shares represent approximately 15.8 percent of the total number of ChipMOS Taiwan's outstanding shares. Under the terms and conditions of the Share Purchase Agreement, SPIL will pay the purchase price in four installments to the Company with the final installment scheduled to be paid on or about March 31, 2011.
SPIL will not effect the transfer of the purchased shares until Company has fulfilled certain closing conditions of the Share Purchase Agreement. The Company plans to use the net proceeds from the Share Purchase Agreement as repayment to sums owed under the US$74.5 million syndication loan agreement executed in July 2008.
The Company also announced that ChipMOS Taiwan has entered into an equipment purchase agreement with SPIL to purchase SPIL's DRAM test and LCD driver assembly and test operation lines with purchase price of approximately NT$1.63 billion (approximately $51 million).
Under the terms and conditions of the Equipment Purchase Agreement, ChipMOS Taiwan will pay the purchase price in four installments to SPIL with the final installment scheduled to be paid on or before March 31, 2011. All the purchased equipments will be shipped to and installed at ChipMOS' plant by no later than July 31, 2010.
Under the terms and conditions of the Equipment Purchase Agreement, SPIL commits not to purchase DRAM testers and LCD driver assembly and test equipments within five years from the effective date of the Equipment Purchase Agreement.
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