BANGALORE, INDIA: LSI Corp. has reported results for its fourth quarter and full year ended December 31, 2009.
Fourth quarter 2009 revenues were $638 million, a 5percent increase year-over-year compared to $610 million reported in the fourth quarter of 2008, and up 10 percent sequentially compared to $578 million reported in the third quarter of 2009.
Fourth quarter 2009 GAAP net income was $65 million or 10 cents per diluted share, compared to fourth quarter 2008 GAAP net loss of $606 million or 94 cents per share. Fourth quarter GAAP results included a $31 million tax benefit, or 5 cents per diluted share, primarily related to the settlement of a multi-year foreign tax audit.
Fourth quarter 2009 GAAP results compare to third quarter 2009 GAAP net income of $52 million or 8 cents per diluted share. Fourth quarter 2009 GAAP net income included a net charge of $59 million from special items, consisting primarily of $43 million of amortization of acquisition-related items, $14 million of stock-based compensation expense, and $2 million in net restructuring and other items.
Fourth quarter 2009 non-GAAP net income was $124 million or 18 cents per diluted share, compared to fourth quarter 2008 non-GAAP net income of $41 million or 6 cents per diluted share. Third quarter 2009 non-GAAP net income was $119 million or 18 cents per diluted share.
Cash and short-term investments totaled approximately $962 million at quarter end.
“With increasing signs in the fourth quarter that an early-stage recovery of enterprise IT spending is now underway, LSI achieved double-digit sequential revenue growth, with revenues coming in at the high end of our guidance range,“ said Abhi Talwalkar, LSI president and CEO. “With more than 80 percent of our revenues tied to enterprise technology spending, we are well positioned to benefit as this recovery gains strength going forward.”
Thursday, January 28, 2010
iPad stimulates demand of NAND Flash
TAIPEI, TAIWAN: According to DRAMeXchange, regarding the impact of iPad on the NAND flash industry, Apple currently controls over 20 percent of the NAND flash demand according to our estimation. Therefore, whenever Apple launches new products, the popularity of the new device may bring forth a capacity crunch to the NAND flash market.
We believe that the iPad may sell 1.5million units in the first half of 2010, a total of 9million—10 million for 2010. Consequently, the iPad will consume approximately 2 percent of the total NAND flash demand in 2010.
We also expect that the iPad demand created by Apple will exacerbate the shortage situation in 2H10, magnify NAND flash sufficiency ratio from -2.6 percent to -5.7 percent for 2010 and from -5.4 percent to -9.8 percent for 2H10.
The device is a half-inch thick and weighs about 1.5 pounds with a 9.7-inch capacitive touchscreen IPS LCD display. The heart of iPad is a 1GHz Apple-built A4 processor with 10 hours of battery life and 30 days of standby time.
Basically, we view the new iPad as an extension of the iPhone/iPod touch product line. iPad essentially works as the way as a iPod touch does, purchasing and listening to music on iTunes, playing games downloaded from Apps stores, surfing the web in the palm of your hand.
However, what is intriguing about the new device is the differentiation of the three product lines. If the iPhone is targeted on mobile phone users and the iPod touch is targeted on gamers and iPod users, the iPad is obviously design for e-book reading and light computing.
Apple has struck deals with five major book partners in the US to bring contents to the iBooks, Apple's new e-book reading application available on iPhone/iPod touch/iPad. Book contents are not limited to black and white text e-books like Amazon kindle; everything is displayed in sharp, rich, color.
Moreover, we speculate that in future versions of iBooks, publishers may provide dynamic and interactive e-books, author’s video interviews and even social networking applications. Apple reinvented the portable music play industry with iPod, reinvented the mobile phone industry with iPhone, and may as well reinvent the publishing industry with iPad, says DRAMeXchange.
As for the pricing of the new tablet computer, the Wi-Fi only models will come in 16GB for $499, 32GB for $599 and 64GB for $699. The 3G models runs on AT&T with new data plans – 250MB for $14.99 and an unlimited plan for $29.99 a month contract-free – and will cost an extra $130 per model. The Wi-Fi only models will be available beginning in April and the 3G model in May. Plans for international release will be announced later this summer.
We believe that the iPad may sell 1.5million units in the first half of 2010, a total of 9million—10 million for 2010. Consequently, the iPad will consume approximately 2 percent of the total NAND flash demand in 2010. We also expect that the iPad demand created by Apple will exacerbate the shortage situation in 2H10, magnify NAND flash sufficiency ratio from -2.6 percent to -5.7 percent for 2010 and from -5.4 percent to -9.8 percent for 2H10.
The device is a half-inch thick and weighs about 1.5 pounds with a 9.7-inch capacitive touchscreen IPS LCD display. The heart of iPad is a 1GHz Apple-built A4 processor with 10 hours of battery life and 30 days of standby time.
Basically, we view the new iPad as an extension of the iPhone/iPod touch product line. iPad essentially works as the way as a iPod touch does, purchasing and listening to music on iTunes, playing games downloaded from Apps stores, surfing the web in the palm of your hand.
However, what is intriguing about the new device is the differentiation of the three product lines. If the iPhone is targeted on mobile phone users and the iPod touch is targeted on gamers and iPod users, the iPad is obviously design for e-book reading and light computing.
Apple has struck deals with five major book partners in the US to bring contents to the iBooks, Apple's new e-book reading application available on iPhone/iPod touch/iPad. Book contents are not limited to black and white text e-books like Amazon kindle; everything is displayed in sharp, rich, color.
Moreover, we speculate that in future versions of iBooks, publishers may provide dynamic and interactive e-books, author’s video interviews and even social networking applications. Apple reinvented the portable music play industry with iPod, reinvented the mobile phone industry with iPhone, and may as well reinvent the publishing industry with iPad, says DRAMeXchange.
As for the pricing of the new tablet computer, the Wi-Fi only models will come in 16GB for $499, 32GB for $599 and 64GB for $699. The 3G models runs on AT&T with new data plans – 250MB for $14.99 and an unlimited plan for $29.99 a month contract-free – and will cost an extra $130 per model. The Wi-Fi only models will be available beginning in April and the 3G model in May. Plans for international release will be announced later this summer.
Global PC MPU unit shipments rise 31.3pc YoY in Q4
SAN MATEO, USA: Worldwide PC microprocessor shipments in the fourth calendar quarter of 2009 (4Q09) rose modestly, compared to 3Q09, but still achieved all-time record levels for a single quarter, according to IDC's latest PC processor study. Notably, when compared to 4Q08, shipments in 4Q09 rose 31.3 percent. For the full year 2009, total PC processor unit shipments grew 2.5 percent, while revenue declined 7.1 percent to $28.6 billion.
"Compared to 3Q09, the modest rise in shipments in 4Q09 indicates that the market is returning to normal seasonal patterns," said Shane Rau, director of Semiconductors: Personal Computing research at IDC. "Compared to 4Q08, the huge rise in shipments indicates that the market has put the recession behind it. Both comparisons indicate that the PC industry anticipates improvement in PC end demand in 2010."
Looking at market performance by PC form factor, both mobile PC processors and PC server processors grew well. Mobile PC processors, which include Intel’s Atom processors for mininotebooks (also known as netbooks), increased 11.7 percent in 4Q09 compared to 3Q09. x86 server processors grew 14.1 percent quarter over quarter. Desktop processors grew 4.8 percent quarter over quarter.
On the client side—mobile and desktop—IDC notes that mainstream and performance processors rose modestly as a percentage of the total mix compared to value processors, which caused the overall market average selling price of processors to rise 6.7 percent quarter over quarter.
"The sequential rise in mainstream and high-end client processors points to the new products, like Core i5 and Athlon II, that Intel and AMD were shipping into the market for the holiday buying season in the fourth quarter," said Rau.
"What's interesting there is that consumers were there to buy systems based on them and that OEMs were investing in them for future builds. At the same time, the sequential rise in server processors indicates that server OEMs are starting to see corporations come off the sidelines."
4Q09 and 2009 Vendor Highlights
In 4Q09, Intel earned 80.5 percent unit market share, a loss of 0.6 percent, while AMD earned 19.4% percent, a gain of 0.7 percent, and VIA Technologies earned 0.2 percent.
In the full year 2009, Intel earned 79.7 percent unit market share, a loss of 0.7 percent, AMD earned 20.1 percent, a gain of 0.8 percent, and VIA Technologies earned 0.3 percent.
In 4Q09 by form factor, Intel earned 87.3 percent share in the mobile PC processor segment, a loss of 0.7 percent, AMD finished with 12.7 percent, a gain of 0.8 percent, and VIA earned 0.1 percent.
In the PC server/workstation processor segment, Intel finished with 89.8 percent market share, a loss of 0.6 percent and AMD earned 10.2 percent, a gain of 0.6 percent. In the desktop PC processor segment, Intel earned 71.1 percent, a loss of 1.1 percent, and AMD earned 28.6 percent, a gain of 1.2 percent.
In 2009 by form factor, Intel earned 86.8 percent share in the mobile PC processor segment, a loss of 0.3 percent, AMD finished with 12.8 percent, a gain of 0.8 percent, and VIA earned 0.3 percent, a loss of -0.5 percent.
In the PC server/workstation processor segment, Intel finished with 89.9 percent market share, a gain of 3.2 percent and AMD earned 10.1 percent, a loss of 3.2 percent. In the desktop PC processor segment, Intel earned 71 percent, a loss of 2.5 percent, AMD earned 28.8 percent, a gain of 2.3 percent, and VIA earned 0.3 percent, a gain of 0.1 percent.
Market outlook
IDC has raised its forecast for growth in PC processor unit shipments to 15.1 percent compared to 2009.
"We're looking forward to the end of the second quarter and the second half of the year as corporations qualify new client and server platforms and open up their IT budgets further. Combined with healthy consumer spending, the resumption of corporation spending will lead to a healthy 2010," said Rau.
"Compared to 3Q09, the modest rise in shipments in 4Q09 indicates that the market is returning to normal seasonal patterns," said Shane Rau, director of Semiconductors: Personal Computing research at IDC. "Compared to 4Q08, the huge rise in shipments indicates that the market has put the recession behind it. Both comparisons indicate that the PC industry anticipates improvement in PC end demand in 2010."
Looking at market performance by PC form factor, both mobile PC processors and PC server processors grew well. Mobile PC processors, which include Intel’s Atom processors for mininotebooks (also known as netbooks), increased 11.7 percent in 4Q09 compared to 3Q09. x86 server processors grew 14.1 percent quarter over quarter. Desktop processors grew 4.8 percent quarter over quarter.
On the client side—mobile and desktop—IDC notes that mainstream and performance processors rose modestly as a percentage of the total mix compared to value processors, which caused the overall market average selling price of processors to rise 6.7 percent quarter over quarter.
"The sequential rise in mainstream and high-end client processors points to the new products, like Core i5 and Athlon II, that Intel and AMD were shipping into the market for the holiday buying season in the fourth quarter," said Rau.
"What's interesting there is that consumers were there to buy systems based on them and that OEMs were investing in them for future builds. At the same time, the sequential rise in server processors indicates that server OEMs are starting to see corporations come off the sidelines."
4Q09 and 2009 Vendor Highlights
In 4Q09, Intel earned 80.5 percent unit market share, a loss of 0.6 percent, while AMD earned 19.4% percent, a gain of 0.7 percent, and VIA Technologies earned 0.2 percent.
In the full year 2009, Intel earned 79.7 percent unit market share, a loss of 0.7 percent, AMD earned 20.1 percent, a gain of 0.8 percent, and VIA Technologies earned 0.3 percent.
In 4Q09 by form factor, Intel earned 87.3 percent share in the mobile PC processor segment, a loss of 0.7 percent, AMD finished with 12.7 percent, a gain of 0.8 percent, and VIA earned 0.1 percent.
In the PC server/workstation processor segment, Intel finished with 89.8 percent market share, a loss of 0.6 percent and AMD earned 10.2 percent, a gain of 0.6 percent. In the desktop PC processor segment, Intel earned 71.1 percent, a loss of 1.1 percent, and AMD earned 28.6 percent, a gain of 1.2 percent.
In 2009 by form factor, Intel earned 86.8 percent share in the mobile PC processor segment, a loss of 0.3 percent, AMD finished with 12.8 percent, a gain of 0.8 percent, and VIA earned 0.3 percent, a loss of -0.5 percent.
In the PC server/workstation processor segment, Intel finished with 89.9 percent market share, a gain of 3.2 percent and AMD earned 10.1 percent, a loss of 3.2 percent. In the desktop PC processor segment, Intel earned 71 percent, a loss of 2.5 percent, AMD earned 28.8 percent, a gain of 2.3 percent, and VIA earned 0.3 percent, a gain of 0.1 percent.
Market outlook
IDC has raised its forecast for growth in PC processor unit shipments to 15.1 percent compared to 2009.
"We're looking forward to the end of the second quarter and the second half of the year as corporations qualify new client and server platforms and open up their IT budgets further. Combined with healthy consumer spending, the resumption of corporation spending will lead to a healthy 2010," said Rau.
Opnext delivers world's first ultra-high speed SMT mux IC for 100G coherent transponders
FREMONT, USA: Opnext Inc., a global leader in state-of-the-art laser technology and high speed optical communications, has developed the world’s first ultra-high speed Surface Mount Technology (SMT) multiplexer Integrated Circuit (IC) for 100Gbps applications.
The SiGe (Silicon Germanium) 0.13µm process technology chip was designed in-house to be used inside Opnext’s leading edge coherent 40Gbps and 100Gbps transponder modules and subsystems.
The 128Gbps multiplexer IC transmits the data in 32Gbps lanes suitable for transmission using the DP-QPSK modulation scheme, as documented in the OIF 100G Ultra Long Haul DWDM Framework, for 100GbE and OTU4 transmission in the Wide Area Network (WAN). The multiplexer IC employs Ball Grid Array (BGA) technology to allow standard SMT manufacturing processes. This enables higher density transponder designs with ICs mounted directly onto the PCBs.
“One of the major challenges of increasing 40G production was the manufacturability, quality and performance consistency of the hardware,” said Roberto Marcoccia, vice president of R&D for Opnext’s subsystems business unit. “This SMT IC eliminates the radio frequency (RF) connectors and coaxial cabling, a major source of these volume manufacturing issues.”
Opnext continues to employ selective vertical integration on components like this new SMT IC with the goal of delivering the lowest cost and highest performance 100Gbps OIF MSA compliant solution to its OEM partners.
The SiGe (Silicon Germanium) 0.13µm process technology chip was designed in-house to be used inside Opnext’s leading edge coherent 40Gbps and 100Gbps transponder modules and subsystems.
The 128Gbps multiplexer IC transmits the data in 32Gbps lanes suitable for transmission using the DP-QPSK modulation scheme, as documented in the OIF 100G Ultra Long Haul DWDM Framework, for 100GbE and OTU4 transmission in the Wide Area Network (WAN). The multiplexer IC employs Ball Grid Array (BGA) technology to allow standard SMT manufacturing processes. This enables higher density transponder designs with ICs mounted directly onto the PCBs.
“One of the major challenges of increasing 40G production was the manufacturability, quality and performance consistency of the hardware,” said Roberto Marcoccia, vice president of R&D for Opnext’s subsystems business unit. “This SMT IC eliminates the radio frequency (RF) connectors and coaxial cabling, a major source of these volume manufacturing issues.”
Opnext continues to employ selective vertical integration on components like this new SMT IC with the goal of delivering the lowest cost and highest performance 100Gbps OIF MSA compliant solution to its OEM partners.
Wednesday, January 27, 2010
Cypress offers TrueTouch touchscreen driver for Android phones; joins Open Handset Alliance
SAN JOSE, USA: Cypress Semiconductor Corp. has introduced a touchscreen device driver supporting the Android mobile handset platform, and announced that it has joined the Open Handset Alliance.
The I2C interface driver for Cypress’s flexible, robust TrueTouch touchscreen solution gives manufacturers of handsets based on Android or other Linux operating systems an easy and quick path to delivering high-performance touchscreen interfaces. The driver supports single-touch and multi-touch signaling and is backwards compatible for applications written in earlier versions of Android.
The Open Handset Alliance is a group of more than 60 technology and mobile companies working to offer consumers a richer, less expensive, and better mobile experience.
The Open Handset Alliance developed Android, the first complete, open and free mobile platform. Android features an operating system, middleware and key mobile applications. As a member of the Open Handset Alliance, Cypress will work with other members to contribute to continued development and success of the Android platform for mobile devices.
“The Android platform is rapidly gaining popularity, and our new driver has already enabled customers to rapidly integrate TrueTouch touchscreen controllers into Android-based phones coming to market,” said Dhwani Vyas, vice president of the User Interface Business Unit at Cypress. “Cypress is pleased to bring the unmatched design flexibility, accuracy and performance of the TrueTouch solution to members of the Open Handset Alliance for development of full-featured Android handsets.”
Cypress’s TrueTouch family includes single-touch, multi-touch gesture and multi-touch all-point offerings. Cypress was the first company to introduce multi-touch all-point functionality, which can track an unlimited number of touches. This capability enables designers to create new usage models for products such as mobile handsets, portable media players (PMPs), GPS systems and other products, and has been in mass production since 2008.
TrueTouch is the industry’s most flexible touchscreen architecture, which allows designers to implement differentiated features and make last-minute design iterations without board changes.
Cypress recently announced its next-generation high performance TMA300 multi-touch all-point family. This controller provides best-in-class scan times for true multi-finger touch and superior signal-to-noise ratio for the most demanding touchscreen applications. Additional information about the TrueTouch solution is available at www.cypress.com/go/TrueTouch.
The flexible TrueTouch solution allows customers to rapidly develop leading-edge solutions without having to buy turnkey modules. They have a choice of using touch sensors (glass or film) and LCDs from preferred partners, and can develop innovative mechanical designs ranging from flat to curved surfaces of varying thickness. In addition, TrueTouch devices offer Cypress’s legendary noise immunity with patented capacitive sensing technology that enables flawless operation in noisy RF and LCD environments.
The I2C interface driver for Cypress’s flexible, robust TrueTouch touchscreen solution gives manufacturers of handsets based on Android or other Linux operating systems an easy and quick path to delivering high-performance touchscreen interfaces. The driver supports single-touch and multi-touch signaling and is backwards compatible for applications written in earlier versions of Android.
The Open Handset Alliance is a group of more than 60 technology and mobile companies working to offer consumers a richer, less expensive, and better mobile experience.
The Open Handset Alliance developed Android, the first complete, open and free mobile platform. Android features an operating system, middleware and key mobile applications. As a member of the Open Handset Alliance, Cypress will work with other members to contribute to continued development and success of the Android platform for mobile devices.
“The Android platform is rapidly gaining popularity, and our new driver has already enabled customers to rapidly integrate TrueTouch touchscreen controllers into Android-based phones coming to market,” said Dhwani Vyas, vice president of the User Interface Business Unit at Cypress. “Cypress is pleased to bring the unmatched design flexibility, accuracy and performance of the TrueTouch solution to members of the Open Handset Alliance for development of full-featured Android handsets.”
Cypress’s TrueTouch family includes single-touch, multi-touch gesture and multi-touch all-point offerings. Cypress was the first company to introduce multi-touch all-point functionality, which can track an unlimited number of touches. This capability enables designers to create new usage models for products such as mobile handsets, portable media players (PMPs), GPS systems and other products, and has been in mass production since 2008.
TrueTouch is the industry’s most flexible touchscreen architecture, which allows designers to implement differentiated features and make last-minute design iterations without board changes.
Cypress recently announced its next-generation high performance TMA300 multi-touch all-point family. This controller provides best-in-class scan times for true multi-finger touch and superior signal-to-noise ratio for the most demanding touchscreen applications. Additional information about the TrueTouch solution is available at www.cypress.com/go/TrueTouch.
The flexible TrueTouch solution allows customers to rapidly develop leading-edge solutions without having to buy turnkey modules. They have a choice of using touch sensors (glass or film) and LCDs from preferred partners, and can develop innovative mechanical designs ranging from flat to curved surfaces of varying thickness. In addition, TrueTouch devices offer Cypress’s legendary noise immunity with patented capacitive sensing technology that enables flawless operation in noisy RF and LCD environments.
ST reports 2009 Q4 and full year financial results
PARIS, FRANCE: STMicroelectronics reported financial results for the 2009 fourth quarter and full year ended December 31, 2009.
President and CEO Carlo Bozotti commented: “ST’s fourth quarter financial results reflect a positive finish to a very difficult year for ST, the semiconductor industry and the global economy.
“Our fourth quarter net revenues increased 13.6 percent sequentially, above our outlook range and our gross margin came in at 37 percent, above the midpoint of our outlook range. Excluding restructuring charges, ST returned to an operating income of $90 million for the quarter.
“The Company’s stronger than forecasted quarterly sequential revenue performance was thanks to growth in all regions and market segments, with all segments, except telecom, posting double-digit growth.
“Despite the challenging economic environment, ST made significant progress over the course of 2009 by successfully delivering on key actions announced earlier in the year. First, we protected and then enhanced our cash position, improving our net financial position by $965 million to end the year with a net cash position of $420 million. Second, we made excellent progress in lowering our cost base with a $1 billion savings plan to be completed by about mid-2010. As a result, we improved our financial performance having generated, as anticipated, some points of operating margin and net operating cash flow equal to 8.6% of sales despite an unfavorable currency environment.
“2009 has been a year of severe losses for ST but we are encouraged by the progress we made throughout the year. 2010 will be a year of great opportunities for ST. Our efforts to strengthen our product portfolio will allow us to grow organically and to participate in new markets and the completion of our major restructuring program will continue to substantially improve our cost structure and competitiveness.”
Q1 2010 business outlook
Bozotti stated: “We started the first quarter with a solid backlog and we are working to serve our customers’ demand. In-line with historical trends, we expect to register a sequential net revenue decrease between about -7 percent and -13 percent, which equates to a positive 35 percent to 45 percent when compared to the year-over-year period. However, we expect a better than historical evolution in our gross margin to about 37.5 percent, plus or minus 1 percentage point thanks to better manufacturing loading and efficiency and an improved product mix.
“Looking forward, we believe ST is well positioned to benefit from the industry upturn because of the important work we have done in product and technology innovation. We plan to deliver the benefits of our innovation to our customers and we also expect ST-Ericsson to execute on its plan to transition to the new portfolio strategy they have devised for their next generation offering.
“ST’s recent design-wins for digital consumer platforms, ASICs, and automotive products and our many promising offerings including 32-bit microcontrollers, MEMS, with our new families of gyroscopes and active microphones, and low-power sensors for healthcare and building automation applications support our efforts to continuously improve our product portfolio.
“In summary, we are excited about the many opportunities ahead of us. While we continue to make solid progress on reducing our cost structure, our innovative product portfolio is positioning us well to achieve sustainable profitability and cash flow generation.”
President and CEO Carlo Bozotti commented: “ST’s fourth quarter financial results reflect a positive finish to a very difficult year for ST, the semiconductor industry and the global economy.
“Our fourth quarter net revenues increased 13.6 percent sequentially, above our outlook range and our gross margin came in at 37 percent, above the midpoint of our outlook range. Excluding restructuring charges, ST returned to an operating income of $90 million for the quarter.
“The Company’s stronger than forecasted quarterly sequential revenue performance was thanks to growth in all regions and market segments, with all segments, except telecom, posting double-digit growth.
“Despite the challenging economic environment, ST made significant progress over the course of 2009 by successfully delivering on key actions announced earlier in the year. First, we protected and then enhanced our cash position, improving our net financial position by $965 million to end the year with a net cash position of $420 million. Second, we made excellent progress in lowering our cost base with a $1 billion savings plan to be completed by about mid-2010. As a result, we improved our financial performance having generated, as anticipated, some points of operating margin and net operating cash flow equal to 8.6% of sales despite an unfavorable currency environment.
“2009 has been a year of severe losses for ST but we are encouraged by the progress we made throughout the year. 2010 will be a year of great opportunities for ST. Our efforts to strengthen our product portfolio will allow us to grow organically and to participate in new markets and the completion of our major restructuring program will continue to substantially improve our cost structure and competitiveness.”
Q1 2010 business outlook
Bozotti stated: “We started the first quarter with a solid backlog and we are working to serve our customers’ demand. In-line with historical trends, we expect to register a sequential net revenue decrease between about -7 percent and -13 percent, which equates to a positive 35 percent to 45 percent when compared to the year-over-year period. However, we expect a better than historical evolution in our gross margin to about 37.5 percent, plus or minus 1 percentage point thanks to better manufacturing loading and efficiency and an improved product mix.
“Looking forward, we believe ST is well positioned to benefit from the industry upturn because of the important work we have done in product and technology innovation. We plan to deliver the benefits of our innovation to our customers and we also expect ST-Ericsson to execute on its plan to transition to the new portfolio strategy they have devised for their next generation offering.
“ST’s recent design-wins for digital consumer platforms, ASICs, and automotive products and our many promising offerings including 32-bit microcontrollers, MEMS, with our new families of gyroscopes and active microphones, and low-power sensors for healthcare and building automation applications support our efforts to continuously improve our product portfolio.
“In summary, we are excited about the many opportunities ahead of us. While we continue to make solid progress on reducing our cost structure, our innovative product portfolio is positioning us well to achieve sustainable profitability and cash flow generation.”
TI intros industry’s first 12-V dual-channel synchronous buck converter with integrated FETs
BANGALORE, INDIA: Texas Instruments Inc. (TI) has introduced its first dual-output fully synchronous SWIFT power management IC. The TPS54290 1.5-A/2.5-A converter simplifies power design in consumer electronics with a 12-V power supply, such as a set top box or digital TV.
The SWIFT device operates from a 4.5-V to 18-V input supply voltage, and supports output voltages as low as 0.8 V with a 90 percent power efficiency rating. The TPS54290 is set at a fixed frequency of 300 kHz. Two other family members, the TPS54291 and TPS54292, provide switching frequencies of 600 kHz and 1.2 MHz, further reducing the DC/DC solution size.
Key features and benefits of TPS54290:
* Dual output synchronous buck converter with four integrated MOSFETs provides fully synchronous conversion with 90 percent efficiency, while using 35 percent less board space compared to non-synchronous conversion solutions.
* Current mode control simplifies external compensation, giving the designer greater flexibility when choosing different types of output capacitors.
* 180º out-of-phase operation minimizes ripple current through the input capacitor.
Input capacitance is reduced by up to 50 percent compared to non-synchronous converters, which helps lessen electromagnetic interference.
The SWIFT device operates from a 4.5-V to 18-V input supply voltage, and supports output voltages as low as 0.8 V with a 90 percent power efficiency rating. The TPS54290 is set at a fixed frequency of 300 kHz. Two other family members, the TPS54291 and TPS54292, provide switching frequencies of 600 kHz and 1.2 MHz, further reducing the DC/DC solution size. Key features and benefits of TPS54290:
* Dual output synchronous buck converter with four integrated MOSFETs provides fully synchronous conversion with 90 percent efficiency, while using 35 percent less board space compared to non-synchronous conversion solutions.
* Current mode control simplifies external compensation, giving the designer greater flexibility when choosing different types of output capacitors.
* 180º out-of-phase operation minimizes ripple current through the input capacitor.
Input capacitance is reduced by up to 50 percent compared to non-synchronous converters, which helps lessen electromagnetic interference.
NXP MIFARE Plus scores high in independent security reviews
SINGAPORE: NXP Semiconductors announced that its MIFARE Plus contactless smart card CPU IC (MF1PLUSx0y1) has been awarded Common Criteria EAL 4+ certification by the German Federal Office for Information Security (Ref.: BSI-DSZ-CC-0586-2009).
In addition, MIFARE Plus has proven successful in independent security reviews conducted by leading cryptography experts from the Ruhr-Universität in Germany and the Katholieke Universiteit Leuven in Belgium, which executed a thorough security and privacy assessment of the architecture of MIFARE Plus.
“NXP is striving to ensure that our products such as the MIFARE Plus microcontroller IC provide customers with the highest possible level of trust and privacy for secure transactions in contactless smart card applications,” said Henri Ardevol, general manager, Secure Transactions, NXP Semiconductors.
“We’re very pleased that the security features of MIFARE Plus have been independently validated by three different institutions following extensive testing. Since the release in mid 2009 we have worked with over 300 partner companies worldwide to adopt MIFARE Plus while the product is already being shipped in millions.”
MIFARE Plus technology features 128-bit Advanced Encryption Standard (AES) and supports migration from existing MIFARE ClassicTM implementations. The contactless microcontroller IC offers an upgrade path for system integrators and operators wishing to implement additional layers of security to their automatic fare collection, access management and micro-payment installations.
The independent third-party validation of MIFARE Plus offers NXP’s customers a high degree of certainty that the technology is providing advanced security. The Common Criteria certification validates correct implementation of the promised security features, evaluates attack resistance and allows systems integrators to assess the security quality of similar products.
“For newly built contactless smart card installations we strongly recommend Common Criteria-certified products, preferably those based on AES encryption”, said Dipl.-Ing. Harald Kelter, security expert, Federal Office for Information Security in Germany.
Working with leading universities in the area of IT security and cryptography has enabled NXP to tap into the latest cryptographic research and validate the technologies’ security features.
“Despite extensive and careful analysis, we have not identified any security weakness with practical relevance,” said Prof. Dr.-Ing. Chris tof Paar of the Ruhr-Universität Bochum. “We consider the MIFARE Plus architecture to be secure if all security mechanisms are activated as recommended in the MIFARE Plus documentation. The CC evaluation of the card further supports our belief that NXP has succeeded in designing a very secure contactless authentication and storage system.”
“Based on our study, we believe that the MIFARE Plus architecture is a solid design, which is based on a detailed analysis of the requirements including security, privacy and feasibility“, said Prof. Dr. Ir. Bart Preneel of the Katholieke Universiteit Leuven. “The solutions proposed take into account the severe constraints offered by the contactless environment. In spite of these constraints, the MIFARE Plus architecture allows to deploy applications in areas such as access control and transportation that offer a level of security and privacy that is state of the art.”
Security, performance, privacy and ease of use are at the heart of MIFARE Plus. It is – next to MIFARE DESFireTM EV1 – the only contactless smart card technology to offer strong AES encryption for authentication, integrity and confidentiality.
Furthermore, MIFARE Plus chips comprise a number of additional privacy features which, when used optimally in the infrastructure, provide a system that prevents individuals from being identified and tracked by others. Finally, migration planning is made easier as MIFARE Plus supports the pre-issuance of new cards; co-existence of current and new cards; and software based infrastructure upgrades.
In addition, MIFARE Plus has proven successful in independent security reviews conducted by leading cryptography experts from the Ruhr-Universität in Germany and the Katholieke Universiteit Leuven in Belgium, which executed a thorough security and privacy assessment of the architecture of MIFARE Plus.
“NXP is striving to ensure that our products such as the MIFARE Plus microcontroller IC provide customers with the highest possible level of trust and privacy for secure transactions in contactless smart card applications,” said Henri Ardevol, general manager, Secure Transactions, NXP Semiconductors.
“We’re very pleased that the security features of MIFARE Plus have been independently validated by three different institutions following extensive testing. Since the release in mid 2009 we have worked with over 300 partner companies worldwide to adopt MIFARE Plus while the product is already being shipped in millions.”
MIFARE Plus technology features 128-bit Advanced Encryption Standard (AES) and supports migration from existing MIFARE ClassicTM implementations. The contactless microcontroller IC offers an upgrade path for system integrators and operators wishing to implement additional layers of security to their automatic fare collection, access management and micro-payment installations.
The independent third-party validation of MIFARE Plus offers NXP’s customers a high degree of certainty that the technology is providing advanced security. The Common Criteria certification validates correct implementation of the promised security features, evaluates attack resistance and allows systems integrators to assess the security quality of similar products.
“For newly built contactless smart card installations we strongly recommend Common Criteria-certified products, preferably those based on AES encryption”, said Dipl.-Ing. Harald Kelter, security expert, Federal Office for Information Security in Germany.
Working with leading universities in the area of IT security and cryptography has enabled NXP to tap into the latest cryptographic research and validate the technologies’ security features.
“Despite extensive and careful analysis, we have not identified any security weakness with practical relevance,” said Prof. Dr.-Ing. Chris tof Paar of the Ruhr-Universität Bochum. “We consider the MIFARE Plus architecture to be secure if all security mechanisms are activated as recommended in the MIFARE Plus documentation. The CC evaluation of the card further supports our belief that NXP has succeeded in designing a very secure contactless authentication and storage system.”
“Based on our study, we believe that the MIFARE Plus architecture is a solid design, which is based on a detailed analysis of the requirements including security, privacy and feasibility“, said Prof. Dr. Ir. Bart Preneel of the Katholieke Universiteit Leuven. “The solutions proposed take into account the severe constraints offered by the contactless environment. In spite of these constraints, the MIFARE Plus architecture allows to deploy applications in areas such as access control and transportation that offer a level of security and privacy that is state of the art.”
Security, performance, privacy and ease of use are at the heart of MIFARE Plus. It is – next to MIFARE DESFireTM EV1 – the only contactless smart card technology to offer strong AES encryption for authentication, integrity and confidentiality.
Furthermore, MIFARE Plus chips comprise a number of additional privacy features which, when used optimally in the infrastructure, provide a system that prevents individuals from being identified and tracked by others. Finally, migration planning is made easier as MIFARE Plus supports the pre-issuance of new cards; co-existence of current and new cards; and software based infrastructure upgrades.
2HJan. NAND Flash contract price roughly remains flat under market consolidation
TAIPEI, TAIWAN: 2HJan NAND Flash contract price roughly stays flat given the steady inventory replenishment demand for Chinese Lunar New Year seasons from electronics system and memory card customers, which roughly meets the expectation of NAND Flash related makers.
That is, most NAND Flash suppliers did not adjust the 2HJan. contract price for most products while only few suppliers slightly adjusted the price for some products.
Besides the stable inventory replenishment for Chinese Lunar New Year holidays to help stabilize the NAND Flash price trend in slow season, NAND Flash suppliers and buyers are watching & waiting for some electronics system makers expected to launch certain new NAND Flash killer-application products in the short term, which will help rally the market sentiment as well.
However, the positive stimulus effect in NAND Flash demand side still will depend on the new killer applications specification details as well as launch timetable and operation model arrangement released in the near future.
Market believes that the additional NAND Flash demand in NAND Flash market can help cushion the slow season effect and new incremental supply from the increasing output of new 3xnm process technology and 3-bit/cell MLC products in 1Q10.
Owing to the wait-and-see market sentiment, we expect NAND Flash market still to stay at consolidation in the short term. However, we expect NAND Flash price can be inspired to further boost if some electronics system customers can significantly restock for more NAND Flash chips used for some new high-capacity NAND Flash applications in 1Q10.
That is, most NAND Flash suppliers did not adjust the 2HJan. contract price for most products while only few suppliers slightly adjusted the price for some products. Besides the stable inventory replenishment for Chinese Lunar New Year holidays to help stabilize the NAND Flash price trend in slow season, NAND Flash suppliers and buyers are watching & waiting for some electronics system makers expected to launch certain new NAND Flash killer-application products in the short term, which will help rally the market sentiment as well.
However, the positive stimulus effect in NAND Flash demand side still will depend on the new killer applications specification details as well as launch timetable and operation model arrangement released in the near future.
Market believes that the additional NAND Flash demand in NAND Flash market can help cushion the slow season effect and new incremental supply from the increasing output of new 3xnm process technology and 3-bit/cell MLC products in 1Q10.
Owing to the wait-and-see market sentiment, we expect NAND Flash market still to stay at consolidation in the short term. However, we expect NAND Flash price can be inspired to further boost if some electronics system customers can significantly restock for more NAND Flash chips used for some new high-capacity NAND Flash applications in 1Q10.
Cash in on technology recovery at iSuppli’s European briefing
EL SEGUNDO, USA: The great downturn of 2009 was unique in the history of the technology industry. Because of this, the great rebound of 2010 is expected to be exceptional as well, with the next 12 months bringing conditions never before seen in the electronics supply chain.
To help the industry capitalize on the expected market recovery, iSuppli Corp. in April is hosting in Berlin a special three-day briefing, entitled: What's Next in the Renewed Economy—Impacts on the Electronics Value Chain.
“The downturn has a very different dynamic than anything that the electronics industry has seen before,” said Derek Lidow, chief executive officer of iSuppli. “Previous downturns were caused by too much capacity. This one was caused by a steep and sudden drop in demand. We’ve never had a demand-less downturn in electronics.
Even as conditions improve, the market remains in uncharted territory.”
The global macroeconomic recession of 2009 will continue to have dramatic implications for the electronics value chain in 2010. With revenues falling by as much as 50 percent in some electronics sectors and with entire markets undergoing fundamental changes, the renewed economy of 2010 and beyond requires all participants in the electronics value chain to review and adjust their business strategies.
iSuppli’s European briefing
The briefing will feature presentations from top iSuppli experts, as well as invited industry speakers from STMicroelectronics, Robert Bosch, Vodafone, BMW, Google, Infineon, Nokia, Samsung and other leading technology companies.
iSuppli analysts speaking at the briefing will include:
* Dale Ford, senior vice president, market intelligence services
* Jagdish Rebello, senior director and principal analyst, communications/LEDs/India
* Richard Robinson, principal analyst, automotive electronics
* Francis Sideco, principal analyst, wireless communications
* Steve Mather, principal analyst, wireless communications
* Richard Dixon, senior analyst, microelectromechanical systems
* Phil Magney, vice president, automotive
Featured sessions include:
* Semiconductor Synergies in the Renewed Economy
* Mobile Handsets = Ubiquitous Connectivity
* Displaying Growth for the Wireless and Automotive Markets
* The Taming of the Wild Wireless Semiconductor Market
* The New Human Interfaces – Touch Screens, OLED Displays, and Haptics
* Automotive Realities in the Renewed Economy
* Connectivity and Business Models in the Renewed Economy
* Making a Connection With the Digitally Connected Home
* Will the Automotive Semiconductor Market Ever Fully Recover from the 2009 Crash?
* Digital Content and Digital Connections
Day one of the briefing will focus on the semiconductor market, specifically the winners and losers in a renewed economy, those most aptly positioned in 2010 for the wireless market, the automotive IC market, MEMS technology and much more.
Day two will cover hardware devices, content, human machine interface, and connectivity—perfect for MNOs and infrastructure companies looking to keep up to date on what will pique the interest of consumers in 2010, as well as for companies interested in how information will be displayed on and interact with the latest platforms, including the automobile.
Day three will focus on the future and at what end point information reaches consumption. Sessions for this day will examine the battle for bandwidth; how e-book, netbooks and other applications are changing the way electronics companies do business; and where growth opportunities are to be found for the Googles and Yahoos of the world and for other portals, versus those for content companies such as Sony and Disney.
Prices for the European Briefing Series are as follows: 995 euros for the whole event; or 595 euros for the first day and a half, or for the second day and a half. Also, those registering for the event before February 25 can save 100 euros off their registration. Press registration is free.
Source: iSuppli
To help the industry capitalize on the expected market recovery, iSuppli Corp. in April is hosting in Berlin a special three-day briefing, entitled: What's Next in the Renewed Economy—Impacts on the Electronics Value Chain.
“The downturn has a very different dynamic than anything that the electronics industry has seen before,” said Derek Lidow, chief executive officer of iSuppli. “Previous downturns were caused by too much capacity. This one was caused by a steep and sudden drop in demand. We’ve never had a demand-less downturn in electronics.
Even as conditions improve, the market remains in uncharted territory.”
The global macroeconomic recession of 2009 will continue to have dramatic implications for the electronics value chain in 2010. With revenues falling by as much as 50 percent in some electronics sectors and with entire markets undergoing fundamental changes, the renewed economy of 2010 and beyond requires all participants in the electronics value chain to review and adjust their business strategies.
iSuppli’s European briefing
The briefing will feature presentations from top iSuppli experts, as well as invited industry speakers from STMicroelectronics, Robert Bosch, Vodafone, BMW, Google, Infineon, Nokia, Samsung and other leading technology companies.
iSuppli analysts speaking at the briefing will include:
* Dale Ford, senior vice president, market intelligence services
* Jagdish Rebello, senior director and principal analyst, communications/LEDs/India
* Richard Robinson, principal analyst, automotive electronics
* Francis Sideco, principal analyst, wireless communications
* Steve Mather, principal analyst, wireless communications
* Richard Dixon, senior analyst, microelectromechanical systems
* Phil Magney, vice president, automotive
Featured sessions include:
* Semiconductor Synergies in the Renewed Economy
* Mobile Handsets = Ubiquitous Connectivity
* Displaying Growth for the Wireless and Automotive Markets
* The Taming of the Wild Wireless Semiconductor Market
* The New Human Interfaces – Touch Screens, OLED Displays, and Haptics
* Automotive Realities in the Renewed Economy
* Connectivity and Business Models in the Renewed Economy
* Making a Connection With the Digitally Connected Home
* Will the Automotive Semiconductor Market Ever Fully Recover from the 2009 Crash?
* Digital Content and Digital Connections
Day one of the briefing will focus on the semiconductor market, specifically the winners and losers in a renewed economy, those most aptly positioned in 2010 for the wireless market, the automotive IC market, MEMS technology and much more.
Day two will cover hardware devices, content, human machine interface, and connectivity—perfect for MNOs and infrastructure companies looking to keep up to date on what will pique the interest of consumers in 2010, as well as for companies interested in how information will be displayed on and interact with the latest platforms, including the automobile.
Day three will focus on the future and at what end point information reaches consumption. Sessions for this day will examine the battle for bandwidth; how e-book, netbooks and other applications are changing the way electronics companies do business; and where growth opportunities are to be found for the Googles and Yahoos of the world and for other portals, versus those for content companies such as Sony and Disney.
Prices for the European Briefing Series are as follows: 995 euros for the whole event; or 595 euros for the first day and a half, or for the second day and a half. Also, those registering for the event before February 25 can save 100 euros off their registration. Press registration is free.
Source: iSuppli
Semico: Technology in the palm of your hand
USA: If, as is often said, information is power, then we are living in the power generation. Businesses and consumers are driven by a thirst for information in a second’s notice. The semiconductor industry is challenged to keep up with demand.
eSilicon is a company that has pioneered a new business model to help meet the needs of a complex and volatile infrastructure market. At the Semico Outlook conference on March 2, 2010, Jack Harding, President and CEO of eSilicon, will talk about what technology and business solutions will support our desire for “Technology in the Palm of Our Hand.” Infrastructure is key, but will it be an enabler or a gating factor, as consumers and businesses vie for more and more capabilities and bandwidth?
Other executives addressing this critical issue include:
* Bradley Howe, Vice President, Altera
* Young K. Sohn, President and CEO, Inphi
* Lisa Su, Senior Vice President, Freescale
The Semico Outlook Event: Technology in the Palm of Your Hand provides a unique opportunity to hear from executives from around the world, with decades of experience and knowledge, each sharing their insights and vision for continued semiconductor market growth.
eSilicon is a company that has pioneered a new business model to help meet the needs of a complex and volatile infrastructure market. At the Semico Outlook conference on March 2, 2010, Jack Harding, President and CEO of eSilicon, will talk about what technology and business solutions will support our desire for “Technology in the Palm of Our Hand.” Infrastructure is key, but will it be an enabler or a gating factor, as consumers and businesses vie for more and more capabilities and bandwidth?
Other executives addressing this critical issue include:
* Bradley Howe, Vice President, Altera
* Young K. Sohn, President and CEO, Inphi
* Lisa Su, Senior Vice President, Freescale
The Semico Outlook Event: Technology in the Palm of Your Hand provides a unique opportunity to hear from executives from around the world, with decades of experience and knowledge, each sharing their insights and vision for continued semiconductor market growth.
Microsemi, MagnaChip to develop advanced mixed-signal process technology
IRVINE, USA: Microsemi Corp., a leading manufacturer of high performance analog/mixed signal integrated circuits and high reliability semiconductors, has partnered with specialty foundry provider MagnaChip Semiconductor LLC to develop advanced mixed-signal process technology that is optimized for products in Microsemi's key commercial growth markets.
The new process is electrically compatible with MagnaChip's own 0.35-micron baseline process that is already used by Microsemi to manufacture current products.
Microsemi and MagnaChip have completed a 24-month joint R&D project for a 0.35-micron, 72 volt (V) version of MagnaChip's proven power process technology, which combines Bipolar technology for analog control, Complementary metal-oxide semiconductor (CMOS) technology for digital control, and Diffused MOS (DMOS) technology for handling the high currents required for managing on-chip or system power.
One of the advanced features of this Bipolar CMOS DMOS (BCD) process is its innovative deep trench isolation technique, which reduces transistor pitch and off-state leakage current while improving latch-up immunity, resulting in a higher degree of integration for complex power management ICs.
The enhanced BCD process technology includes proprietary Microsemi devices and structures that are optimized for its targeted product applications to reduce die size, improve overall analog performance, and enhance device performance in high-current situations. The two companies are also working on a second enhanced process technology for additional product applications, which will be released after designs have been validated.
"This is a first key step in expanding our technology portfolio to include a variety of custom processes for the next generation of LED and CCFL lighting products as well as many other future product areas," said James Aralis, Microsemi Vice President of R&D. "The combination of these processes and custom device technologies with our world-class system and IC design capabilities will enable our team to develop highly differentiated and cost-effective products for customers across the full range of our targeted market segments."
Dr. T.J. Lee, Senior Vice president of MagnaChip Semiconductor Manufacturing Services Engineering, commented: "Our goal is to build solid, strategic relationships with foundry customers through outstanding customer service and high quality products. Microsemi exemplifies this type of customer and we are very pleased to partner with industry leader Microsemi to develop our 0.35-micron advanced BCD process. The successful partnership between MagnaChip and Microsemi has demonstrated MagnaChip's capability of providing truly leading edge BCD processes to support our customers' growth."
The Microsemi and MagnaChip advanced BCD process will improve time-to-market for new product development, while enabling the ongoing re-use of all proven low-voltage blocks and cells that Microsemi has adopted for existing products.
Microsemi currently has five new products in the final stages of development using the new BCD process, four of which are now being tested and validated both internally and by customers. All five products have benefitted from the improved performance and cost associated with the enhanced BCD process.
The new process is electrically compatible with MagnaChip's own 0.35-micron baseline process that is already used by Microsemi to manufacture current products.
Microsemi and MagnaChip have completed a 24-month joint R&D project for a 0.35-micron, 72 volt (V) version of MagnaChip's proven power process technology, which combines Bipolar technology for analog control, Complementary metal-oxide semiconductor (CMOS) technology for digital control, and Diffused MOS (DMOS) technology for handling the high currents required for managing on-chip or system power.
One of the advanced features of this Bipolar CMOS DMOS (BCD) process is its innovative deep trench isolation technique, which reduces transistor pitch and off-state leakage current while improving latch-up immunity, resulting in a higher degree of integration for complex power management ICs.
The enhanced BCD process technology includes proprietary Microsemi devices and structures that are optimized for its targeted product applications to reduce die size, improve overall analog performance, and enhance device performance in high-current situations. The two companies are also working on a second enhanced process technology for additional product applications, which will be released after designs have been validated.
"This is a first key step in expanding our technology portfolio to include a variety of custom processes for the next generation of LED and CCFL lighting products as well as many other future product areas," said James Aralis, Microsemi Vice President of R&D. "The combination of these processes and custom device technologies with our world-class system and IC design capabilities will enable our team to develop highly differentiated and cost-effective products for customers across the full range of our targeted market segments."
Dr. T.J. Lee, Senior Vice president of MagnaChip Semiconductor Manufacturing Services Engineering, commented: "Our goal is to build solid, strategic relationships with foundry customers through outstanding customer service and high quality products. Microsemi exemplifies this type of customer and we are very pleased to partner with industry leader Microsemi to develop our 0.35-micron advanced BCD process. The successful partnership between MagnaChip and Microsemi has demonstrated MagnaChip's capability of providing truly leading edge BCD processes to support our customers' growth."
The Microsemi and MagnaChip advanced BCD process will improve time-to-market for new product development, while enabling the ongoing re-use of all proven low-voltage blocks and cells that Microsemi has adopted for existing products.
Microsemi currently has five new products in the final stages of development using the new BCD process, four of which are now being tested and validated both internally and by customers. All five products have benefitted from the improved performance and cost associated with the enhanced BCD process.
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