MINNEAPOLIS, USA: FSI International Inc., a leading manufacturer of wafer cleaning systems used in the fabrication of integrated circuits, has received an order for an FSI ORION system with ViPR technology from a major semiconductor manufacturer based in Asia.
The FSI ORION system will be used for the development and qualification of front-end-of-line (FEOL) cleaning processes in advanced IC manufacturing. After a comparison of competitive alternatives, this customer determined that the FSI ORION ViPR technology was the ideal solution for meeting its anticipated resist stripping requirements. FSI expects to ship this evaluation FSI ORION single wafer cleaning system to this customer during its fiscal 2010 third quarter.
IC manufacturers are finding that the unique closed chamber design of the FSI ORION system permits safe use of aggressive, high-temperature ViPR process technology for all-wet removal of highly implanted photoresist. FSI’s differentiated ViPR technology minimizes material loss and lowers defectivity. The FSI ORION process chamber design, with an integrated spray bar, improves process uniformity, shortens process time, reduces chemical consumption and enhances particle removal.
“With this order we have accomplished a key fiscal 2010 objective to place FSI ORION systems at strategic logic, memory and foundry producers,” said Don Mitchell, FSI chairman and chief executive officer. “We have taken a very deliberate approach in the development of our single wafer cleaning technology, focusing on translating our considerable experience and expertise into a tool that will meet the industry’s advancing surface conditioning requirements,” continued Mitchell.
Wednesday, March 17, 2010
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