Thursday, September 2, 2010

Trident to demo industry's first integrated 2D-to-3D conversion

IFA 2010, SUNNYVALE, USA: At the IFA show this week in Berlin, Trident Microsystems, Inc., a leading provider of set-top box and TV semiconductor solutions, will be demonstrating the industry's first integrated 2D-to-3D conversion chipset that provides best-in-class 3D capabilities while also enabling a 3D TV to display the high volume of 2D content that exists today.

While most 3D TV manufacturers have been required to incorporate expensive ICs to handle the 2D-to-3D conversion, Trident has integrated this feature onto its PNX5130 chipset to reduce customers' 3D TV system cost, provide full flexibility for handling frame sequential and line interleaved 3D panels, and deliver the best picture quality through its halo-free MEMC and accurate 3D motion technology.

"By integrating the 2D-to-3D conversion feature directly onto our PN5130 chipset, Trident enables customers to deliver lower-cost 3D TVs that are capable of displaying the large volumes of 2D content in impressive 3D," said Dirk Wieberneit, senior vice president and general manager of the Trident TV Business unit.

"Given that the majority of today's TV content is in 2D, this is a critical feature for the top TV OEMs and we are proud to be the first chip manufacturer to provide this capability in PNX5130 frame rate converter products."

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